DE69624936D1 - Herstellung thermoelektrischer module und lötmittel für diese herstellung - Google Patents

Herstellung thermoelektrischer module und lötmittel für diese herstellung

Info

Publication number
DE69624936D1
DE69624936D1 DE69624936T DE69624936T DE69624936D1 DE 69624936 D1 DE69624936 D1 DE 69624936D1 DE 69624936 T DE69624936 T DE 69624936T DE 69624936 T DE69624936 T DE 69624936T DE 69624936 D1 DE69624936 D1 DE 69624936D1
Authority
DE
Germany
Prior art keywords
solder
manufacturing
thermoelectric
manufacture
thermoelectric modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69624936T
Other languages
English (en)
Other versions
DE69624936T2 (de
Inventor
Michael Yahatz
James Harper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laird Technologies Inc
Original Assignee
Melcor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melcor Corp filed Critical Melcor Corp
Application granted granted Critical
Publication of DE69624936D1 publication Critical patent/DE69624936D1/de
Publication of DE69624936T2 publication Critical patent/DE69624936T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/82—Connection of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
DE69624936T 1995-10-03 1996-09-30 Herstellung thermoelektrischer module und lötmittel für diese herstellung Expired - Lifetime DE69624936T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53844995A 1995-10-03 1995-10-03
PCT/US1996/016077 WO1997013283A1 (en) 1995-10-03 1996-09-30 Fabrication of thermoelectric modules and solder for such fabrication

Publications (2)

Publication Number Publication Date
DE69624936D1 true DE69624936D1 (de) 2003-01-02
DE69624936T2 DE69624936T2 (de) 2003-03-27

Family

ID=24146982

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69624936T Expired - Lifetime DE69624936T2 (de) 1995-10-03 1996-09-30 Herstellung thermoelektrischer module und lötmittel für diese herstellung

Country Status (22)

Country Link
US (1) US5817188A (de)
EP (1) EP0870337B1 (de)
JP (1) JP3862179B2 (de)
KR (1) KR19990066931A (de)
CN (1) CN1326256C (de)
AT (1) ATE228270T1 (de)
AU (1) AU702453B2 (de)
BR (1) BR9610829A (de)
CA (1) CA2233979C (de)
CZ (1) CZ102898A3 (de)
DE (1) DE69624936T2 (de)
DK (1) DK0870337T3 (de)
EA (1) EA000388B1 (de)
ES (1) ES2183979T3 (de)
HU (1) HUP9902023A3 (de)
IL (1) IL123773A (de)
MX (1) MX9802673A (de)
NO (1) NO981507L (de)
PT (1) PT870337E (de)
TR (1) TR199800606T1 (de)
UA (1) UA51672C2 (de)
WO (1) WO1997013283A1 (de)

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US6492585B1 (en) 2000-03-27 2002-12-10 Marlow Industries, Inc. Thermoelectric device assembly and method for fabrication of same
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US6555413B1 (en) * 2001-02-23 2003-04-29 Triquint Technology Holding Co. Method for interconnecting semiconductor elements to form a thermoelectric cooler and a thermoelectric cooler formed therefrom
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US6756536B2 (en) * 2002-03-28 2004-06-29 Bae Systems Information And Electronic Systems Integration Inc. Thermoelectric microactuator
US6679064B2 (en) * 2002-05-13 2004-01-20 Taiwan Semiconductor Manufacturing Co., Ltd Wafer transfer system with temperature control apparatus
JP3989486B2 (ja) * 2002-06-06 2007-10-10 古河電気工業株式会社 熱電素子モジュール及びその作製方法
JP4401754B2 (ja) * 2003-11-28 2010-01-20 清仁 石田 熱電変換モジュールの製造方法
US8309838B2 (en) * 2004-01-16 2012-11-13 Massachusetts Institute Of Technology Potential amplified nonequilibrium thermal electric device (PANTEC)
CN100353534C (zh) * 2004-06-16 2007-12-05 华孚科技股份有限公司 热电式散热器的制造方法及所制造的热电式散热器
CN100346490C (zh) * 2004-06-21 2007-10-31 浙江大学 一种薄片型热电转换装置的制备方法
DE102004048220A1 (de) * 2004-09-30 2006-04-06 Basf Ag Kontaktierung thermoelektrischer Materialien durch Ultraschallschweißen
US7527101B2 (en) * 2005-01-27 2009-05-05 Schlumberger Technology Corporation Cooling apparatus and method
US8039726B2 (en) * 2005-05-26 2011-10-18 General Electric Company Thermal transfer and power generation devices and methods of making the same
US20070101737A1 (en) 2005-11-09 2007-05-10 Masao Akei Refrigeration system including thermoelectric heat recovery and actuation
US7310953B2 (en) 2005-11-09 2007-12-25 Emerson Climate Technologies, Inc. Refrigeration system including thermoelectric module
US20070277866A1 (en) * 2006-05-31 2007-12-06 General Electric Company Thermoelectric nanotube arrays
CN101409324B (zh) * 2008-07-24 2013-10-16 中国科学院上海硅酸盐研究所 一种碲化铋基热电发电器件的制造方法
US20100024436A1 (en) * 2008-08-01 2010-02-04 Baker Hughes Incorporated Downhole tool with thin film thermoelectric cooling
WO2010125411A1 (en) * 2009-04-27 2010-11-04 Szenergia Kft. Procedure for producing a device containing metal and intermetallic semiconductor parts joined together with an electrically conductive and heat conducting connection, especially a rod suitable for use with thermoelectric modules
DE102010035151A1 (de) * 2010-08-23 2012-02-23 Emitec Gesellschaft Für Emissionstechnologie Mbh Halbleiterelement für ein thermoelektrisches Modul und Verfahren zu dessen Herstellung
US8889454B2 (en) * 2011-11-08 2014-11-18 Ut-Battelle, Llc Manufacture of thermoelectric generator structures by fiber drawing
WO2013069347A1 (ja) * 2011-11-08 2013-05-16 富士通株式会社 熱電変換素子及びその製造方法
US8641917B2 (en) * 2011-12-01 2014-02-04 Toyota Motor Engineering & Manufacturing North America, Inc. Ternary thermoelectric material containing nanoparticles and process for producing the same
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CN108284286B (zh) * 2013-01-28 2020-07-03 日本半田株式会社 用于芯片焊接的钎焊合金
US11024789B2 (en) 2013-12-06 2021-06-01 Sridhar Kasichainula Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs
US10566515B2 (en) 2013-12-06 2020-02-18 Sridhar Kasichainula Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device
US10367131B2 (en) 2013-12-06 2019-07-30 Sridhar Kasichainula Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device
US20180090660A1 (en) 2013-12-06 2018-03-29 Sridhar Kasichainula Flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs
US10141492B2 (en) 2015-05-14 2018-11-27 Nimbus Materials Inc. Energy harvesting for wearable technology through a thin flexible thermoelectric device
US10290794B2 (en) 2016-12-05 2019-05-14 Sridhar Kasichainula Pin coupling based thermoelectric device
CA2868197C (en) 2014-01-31 2020-03-10 Berken Energy Llc Methods for thick film thermoelectric device fabrication
US20150240793A1 (en) * 2014-02-21 2015-08-27 The Boeing Company Temperature control system for shape-memory alloy
TWI575786B (zh) * 2014-04-08 2017-03-21 財團法人紡織產業綜合研究所 一種熱電轉換元件
KR20160028697A (ko) 2014-09-04 2016-03-14 한국전기연구원 벌크형 소면적 열전모듈 및 그 제조방법
US11283000B2 (en) 2015-05-14 2022-03-22 Nimbus Materials Inc. Method of producing a flexible thermoelectric device to harvest energy for wearable applications
US11276810B2 (en) 2015-05-14 2022-03-15 Nimbus Materials Inc. Method of producing a flexible thermoelectric device to harvest energy for wearable applications
US9995288B2 (en) 2016-01-28 2018-06-12 The Boeing Company Solid-state motor and associated systems and methods
EP3469445B1 (de) * 2016-06-14 2021-03-31 Ariel Scientific Innovations Ltd. Thermoelektrischer generator
US10288048B2 (en) 2016-12-16 2019-05-14 The Boeing Company Deforming shape memory alloy using self-regulating thermal elements
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CN108281541A (zh) * 2018-02-08 2018-07-13 南方科技大学 可预成型的热电器件及制备方法

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Also Published As

Publication number Publication date
JP2002507321A (ja) 2002-03-05
CA2233979A1 (en) 1997-04-10
JP3862179B2 (ja) 2006-12-27
KR19990066931A (ko) 1999-08-16
ATE228270T1 (de) 2002-12-15
EP0870337A1 (de) 1998-10-14
DK0870337T3 (da) 2003-03-03
MX9802673A (es) 1998-11-30
CZ102898A3 (cs) 1998-08-12
DE69624936T2 (de) 2003-03-27
AU7394796A (en) 1997-04-28
PT870337E (pt) 2003-03-31
CN1211342A (zh) 1999-03-17
EA000388B1 (ru) 1999-06-24
CA2233979C (en) 2005-09-27
US5817188A (en) 1998-10-06
AU702453B2 (en) 1999-02-18
EP0870337A4 (de) 1999-02-17
HUP9902023A2 (hu) 1999-11-29
BR9610829A (pt) 1999-12-21
TR199800606T1 (xx) 1998-06-22
IL123773A0 (en) 1999-11-30
EA199800303A1 (ru) 1998-10-29
IL123773A (en) 2001-03-19
HUP9902023A3 (en) 2002-11-28
NO981507D0 (no) 1998-04-02
UA51672C2 (uk) 2002-12-16
EP0870337B1 (de) 2002-11-20
CN1326256C (zh) 2007-07-11
ES2183979T3 (es) 2003-04-01
WO1997013283A1 (en) 1997-04-10
NO981507L (no) 1998-04-02

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Legal Events

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8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: THERMAGON, INC., CLEVELAND, OHIO, US