DE69626345T2 - Apparat zum Laden und Abladen einer Halbleiterscheibe - Google Patents

Apparat zum Laden und Abladen einer Halbleiterscheibe

Info

Publication number
DE69626345T2
DE69626345T2 DE69626345T DE69626345T DE69626345T2 DE 69626345 T2 DE69626345 T2 DE 69626345T2 DE 69626345 T DE69626345 T DE 69626345T DE 69626345 T DE69626345 T DE 69626345T DE 69626345 T2 DE69626345 T2 DE 69626345T2
Authority
DE
Germany
Prior art keywords
unloading
loading
semiconductor wafer
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69626345T
Other languages
English (en)
Other versions
DE69626345D1 (de
Inventor
Saburo Miyamoto
Minoru Ametani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP21263995A external-priority patent/JPH08207986A/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of DE69626345D1 publication Critical patent/DE69626345D1/de
Publication of DE69626345T2 publication Critical patent/DE69626345T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
DE69626345T 1995-07-27 1996-06-05 Apparat zum Laden und Abladen einer Halbleiterscheibe Expired - Fee Related DE69626345T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21263995A JPH08207986A (ja) 1994-12-07 1995-07-27 半導体ウエハの運搬容器

Publications (2)

Publication Number Publication Date
DE69626345D1 DE69626345D1 (de) 2003-04-03
DE69626345T2 true DE69626345T2 (de) 2003-09-18

Family

ID=16625980

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69626345T Expired - Fee Related DE69626345T2 (de) 1995-07-27 1996-06-05 Apparat zum Laden und Abladen einer Halbleiterscheibe

Country Status (4)

Country Link
US (1) US5759006A (de)
EP (1) EP0756314B1 (de)
KR (1) KR100432975B1 (de)
DE (1) DE69626345T2 (de)

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JPH09129719A (ja) * 1995-08-30 1997-05-16 Achilles Corp 半導体ウエハの収納構造および半導体ウエハの収納・取出し方法
US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US6322119B1 (en) 1999-07-09 2001-11-27 Semitool, Inc. Robots for microelectronic workpiece handling
US6749391B2 (en) 1996-07-15 2004-06-15 Semitool, Inc. Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US6318951B1 (en) 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
US6752584B2 (en) 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
DE19725866C1 (de) * 1997-06-18 1999-04-22 Ivoclar Ag Brennofen
ITTO980012A1 (it) * 1998-01-09 1999-07-09 Framatome Connectors Italia Connettore elettrico.
US6270306B1 (en) * 1998-01-14 2001-08-07 Applied Materials, Inc. Wafer aligner in center of front end frame of vacuum system
JPH11208708A (ja) * 1998-01-30 1999-08-03 Tokyo Electron Ltd クリーンルーム内への搬入物の梱包方法および梱包材
US5988393A (en) * 1998-06-15 1999-11-23 United Microelectronics Corp. Storage box for semiconductor wafers
CN1411420A (zh) * 1998-07-11 2003-04-16 塞米用具公司 用于装卸微电子工件的机器人
US6247889B1 (en) * 1998-07-31 2001-06-19 Bks Lab. Ltd. Multiple-shaft power transmission apparatus and wafer transport arm link
US6151864A (en) * 1999-04-28 2000-11-28 Semiconductor Technologies & Instruments System and method for transferring components between packing media
US6481951B1 (en) * 1999-09-16 2002-11-19 Applied Materials, Inc. Multiple sided robot blade for semiconductor processing equipment
US6265684B1 (en) * 1999-10-28 2001-07-24 Promos Technologies Inc. Wafer ID optical sorting system
US6356337B1 (en) * 2000-03-08 2002-03-12 Anvik Corporation Two-sided substrate imaging using single-approach projection optics
JP3955724B2 (ja) * 2000-10-12 2007-08-08 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
DE10121115A1 (de) * 2001-04-28 2002-10-31 Leica Microsystems Haltevorrichtung für Wafer
WO2003007350A2 (en) * 2001-07-12 2003-01-23 Speedline Manufacturing Company Wafer jar loader method, system and apparatus
US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
US7281741B2 (en) * 2001-07-13 2007-10-16 Semitool, Inc. End-effectors for handling microelectronic workpieces
KR100876446B1 (ko) * 2001-11-28 2008-12-29 가부시키가이샤 라이트세이사쿠쇼 반송 용기의 덮개 착탈 장치
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
US20030159921A1 (en) * 2002-02-22 2003-08-28 Randy Harris Apparatus with processing stations for manually and automatically processing microelectronic workpieces
US6991710B2 (en) * 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
US20070014656A1 (en) * 2002-07-11 2007-01-18 Harris Randy A End-effectors and associated control and guidance systems and methods
US20060043750A1 (en) * 2004-07-09 2006-03-02 Paul Wirth End-effectors for handling microfeature workpieces
US6976822B2 (en) * 2002-07-16 2005-12-20 Semitool, Inc. End-effectors and transfer devices for handling microelectronic workpieces
WO2004033103A2 (en) * 2002-10-09 2004-04-22 Entegris, Inc. High temperature, high strength, colorable materials for device processing systems
US20070020080A1 (en) * 2004-07-09 2007-01-25 Paul Wirth Transfer devices and methods for handling microfeature workpieces within an environment of a processing machine
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
JP5132904B2 (ja) * 2006-09-05 2013-01-30 東京エレクトロン株式会社 基板位置決め方法，基板位置検出方法，基板回収方法及び基板位置ずれ補正装置
KR101116839B1 (ko) * 2007-07-16 2012-03-07 (주)미래컴퍼니 자동 패킹 장치 및 방법
JP4600495B2 (ja) * 2008-03-06 2010-12-15 セイコーエプソン株式会社 ウエハ取り出し装置及び半導体装置の製造方法
DE102008012928B3 (de) * 2008-03-06 2009-06-04 Roth & Rau Ag Waferbox für den Transport von Solarzellenwafern
DE102009013353B3 (de) * 2009-03-16 2010-10-07 Siemens Aktiengesellschaft Verfahren zur Bestimmung von Rüstungen für konstante Tische von Bestückautomaten
DE102010049192B4 (de) * 2010-10-21 2014-07-03 Multivac Sepp Haggenmüller Gmbh & Co. Kg Greifersystem und Verfahren zum Ergreifen und Anheben von Objekten
WO2021016389A1 (en) 2019-07-22 2021-01-28 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
US11443129B2 (en) 2019-10-29 2022-09-13 Microsoft Technology Licensing, Llc Glass media unique identification and tracking system
KR102453632B1 (ko) * 2021-02-23 2022-10-12 (주)퓨렉스 웨이퍼 링 포장 장치

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Publication number Priority date Publication date Assignee Title
SE343811B (de) * 1970-06-22 1972-03-20 Emmaboda Glasverk Ab
DE3521010A1 (de) * 1985-06-12 1986-12-18 Robert Bosch Gmbh, 7000 Stuttgart Stapelvorrichtung fuer einheitliche, insbesondere plattenfoermige teile
US4842136A (en) * 1987-02-13 1989-06-27 Canon Kabushiki Kaisha Dust-proof container having improved construction for holding a reticle therein
US5061144A (en) * 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
JPH0626995B2 (ja) * 1989-01-27 1994-04-13 住友金属鉱山株式会社 スペーサー挿入型薄板整列装置
JPH04157756A (ja) * 1990-10-22 1992-05-29 Tel Varian Ltd ウエハー枚葉処理装置
JPH04257244A (ja) * 1991-02-12 1992-09-11 Fujitsu Ltd ウェーハキャリア
JPH05218185A (ja) * 1992-02-06 1993-08-27 Nippon Steel Corp ウェハキャリアボックス
EP0582018B1 (de) * 1992-08-04 1995-10-18 International Business Machines Corporation Unter Druck stehende Koppelsysteme zum Transferieren von einem Halbleiterwafer zwischen einem tragbaren abdichtbaren unter druckstehenden Behälter und einer Bearbeitungsanlage
JPH06216227A (ja) * 1993-01-12 1994-08-05 Nippon Steel Corp ウェーハキャリアケース
US5570987A (en) * 1993-12-14 1996-11-05 W. L. Gore & Associates, Inc. Semiconductor wafer transport container
JPH07307380A (ja) * 1994-05-12 1995-11-21 Sony Corp キャリアボックス
KR0135152B1 (ko) * 1994-05-27 1998-04-25 문정환 트레이 상면 종이 덮음장치
KR200198406Y1 (ko) * 1994-06-15 2000-11-01 김영환 웨이퍼 보관용 질소상자
KR0150052B1 (ko) * 1994-08-02 1998-12-01 김주용 웨이퍼 이송장치 및 방법

Also Published As

Publication number Publication date
EP0756314A2 (de) 1997-01-29
KR970008466A (ko) 1997-02-24
DE69626345D1 (de) 2003-04-03
US5759006A (en) 1998-06-02
EP0756314A3 (de) 1997-05-07
EP0756314B1 (de) 2003-02-26
KR100432975B1 (ko) 2004-10-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee