DE69623583T2 - Verfahren und Vorrichtung zur Reduzierung von Perfluorverbindungen enthaltenden Abgasen aus Substratbearbeitungsvorrichtungen. - Google Patents

Verfahren und Vorrichtung zur Reduzierung von Perfluorverbindungen enthaltenden Abgasen aus Substratbearbeitungsvorrichtungen.

Info

Publication number
DE69623583T2
DE69623583T2 DE69623583T DE69623583T DE69623583T2 DE 69623583 T2 DE69623583 T2 DE 69623583T2 DE 69623583 T DE69623583 T DE 69623583T DE 69623583 T DE69623583 T DE 69623583T DE 69623583 T2 DE69623583 T2 DE 69623583T2
Authority
DE
Germany
Prior art keywords
substrate processing
processing devices
exhaust gases
devices containing
reducing exhaust
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69623583T
Other languages
English (en)
Other versions
DE69623583D1 (de
Inventor
David Cheung
Sebastien Raoux
Judy H Huang
Taylor, Jr
Mark Fodor
Kevin Fairbairn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69623583D1 publication Critical patent/DE69623583D1/de
Publication of DE69623583T2 publication Critical patent/DE69623583T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816Pressure
    • H01J37/32834Exhausting
    • H01J37/32844Treating effluent gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D45/00Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces
    • B01D45/04Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia
    • B01D45/06Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by utilising inertia by reversal of direction of flow
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/32Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/46Removing components of defined structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/087Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy
    • B01J19/088Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electric or magnetic energy giving rise to electric discharges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • B01J19/122Incoherent waves
    • B01J19/126Microwaves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/24Stationary reactors without moving elements inside
    • B01J19/248Reactors comprising multiple separated flow channels
    • B01J19/249Plate-type reactors
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405Cleaning of reactor or parts inside the reactor by using reactive gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H05H1/461Microwave discharges
    • H05H1/4622Microwave discharges using waveguides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/20Halogens or halogen compounds
    • B01D2257/206Organic halogen compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2259/00Type of treatment
    • B01D2259/80Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
    • B01D2259/818Employing electrical discharges or the generation of a plasma
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2451Geometry of the reactor
    • B01J2219/2453Plates arranged in parallel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2451Geometry of the reactor
    • B01J2219/2456Geometry of the plates
    • B01J2219/2458Flat plates, i.e. plates which are not corrugated or otherwise structured, e.g. plates with cylindrical shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2461Heat exchange aspects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2461Heat exchange aspects
    • B01J2219/2467Additional heat exchange means, e.g. electric resistance heaters, coils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2469Feeding means
    • B01J2219/247Feeding means for the reactants
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2474Mixing means, e.g. fins or baffles attached to the plates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2475Separation means, e.g. membranes inside the reactor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2476Construction materials
    • B01J2219/2483Construction materials of the plates
    • B01J2219/2487Ceramics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2491Other constructional details
    • B01J2219/2492Assembling means
    • B01J2219/2493Means for assembling plates together, e.g. sealing means, screws, bolts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/24Stationary reactors without moving elements inside
    • B01J2219/2401Reactors comprising multiple separate flow channels
    • B01J2219/245Plate-type reactors
    • B01J2219/2491Other constructional details
    • B01J2219/2492Assembling means
    • B01J2219/2496Means for assembling modules together, e.g. casings, holders, fluidic connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02Details
    • H01J2237/022Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H05H1/4645Radiofrequency discharges
    • H05H1/4652Radiofrequency discharges using inductive coupling means, e.g. coils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2245/00Applications of plasma devices
    • H05H2245/10Treatment of gases
    • H05H2245/17Exhaust gases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02CCAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00Capture or disposal of greenhouse gases
    • Y02C20/30Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
DE69623583T 1995-12-27 1996-12-24 Verfahren und Vorrichtung zur Reduzierung von Perfluorverbindungen enthaltenden Abgasen aus Substratbearbeitungsvorrichtungen. Expired - Fee Related DE69623583T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57937595A 1995-12-27 1995-12-27
US08/741,272 US6187072B1 (en) 1995-09-25 1996-10-30 Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions

Publications (2)

