DE69635724D1 - Kontaktlose Chipkarte und Herstellungsverfahren - Google Patents

Kontaktlose Chipkarte und Herstellungsverfahren

Info

Publication number
DE69635724D1
DE69635724D1 DE69635724T DE69635724T DE69635724D1 DE 69635724 D1 DE69635724 D1 DE 69635724D1 DE 69635724 T DE69635724 T DE 69635724T DE 69635724 T DE69635724 T DE 69635724T DE 69635724 D1 DE69635724 D1 DE 69635724D1
Authority
DE
Germany
Prior art keywords
manufacturing process
chip card
contactless chip
contactless
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69635724T
Other languages
English (en)
Other versions
DE69635724T2 (de
Inventor
Katsuhisa Orihara
Masahiro Fujimoto
Haruo Monkawa
Hideyuki Kurita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=14617395&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69635724(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of DE69635724D1 publication Critical patent/DE69635724D1/de
Application granted granted Critical
Publication of DE69635724T2 publication Critical patent/DE69635724T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48265—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/819—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
    • H01L2224/81901—Pressing the bump connector against the bonding areas by means of another connector
    • H01L2224/81903—Pressing the bump connector against the bonding areas by means of another connector by means of a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
DE69635724T 1995-04-13 1996-04-11 Kontaktlose Chipkarte und Herstellungsverfahren Expired - Lifetime DE69635724T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7113641A JP2814477B2 (ja) 1995-04-13 1995-04-13 非接触式ｉｃカード及びその製造方法
JP11364195 1995-04-13

Publications (2)

Publication Number Publication Date
DE69635724D1 true DE69635724D1 (de) 2006-04-06
DE69635724T2 DE69635724T2 (de) 2006-09-07

Family

ID=14617395

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69635724T Expired - Lifetime DE69635724T2 (de) 1995-04-13 1996-04-11 Kontaktlose Chipkarte und Herstellungsverfahren

Country Status (5)

Country Link
US (1) US5705852A (de)
EP (1) EP0737935B1 (de)
JP (1) JP2814477B2 (de)
KR (1) KR100416410B1 (de)
DE (1) DE69635724T2 (de)

Families Citing this family (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4410732C2 (de) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
KR19990035991A (ko) * 1995-08-01 1999-05-25 노버트 토마셰크, 요셉 발크너 비접촉 작용 전송 시스템 및 콤포넌트를 구비한 비접촉 작용카드형 데이터 캐리어와 이런 카드형 데이터 캐리어 및 그모듈의 생산 방법
US5861661A (en) * 1995-12-27 1999-01-19 Industrial Technology Research Institute Composite bump tape automated bonded structure
DE19609134A1 (de) * 1996-03-08 1997-09-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers mit einem elektronischen Modul
DE19753619A1 (de) * 1997-10-29 1999-05-06 Meto International Gmbh Identifizierungselement und Verfahren zu seiner Herstellung
FR2756648B1 (fr) 1996-11-29 1999-01-08 Solaic Sa Carte a memoire du type sans contact
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
EP1034942A4 (de) 1996-12-26 2005-07-06 Hitachi Ltd Halbleiteranordnung und herstellungsverfahren dafür
JPH10193849A (ja) * 1996-12-27 1998-07-28 Rohm Co Ltd 回路チップ搭載カードおよび回路チップモジュール
JP3960645B2 (ja) 1996-12-27 2007-08-15 ローム株式会社 回路チップ搭載カードおよび回路チップモジュール
JPH10203066A (ja) * 1997-01-28 1998-08-04 Hitachi Ltd 非接触ｉｃカード
DE19713642A1 (de) * 1997-04-02 1998-10-08 Ods Gmbh & Co Kg Verfahren zur Herstellung kontaktloser Chipkarten
DE19716342C2 (de) * 1997-04-18 1999-02-25 Pav Card Gmbh Verfahren zur Herstellung einer Chipkarte
AU7239098A (en) * 1997-05-19 1998-12-11 Hitachi Maxell, Ltd. Flexible ic module and method of its manufacture, and method of manufacturing information carrier comprising flexible ic module
EP0913268A4 (de) * 1997-05-19 2004-11-17 Hitachi Maxell Flexibeles ic-modul und verfahren zu seiner herstellung und verfahren zur herstellung eines informationsträgers, der ein ic-modul enthält
JPH10320519A (ja) * 1997-05-19 1998-12-04 Rohm Co Ltd Ｉｃカード通信システムにおける応答器
JPH1111055A (ja) * 1997-06-20 1999-01-19 Toshiba Corp 無線モジュール及び無線カード
DE69819299T2 (de) * 1997-06-23 2004-07-29 Rohm Co. Ltd. Ic modul und ic karte
EP0919950B1 (de) * 1997-06-23 2007-04-04 Rohm Co., Ltd. Modul für ic-karte, ic-karte und verfahren zu seiner herstellung
JPH1131784A (ja) * 1997-07-10 1999-02-02 Rohm Co Ltd 非接触ｉｃカード
FR2769109B1 (fr) * 1997-09-26 1999-11-19 Gemplus Sca Dispositif electronique a puce jetable et procede de fabrication
FR2769441A1 (fr) * 1997-10-07 1999-04-09 Philips Electronics Nv Carte electronique sans contact et son procede de fabrication
FR2769389B1 (fr) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
JP3663938B2 (ja) * 1997-10-24 2005-06-22 セイコーエプソン株式会社 フリップチップ実装方法
JPH11161760A (ja) * 1997-11-26 1999-06-18 Hitachi Ltd 薄型電子回路部品及びその製造方法及びその製造装置
AU2546499A (en) 1998-02-13 1999-08-30 Shinko Electric Industries Co., Ltd. Ic card and its frame
JPH11250214A (ja) * 1998-03-03 1999-09-17 Matsushita Electron Corp 部品の実装方法とｉｃカード及びその製造方法
FR2778475B1 (fr) * 1998-05-11 2001-11-23 Schlumberger Systems & Service Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
US6255725B1 (en) 1998-05-28 2001-07-03 Shinko Electric Industries Co., Ltd. IC card and plane coil for IC card
TW428149B (en) * 1998-05-28 2001-04-01 Shinko Electric Ind Co IC card and plane coil for IC card
US6130613A (en) * 1998-06-09 2000-10-10 Motorola, Inc. Radio frequency indentification stamp and radio frequency indentification mailing label
FR2781298B1 (fr) * 1998-07-20 2003-01-31 St Microelectronics Sa Procede de fabrication d'une carte a puce electronique et carte a puce electronique
EP0977145A3 (de) * 1998-07-28 2002-11-06 Kabushiki Kaisha Toshiba Radio IC-Karte
EP1117064B1 (de) * 1998-07-31 2005-01-26 Matsushita Electric Industrial Co., Ltd. Eine zweifach verwendbare kontaktlose Chipkarte, ein System bestehend aus Endgerät und Karte, und Kommunikationsverfahren
US6147605A (en) * 1998-09-11 2000-11-14 Motorola, Inc. Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag
JP3484356B2 (ja) * 1998-09-28 2004-01-06 新光電気工業株式会社 Ｉｃカード及びｉｃカード用アンテナ並びにｉｃカード用アンテナフレーム
KR100629923B1 (ko) * 1998-09-30 2006-09-29 돗빤호무즈가부시기가이샤 도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
TW484101B (en) 1998-12-17 2002-04-21 Hitachi Ltd Semiconductor device and its manufacturing method
FR2787609B1 (fr) * 1998-12-21 2001-02-09 Gemplus Card Int Procede de fabrication de carte a puce sans contact
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
DE19905886A1 (de) * 1999-02-11 2000-08-17 Meto International Gmbh Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements
KR100530760B1 (ko) * 1999-02-18 2005-11-23 삼성테크윈 주식회사 비접촉형 집적회로카드 및 그 제조방법
JP3335938B2 (ja) * 1999-03-01 2002-10-21 新光電気工業株式会社 Ｉｃカード用アンテナフレーム及びｉｃカードの製造方法
FR2793054B1 (fr) * 1999-04-29 2001-06-29 Schlumberger Systems & Service Procede de fabrication de cartes sans contact par laminage et carte sans contact fabriquee selon un tel procede
JP3687459B2 (ja) * 1999-06-29 2005-08-24 ソニーケミカル株式会社 Ｉｃカード
JP2001024145A (ja) 1999-07-13 2001-01-26 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
WO2001006558A1 (fr) 1999-07-16 2001-01-25 Matsushita Electric Industrial Co., Ltd. Emballage de dispositifs a semi-conducteurs et leur procede de fabrication
JP2001043336A (ja) * 1999-07-29 2001-02-16 Sony Chem Corp Ｉｃカード
DE60037717T2 (de) * 1999-08-31 2009-01-15 Nxp B.V. Datenträger mit integriertem schaltkreis und übertragungsspule
US7070112B2 (en) * 1999-09-07 2006-07-04 American Express Travel Related Services Company, Inc. Transparent transaction device
US7889052B2 (en) 2001-07-10 2011-02-15 Xatra Fund Mx, Llc Authorizing payment subsequent to RF transactions
US7239226B2 (en) * 2001-07-10 2007-07-03 American Express Travel Related Services Company, Inc. System and method for payment using radio frequency identification in contact and contactless transactions
CA2350705C (en) * 1999-10-08 2008-01-15 Dai Nippon Printing Co., Ltd. Non-contact data carrier and ic chip
EP1234275B1 (de) * 1999-12-02 2004-03-31 Infineon Technologies AG Chipkartenmodul mit anisotrop leitfähiger trägerfolie
JP2001188891A (ja) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd 非接触型ｉｃカード
AU2001243473A1 (en) * 2000-03-07 2001-09-17 American Express Travel Related Services Company, Inc. System for facilitating a transaction
FI112287B (fi) 2000-03-31 2003-11-14 Rafsec Oy Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
WO2001075772A2 (en) * 2000-04-04 2001-10-11 Smartag (S) Pte Ltd. Method for manufacturing of rfid inlet
NZ504686A (en) * 2000-05-22 2002-08-28 Frederick Johnston Needham Office chair including self contained air conditioning system
JP2001344580A (ja) * 2000-05-31 2001-12-14 Toppan Forms Co Ltd 非接触型データ送受信体およびその製造方法
JP2002074305A (ja) * 2000-09-05 2002-03-15 Dainippon Printing Co Ltd 非接触ｉｃカード及びその製造方法
US6424263B1 (en) * 2000-12-01 2002-07-23 Microchip Technology Incorporated Radio frequency identification tag on a single layer substrate
JP2002319011A (ja) * 2001-01-31 2002-10-31 Canon Inc 半導体装置、半導体装置の製造方法及び電子写真装置
US7650314B1 (en) 2001-05-25 2010-01-19 American Express Travel Related Services Company, Inc. System and method for securing a recurrent billing transaction
JP4789348B2 (ja) * 2001-05-31 2011-10-12 リンテック株式会社 面状コイル部品、面状コイル部品の特性調整方法、ｉｄタグ、及び、ｉｄタグの共振周波数の調整方法
FI112550B (fi) * 2001-05-31 2003-12-15 Rafsec Oy Älytarra ja älytarraraina
EP2315510A3 (de) * 2001-06-05 2012-05-02 Dai Nippon Printing Co., Ltd. Leiterplatte mit passiven Elementen
DE60234224D1 (de) * 2001-06-19 2009-12-10 Nippon Carbide Kogyo Kk In einer integrierten Schaltung eingeschlossenes Rückstrahlprodukt
US20040236699A1 (en) 2001-07-10 2004-11-25 American Express Travel Related Services Company, Inc. Method and system for hand geometry recognition biometrics on a fob
US7705732B2 (en) * 2001-07-10 2010-04-27 Fred Bishop Authenticating an RF transaction using a transaction counter
US7249112B2 (en) 2002-07-09 2007-07-24 American Express Travel Related Services Company, Inc. System and method for assigning a funding source for a radio frequency identification device
US9024719B1 (en) 2001-07-10 2015-05-05 Xatra Fund Mx, Llc RF transaction system and method for storing user personal data
US8548927B2 (en) 2001-07-10 2013-10-01 Xatra Fund Mx, Llc Biometric registration for facilitating an RF transaction
US7668750B2 (en) 2001-07-10 2010-02-23 David S Bonalle Securing RF transactions using a transactions counter
US7360689B2 (en) 2001-07-10 2008-04-22 American Express Travel Related Services Company, Inc. Method and system for proffering multiple biometrics for use with a FOB
US7746215B1 (en) 2001-07-10 2010-06-29 Fred Bishop RF transactions using a wireless reader grid
US20090008441A1 (en) * 2001-07-10 2009-01-08 Xatra Fund Mx, Llc Tracking rf transaction activity using a transaction device identifier
US8294552B2 (en) 2001-07-10 2012-10-23 Xatra Fund Mx, Llc Facial scan biometrics on a payment device
US9031880B2 (en) * 2001-07-10 2015-05-12 Iii Holdings 1, Llc Systems and methods for non-traditional payment using biometric data
US7735725B1 (en) 2001-07-10 2010-06-15 Fred Bishop Processing an RF transaction using a routing number
US9454752B2 (en) 2001-07-10 2016-09-27 Chartoleaux Kg Limited Liability Company Reload protocol at a transaction processing entity
US7303120B2 (en) * 2001-07-10 2007-12-04 American Express Travel Related Services Company, Inc. System for biometric security using a FOB
