DE69622192T2 - Zinnbeschichteter elektrischer leiter - Google Patents

Zinnbeschichteter elektrischer leiter

Info

Publication number
DE69622192T2
DE69622192T2 DE69622192T DE69622192T DE69622192T2 DE 69622192 T2 DE69622192 T2 DE 69622192T2 DE 69622192 T DE69622192 T DE 69622192T DE 69622192 T DE69622192 T DE 69622192T DE 69622192 T2 DE69622192 T2 DE 69622192T2
Authority
DE
Germany
Prior art keywords
coated electric
tin coated
electric ladder
ladder
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69622192T
Other languages
English (en)
Other versions
DE69622192D1 (de
Inventor
C Fister
Szuchain Chen
A Khan
L Bender
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/657,211 external-priority patent/US5780172A/en
Application filed by Olin Corp filed Critical Olin Corp
Publication of DE69622192D1 publication Critical patent/DE69622192D1/de
Application granted granted Critical
Publication of DE69622192T2 publication Critical patent/DE69622192T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
    • Y10S428/9265Special properties
    • Y10S428/929Electrical contact feature
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/922Static electricity metal bleed-off metallic stock
    • Y10S428/9335Product by special process
    • Y10S428/934Electrical process
    • Y10S428/935Electroplating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • Y10T428/12715Next to Group IB metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708Sn-base component
    • Y10T428/12722Next to Group VIII metal-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12903Cu-base component
    • Y10T428/1291Next to Co-, Cu-, or Ni-base component
DE69622192T 1995-12-18 1996-12-10 Zinnbeschichteter elektrischer leiter Expired - Lifetime DE69622192T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US57368695A 1995-12-18 1995-12-18
US08/657,211 US5780172A (en) 1995-12-18 1996-06-03 Tin coated electrical connector
US08/769,912 US5916695A (en) 1995-12-18 1996-12-09 Tin coated electrical connector
PCT/US1996/019768 WO1997022472A1 (en) 1995-12-18 1996-12-10 Tin coated electrical connector
CA002240239A CA2240239C (en) 1995-12-18 1998-06-10 Tin coated electrical connector

Publications (2)

Publication Number Publication Date
DE69622192D1 DE69622192D1 (de) 2002-08-08
DE69622192T2 true DE69622192T2 (de) 2003-02-27

Family

ID=31499384

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69622192T Expired - Lifetime DE69622192T2 (de) 1995-12-18 1996-12-10 Zinnbeschichteter elektrischer leiter

Country Status (6)

Country Link
US (1) US5916695A (de)
EP (2) EP1203654A3 (de)
JP (1) JP3727069B2 (de)
CA (1) CA2240239C (de)
DE (1) DE69622192T2 (de)
WO (1) WO1997022472A1 (de)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6652990B2 (en) * 1992-03-27 2003-11-25 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6794060B2 (en) 1992-03-27 2004-09-21 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6861159B2 (en) * 1992-03-27 2005-03-01 The Louis Berkman Company Corrosion-resistant coated copper and method for making the same
US6080497A (en) * 1992-03-27 2000-06-27 The Louis Berkman Company Corrosion-resistant coated copper metal and method for making the same
DE69637333T2 (de) * 1995-06-27 2008-10-02 International Business Machines Corp. Kupferlegierungen für Chipverbindungen und Herstellungsverfahren
JPH10134869A (ja) * 1996-10-30 1998-05-22 Yazaki Corp 端子材料および端子
JP3286560B2 (ja) * 1997-04-28 2002-05-27 株式会社オートネットワーク技術研究所 嵌合型接続端子
DE19751841A1 (de) * 1997-11-22 1999-05-27 Stolberger Metallwerke Gmbh Elektrisch leitfähiges Metallband und Steckverbinder daraus
JP4489232B2 (ja) * 1999-06-14 2010-06-23 日鉱金属株式会社 コネクタ用めっき材料
US6274254B1 (en) * 1999-08-23 2001-08-14 Lucent Technologies Inc. Electrodeposited precious metal finishes having wear resistant particles therein
JP4459360B2 (ja) * 2000-02-08 2010-04-28 マスプロ電工株式会社 回路基板およびその製造方法
JP3621365B2 (ja) * 2000-09-18 2005-02-16 第一電子工業株式会社 電気コネクタ
DE60134108D1 (de) * 2000-10-25 2008-07-03 Japan Aviation Electron Eine elektronische Komponente und zugehöriges Herstellungsverfahren
US6368167B1 (en) * 2000-12-22 2002-04-09 Hon Hai Precision Ind. Co., Ltd. Method of making an electrical connector
TW575688B (en) * 2001-01-19 2004-02-11 Furukawa Electric Co Ltd Metal-plated material and method for preparation thereof, and electric and electronic parts using the same
US20050037229A1 (en) * 2001-01-19 2005-02-17 Hitoshi Tanaka Plated material, method of producing same, and electrical / electronic part using same
JP2002226982A (ja) * 2001-01-31 2002-08-14 Dowa Mining Co Ltd 耐熱性皮膜、その製造方法および電気電子部品
US6759142B2 (en) 2001-07-31 2004-07-06 Kobe Steel Ltd. Plated copper alloy material and process for production thereof
US6924044B2 (en) * 2001-08-14 2005-08-02 Snag, Llc Tin-silver coatings
DE10146274A1 (de) * 2001-09-19 2003-04-10 Bosch Gmbh Robert Metallische Oberfläche eines Körpers, Verfahren zur Herstellung einer strukturierten metallischen Oberfläche eines Körpers und dessen Verwendung
DE10251507A1 (de) * 2001-11-13 2003-06-05 Yazaki Corp Anschlußklemme
DE10208618A1 (de) * 2002-02-27 2003-09-04 Bosch Gmbh Robert Digitale Verzögerungsleitung
US6923692B2 (en) * 2002-04-22 2005-08-02 Yazaki Corporation Electrical connectors incorporating low friction coatings and methods for making them
DE10224693A1 (de) * 2002-06-04 2003-12-18 Bosch Gmbh Robert Verbundwerkstoff zur Herstellung einer elektrischen Kontaktfläche sowie Verfahren zur Erzeugung einer gleitfähigen und korrosionsarmen elektrischen Kontaktoberfläche
DE10245343A1 (de) * 2002-09-27 2004-04-08 Robert Bosch Gmbh Elektrischer Kontakt
DE10326788B4 (de) * 2003-06-13 2005-05-25 Robert Bosch Gmbh Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung
DE10346206A1 (de) * 2003-10-06 2005-04-28 Bosch Gmbh Robert Kontaktoberflächen für elektrische Kontakte
US7391116B2 (en) * 2003-10-14 2008-06-24 Gbc Metals, Llc Fretting and whisker resistant coating system and method
DE502004010902D1 (de) * 2003-11-28 2010-04-29 Wieland Werke Ag Schichtenfolge zur Herstellung eines Verbundmaterials für elektromechanische Bauelemente
JP4739734B2 (ja) * 2003-11-28 2011-08-03 ヴィーラント ウェルケ アクチーエン ゲゼルシャフト 電子機械的構成要素用の複合材を製造するための連続層、その複合材及び使用方法
JP4302545B2 (ja) * 2004-02-10 2009-07-29 株式会社オートネットワーク技術研究所 プレスフィット端子
US20050268991A1 (en) * 2004-06-03 2005-12-08 Enthone Inc. Corrosion resistance enhancement of tin surfaces
JP4813785B2 (ja) 2004-09-29 2011-11-09 Dowaメタルテック株式会社 錫めっき材
WO2006059578A1 (ja) * 2004-12-03 2006-06-08 Murata Manufacturing Co., Ltd. 電気接点部品、同軸コネクタおよびそれらを用いた電気回路装置
JP2006161127A (ja) * 2004-12-09 2006-06-22 Takamatsu Mekki:Kk 嵌合型接続端子に適した電子材料とその製造方法
JP4749746B2 (ja) * 2005-03-24 2011-08-17 Dowaメタルテック株式会社 錫めっき材およびその製造方法
JP4855032B2 (ja) * 2005-09-29 2012-01-18 Dowaメタルテック株式会社 複合めっき材およびその製造方法
JP4817095B2 (ja) * 2005-10-03 2011-11-16 上村工業株式会社 ウィスカ抑制表面処理方法
JP4934456B2 (ja) 2006-02-20 2012-05-16 古河電気工業株式会社 めっき材料および前記めっき材料が用いられた電気電子部品
US20080308300A1 (en) * 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
DE102007047007A1 (de) * 2007-10-01 2009-04-09 Tyco Electronics Amp Gmbh Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben
JP2009097053A (ja) * 2007-10-19 2009-05-07 Hitachi Ltd 金属条、コネクタ、および金属条の製造方法
US8226807B2 (en) * 2007-12-11 2012-07-24 Enthone Inc. Composite coatings for whisker reduction
US20090145764A1 (en) * 2007-12-11 2009-06-11 Enthone Inc. Composite coatings for whisker reduction
JP4748550B2 (ja) * 2008-06-24 2011-08-17 古河電気工業株式会社 電気電子部品用複合材料およびそれを用いた電気電子部品
JP5079605B2 (ja) * 2008-06-30 2012-11-21 株式会社オートネットワーク技術研究所 圧着端子及び端子付電線並びにこれらの製造方法
JP2010126801A (ja) * 2008-12-01 2010-06-10 Hitachi Cable Ltd 錫被覆アルミニウム材料
JP5621570B2 (ja) * 2010-03-30 2014-11-12 三菱マテリアル株式会社 Snめっき付き導電材及びその製造方法
KR101418323B1 (ko) * 2010-04-23 2014-07-10 제이에프이 스틸 가부시키가이샤 고체 고분자형 연료 전지 세퍼레이터용 금속판
JP2013033656A (ja) * 2011-08-02 2013-02-14 Yazaki Corp 端子
JP2013037791A (ja) * 2011-08-04 2013-02-21 Sumitomo Wiring Syst Ltd 回路基板と端子金具の接続構造
US9260789B2 (en) * 2012-05-14 2016-02-16 United Technologies Corporation Underpotential depositon of metal monolayers from ionic liquids
FR2993579B1 (fr) * 2012-07-20 2015-09-25 Tyco Electronics France Sas Procede de revetement et revetement pour contact a insertion a force
WO2014099566A1 (en) * 2012-12-20 2014-06-26 3M Innovative Properties Company Electrical connectors and methods of making same
EP2799595A1 (de) * 2013-05-03 2014-11-05 Delphi Technologies, Inc. Elektrisches Kontaktelement
US20150093923A1 (en) * 2013-09-27 2015-04-02 Lotes Co., Ltd Terminal
JP2015149218A (ja) * 2014-02-07 2015-08-20 矢崎総業株式会社 固定接点
KR102408021B1 (ko) * 2014-11-11 2022-06-13 삼성디스플레이 주식회사 금속배선 및 이를 포함하는 표시 장치
JP6543138B2 (ja) * 2015-08-28 2019-07-10 Dowaメタルテック株式会社 Snめっき材およびその製造方法
DE102016102319A1 (de) * 2016-02-10 2017-08-10 Harting Ag & Co. Kg Verfahren zur Beschichtung eines Kontaktelements mit einer Kupfer-Nickel-Legierung
JP6750545B2 (ja) * 2016-05-19 2020-09-02 株式会社オートネットワーク技術研究所 プレスフィット端子接続構造
JP7309469B2 (ja) * 2019-06-12 2023-07-18 新光電気工業株式会社 リードピン及びリードピン付き配線基板
JP7352851B2 (ja) * 2019-08-05 2023-09-29 株式会社オートネットワーク技術研究所 電気接点材料、端子金具、コネクタ、及びワイヤーハーネス

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1750092A (en) * 1921-11-26 1930-03-11 Crawford Robert Brace Penn Electroplating process
US3247082A (en) * 1962-08-07 1966-04-19 Harshaw Chem Corp Electrodeposition of a corrosion resistant coating
US3635702A (en) * 1968-07-01 1972-01-18 Int Nickel Co Copper-nickel alloys of high-yield strength
US3892637A (en) * 1969-03-10 1975-07-01 Polti Jean Loup Method of treatment of metal surfaces
US3833481A (en) * 1972-12-18 1974-09-03 Buckbel Mears Co Electroforming nickel copper alloys
US3954420A (en) * 1975-06-24 1976-05-04 Whyco Chromium Co., Inc. Non-ferrous corrosion resistant undercoating
US4131517A (en) * 1977-06-03 1978-12-26 Nippon Mining Co., Ltd. Surface treating process for copper foil for use in printed circuit
US4311768A (en) * 1977-12-22 1982-01-19 Gould Inc. Printed circuit board having mutually etchable copper and nickel layers
US4190474A (en) * 1977-12-22 1980-02-26 Gould Inc. Method of making a printed circuit board having mutually etchable copper and nickel layers
US4167459A (en) * 1979-01-08 1979-09-11 The United States Of America As Represented By The Secretary Of The Interior Electroplating with Ni-Cu alloy
DE2940772C2 (de) * 1979-10-08 1982-09-09 W.C. Heraeus Gmbh, 6450 Hanau Elektrischer Schwachstromkontakt
DE3027304C2 (de) * 1980-07-18 1982-09-30 Sds-Elektro Gmbh, 8024 Deisenhofen Elektrischer Mehrlagenkontakt
US4394419A (en) * 1981-06-12 1983-07-19 Oak Industries Inc. Printed circuit material
US4411961A (en) * 1981-09-28 1983-10-25 Occidental Chemical Corporation Composite electroplated article and process
JPS5976453A (ja) * 1982-10-19 1984-05-01 Mitsubishi Metal Corp 半導体装置のリ−ド材用Cu合金クラツド材
US4441118A (en) * 1983-01-13 1984-04-03 Olin Corporation Composite copper nickel alloys with improved solderability shelf life
US4498121A (en) * 1983-01-13 1985-02-05 Olin Corporation Copper alloys for suppressing growth of Cu-Al intermetallic compounds
GB2134136B (en) * 1983-01-19 1986-03-26 Shell Int Research An electronic conduit and a method of manufacturing it
US5001546A (en) * 1983-07-27 1991-03-19 Olin Corporation Clad metal lead frame substrates
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
JPH0612796B2 (ja) * 1984-06-04 1994-02-16 株式会社日立製作所 半導体装置
JPS62112787A (ja) * 1985-11-13 1987-05-23 Toyota Central Res & Dev Lab Inc 金属積層体
US4882236A (en) * 1988-02-10 1989-11-21 Olin Corporation Rigid magnetic recording disks and method of producing same
US5158653A (en) * 1988-09-26 1992-10-27 Lashmore David S Method for production of predetermined concentration graded alloys
US5268235A (en) * 1988-09-26 1993-12-07 The United States Of America As Represented By The Secretary Of Commerce Predetermined concentration graded alloys
JPH02285091A (ja) * 1989-04-26 1990-11-22 Kobe Steel Ltd ニッケル―銅合金めっき浴
US5019222A (en) * 1989-05-02 1991-05-28 Nikko Gould Foil Co., Ltd. Treatment of copper foil for printed circuits
JPH0818401B2 (ja) * 1989-05-17 1996-02-28 福田金属箔粉工業株式会社 複合箔とその製法
US5021300A (en) * 1989-09-05 1991-06-04 Raytheon Company Solder back contact
US5028492A (en) * 1990-03-13 1991-07-02 Olin Corporation Composite coating for electrical connectors
TW208110B (de) * 1990-06-08 1993-06-21 Furukawa Circuit Foil Kk
EP0468787A3 (en) * 1990-07-27 1993-08-04 Shinko Electric Industries Co. Ltd. Tape automated bonding in semiconductor technique
JPH05183017A (ja) * 1991-12-26 1993-07-23 Hitachi Cable Ltd Tab用テープキャリア

Also Published As

Publication number Publication date
CA2240239C (en) 2009-12-01
EP1203654A3 (de) 2006-03-08
EP0869867A4 (de) 1998-12-09
JP3727069B2 (ja) 2005-12-14
WO1997022472A1 (en) 1997-06-26
EP1203654A2 (de) 2002-05-08
DE69622192D1 (de) 2002-08-08
US5916695A (en) 1999-06-29
CA2240239A1 (en) 1999-12-10
EP0869867A1 (de) 1998-10-14
JP2001526734A (ja) 2001-12-18
EP0869867B1 (de) 2002-07-03

Similar Documents

Publication Publication Date Title
DE69622192D1 (de) Zinnbeschichteter elektrischer leiter
DE69618692T2 (de) Elektrischer Doppelschichtkondensator
DE69622694D1 (de) Elektrischer besen
DE69607372D1 (de) Elektrischer verbinder mit positionierungskamm für leiter
DE69505165T2 (de) Elektrischer Kabelendverschluss
ATA132394A (de) Elektrischer leiter in lampen
DE69604656T2 (de) Elektrischer verbinder
DE69603189T2 (de) Elektrischer verbinder
DE69621082D1 (de) Elektrischer verbinder
DE59603299D1 (de) Elektrischer verbinder
DE69632004D1 (de) Elektrischer Kondensator mit Überdruckschutz
DE59600482D1 (de) Emv-gerechter elektrischer anschluss
HK1042869A1 (zh) 鍍錫電連接器
DE69504260T2 (de) Elektrischer Kondensator
FI98787B (fi) Sähkökäyttöinen saunakiuas
DE29519665U1 (de) Leiter
DE9313411U1 (de) Elektrischer Leiter
DE69502545T2 (de) Leiter
DE29515178U1 (de) Leiter
DE29606846U1 (de) Leiter
DE29509195U1 (de) Aufrecht stehender elektrischer Backofen
DE29513163U1 (de) Elektrischer Backofen
IT1279834B1 (it) Rivestimento per condensatori elettrici
DE29507818U1 (de) Weitspann-Kabelleiter
DE29605372U1 (de) Leiter

Legal Events

Date Code Title Description
8364 No opposition during term of opposition