Publication Number Publication Date
DE69623583D1 DE69623583D1 (de) 2002-10-17
DE69623583T2 true DE69623583T2 (de) 2003-01-09

Family

ID=27077737

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69623583T Expired - Fee Related DE69623583T2 (de) 1995-12-27 1996-12-24 Verfahren und Vorrichtung zur Reduzierung von Perfluorverbindungen enthaltenden Abgasen aus Substratbearbeitungsvorrichtungen.
DE69632275T Expired - Fee Related DE69632275T2 (de) 1995-12-27 1996-12-24 Verfahren und Vorrichrung zur Reduzierung von Gasen bestehend aus Perfluoroverbindungen in Abgasen von einer Substrat-Bearbeitungsvorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69632275T Expired - Fee Related DE69632275T2 (de) 1995-12-27 1996-12-24 Verfahren und Vorrichrung zur Reduzierung von Gasen bestehend aus Perfluoroverbindungen in Abgasen von einer Substrat-Bearbeitungsvorrichtung

Country Status (5)

Country Link
US (2) US6187072B1 (de)
EP (2) EP1145759B1 (de)
JP (1) JP3992315B2 (de)
KR (1) KR100271694B1 (de)
DE (2) DE69623583T2 (de)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193802B1 (en) 1995-09-25 2001-02-27 Applied Materials, Inc. Parallel plate apparatus for in-situ vacuum line cleaning for substrate processing equipment
US6187072B1 (en) 1995-09-25 2001-02-13 Applied Materials, Inc. Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
US6045618A (en) * 1995-09-25 2000-04-04 Applied Materials, Inc. Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment
US6888040B1 (en) * 1996-06-28 2005-05-03 Lam Research Corporation Method and apparatus for abatement of reaction products from a vacuum processing chamber
FR2757082B1 (fr) * 1996-12-13 1999-01-15 Air Liquide Procede d'epuration d'un gaz plasmagene et installation pour la mise en oeuvre d'un tel procede
US8779322B2 (en) 1997-06-26 2014-07-15 Mks Instruments Inc. Method and apparatus for processing metal bearing gases
US7569790B2 (en) 1997-06-26 2009-08-04 Mks Instruments, Inc. Method and apparatus for processing metal bearing gases
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
DE19847848C1 (de) * 1998-10-16 2000-05-11 R3 T Gmbh Rapid Reactive Radic Vorrichtung und Erzeugung angeregter/ionisierter Teilchen in einem Plasma
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
JP4219562B2 (ja) * 1999-04-13 2009-02-04 セミトゥール・インコーポレイテッド ワークピースを電気化学的に処理するためのシステム
US6354241B1 (en) 1999-07-15 2002-03-12 Applied Materials, Inc. Heated electrostatic particle trap for in-situ vacuum line cleaning of a substrated processing
US6468490B1 (en) 2000-06-29 2002-10-22 Applied Materials, Inc. Abatement of fluorine gas from effluent
US6689252B1 (en) 1999-07-28 2004-02-10 Applied Materials, Inc. Abatement of hazardous gases in effluent
US6255222B1 (en) 1999-08-24 2001-07-03 Applied Materials, Inc. Method for removing residue from substrate processing chamber exhaust line for silicon-oxygen-carbon deposition process
JP2001132638A (ja) * 1999-11-10 2001-05-18 Ebara Corp トラップ装置
US6367412B1 (en) * 2000-02-17 2002-04-09 Applied Materials, Inc. Porous ceramic liner for a plasma source
US6673323B1 (en) 2000-03-24 2004-01-06 Applied Materials, Inc. Treatment of hazardous gases in effluent
