DE69638302D1 - Lasermarkierungssystem und -verfahren für edelsteine - Google Patents
Lasermarkierungssystem und -verfahren für edelsteineInfo
- Publication number
- DE69638302D1 DE69638302D1 DE69638302T DE69638302T DE69638302D1 DE 69638302 D1 DE69638302 D1 DE 69638302D1 DE 69638302 T DE69638302 T DE 69638302T DE 69638302 T DE69638302 T DE 69638302T DE 69638302 D1 DE69638302 D1 DE 69638302D1
- Authority
- DE
- Germany
- Prior art keywords
- gemstone
- laser
- optical system
- holder
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
- B44B3/00—Artist's machines or apparatus equipped with tools or work holders moving or able to be controlled substantially two- dimensionally for carving, engraving, or guilloching shallow ornamenting or markings
- B44B3/009—Artist's machines or apparatus equipped with tools or work holders moving or able to be controlled substantially two- dimensionally for carving, engraving, or guilloching shallow ornamenting or markings using a computer control means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44B—MACHINES, APPARATUS OR TOOLS FOR ARTISTIC WORK, e.g. FOR SCULPTURING, GUILLOCHING, CARVING, BRANDING, INLAYING
- B44B7/00—Machines, apparatus or hand tools for branding, e.g. using radiant energy such as laser beams
- B44B7/007—Machines, apparatus or hand tools for branding, e.g. using radiant energy such as laser beams using a computer control means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/22—Removing surface-material, e.g. by engraving, by etching
- B44C1/228—Removing surface-material, e.g. by engraving, by etching by laser radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/87—Investigating jewels
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
- G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
- G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/262—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used recording or marking of inorganic surfaces or materials, e.g. glass, metal, or ceramics
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US963896P | 1996-01-05 | 1996-01-05 | |
US08/690,309 US5932119A (en) | 1996-01-05 | 1996-07-30 | Laser marking system |
PCT/US1996/018448 WO1997025177A1 (en) | 1996-01-05 | 1996-11-14 | Laser marking system for gemstones and method of authenticating marking |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69638302D1 true DE69638302D1 (de) | 2011-01-20 |
Family
ID=26679714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69638302T Expired - Lifetime DE69638302D1 (de) | 1996-01-05 | 1996-11-14 | Lasermarkierungssystem und -verfahren für edelsteine |
Country Status (14)
Country | Link |
---|---|
US (9) | US5932119A (de) |
EP (2) | EP2216126A3 (de) |
JP (5) | JP3238875B2 (de) |
KR (2) | KR100317554B1 (de) |
CN (3) | CN1264445C (de) |
AT (1) | ATE490837T1 (de) |
AU (1) | AU699816B2 (de) |
BR (1) | BR9612467B1 (de) |
CA (1) | CA2238612C (de) |
DE (1) | DE69638302D1 (de) |
HK (2) | HK1017298A1 (de) |
IL (2) | IL140513A (de) |
RU (1) | RU2205733C2 (de) |
WO (1) | WO1997025177A1 (de) |
Families Citing this family (271)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6882738B2 (en) * | 1994-03-17 | 2005-04-19 | Digimarc Corporation | Methods and tangible objects employing textured machine readable data |
US5932119A (en) * | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
US5937270A (en) | 1996-01-24 | 1999-08-10 | Micron Electronics, Inc. | Method of efficiently laser marking singulated semiconductor devices |
DE19706038A1 (de) * | 1997-02-06 | 1998-08-20 | Chromatron Laser Sys Gmbh | Vorrichtung zum Beschriften von Materialien mit einem Laser |
IL124592A (en) | 1997-05-23 | 2002-07-25 | Gersan Ets | Method of marking a gemstone or diamond |
US5974150A (en) | 1997-09-30 | 1999-10-26 | Tracer Detection Technology Corp. | System and method for authentication of goods |
JP3557512B2 (ja) * | 1997-12-03 | 2004-08-25 | ミヤチテクノス株式会社 | 2次元バーコードのレーザマーキング方法 |
GB9727362D0 (en) * | 1997-12-24 | 1998-02-25 | Gersan Ets | Examining diamonds |
GB9727364D0 (en) * | 1997-12-24 | 1998-02-25 | Gersan Ets | Watermark |
US6608911B2 (en) | 2000-12-21 | 2003-08-19 | Digimarc Corporation | Digitally watermaking holograms for use with smart cards |
US6782115B2 (en) | 1998-04-16 | 2004-08-24 | Digimarc Corporation | Watermark holograms |
US6075332A (en) * | 1998-05-14 | 2000-06-13 | Mccann; Roy A. | Predictive conductive angle motor control system for brake-by-wire application |
DE19822323C2 (de) * | 1998-05-19 | 2003-04-17 | Stefan Dengler | Reifenbeschriftungseinrichtung |
EP1001587A1 (de) * | 1998-06-03 | 2000-05-17 | Mitsubishi Denki Kabushiki Kaisha | Kommunikationsgerät |
DE19831340C1 (de) * | 1998-07-13 | 2000-03-02 | Siemens Ag | Verfahren und Anordnung zum Kalibrieren einer Laserbearbeitungsmaschine zum Bearbeiten von Werkstücken |
US6417484B1 (en) | 1998-12-21 | 2002-07-09 | Micron Electronics, Inc. | Laser marking system for dice carried in trays and method of operation |
US6262388B1 (en) | 1998-12-21 | 2001-07-17 | Micron Electronics, Inc. | Laser marking station with enclosure and method of operation |
US6771895B2 (en) * | 1999-01-06 | 2004-08-03 | Mattson Technology, Inc. | Heating device for heating semiconductor wafers in thermal processing chambers |
WO2000066315A1 (en) * | 1999-04-30 | 2000-11-09 | Pacific Technology Corporation | Method for inscribing indicia on or in a workpiece |
US6308891B1 (en) * | 1999-05-05 | 2001-10-30 | T.I.D. (The Identifying Diamond) Inc. | Jewelry identification |
US6450402B1 (en) | 1999-05-05 | 2002-09-17 | T.I.D. (The Identifying Diamond) Inc. | Identification device |
EP1202776A1 (de) * | 1999-06-16 | 2002-05-08 | Norsam Technologies | Verfahren, gerät und erzeugnis zur identifikation eines diamantes mittels fokusiertem ionenstrahl |
EP1207730B1 (de) * | 1999-08-06 | 2009-09-16 | Ibiden Co., Ltd. | Lösung für die elektrochemische abscheidung, methode, eine leiterplatte unter verwendung dieser lösung herzustellen und mehrschichtige leiterplatte |
IL131575A (en) | 1999-08-24 | 2003-11-23 | U C Laser Ltd | Volume holograms in transparent materials |
JP3862198B2 (ja) * | 1999-12-21 | 2006-12-27 | 富士フイルムホールディングス株式会社 | 証明写真撮影装置と画像処理装置及び証明写真作成システム |
GB2357737A (en) * | 1999-12-27 | 2001-07-04 | Yasuhira Mori | Digitally marking a gemstone using a laser |
US20030024913A1 (en) * | 2002-04-15 | 2003-02-06 | Downes Joseph P. | Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
US7089420B1 (en) | 2000-05-24 | 2006-08-08 | Tracer Detection Technology Corp. | Authentication method and system |
US7162035B1 (en) | 2000-05-24 | 2007-01-09 | Tracer Detection Technology Corp. | Authentication method and system |
DE10026499A1 (de) * | 2000-05-27 | 2001-12-06 | Isola Ag | Vorrichtung und Verfahren zur Beschriftung von kupferkaschierten Laminaten |
US20020025040A1 (en) * | 2000-06-28 | 2002-02-28 | Howard Stein | Method and apparatus for generating an encryption key |
US6339728B1 (en) * | 2000-06-28 | 2002-01-15 | Advanced Micro Devices, Inc. | Method for marking semiconductor device using a green laser |
US6528760B1 (en) | 2000-07-14 | 2003-03-04 | Micron Technology, Inc. | Apparatus and method using rotational indexing for laser marking IC packages carried in trays |
US6593543B2 (en) * | 2000-07-20 | 2003-07-15 | David Benderly | Gemstone marking system and method |
AU2001279057A1 (en) * | 2000-07-28 | 2002-02-13 | Norsam Technologies, Inc. | Customizing objects and materials with digital identifiers |
US6884961B1 (en) | 2000-08-24 | 2005-04-26 | Uc Laser Ltd. | Intravolume diffractive optical elements |
IL138347A (en) | 2000-09-08 | 2003-09-17 | Sarin Technologies Ltd | Laser marking on diamonds |
JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
US7200464B2 (en) | 2000-09-21 | 2007-04-03 | Gsi Group Corporation | Digital control servo system |
US6660964B1 (en) * | 2000-09-22 | 2003-12-09 | David Benderly | Optical modification of laser beam cross section in object marking systems |
US6713715B2 (en) | 2001-01-16 | 2004-03-30 | Potomac Photonics, Inc. | Method and system for laser marking a gemstone |
US6649863B2 (en) * | 2001-01-16 | 2003-11-18 | Potomac Photonics, Inc. | Gemstone marking system with a focus sensing unit for sensing relative disposition between a marking surface of the gemstone and a focal plane of a laser beam |
GB0103881D0 (en) * | 2001-02-16 | 2001-04-04 | Gersan Ets | E-beam marking |
US20030167233A1 (en) * | 2001-03-02 | 2003-09-04 | The Timken Company | Method of sharing manufacturing data with a customer of manufactured parts |
US6639177B2 (en) * | 2001-03-29 | 2003-10-28 | Gsi Lumonics Corporation | Method and system for processing one or more microstructures of a multi-material device |
CA2343489C (en) * | 2001-04-05 | 2007-05-22 | Electrofuel, Inc. | Energy storage device for loads having variable power rates |
US6710943B2 (en) * | 2001-05-18 | 2004-03-23 | David Alan Weir | Viewer for laser-inscribed diamonds |
US20030017932A1 (en) * | 2001-07-17 | 2003-01-23 | Vandenbiesen Russell P. | Method for making synthetic gems comprising elements recovered from complete or partial human or animal remains and the product thereof |
US20040112087A1 (en) * | 2001-07-28 | 2004-06-17 | Bishop John L. | Method and article of manufacture for identifying and tracking rough gemstones |
JP2004537175A (ja) * | 2001-08-02 | 2004-12-09 | エスケーシー カンパニー,リミテッド | レーザーを使用した化学的機械的研磨パッドの製造方法 |
EP1281889A1 (de) * | 2001-08-03 | 2003-02-05 | Peter Heiland | Verfahren zum Erfassen eines Schwingungsisolationssystems |
US8204618B2 (en) * | 2008-03-24 | 2012-06-19 | Hypertherm, Inc. | Method and apparatus for operating an automated high temperature thermal cutting system |
US6781773B2 (en) * | 2001-08-15 | 2004-08-24 | Bae Systems Information And Electronic Systems Integration Inc | Boresight stability of an optical system |
DE10144008A1 (de) * | 2001-09-07 | 2003-03-27 | Siemens Ag | Verfahren und Vorrichtung zum Erzeugen einer Bohrung in einem Werkstück mit Laserstrahlung |
US20030071021A1 (en) | 2001-10-17 | 2003-04-17 | Danog Properties & Investments Ltd. | Automatic marking of diamond girdles using a laser |
US6885492B2 (en) * | 2001-11-08 | 2005-04-26 | Imaginative Optics, Inc. | Spatial light modulator apparatus |
FR2832945A1 (fr) * | 2001-11-30 | 2003-06-06 | Technifor | Dispositif d'usinage de pieces a l'aide d'un faisceau laser |
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US6624385B2 (en) * | 2001-12-21 | 2003-09-23 | Eastman Kodak Company | Method for marking gemstones with a unique micro discrete indicia |
US6799187B2 (en) * | 2001-12-26 | 2004-09-28 | The Boeing Company | Opportunistic parts marking management system |
ATE377277T1 (de) * | 2002-01-14 | 2007-11-15 | Ceyx Technologies Inc | Verfahren zur konfiguration eines laserbetriebssystems |
US20040089642A1 (en) * | 2002-01-15 | 2004-05-13 | Christensen C. Paul | Method and system for laser marking a gemstone |
RU2314197C2 (ru) * | 2002-02-13 | 2008-01-10 | Арвиндбхай Лавджибхай ПАТЕЛ | Лазерная машина для анализа, планирования и разметки необработанного алмаза |
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US7169685B2 (en) | 2002-02-25 | 2007-01-30 | Micron Technology, Inc. | Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive |
US6605244B1 (en) | 2002-03-04 | 2003-08-12 | Kristy J. Holtz | Hematite engraving |
ATE362653T1 (de) | 2002-03-12 | 2007-06-15 | Hamamatsu Photonics Kk | Methode zur trennung von substraten |
WO2003082583A1 (en) * | 2002-03-22 | 2003-10-09 | Ap Technoglass | Laser marking system |
GB2417075B (en) * | 2002-04-08 | 2006-06-21 | Pryor Edward & Son | Improved marking system |
US7067763B2 (en) * | 2002-05-17 | 2006-06-27 | Gsi Group Corporation | High speed, laser-based marking method and system for producing machine readable marks on workpieces and semiconductor devices with reduced subsurface damage produced thereby |
EP1364809A1 (de) * | 2002-05-24 | 2003-11-26 | Kba-Giori S.A. | Verfahren und Vorrichtung zur Markierung von Sicherheitspapieren |
US6813008B2 (en) * | 2002-06-10 | 2004-11-02 | Palantyr Research, Llc | Microdissection optical system |
SG114560A1 (en) * | 2002-07-31 | 2005-09-28 | Inst Data Storage | A method and apparatus for cleaning surfaces |
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1996
- 1996-07-30 US US08/690,309 patent/US5932119A/en not_active Expired - Lifetime
- 1996-11-14 DE DE69638302T patent/DE69638302D1/de not_active Expired - Lifetime
- 1996-11-14 KR KR1019980704407A patent/KR100317554B1/ko not_active IP Right Cessation
- 1996-11-14 CN CNB2004100495142A patent/CN1264445C/zh not_active Expired - Fee Related
- 1996-11-14 RU RU98114670/02A patent/RU2205733C2/ru not_active IP Right Cessation
- 1996-11-14 IL IL14051396A patent/IL140513A/xx not_active IP Right Cessation
- 1996-11-14 EP EP10003248A patent/EP2216126A3/de not_active Withdrawn
- 1996-11-14 EP EP96940506A patent/EP1021271B1/de not_active Revoked
- 1996-11-14 CA CA002238612A patent/CA2238612C/en not_active Expired - Fee Related
- 1996-11-14 AU AU77369/96A patent/AU699816B2/en not_active Ceased
- 1996-11-14 AT AT96940506T patent/ATE490837T1/de not_active IP Right Cessation
- 1996-11-14 KR KR1020017008356A patent/KR100344886B1/ko active IP Right Grant
- 1996-11-14 CN CNB961992891A patent/CN1169648C/zh not_active Expired - Fee Related
- 1996-11-14 IL IL12403496A patent/IL124034A/en active IP Right Review Request
- 1996-11-14 BR BRPI9612467-9A patent/BR9612467B1/pt not_active IP Right Cessation
- 1996-11-14 WO PCT/US1996/018448 patent/WO1997025177A1/en active IP Right Grant
- 1996-12-27 JP JP35040296A patent/JP3238875B2/ja not_active Expired - Lifetime
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1999
- 1999-05-11 US US09/309,982 patent/US6211484B1/en not_active Expired - Lifetime
- 1999-06-21 HK HK99102635A patent/HK1017298A1/xx not_active IP Right Cessation
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2000
- 2000-10-16 US US09/688,655 patent/US6476351B1/en not_active Expired - Lifetime
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2001
- 2001-04-27 JP JP2001133341A patent/JP4160274B2/ja not_active Expired - Lifetime
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2002
- 2002-09-06 US US10/237,329 patent/US6684663B2/en not_active Expired - Lifetime
- 2002-09-17 CN CNB021431957A patent/CN1250963C/zh not_active Expired - Fee Related
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2004
- 2004-01-26 US US10/764,937 patent/US7265316B2/en not_active Expired - Fee Related
- 2004-08-12 US US10/917,217 patent/US7010938B2/en not_active Expired - Fee Related
- 2004-11-24 US US10/996,948 patent/US20050103760A1/en not_active Abandoned
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2005
- 2005-07-19 HK HK05106098A patent/HK1073233A1/xx not_active IP Right Cessation
- 2005-12-28 JP JP2005379930A patent/JP4220515B2/ja not_active Expired - Lifetime
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2006
- 2006-03-14 US US11/374,781 patent/US7655882B2/en not_active Expired - Fee Related
- 2006-12-13 JP JP2006335962A patent/JP4584904B2/ja not_active Expired - Lifetime
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2007
- 2007-09-04 US US11/850,022 patent/US7915564B2/en not_active Expired - Fee Related
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2008
- 2008-02-14 JP JP2008033641A patent/JP4440982B2/ja not_active Expired - Lifetime
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