US8001054B1 (en) 2001-07-10 2011-08-16 American Express Travel Related Services Company, Inc. System and method for generating an unpredictable number using a seeded algorithm
US8284025B2 (en) 2001-07-10 2012-10-09 Xatra Fund Mx, Llc Method and system for auditory recognition biometrics on a FOB
KR20010086181A (ko) * 2001-07-13 2001-09-10 ０ 비접촉형 아이씨 모듈과 이를 장착한 아이씨 카드
US6693541B2 (en) 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
US6805287B2 (en) 2002-09-12 2004-10-19 American Express Travel Related Services Company, Inc. System and method for converting a stored value card to a credit card
MXPA05003670A (es) 2002-10-08 2005-06-08 Nippon Carbide Kogyo Kk Dispositivos de visualizacion retrorreflectores.
US6912805B2 (en) * 2003-06-24 2005-07-05 Chi Lung Ngan Magnetized card holder
WO2005013360A1 (ja) * 2003-08-05 2005-02-10 Lintec Corporation フリップチップ実装用基板
JP2005093867A (ja) * 2003-09-19 2005-04-07 Seiko Epson Corp 半導体装置及びその製造方法
FR2870351B1 (fr) * 2004-05-14 2006-07-14 Alstom Transport Sa Dispositif de mesure d'un champ electromagnetique, systeme de commande utilisant ce dispositif et circuit electronique concu pour ce dispositif
KR100602621B1 (ko) 2004-06-16 2006-07-19 한국조폐공사 조립식 콤비카드 및 이의 제조방법
US7318550B2 (en) 2004-07-01 2008-01-15 American Express Travel Related Services Company, Inc. Biometric safeguard method for use with a smartcard
US8049594B1 (en) 2004-11-30 2011-11-01 Xatra Fund Mx, Llc Enhanced RFID instrument security
JP4628835B2 (ja) * 2005-03-24 2011-02-09 トッパン・フォームズ株式会社 通信用回路保持体
WO2007043602A1 (en) 2005-10-14 2007-04-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and communication system using the semiconductor device
WO2007063786A1 (en) * 2005-11-29 2007-06-07 Semiconductor Energy Laboratory Co., Ltd. Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system
US20070131781A1 (en) 2005-12-08 2007-06-14 Ncr Corporation Radio frequency device
IL184260A0 (en) * 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
US7948384B1 (en) 2007-08-14 2011-05-24 Mpt, Inc. Placard having embedded RFID device for tracking objects
US8028923B2 (en) * 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US20090123743A1 (en) * 2007-11-14 2009-05-14 Guy Shafran Method of manufacture of wire imbedded inlay
JP2008090863A (ja) * 2007-12-11 2008-04-17 Hitachi Chem Co Ltd Ｉｃカード
JP4525786B2 (ja) * 2008-03-31 2010-08-18 Ｔｄｋ株式会社 電子部品及び電子部品モジュール
WO2010000806A1 (en) * 2008-07-02 2010-01-07 Imec Rfid device
JP5248224B2 (ja) * 2008-07-09 2013-07-31 リンテック株式会社 電子回路及びｉｃタグ
US20100090008A1 (en) * 2008-10-13 2010-04-15 Oded Bashan Authentication seal
JP4556002B2 (ja) * 2008-10-14 2010-10-06 日立化成工業株式会社 非接触式ｉｃカード
US8169060B2 (en) 2010-03-29 2012-05-01 Infineon Technologies Ag Integrated circuit package assembly including wave guide
DE102010028444B4 (de) * 2010-04-30 2016-06-23 Bundesdruckerei Gmbh Dokument mit einem Chip und Verfahren zur Herstellung eines Dokuments
US8195236B2 (en) * 2010-06-16 2012-06-05 On Track Innovations Ltd. Retrofit contactless smart SIM functionality in mobile communicators
JP2010277609A (ja) * 2010-09-01 2010-12-09 Hitachi Chem Co Ltd Ｉｃカード
US8424757B2 (en) 2010-12-06 2013-04-23 On Track Innovations Ltd. Contactless smart SIM functionality retrofit for mobile communication device
DE102011114635A1 (de) * 2011-10-04 2013-04-04 Smartrac Ip B.V. Chipkarte und Verfahren zur Herstellung einer Chipkarte
DE102012203260A1 (de) 2012-03-01 2013-09-05 Bundesdruckerei Gmbh Verfahren zum Herstellen einer elektrischen Leiterzugstruktur und Wert- und/oder Sicherheitsdokument mit einer Transpondereinheit
DE102012203270A1 (de) 2012-03-01 2013-09-05 Bundesdruckerei Gmbh Dokument und Verfahren zum Herstellen des Dokuments
EP2669852A1 (de) 2012-05-31 2013-12-04 Gemalto SA Chip-Modul eines integrierten Schaltkreises mit Antenne
CN102945817A (zh) * 2012-11-21 2013-02-27 兰荣 一体式智能卡封装系统及封装方法
USD776664S1 (en) * 2015-05-20 2017-01-17 Chaya Coleena Hendrick Smart card
FR3038105B1 (fr) * 2015-06-29 2017-08-04 Oberthur Technologies Module equipe d'un condensateur et d'une antenne, avec disposition d'electrode de condensateur amelioree
JP6401119B2 (ja) * 2015-07-21 2018-10-03 太陽誘電株式会社 モジュール基板
FR3073307B1 (fr) * 2017-11-08 2021-05-28 Oberthur Technologies Dispositif de securite tel qu'une carte a puce
US10628722B2 (en) 2018-03-23 2020-04-21 International Business Machines Corporation Method and apparatus to enhance the security of contact-less cards
US10755157B2 (en) * 2018-03-23 2020-08-25 International Business Machines Corporation Advance alert system against copy of contact-less card information

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61123990A (ja) * 1984-11-05 1986-06-11 Casio Comput Co Ltd Ｉｃカ−ド
JPS63193896A (ja) * 1987-02-06 1988-08-11 株式会社東芝 薄膜電磁変換器
JPS6478888A (en) * 1987-09-21 1989-03-24 Hitachi Maxell Semiconductor module
JPH01127393A (ja) * 1987-11-12 1989-05-19 Toshiba Corp 薄型電子機器及びその製造方法
FR2641102B1 (de) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
JP3096069B2 (ja) * 1990-08-06 2000-10-10 チェックポイント・マニュファクチュアリング・ジャパン株式会社 共振タグ及びその製造方法
DE4345610B4 (de) * 1992-06-17 2013-01-03 Micron Technology Inc. Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID)
GB9222460D0 (en) * 1992-10-26 1992-12-09 Hughes Microelectronics Europa Radio frequency baggage tag
KR0170456B1 (ko) * 1993-07-16 1999-03-30 세끼사와 다까시 반도체 장치 및 그 제조방법
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
DE4431754C1 (de) * 1994-09-06 1995-11-23 Siemens Ag Trägerelement

Also Published As

Publication number Publication date
KR100416410B1 (ko) 2004-04-28
US5705852A (en) 1998-01-06
JPH08287208A (ja) 1996-11-01
JP2814477B2 (ja) 1998-10-22
EP0737935A3 (de) 1999-12-01
EP0737935B1 (de) 2006-01-11
EP0737935A2 (de) 1996-10-16
DE69635724T2 (de) 2006-09-07

Similar Documents

Publication Publication Date Title
DE69635724D1 (de) Kontaktlose Chipkarte und Herstellungsverfahren
DE69434234D1 (de) Chipkarte und Herstellungsmethode
DE69532399D1 (de) Kontaktlose IC-Karte
DE69637439D1 (de) Ringoszillatorschaltung und chipkarte
DE69716310T2 (de) Chipkarte und chipkartenmodul
DE69617304T2 (de) IC Karte
BR9506922A (pt) Cartão de chip
DE69732719D1 (de) Chipkarte und chipkartenmodul
DE69314867T2 (de) Kontaktlose IC-Karte sowie deren Herstellungs- und Prüfverfahren
DE69532637D1 (de) System mit kontaktloser Chipkarte
DE69622633D1 (de) Chipkartenleser
KR960011779A (ko) 스마트 식별 카드
NO995662D0 (no) Fremgangsmåte for tilvirkning av smartkort
DE69500592T2 (de) Geerdete Chipkarte
GB2299885B (en) Chip card reader
BR9603590A (pt) Chip para cartão eletrónico e cartão eletrónico
DE69805412T2 (de) Kontaktlose chipkarte
EP0729109A3 (de) Chipkartenleser
DE69801150D1 (de) Kontaktlose chipkarte
DE69621176T2 (de) Kontaktlose IC-Karte und System dafür
GB2308505B (en) IC card and manufacturing method thereof
DE69602942T2 (de) Chipkartenleser
ZA9610816B (en) Method of manufacturing chip cards for use in non-contact technology
DE69507292D1 (de) Chipkarte
DE9314355U1 (de) Chipkarten-Modul und Chipkarte

Legal Events

Date Code Title Description
8364 No opposition during term of opposition