US6391146B1 (en) 2000-04-11 2002-05-21 Applied Materials, Inc. Erosion resistant gas energizer
JP2001284267A (ja) * 2000-04-03 2001-10-12 Canon Inc 排気処理方法、プラズマ処理方法及びプラズマ処理装置
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
US6576202B1 (en) 2000-04-21 2003-06-10 Kin-Chung Ray Chiu Highly efficient compact capacitance coupled plasma reactor/generator and method
US6863019B2 (en) 2000-06-13 2005-03-08 Applied Materials, Inc. Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gas
US7102763B2 (en) * 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US6747734B1 (en) 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US6428673B1 (en) * 2000-07-08 2002-08-06 Semitool, Inc. Apparatus and method for electrochemical processing of a microelectronic workpiece, capable of modifying processing based on metrology
US20050061676A1 (en) * 2001-03-12 2005-03-24 Wilson Gregory J. System for electrochemically processing a workpiece
US6602323B2 (en) 2001-03-21 2003-08-05 Samsung Electronics Co., Ltd. Method and apparatus for reducing PFC emission during semiconductor manufacture
US6733827B2 (en) * 2001-04-11 2004-05-11 The Procter & Gamble Co. Processes for manufacturing particles coated with activated lignosulfonate
FR2825295B1 (fr) * 2001-05-31 2004-05-28 Air Liquide Application des plasmas denses crees a pression atmospherique au traitement d'effluents gazeux
US6824748B2 (en) 2001-06-01 2004-11-30 Applied Materials, Inc. Heated catalytic treatment of an effluent gas from a substrate fabrication process
US20020185067A1 (en) * 2001-06-07 2002-12-12 International Business Machines Corporation Apparatus and method for in-situ cleaning of a throttle valve in a CVD system
US7037862B2 (en) * 2001-06-13 2006-05-02 Micron Technology, Inc. Dielectric layer forming method and devices formed therewith
US6962679B2 (en) 2001-07-11 2005-11-08 Battelle Memorial Institute Processes and apparatuses for treating halogen-containing gases
US7220396B2 (en) * 2001-07-11 2007-05-22 Battelle Memorial Institute Processes for treating halogen-containing gases
US7060234B2 (en) 2001-07-18 2006-06-13 Applied Materials Process and apparatus for abatement of by products generated from deposition processes and cleaning of deposition chambers
US6730354B2 (en) 2001-08-08 2004-05-04 Agilent Technologies, Inc. Forming ferroelectric Pb(Zr,Ti)O3 films
WO2003018874A2 (en) * 2001-08-31 2003-03-06 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6837250B2 (en) * 2002-02-27 2005-01-04 Air Products And Chemicals, Inc. CVD chamber cleaning using mixed PFCs from capture/recycle
US7390755B1 (en) 2002-03-26 2008-06-24 Novellus Systems, Inc. Methods for post etch cleans
US6719641B2 (en) * 2002-04-26 2004-04-13 Nicklaus Golf Equipment Company Golf iron having a customizable weighting feature
US20040108212A1 (en) * 2002-12-06 2004-06-10 Lyndon Graham Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces
ITPD20020316A1 (it) * 2002-12-11 2004-06-12 Mauro Schiavon Dispositivo e metodo per la creazione di fullereni e/o nanotubi
US20040129385A1 (en) * 2003-01-02 2004-07-08 International Business Machines Corporation Pre-loaded plasma reactor apparatus and application thereof
TWI230094B (en) * 2003-01-14 2005-04-01 Desiccant Technology Corp Method for exhaust treatment of perfluoro compounds
KR100505670B1 (ko) * 2003-02-05 2005-08-03 삼성전자주식회사 부산물 제거용 고온 유체 공급 장치를 구비한 반도체 소자제조 장치
FR2863103B1 (fr) 2003-12-01 2006-07-14 Cit Alcatel Systeme de traitement des gaz par plasma integre dans une pompe a vide
US7569193B2 (en) * 2003-12-19 2009-08-04 Applied Materials, Inc. Apparatus and method for controlled combustion of gaseous pollutants
US20050148199A1 (en) * 2003-12-31 2005-07-07 Frank Jansen Apparatus for atomic layer deposition
US20050250347A1 (en) * 2003-12-31 2005-11-10 Bailey Christopher M Method and apparatus for maintaining by-product volatility in deposition process
WO2005072852A1 (ja) * 2004-01-29 2005-08-11 Taiyo Nippon Sanso Corporation 排ガス処理方法および排ガス処理装置
US20050238816A1 (en) * 2004-04-23 2005-10-27 Li Hou Method and apparatus of depositing low temperature inorganic films on plastic substrates
GB0415560D0 (en) * 2004-07-12 2004-08-11 Boc Group Plc Pump cleaning
US7288484B1 (en) 2004-07-13 2007-10-30 Novellus Systems, Inc. Photoresist strip method for low-k dielectrics
WO2006078340A2 (en) * 2004-11-08 2006-07-27 Mks Instruments, Inc. Method and apparatus for processing metal bearing gases
US7736599B2 (en) * 2004-11-12 2010-06-15 Applied Materials, Inc. Reactor design to reduce particle deposition during process abatement
US8193096B2 (en) 2004-12-13 2012-06-05 Novellus Systems, Inc. High dose implantation strip (HDIS) in H2 base chemistry
US7202176B1 (en) * 2004-12-13 2007-04-10 Novellus Systems, Inc. Enhanced stripping of low-k films using downstream gas mixing
US8129281B1 (en) 2005-05-12 2012-03-06 Novellus Systems, Inc. Plasma based photoresist removal system for cleaning post ash residue
US20060276049A1 (en) * 2005-06-06 2006-12-07 Bailey Christopher M High efficiency trap for deposition process
GB0522088D0 (en) * 2005-10-28 2005-12-07 Boc Group Plc Plasma abatement device
WO2007053626A2 (en) * 2005-10-31 2007-05-10 Applied Materials, Inc. Process abatement reactor
GB0523947D0 (en) * 2005-11-24 2006-01-04 Boc Group Plc Microwave plasma system
EP1816668A2 (de) * 2006-02-01 2007-08-08 FEI Company Teilchenstrahlgerät mit vrobestimmtem Arbeitsdruck
US20070267143A1 (en) * 2006-05-16 2007-11-22 Applied Materials, Inc. In situ cleaning of CVD system exhaust
US20080081130A1 (en) * 2006-09-29 2008-04-03 Applied Materials, Inc. Treatment of effluent in the deposition of carbon-doped silicon
US7740768B1 (en) 2006-10-12 2010-06-22 Novellus Systems, Inc. Simultaneous front side ash and backside clean
DE102006052586B4 (de) * 2006-11-08 2008-07-03 Schott Solar Gmbh Verfahren und Vorrichtung zur Reinigung der Abgase einer Siliziumdünnschicht-Produktionsanlage
US7655930B2 (en) * 2007-03-22 2010-02-02 Axcelis Technologies, Inc. Ion source arc chamber seal
US8435895B2 (en) 2007-04-04 2013-05-07 Novellus Systems, Inc. Methods for stripping photoresist and/or cleaning metal regions
JP4950763B2 (ja) * 2007-05-25 2012-06-13 大陽日酸株式会社 プラズマ生成装置
US20110045208A1 (en) * 2008-02-12 2011-02-24 Imott Inc. Diamond-like carbon film forming apparatus and method of forming diamond-like carbon film
KR100876983B1 (ko) * 2008-03-17 2009-01-07 (주)여진 Pcb 제조 공정에서 발생하는 산화 및 악취가스처리시스템
US9997325B2 (en) * 2008-07-17 2018-06-12 Verity Instruments, Inc. Electron beam exciter for use in chemical analysis in processing systems
JP5460982B2 (ja) * 2008-07-30 2014-04-02 東京エレクトロン株式会社 弁体、粒子進入阻止機構、排気制御装置及び基板処理装置
US20100051612A1 (en) 2008-08-29 2010-03-04 Hans Magnus Fagrell Microwave heater and method of heating
US8591661B2 (en) 2009-12-11 2013-11-26 Novellus Systems, Inc. Low damage photoresist strip method for low-K dielectrics
US8707899B2 (en) * 2009-02-26 2014-04-29 Hitachi High-Technologies Corporation Plasma processing apparatus
US7993937B2 (en) * 2009-09-23 2011-08-09 Tokyo Electron Limited DC and RF hybrid processing system
US20110143548A1 (en) * 2009-12-11 2011-06-16 David Cheung Ultra low silicon loss high dose implant strip
WO2011072061A2 (en) * 2009-12-11 2011-06-16 Novellus Systems, Inc. Enhanced passivation process to protect silicon prior to high dose implant strip
US20110195202A1 (en) * 2010-02-11 2011-08-11 Applied Materials, Inc. Oxygen pump purge to prevent reactive powder explosion
US9613825B2 (en) 2011-08-26 2017-04-04 Novellus Systems, Inc. Photoresist strip processes for improved device integrity
KR101427726B1 (ko) * 2011-12-27 2014-08-07 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치 및 반도체 장치의 제조 방법
EP2807902B1 (de) * 2012-01-23 2020-08-19 CONNORS, Robert W. Kompakter mikrowellenofen
CN106030755B (zh) * 2014-03-06 2020-01-03 应用材料公司 含有重原子的化合物的等离子体减量
TWI647004B (zh) 2014-04-30 2019-01-11 南韓商韓國機械研究院 減少有害物質之電漿反應器
US9514954B2 (en) 2014-06-10 2016-12-06 Lam Research Corporation Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films
KR101638325B1 (ko) 2014-09-03 2016-07-12 노영석 분리막시스템과 스크러버가 일체로 이루어지는 과불화화합물 분리시스템
JP6261100B2 (ja) * 2014-09-29 2018-01-17 株式会社日立国際電気 大気圧誘導結合プラズマ装置
KR20170070175A (ko) * 2014-10-15 2017-06-21 어플라이드 머티어리얼스, 인코포레이티드 내부식성 저감 시스템
US10187966B2 (en) * 2015-07-24 2019-01-22 Applied Materials, Inc. Method and apparatus for gas abatement
GB2541214A (en) * 2015-08-12 2017-02-15 Edwards Ltd Plasma generator
US10535506B2 (en) 2016-01-13 2020-01-14 Mks Instruments, Inc. Method and apparatus for deposition cleaning in a pumping line
US10337105B2 (en) * 2016-01-13 2019-07-02 Mks Instruments, Inc. Method and apparatus for valve deposition cleaning and prevention by plasma discharge
US11332824B2 (en) * 2016-09-13 2022-05-17 Lam Research Corporation Systems and methods for reducing effluent build-up in a pumping exhaust system
US11031252B2 (en) * 2016-11-30 2021-06-08 Taiwan Semiconductor Manufacturing Compant, Ltd. Heat shield for chamber door and devices manufactured using same
KR102646623B1 (ko) * 2017-01-23 2024-03-11 에드워드 코리아 주식회사 플라즈마 발생 장치 및 가스 처리 장치
JP6918146B2 (ja) * 2017-05-19 2021-08-11 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 液体および固体の排出物を収集して後に反応させて気体の排出物にする装置
US11745229B2 (en) 2020-08-11 2023-09-05 Mks Instruments, Inc. Endpoint detection of deposition cleaning in a pumping line and a processing chamber
US11664197B2 (en) 2021-08-02 2023-05-30 Mks Instruments, Inc. Method and apparatus for plasma generation

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA128732A (en) 1910-07-25 1910-10-18 Lars O. Lundgren Suction pump for cleaning drain pipes
US3795557A (en) * 1972-05-12 1974-03-05 Lfe Corp Process and material for manufacturing semiconductor devices
JPS51129868A (en) 1975-05-07 1976-11-11 Fujitsu Ltd A process for treatment of waste gas
GB1550853A (en) * 1975-10-06 1979-08-22 Hitachi Ltd Apparatus and process for plasma treatment
JPS5278176A (en) 1975-12-25 1977-07-01 Chiyoda R & D Discharge reactor for gases
WO1980001363A1 (en) 1978-12-29 1980-07-10 Ncr Co Lpcvd systems having in situ plasma cleaning
JPS58101722A (ja) 1981-12-10 1983-06-17 Fujitsu Ltd 排気ガス処理装置
JPS5970763A (ja) 1982-10-12 1984-04-21 Matsushita Electric Ind Co Ltd 薄膜形成装置
JPS59181619A (ja) 1983-03-31 1984-10-16 Toshiba Corp 反応性イオンエツチング装置
JPS60114570A (ja) 1983-11-25 1985-06-21 Canon Inc プラズマcvd装置の排気系
DE3414121A1 (de) 1984-04-14 1985-10-24 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren und vorrichtung zur reinigung von abgasen
US4657738A (en) 1984-04-30 1987-04-14 Westinghouse Electric Corp. Stack gas emissions control system
JPS60234313A (ja) 1984-05-07 1985-11-21 Hitachi Ltd プラズマ処理装置
US5137701A (en) 1984-09-17 1992-08-11 Mundt Randall S Apparatus and method for eliminating unwanted materials from a gas flow line
JPS6328869A (ja) 1986-07-22 1988-02-06 Nec Corp Cvd装置
US5000113A (en) 1986-12-19 1991-03-19 Applied Materials, Inc. Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process
JPH0757297B2 (ja) 1987-04-22 1995-06-21 日本真空技術株式会社 真空排気系用微粒子トラツプ
JPH0757298B2 (ja) 1987-05-19 1995-06-21 日本真空技術株式会社 真空排気系用微粒子捕集装置
US4735633A (en) 1987-06-23 1988-04-05 Chiu Kin Chung R Method and system for vapor extraction from gases
US4830702A (en) 1987-07-02 1989-05-16 General Electric Company Hollow cathode plasma assisted apparatus and method of diamond synthesis
JPH01171227A (ja) 1987-12-25 1989-07-06 Matsushita Electric Ind Co Ltd Cvd方法
JP2671009B2 (ja) 1988-05-13 1997-10-29 増田 佳子 超微粒子の回収方法及びその回収装置
JPH02125876A (ja) 1988-11-01 1990-05-14 Fujitsu Ltd Cvd装置の排気機構
JPH02159018A (ja) 1988-12-12 1990-06-19 Nec Corp 減圧式気相成長装置
US5141714A (en) 1989-08-01 1992-08-25 Kabushiki Kaisha Riken Exhaust gas cleaner
JPH03253571A (ja) 1990-03-02 1991-11-12 Hitachi Ltd 排気装置および化学気相成長装置
EP0454346A1 (de) 1990-04-21 1991-10-30 United Kingdom Atomic Energy Authority Filter für Teilchen in Auspuffgas
JPH04136175A (ja) 1990-09-26 1992-05-11 Matsushita Electric Ind Co Ltd 薄膜形成装置
US5451378A (en) 1991-02-21 1995-09-19 The United States Of America As Represented By The Secretary Of The Navy Photon controlled decomposition of nonhydrolyzable ambients
US5211729A (en) 1991-08-30 1993-05-18 Sematech, Inc. Baffle/settling chamber for a chemical vapor deposition equipment
US5279669A (en) 1991-12-13 1994-01-18 International Business Machines Corporation Plasma reactor for processing substrates comprising means for inducing electron cyclotron resonance (ECR) and ion cyclotron resonance (ICR) conditions
JPH05202474A (ja) 1992-01-24 1993-08-10 Hitachi Electron Eng Co Ltd Cvd装置の排気ガスの異物捕獲方法
US5323013A (en) 1992-03-31 1994-06-21 The United States Of America As Represented By The Secretary Of The Navy Method of rapid sample handling for laser processing
US5417826A (en) 1992-06-15 1995-05-23 Micron Technology, Inc. Removal of carbon-based polymer residues with ozone, useful in the cleaning of plasma reactors
JP3111663B2 (ja) 1992-07-28 2000-11-27 ソニー株式会社 プラズマ装置
DE4319118A1 (de) 1993-06-09 1994-12-15 Breitbarth Friedrich Wilhelm D Verfahren und Vorrichtung zur Entsorgung von Fluorkohlenstoffen und anderen fluorhaltigen Verbindungen
JP3178947B2 (ja) 1993-08-31 2001-06-25 株式会社東芝 薄膜形成方法
JP3368018B2 (ja) 1993-10-29 2003-01-20 東京エレクトロン株式会社 減圧処理方法および装置
US5453125A (en) 1994-02-17 1995-09-26 Krogh; Ole D. ECR plasma source for gas abatement
US5569810A (en) * 1994-03-18 1996-10-29 Samco International, Inc. Method of and system for processing halogenated hydrocarbons
JPH0910544A (ja) 1995-06-27 1997-01-14 Alpha Tec:Kk 除害装置及び成膜装置及びエッチング装置
US5750823A (en) * 1995-07-10 1998-05-12 R.F. Environmental Systems, Inc. Process and device for destruction of halohydrocarbons
US6187072B1 (en) 1995-09-25 2001-02-13 Applied Materials, Inc. Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions
US6045618A (en) 1995-09-25 2000-04-04 Applied Materials, Inc. Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment
US6194628B1 (en) 1995-09-25 2001-02-27 Applied Materials, Inc. Method and apparatus for cleaning a vacuum line in a CVD system
US5827370A (en) 1997-01-13 1998-10-27 Mks Instruments, Inc. Method and apparatus for reducing build-up of material on inner surface of tube downstream from a reaction furnace

Also Published As

Publication number Publication date
EP0781599B1 (de) 2002-09-11
US6187072B1 (en) 2001-02-13
DE69632275T2 (de) 2005-04-21
EP0781599A2 (de) 1997-07-02
JP3992315B2 (ja) 2007-10-17
EP1145759B1 (de) 2004-04-21
JPH09321037A (ja) 1997-12-12
DE69623583D1 (de) 2002-10-17
US6517913B1 (en) 2003-02-11
KR100271694B1 (ko) 2000-12-01
EP1145759A1 (de) 2001-10-17
DE69632275D1 (de) 2004-05-27
EP0781599A3 (de) 1997-10-29

Similar Documents

Publication Publication Date Title
DE69623583T2 (de) Verfahren und Vorrichtung zur Reduzierung von Perfluorverbindungen enthaltenden Abgasen aus Substratbearbeitungsvorrichtungen.
DE600440T1 (de) Verfahren und Vorrichtung zur Reinigung von Abgasen.
DE69206846T3 (de) Vorrichtung und Verfahren zur Beseitigung von Kohlendioxyd aus Abgasen
DE69528217D1 (de) Vorrichtung und Verfahren zur Bearbeitung von Substraten
DE69328235T2 (de) Verfahren und Vorrichtung zur Reinigung von Abgas
DE69408957T2 (de) Vorrichtung und Verfahren zur Reinigung von Abgas
DE69624177D1 (de) Verfahren und Vorrichtung zur Datenverarbeitung
DE69226511T2 (de) Verfahren und Vorrichtung zur Belichtung von Substraten
DE59809089D1 (de) Vorrichtung und verfahren zur zersetzung von schadstoffen in abgasen von verbrennungsprozessen
DE69423857T2 (de) Verfahren und Vorrichtung zur Reinigung von Abgas
DE69820312D1 (de) Verfahren und Vorrichtung zur Verminderung von Abgasen
DE69307789D1 (de) Vorrichtung und Verfahren zur Abscheidung von Kohlendioxid aus Abgas
DE69833030D1 (de) Verfahren und vorrichtung zur behandlung von abgasen aus der halbleiterherstellung
DE59600288D1 (de) Verfahren und Vorrichtung zur Bearbeitung von Halbleitermaterial
DE69801606D1 (de) Verfahren und Vorrichtung zur Rückgewinnung von Germanium aus Abgasen chemischer Aufdampfprozesse
DE59100781D1 (de) Verfahren und vorrichtung zur reinigung von abgasen von partikeln.
DE69614769T2 (de) Verfahren und Vorrichtung zum Zersetzen von Reaktionsgasen durch Verbrennen
DE59803859D1 (de) Vorrichtung und verfahren zum ableiten von kondensat aus druckgassystemen
DE3768582D1 (de) Verfahren und vorrichtung zur rueckgewinnung von 1,2-dichlorethan aus abgasen.
DE9407861U1 (de) Vorrichtung zur Entgiftung von Abgasen aus mobilen Anlagen
DE69631446D1 (de) Vorrichtung und Verfahren zur Behandlung von Abgasen aus Verbrennungsanlagen
DE69632839D1 (de) Vorrichtung zur Behandlung von Abgasen aus Verbrennungsanlagen
DE69011044D1 (de) Verfahren und Vorrichtung zur Behandlung von Abgas.
DE69630719D1 (de) Vorrichtung und Verfahren zur Behandlung von Abgasen aus Verbrennungsanlagen
ATA85095A (de) Verfahren und vorrichtung zur aufbereitung von aus thermischen, metallurgischen prozessen stammenden metallhaltigen stäuben

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: PUSCHMANN & BORCHERT, 82041 OBERHACHING

8339 Ceased/non-payment of the annual fee