DE69634144D1 - Verfahren und Vorrichtung zum Polieren von Werkstücken - Google Patents
Verfahren und Vorrichtung zum Polieren von WerkstückenInfo
- Publication number
- DE69634144D1 DE69634144D1 DE69634144T DE69634144T DE69634144D1 DE 69634144 D1 DE69634144 D1 DE 69634144D1 DE 69634144 T DE69634144 T DE 69634144T DE 69634144 T DE69634144 T DE 69634144T DE 69634144 D1 DE69634144 D1 DE 69634144D1
- Authority
- DE
- Germany
- Prior art keywords
- polishing workpieces
- workpieces
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28797695 | 1995-10-09 | ||
JP28797695 | 1995-10-09 | ||
JP5095696A JP3724869B2 (ja) | 1995-10-09 | 1996-02-14 | ポリッシング装置および方法 |
JP5095696 | 1996-02-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69634144D1 true DE69634144D1 (de) | 2005-02-03 |
DE69634144T2 DE69634144T2 (de) | 2005-12-29 |
Family
ID=26391458
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69620333T Expired - Lifetime DE69620333T2 (de) | 1995-10-09 | 1996-10-09 | Verfahren und Vorrichtung zum Polieren von Werkstücken |
DE69634144T Expired - Lifetime DE69634144T2 (de) | 1995-10-09 | 1996-10-09 | Verfahren und Vorrichtung zum Polieren von Werkstücken |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69620333T Expired - Lifetime DE69620333T2 (de) | 1995-10-09 | 1996-10-09 | Verfahren und Vorrichtung zum Polieren von Werkstücken |
Country Status (5)
Country | Link |
---|---|
US (2) | US6033520A (de) |
EP (2) | EP0768148B1 (de) |
JP (1) | JP3724869B2 (de) |
KR (1) | KR100435302B1 (de) |
DE (2) | DE69620333T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3724869B2 (ja) * | 1995-10-09 | 2005-12-07 | 株式会社荏原製作所 | ポリッシング装置および方法 |
DE69717510T2 (de) * | 1996-01-24 | 2003-10-02 | Lam Res Corp | Halbleiterscheiben-Polierkopf |
JPH10230455A (ja) * | 1997-02-17 | 1998-09-02 | Nec Corp | 研磨装置 |
US5857899A (en) * | 1997-04-04 | 1999-01-12 | Ontrak Systems, Inc. | Wafer polishing head with pad dressing element |
US6425812B1 (en) | 1997-04-08 | 2002-07-30 | Lam Research Corporation | Polishing head for chemical mechanical polishing using linear planarization technology |
US6077385A (en) * | 1997-04-08 | 2000-06-20 | Ebara Corporation | Polishing apparatus |
US6244946B1 (en) | 1997-04-08 | 2001-06-12 | Lam Research Corporation | Polishing head with removable subcarrier |
JP3959173B2 (ja) * | 1998-03-27 | 2007-08-15 | 株式会社東芝 | 研磨装置及び研磨加工方法 |
EP0992322A4 (de) * | 1998-04-06 | 2006-09-27 | Ebara Corp | Schleifvorrichtung |
JP2000060091A (ja) * | 1998-08-06 | 2000-02-25 | Ebara Corp | 回転電機 |
US6666756B1 (en) | 2000-03-31 | 2003-12-23 | Lam Research Corporation | Wafer carrier head assembly |
JP2001298006A (ja) | 2000-04-17 | 2001-10-26 | Ebara Corp | 研磨装置 |
JP2001338901A (ja) * | 2000-05-26 | 2001-12-07 | Hitachi Ltd | 平坦化加工方法及び、装置並びに,半導体装置の製造方法 |
EP1177859B1 (de) * | 2000-07-31 | 2009-04-15 | Ebara Corporation | Substrathalter und Poliervorrichtung |
JP2002187060A (ja) | 2000-10-11 | 2002-07-02 | Ebara Corp | 基板保持装置、ポリッシング装置、及び研磨方法 |
JP2005034959A (ja) * | 2003-07-16 | 2005-02-10 | Ebara Corp | 研磨装置及びリテーナリング |
US7186651B2 (en) * | 2003-10-30 | 2007-03-06 | Texas Instruments Incorporated | Chemical mechanical polishing method and apparatus |
US7004827B1 (en) | 2004-02-12 | 2006-02-28 | Komag, Inc. | Method and apparatus for polishing a workpiece |
US7338569B2 (en) * | 2004-09-29 | 2008-03-04 | Agere Systems Inc. | Method and system of using offset gage for CMP polishing pad alignment and adjustment |
JP4757580B2 (ja) | 2005-09-16 | 2011-08-24 | 株式会社荏原製作所 | 研磨方法及び研磨装置、並びに研磨装置制御用プログラム |
US20140273756A1 (en) * | 2013-03-14 | 2014-09-18 | Chih Hung Chen | Substrate precession mechanism for cmp polishing head |
JP6888476B2 (ja) | 2016-08-23 | 2021-06-16 | 信越化学工業株式会社 | 基板の製造方法 |
JP7074606B2 (ja) * | 2018-08-02 | 2022-05-24 | 株式会社荏原製作所 | 基板を保持するためのトップリングおよび基板処理装置 |
CN115091359B (zh) * | 2022-05-26 | 2023-09-05 | 浙江晶盛机电股份有限公司 | 抛光载体 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5911423B2 (ja) * | 1974-04-10 | 1984-03-15 | 株式会社日立製作所 | ラツピング装置 |
JPS55157473A (en) * | 1979-05-22 | 1980-12-08 | Nippon Telegr & Teleph Corp <Ntt> | Polishing method |
JPS5727659A (en) * | 1980-07-18 | 1982-02-15 | Supiide Fuamu Kk | Lapping machine |
JPS62213960A (ja) * | 1986-03-14 | 1987-09-19 | Hitachi Ltd | ラツピング治具 |
JPS6410642A (en) * | 1987-07-02 | 1989-01-13 | Sony Corp | Bonding method for semiconductor substrate |
EP0383910A4 (en) * | 1988-02-17 | 1991-04-17 | Gruzinsky Politekhnichesky Institut Imeni V.I. Lenina | Method and cassette for abrasive machining of the surface of parts |
US4954142A (en) * | 1989-03-07 | 1990-09-04 | International Business Machines Corporation | Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
US5205082A (en) * | 1991-12-20 | 1993-04-27 | Cybeq Systems, Inc. | Wafer polisher head having floating retainer ring |
JP3370112B2 (ja) * | 1992-10-12 | 2003-01-27 | 不二越機械工業株式会社 | ウエハーの研磨装置 |
US5635083A (en) * | 1993-08-06 | 1997-06-03 | Intel Corporation | Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate |
US5449316A (en) * | 1994-01-05 | 1995-09-12 | Strasbaugh; Alan | Wafer carrier for film planarization |
US5651724A (en) * | 1994-09-08 | 1997-07-29 | Ebara Corporation | Method and apparatus for polishing workpiece |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
US5665656A (en) * | 1995-05-17 | 1997-09-09 | National Semiconductor Corporation | Method and apparatus for polishing a semiconductor substrate wafer |
US6024630A (en) * | 1995-06-09 | 2000-02-15 | Applied Materials, Inc. | Fluid-pressure regulated wafer polishing head |
US5795215A (en) * | 1995-06-09 | 1998-08-18 | Applied Materials, Inc. | Method and apparatus for using a retaining ring to control the edge effect |
JP3724869B2 (ja) * | 1995-10-09 | 2005-12-07 | 株式会社荏原製作所 | ポリッシング装置および方法 |
JP3072962B2 (ja) * | 1995-11-30 | 2000-08-07 | ロデール・ニッタ株式会社 | 研磨のための被加工物の保持具及びその製法 |
KR100456803B1 (ko) * | 1996-02-05 | 2005-05-09 | 가부시키 가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
KR100485002B1 (ko) * | 1996-02-16 | 2005-08-29 | 가부시키가이샤 에바라 세이사꾸쇼 | 작업물폴리싱장치및방법 |
-
1996
- 1996-02-14 JP JP5095696A patent/JP3724869B2/ja not_active Expired - Lifetime
- 1996-10-08 KR KR1019960044548A patent/KR100435302B1/ko not_active IP Right Cessation
- 1996-10-09 DE DE69620333T patent/DE69620333T2/de not_active Expired - Lifetime
- 1996-10-09 EP EP96116163A patent/EP0768148B1/de not_active Expired - Lifetime
- 1996-10-09 EP EP01122244A patent/EP1170090B1/de not_active Expired - Lifetime
- 1996-10-09 DE DE69634144T patent/DE69634144T2/de not_active Expired - Lifetime
- 1996-10-09 US US08/728,070 patent/US6033520A/en not_active Expired - Lifetime
-
2000
- 2000-02-07 US US09/499,472 patent/US6432258B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0768148B1 (de) | 2002-04-03 |
KR100435302B1 (ko) | 2004-10-22 |
EP0768148A1 (de) | 1997-04-16 |
JPH09168964A (ja) | 1997-06-30 |
DE69620333D1 (de) | 2002-05-08 |
DE69634144T2 (de) | 2005-12-29 |
EP1170090B1 (de) | 2004-12-29 |
EP1170090A1 (de) | 2002-01-09 |
DE69620333T2 (de) | 2002-11-14 |
US6432258B1 (en) | 2002-08-13 |
JP3724869B2 (ja) | 2005-12-07 |
US6033520A (en) | 2000-03-07 |
KR970063545A (ko) | 1997-09-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |