DE69630495D1 - Poliergerät - Google Patents

Poliergerät

Info

Publication number
DE69630495D1
DE69630495D1 DE69630495T DE69630495T DE69630495D1 DE 69630495 D1 DE69630495 D1 DE 69630495D1 DE 69630495 T DE69630495 T DE 69630495T DE 69630495 T DE69630495 T DE 69630495T DE 69630495 D1 DE69630495 D1 DE 69630495D1
Authority
DE
Germany
Prior art keywords
polisher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69630495T
Other languages
English (en)
Other versions
DE69630495T2 (de
Inventor
Tetsuji Togawa
Kunihiko Sakurai
Ritsuo Kikuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of DE69630495D1 publication Critical patent/DE69630495D1/de
Application granted granted Critical
Publication of DE69630495T2 publication Critical patent/DE69630495T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
DE69630495T 1995-08-21 1996-08-21 Poliergerät Expired - Lifetime DE69630495T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP23466395 1995-08-21
JP23466395 1995-08-21

Publications (2)

Publication Number Publication Date
DE69630495D1 true DE69630495D1 (de) 2003-12-04
DE69630495T2 DE69630495T2 (de) 2004-06-24

Family

ID=16974540

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69630495T Expired - Lifetime DE69630495T2 (de) 1995-08-21 1996-08-21 Poliergerät

Country Status (5)

Country Link
US (3) US5830045A (de)
EP (2) EP0761387B1 (de)
JP (1) JP3841491B2 (de)
KR (3) KR100487590B1 (de)
DE (1) DE69630495T2 (de)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
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JP2000315665A (ja) 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
US6413156B1 (en) * 1996-05-16 2002-07-02 Ebara Corporation Method and apparatus for polishing workpiece
DE19732433A1 (de) * 1996-07-29 1998-02-12 Mitsubishi Material Silicon Verfahren und Gerät zum Polieren von Schrägkanten von Halbleiterwafern
US6149506A (en) * 1998-10-07 2000-11-21 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
JP3231659B2 (ja) 1997-04-28 2001-11-26 日本電気株式会社 自動研磨装置
DE19719503C2 (de) * 1997-05-07 2002-05-02 Wolters Peter Werkzeugmasch Vorrichtung zum chemisch-mechanischen Polieren von Oberflächen von Halbleiterwafern und Verfahren zum Betrieb der Vorrichtung
US6036582A (en) * 1997-06-06 2000-03-14 Ebara Corporation Polishing apparatus
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
US6110011A (en) 1997-11-10 2000-08-29 Applied Materials, Inc. Integrated electrodeposition and chemical-mechanical polishing tool
KR100524054B1 (ko) * 1997-11-21 2005-10-26 가부시키가이샤 에바라 세이사꾸쇼 폴리싱 장치와 이에 사용되는 대상물 홀더 및 폴리싱 방법 및 웨이퍼제조방법
JPH11204468A (ja) * 1998-01-09 1999-07-30 Speedfam Co Ltd 半導体ウエハの表面平坦化装置
US6102777A (en) * 1998-03-06 2000-08-15 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
JP4156039B2 (ja) * 1998-03-09 2008-09-24 株式会社荏原製作所 ポリッシング装置
US6045299A (en) * 1998-04-13 2000-04-04 International Business Machines Corp. Unidirectional gate between interconnecting fluid transport regions
US6283824B1 (en) 1998-05-21 2001-09-04 Tycom Corporation Automated drill bit re-sharpening and verification system
US6030276A (en) * 1998-05-21 2000-02-29 Tycom Corporation Automated drill bit re-shapening and verification system
US20060128272A1 (en) * 1998-05-21 2006-06-15 Tycom Corporation Automated drill bit re-sharpening and verification system
JP2000040679A (ja) * 1998-07-24 2000-02-08 Hitachi Ltd 半導体集積回路装置の製造方法
US6193588B1 (en) 1998-09-02 2001-02-27 Micron Technology, Inc. Method and apparatus for planarizing and cleaning microelectronic substrates
JP3702668B2 (ja) * 1998-09-28 2005-10-05 株式会社村田製作所 電子部品チップ供給装置
JP3045233B2 (ja) * 1998-10-16 2000-05-29 株式会社東京精密 ウェーハ研磨装置
JP3979750B2 (ja) * 1998-11-06 2007-09-19 株式会社荏原製作所 基板の研磨装置
US6309279B1 (en) * 1999-02-19 2001-10-30 Speedfam-Ipec Corporation Arrangements for wafer polishing
SG97860A1 (en) * 1999-03-05 2003-08-20 Ebara Corp Polishing apparatus
US6358128B1 (en) * 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US7192494B2 (en) 1999-03-05 2007-03-20 Applied Materials, Inc. Method and apparatus for annealing copper films
US6354922B1 (en) * 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
US6227950B1 (en) * 1999-03-08 2001-05-08 Speedfam-Ipec Corporation Dual purpose handoff station for workpiece polishing machine
TW467795B (en) * 1999-03-15 2001-12-11 Mitsubishi Materials Corp Wafer transporting device, wafer polishing device and method for making wafers
US6244931B1 (en) * 1999-04-02 2001-06-12 Applied Materials, Inc. Buffer station on CMP system
JP4790695B2 (ja) * 1999-08-20 2011-10-12 株式会社荏原製作所 ポリッシング装置
JP3753569B2 (ja) * 1999-08-24 2006-03-08 株式会社荏原製作所 ポリッシング装置
US6855030B2 (en) * 1999-10-27 2005-02-15 Strasbaugh Modular method for chemical mechanical planarization
WO2001048800A1 (fr) * 1999-12-24 2001-07-05 Ebara Corporation Procede et appareil de traitement de tranche de semi-conducteur
JP3556148B2 (ja) * 2000-03-23 2004-08-18 株式会社東京精密 ウェハ研磨装置
JP3510177B2 (ja) * 2000-03-23 2004-03-22 株式会社東京精密 ウェハ研磨装置
US6413145B1 (en) * 2000-04-05 2002-07-02 Applied Materials, Inc. System for polishing and cleaning substrates
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
JP3916375B2 (ja) * 2000-06-02 2007-05-16 株式会社荏原製作所 ポリッシング方法および装置
US6645550B1 (en) * 2000-06-22 2003-11-11 Applied Materials, Inc. Method of treating a substrate
US20040079633A1 (en) * 2000-07-05 2004-04-29 Applied Materials, Inc. Apparatus for electro chemical deposition of copper metallization with the capability of in-situ thermal annealing
US6488565B1 (en) * 2000-08-29 2002-12-03 Applied Materials, Inc. Apparatus for chemical mechanical planarization having nested load cups
US7172497B2 (en) * 2001-01-05 2007-02-06 Asm Nutool, Inc. Fabrication of semiconductor interconnect structures
US6953392B2 (en) * 2001-01-05 2005-10-11 Asm Nutool, Inc. Integrated system for processing semiconductor wafers
US6672943B2 (en) 2001-01-26 2004-01-06 Wafer Solutions, Inc. Eccentric abrasive wheel for wafer processing
US7204743B2 (en) * 2001-02-27 2007-04-17 Novellus Systems, Inc. Integrated circuit interconnect fabrication systems
TWI222154B (en) * 2001-02-27 2004-10-11 Asm Nutool Inc Integrated system for processing semiconductor wafers
US20040259348A1 (en) * 2001-02-27 2004-12-23 Basol Bulent M. Method of reducing post-CMP defectivity
US6632012B2 (en) 2001-03-30 2003-10-14 Wafer Solutions, Inc. Mixing manifold for multiple inlet chemistry fluids
US20030022498A1 (en) * 2001-07-27 2003-01-30 Jeong In Kwon CMP system and method for efficiently processing semiconductor wafers
US6638145B2 (en) * 2001-08-31 2003-10-28 Koninklijke Philips Electronics N.V. Constant pH polish and scrub
US6866565B2 (en) * 2002-01-29 2005-03-15 Ebara Corporation Polishing tool and polishing apparatus
KR100470230B1 (ko) * 2002-02-08 2005-02-05 두산디앤디 주식회사 화학기계적 연마장치
JP4197103B2 (ja) * 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
US6875076B2 (en) * 2002-06-17 2005-04-05 Accretech Usa, Inc. Polishing machine and method
JP2004106084A (ja) * 2002-09-17 2004-04-08 Ebara Corp ポリッシング装置及び基板処理装置
US7273408B2 (en) * 2005-12-16 2007-09-25 Applied Materials, Inc. Paired pivot arm
JP4413882B2 (ja) * 2006-03-20 2010-02-10 株式会社荏原製作所 ポリッシング装置
JP2007043183A (ja) * 2006-09-05 2007-02-15 Renesas Technology Corp 半導体集積回路装置の製造方法
KR100840648B1 (ko) 2006-12-29 2008-06-24 동부일렉트로닉스 주식회사 화학기계적 연마 장치와 이를 이용한 웨이퍼 건조 방법
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
JP2009194134A (ja) 2008-02-14 2009-08-27 Ebara Corp 研磨方法及び研磨装置
KR101958874B1 (ko) 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
JP4729647B1 (ja) * 2010-11-02 2011-07-20 日東電工株式会社 液晶表示素子の製造システム
US20130115862A1 (en) * 2011-11-09 2013-05-09 Applied Materials, Inc. Chemical mechanical polishing platform architecture
JP6341639B2 (ja) * 2013-08-01 2018-06-13 株式会社ディスコ 加工装置
JP6587379B2 (ja) * 2014-09-01 2019-10-09 株式会社荏原製作所 研磨装置
JP6971676B2 (ja) * 2016-08-29 2021-11-24 株式会社荏原製作所 基板処理装置および基板処理方法
CN107799436B (zh) * 2016-08-29 2023-07-07 株式会社荏原制作所 基板处理装置及基板处理方法
CN107030587A (zh) * 2017-05-24 2017-08-11 青海新高科材料研究院有限公司 一种用于铝锭表面抛光的装置
US11705354B2 (en) 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
KR102360621B1 (ko) 2021-02-09 2022-02-16 주식회사 가우디자인 소화기 설치형 안전표지판

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GB256169A (en) 1925-08-03 1926-08-19 Chamberlain & Hookham Ltd Improvements in electrolytic meters
US4141180A (en) * 1977-09-21 1979-02-27 Kayex Corporation Polishing apparatus
US4208760A (en) * 1977-12-19 1980-06-24 Huestis Machine Corp. Apparatus and method for cleaning wafers
JPS5619635A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Manufacturing apparatus
JPS57132965A (en) 1981-02-03 1982-08-17 Shibayama Kikai Kk One pass type multi-head plane grinding, polishing, washing automatic machine
FR2505712A1 (fr) 1981-05-18 1982-11-19 Procedes Equip Sciences Ind Sa Machine a polir automatique, pour plaquettes minces, fragiles et deformables
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
JPS62102973A (ja) 1985-10-28 1987-05-13 Toshiba Corp 全自動ポリシング装置
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US4944119A (en) 1988-06-20 1990-07-31 Westech Systems, Inc. Apparatus for transporting wafer to and from polishing head
JP3200869B2 (ja) * 1991-05-09 2001-08-20 住友電気工業株式会社 自動研磨機
US5329732A (en) * 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
JP2655975B2 (ja) * 1992-09-18 1997-09-24 三菱マテリアル株式会社 ウェーハ研磨装置
US5679059A (en) 1994-11-29 1997-10-21 Ebara Corporation Polishing aparatus and method
KR100390293B1 (ko) * 1993-09-21 2003-09-02 가부시끼가이샤 도시바 폴리싱장치
JP3326642B2 (ja) * 1993-11-09 2002-09-24 ソニー株式会社 基板の研磨後処理方法およびこれに用いる研磨装置
JPH07132965A (ja) * 1993-11-10 1995-05-23 Permachem Asia Ltd トイレット用水処理剤
JP2586319B2 (ja) * 1993-12-15 1997-02-26 日本電気株式会社 半導体基板の研磨方法
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Also Published As

Publication number Publication date
EP1389505A3 (de) 2004-02-25
JP3841491B2 (ja) 2006-11-01
US20020009954A1 (en) 2002-01-24
KR970013088A (ko) 1997-03-29
EP1389505A2 (de) 2004-02-18
EP0761387B1 (de) 2003-10-29
US6942541B2 (en) 2005-09-13
US6283822B1 (en) 2001-09-04
KR100508995B1 (ko) 2005-08-18
KR100488434B1 (ko) 2005-05-11
JPH09117857A (ja) 1997-05-06
KR100487590B1 (ko) 2005-08-04
US5830045A (en) 1998-11-03
EP0761387A1 (de) 1997-03-12
DE69630495T2 (de) 2004-06-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition