DE69702929D1 - Licht-emittierende vorrichtung und anzeigevorrichtung - Google Patents

Licht-emittierende vorrichtung und anzeigevorrichtung

Info

Publication number
DE69702929D1
DE69702929D1 DE69702929T DE69702929T DE69702929D1 DE 69702929 D1 DE69702929 D1 DE 69702929D1 DE 69702929 T DE69702929 T DE 69702929T DE 69702929 T DE69702929 T DE 69702929T DE 69702929 D1 DE69702929 D1 DE 69702929D1
Authority
DE
Germany
Prior art keywords
light
light emitting
emitting device
emitting component
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69702929T
Other languages
English (en)
Other versions
DE69702929T4 (de
DE69702929T3 (de
DE69702929T2 (de
Inventor
Yoshinori Shimizu
Kensho Sakano
Yasunobu Noguchi
Toshio Moriguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27524906&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69702929(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Publication of DE69702929D1 publication Critical patent/DE69702929D1/de
Application granted granted Critical
Publication of DE69702929T2 publication Critical patent/DE69702929T2/de
Publication of DE69702929T3 publication Critical patent/DE69702929T3/de
Publication of DE69702929T4 publication Critical patent/DE69702929T4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7767—Chalcogenides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
    • H01J29/18—Luminescent screens
    • H01J29/20—Luminescent screens characterised by the luminescent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0025—Diffusing sheet or layer; Prismatic sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051—Diffusing sheet or layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45169—Platinum (Pt) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
DE1997602929 1996-07-29 1997-07-29 Lichtemittierende vorrichtung und anzeigevorrichtung Expired - Lifetime DE69702929T4 (de)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP19858596 1996-07-29
JP19858596 1996-07-29
JP24433996 1996-09-17
JP24433996 1996-09-17
JP24538196 1996-09-18
JP24538196 1996-09-18
JP35900496 1996-12-27
JP35900496 1996-12-27
JP8101097 1997-03-31
JP8101097 1997-03-31
PCT/JP1997/002610 WO1998005078A1 (en) 1996-07-29 1997-07-29 Light emitting device and display device

Publications (4)

Publication Number Publication Date
DE69702929D1 true DE69702929D1 (de) 2000-09-28
DE69702929T2 DE69702929T2 (de) 2001-02-01
DE69702929T3 DE69702929T3 (de) 2008-03-13
DE69702929T4 DE69702929T4 (de) 2010-10-07

Family

ID=27524906

Family Applications (6)

Application Number Title Priority Date Filing Date
DE1997224764 Expired - Lifetime DE29724764U1 (de) 1996-07-29 1997-07-29 Lichtquellesystem
DE1997224670 Expired - Lifetime DE29724670U1 (de) 1996-07-29 1997-07-29 Lichtemittierende Vorrichtung und Diode
DE1997224773 Expired - Lifetime DE29724773U1 (de) 1996-07-29 1997-07-29 Lichtemittierende Vorrichtung
DE1997224458 Expired - Lifetime DE29724458U1 (de) 1996-07-29 1997-07-29 Lichtemittierende Vorrichtung und Anzeigegerät
DE1997602929 Expired - Lifetime DE69702929T4 (de) 1996-07-29 1997-07-29 Lichtemittierende vorrichtung und anzeigevorrichtung
DE1997224642 Expired - Lifetime DE29724642U1 (de) 1996-07-29 1997-07-29 Farbkonversions-Gußmaterial und Licht emittierende Vorrichtung

Family Applications Before (4)

Application Number Title Priority Date Filing Date
DE1997224764 Expired - Lifetime DE29724764U1 (de) 1996-07-29 1997-07-29 Lichtquellesystem
DE1997224670 Expired - Lifetime DE29724670U1 (de) 1996-07-29 1997-07-29 Lichtemittierende Vorrichtung und Diode
DE1997224773 Expired - Lifetime DE29724773U1 (de) 1996-07-29 1997-07-29 Lichtemittierende Vorrichtung
DE1997224458 Expired - Lifetime DE29724458U1 (de) 1996-07-29 1997-07-29 Lichtemittierende Vorrichtung und Anzeigegerät

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1997224642 Expired - Lifetime DE29724642U1 (de) 1996-07-29 1997-07-29 Farbkonversions-Gußmaterial und Licht emittierende Vorrichtung

Country Status (19)

Country Link
US (25) US5998925A (de)
EP (14) EP1017111B1 (de)
JP (19) JP3503139B2 (de)
KR (7) KR100434871B1 (de)
CN (11) CN100382349C (de)
AT (1) ATE195831T1 (de)
AU (1) AU720234B2 (de)
BR (7) BR9715361B1 (de)
CA (4) CA2262136C (de)
DE (6) DE29724764U1 (de)
DK (9) DK2197053T3 (de)
ES (9) ES2576053T3 (de)
GR (1) GR3034493T3 (de)
HK (12) HK1021073A1 (de)
MY (1) MY125748A (de)
PT (5) PT1429398E (de)
SG (5) SG115349A1 (de)
TW (2) TW383508B (de)
WO (1) WO1998005078A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9093616B2 (en) 2003-09-18 2015-07-28 Cree, Inc. Molded chip fabrication method and apparatus
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same

Families Citing this family (1455)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3404064B2 (ja) * 1993-03-09 2003-05-06 株式会社日立製作所 半導体装置及びその製造方法
US6013199A (en) 1997-03-04 2000-01-11 Symyx Technologies Phosphor materials
US6153971A (en) * 1995-09-21 2000-11-28 Matsushita Electric Industrial Co., Ltd. Light source with only two major light emitting bands
US6041345A (en) * 1996-03-08 2000-03-21 Microsoft Corporation Active stream format for holding multiple media streams
US6600175B1 (en) 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
US20040239243A1 (en) * 1996-06-13 2004-12-02 Roberts John K. Light emitting assembly
BRPI9715293B1 (pt) 1996-06-26 2016-11-01 Osram Ag elemento de cobertura para um elemento de construção optoeletrônico
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
DE19655445B3 (de) * 1996-09-20 2016-09-22 Osram Gmbh Weißes Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionsschicht und Verwendung solcher Halbleiterbauelemente
US6613247B1 (en) * 1996-09-20 2003-09-02 Osram Opto Semiconductors Gmbh Wavelength-converting casting composition and white light-emitting semiconductor component
DE19655185B9 (de) * 1996-09-20 2012-03-01 Osram Gesellschaft mit beschränkter Haftung Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP3378465B2 (ja) * 1997-05-16 2003-02-17 株式会社東芝 発光装置
US6623670B2 (en) 1997-07-07 2003-09-23 Asahi Rubber Inc. Method of molding a transparent coating member for light-emitting diodes
US6319425B1 (en) * 1997-07-07 2001-11-20 Asahi Rubber Inc. Transparent coating member for light-emitting diodes and a fluorescent color light source
US5847507A (en) * 1997-07-14 1998-12-08 Hewlett-Packard Company Fluorescent dye added to epoxy of light emitting diode lens
AU747260B2 (en) 1997-07-25 2002-05-09 Nichia Chemical Industries, Ltd. Nitride semiconductor device
US20030133292A1 (en) * 1999-11-18 2003-07-17 Mueller George G. Methods and apparatus for generating and modulating white light illumination conditions
US7014336B1 (en) 1999-11-18 2006-03-21 Color Kinetics Incorporated Systems and methods for generating and modulating illumination conditions
US7161313B2 (en) * 1997-08-26 2007-01-09 Color Kinetics Incorporated Light emitting diode based products
US6806659B1 (en) * 1997-08-26 2004-10-19 Color Kinetics, Incorporated Multicolored LED lighting method and apparatus
US6340824B1 (en) * 1997-09-01 2002-01-22 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a fluorescent material
JPH11135838A (ja) * 1997-10-20 1999-05-21 Ind Technol Res Inst 白色発光ダイオード及びその製造方法
WO1999033934A1 (fr) * 1997-12-24 1999-07-08 Hitachi Medical Corporation Luminophores et detecteurs de rayonnement et unites de tomodensitometrie formes a partir de ces luminophores
US6252254B1 (en) 1998-02-06 2001-06-26 General Electric Company Light emitting device with phosphor composition
US6294800B1 (en) 1998-02-06 2001-09-25 General Electric Company Phosphors for white light generation from UV emitting diodes
US6469322B1 (en) 1998-02-06 2002-10-22 General Electric Company Green emitting phosphor for use in UV light emitting diodes
JP3541709B2 (ja) * 1998-02-17 2004-07-14 日亜化学工業株式会社 発光ダイオードの形成方法
JP3900144B2 (ja) * 1998-02-17 2007-04-04 日亜化学工業株式会社 発光ダイオードの形成方法
FR2775250B1 (fr) * 1998-02-24 2000-05-05 Wilco International Sarl Moyen d'eclairage pour aeronef compatible avec un systeme de vision nocturne
US20080042554A1 (en) * 1998-05-18 2008-02-21 Kabushiki Kaisha Toshiba Image display device and light emission device
JP3645422B2 (ja) * 1998-07-14 2005-05-11 東芝電子エンジニアリング株式会社 発光装置
JP2000081848A (ja) * 1998-09-03 2000-03-21 Semiconductor Energy Lab Co Ltd 液晶表示装置を搭載した電子機器
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
CN1227749C (zh) † 1998-09-28 2005-11-16 皇家菲利浦电子有限公司 照明系统
US6366018B1 (en) * 1998-10-21 2002-04-02 Sarnoff Corporation Apparatus for performing wavelength-conversion using phosphors with light emitting diodes
US6404125B1 (en) 1998-10-21 2002-06-11 Sarnoff Corporation Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes
US6429583B1 (en) 1998-11-30 2002-08-06 General Electric Company Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors
US6299338B1 (en) 1998-11-30 2001-10-09 General Electric Company Decorative lighting apparatus with light source and luminescent material
JP2000208822A (ja) * 1999-01-11 2000-07-28 Matsushita Electronics Industry Corp 半導体発光装置
DE19902750A1 (de) * 1999-01-25 2000-08-03 Osram Opto Semiconductors Gmbh Halbleiterbauelement zur Erzeugung von mischfarbiger elektromagnetischer Strahlung
JP4296644B2 (ja) 1999-01-29 2009-07-15 豊田合成株式会社 発光ダイオード
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
US6351069B1 (en) * 1999-02-18 2002-02-26 Lumileds Lighting, U.S., Llc Red-deficiency-compensating phosphor LED
US6680569B2 (en) 1999-02-18 2004-01-20 Lumileds Lighting U.S. Llc Red-deficiency compensating phosphor light emitting device
US6140669A (en) * 1999-02-20 2000-10-31 Ohio University Gallium nitride doped with rare earth ions and method and structure for achieving visible light emission
EP1168539B1 (de) 1999-03-04 2009-12-16 Nichia Corporation Nitridhalbleiterlaserelement
JP3937644B2 (ja) * 1999-03-25 2007-06-27 セイコーエプソン株式会社 光源及び照明装置並びにその照明装置を用いた液晶装置
KR100425566B1 (ko) 1999-06-23 2004-04-01 가부시키가이샤 시티즌 덴시 발광 다이오드
CN1190997C (zh) 1999-07-23 2005-02-23 电灯专利信托有限公司 光源的发光物质及其相关的光源
CN100334746C (zh) 1999-07-23 2007-08-29 奥斯兰姆奥普托半导体股份有限两合公司 荧光材料混合物、波长转换的浇注料和光源装置
JP2001144331A (ja) 1999-09-02 2001-05-25 Toyoda Gosei Co Ltd 発光装置
US6515421B2 (en) * 1999-09-02 2003-02-04 General Electric Company Control of leachable mercury in fluorescent lamps
US6630691B1 (en) * 1999-09-27 2003-10-07 Lumileds Lighting U.S., Llc Light emitting diode device comprising a luminescent substrate that performs phosphor conversion
KR100683364B1 (ko) 1999-09-27 2007-02-15 필립스 루미리즈 라이팅 캄파니 엘엘씨 완전한 형광 물질 변환에 의해 백색광을 생성하는 발광다이오드 소자
US6686691B1 (en) * 1999-09-27 2004-02-03 Lumileds Lighting, U.S., Llc Tri-color, white light LED lamps
US6696703B2 (en) 1999-09-27 2004-02-24 Lumileds Lighting U.S., Llc Thin film phosphor-converted light emitting diode device
US6299498B1 (en) * 1999-10-27 2001-10-09 Shin Lung Liu White-light emitting diode structure and manufacturing method
JP4197814B2 (ja) * 1999-11-12 2008-12-17 シャープ株式会社 Ｌｅｄ駆動方法およびｌｅｄ装置と表示装置
JP2003517705A (ja) † 1999-11-18 2003-05-27 カラー・キネティックス・インコーポレーテッド 照明状態を発生し且つ調整するシステム及び方法
US20020176259A1 (en) 1999-11-18 2002-11-28 Ducharme Alfred D. Systems and methods for converting illumination
EP1610593B2 (de) 1999-11-18 2020-02-19 Signify North America Corporation Erzeugung von weissem Licht mit LED mit verschiedenen Spektrum
TW500962B (en) * 1999-11-26 2002-09-01 Sanyo Electric Co Surface light source and method for adjusting its hue
US6357889B1 (en) 1999-12-01 2002-03-19 General Electric Company Color tunable light source
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US6350041B1 (en) * 1999-12-03 2002-02-26 Cree Lighting Company High output radial dispersing lamp using a solid state light source
US6666567B1 (en) 1999-12-28 2003-12-23 Honeywell International Inc. Methods and apparatus for a light source with a raised LED structure
JP2001177145A (ja) * 1999-12-21 2001-06-29 Toshiba Electronic Engineering Corp 半導体発光素子およびその製造方法
US6566808B1 (en) * 1999-12-22 2003-05-20 General Electric Company Luminescent display and method of making
US7576496B2 (en) * 1999-12-22 2009-08-18 General Electric Company AC powered OLED device
TW480879B (en) * 2000-01-06 2002-03-21 Dynascan Technology Corp Method to compensate for the color no uniformity of color display
KR20010080796A (ko) * 2000-01-07 2001-08-25 허영덕 백색광용 형광체 및 그 제조방법, 그리고 이를 이용한백색광 발생방법
US6700322B1 (en) * 2000-01-27 2004-03-02 General Electric Company Light source with organic layer and photoluminescent layer
US7049761B2 (en) 2000-02-11 2006-05-23 Altair Engineering, Inc. Light tube and power supply circuit
US6522065B1 (en) 2000-03-27 2003-02-18 General Electric Company Single phosphor for creating white light with high luminosity and high CRI in a UV led device
US6409938B1 (en) 2000-03-27 2002-06-25 The General Electric Company Aluminum fluoride flux synthesis method for producing cerium doped YAG
US6538371B1 (en) 2000-03-27 2003-03-25 The General Electric Company White light illumination system with improved color output
WO2001075359A1 (en) * 2000-04-03 2001-10-11 Getinge/Castle, Inc. High power led source and optical delivery system
US6653765B1 (en) 2000-04-17 2003-11-25 General Electric Company Uniform angular light distribution from LEDs
US6603258B1 (en) * 2000-04-24 2003-08-05 Lumileds Lighting, U.S. Llc Light emitting diode device that emits white light
DE10020465A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP4521929B2 (ja) * 2000-04-26 2010-08-11 株式会社日立メディコ 蛍光体及びそれを用いた放射線検出器及びｘ線ｃｔ装置
US7304325B2 (en) * 2000-05-01 2007-12-04 Toyoda Gosei Co., Ltd. Group III nitride compound semiconductor light-emitting device
US6604971B1 (en) 2000-05-02 2003-08-12 General Electric Company Fabrication of LED lamps by controlled deposition of a suspension media
US6466135B1 (en) 2000-05-15 2002-10-15 General Electric Company Phosphors for down converting ultraviolet light of LEDs to blue-green light
US6621211B1 (en) * 2000-05-15 2003-09-16 General Electric Company White light emitting phosphor blends for LED devices
US6501100B1 (en) * 2000-05-15 2002-12-31 General Electric Company White light emitting phosphor blend for LED devices
US6555958B1 (en) 2000-05-15 2003-04-29 General Electric Company Phosphor for down converting ultraviolet light of LEDs to blue-green light
JP2001332765A (ja) * 2000-05-22 2001-11-30 Iwasaki Electric Co Ltd Ｌｅｄ表示灯
DE10026435A1 (de) * 2000-05-29 2002-04-18 Osram Opto Semiconductors Gmbh Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED
US6504179B1 (en) 2000-05-29 2003-01-07 Patent-Treuhand-Gesellschaft Fur Elektrische Gluhlampen Mbh Led-based white-emitting illumination unit
JP4386693B2 (ja) * 2000-05-31 2009-12-16 パナソニック株式会社 Ｌｅｄランプおよびランプユニット
US6577073B2 (en) 2000-05-31 2003-06-10 Matsushita Electric Industrial Co., Ltd. Led lamp
JP2002057376A (ja) * 2000-05-31 2002-02-22 Matsushita Electric Ind Co Ltd Ｌｅｄランプ
AUPQ818100A0 (en) 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
US7320632B2 (en) * 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
JP2002190622A (ja) 2000-12-22 2002-07-05 Sanken Electric Co Ltd 発光ダイオード用透光性蛍光カバー
JP4926337B2 (ja) * 2000-06-28 2012-05-09 アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド 光源
US6883926B2 (en) 2000-07-25 2005-04-26 General Electric Company Light emitting semi-conductor device apparatus for display illumination
DE10036940A1 (de) * 2000-07-28 2002-02-07 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Lumineszenz-Konversions-LED
JP2002050797A (ja) 2000-07-31 2002-02-15 Toshiba Corp 半導体励起蛍光体発光装置およびその製造方法
US6747406B1 (en) * 2000-08-07 2004-06-08 General Electric Company LED cross-linkable phospor coating
DE10041328B4 (de) * 2000-08-23 2018-04-05 Osram Opto Semiconductors Gmbh Verpackungseinheit für Halbleiterchips
JP2002076434A (ja) * 2000-08-28 2002-03-15 Toyoda Gosei Co Ltd 発光装置
KR100406856B1 (ko) * 2000-08-30 2003-11-21 가부시키가이샤 시티즌 덴시 표면 실장형 발광 다이오드 및 그 제조방법
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
JP2002084002A (ja) * 2000-09-06 2002-03-22 Nippon Leiz Co Ltd 光源装置
US6255129B1 (en) * 2000-09-07 2001-07-03 Highlink Technology Corporation Light-emitting diode device and method of manufacturing the same
US6525464B1 (en) * 2000-09-08 2003-02-25 Unity Opto Technology Co., Ltd. Stacked light-mixing LED
JP2002141556A (ja) * 2000-09-12 2002-05-17 Lumileds Lighting Us Llc 改良された光抽出効果を有する発光ダイオード
US6635987B1 (en) * 2000-09-26 2003-10-21 General Electric Company High power white LED lamp structure using unique phosphor application for LED lighting products
US7378982B2 (en) * 2000-09-28 2008-05-27 Abdulahi Mohamed Electronic display with multiple pre-programmed messages
JP3609709B2 (ja) * 2000-09-29 2005-01-12 株式会社シチズン電子 発光ダイオード
JP2002111072A (ja) * 2000-09-29 2002-04-12 Toyoda Gosei Co Ltd 発光装置
US6998281B2 (en) * 2000-10-12 2006-02-14 General Electric Company Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics
US6650044B1 (en) * 2000-10-13 2003-11-18 Lumileds Lighting U.S., Llc Stenciling phosphor layers on light emitting diodes
JP2002133925A (ja) * 2000-10-25 2002-05-10 Sanken Electric Co Ltd 蛍光カバー及び半導体発光装置
US6476549B2 (en) * 2000-10-26 2002-11-05 Mu-Chin Yu Light emitting diode with improved heat dissipation
JP2002141559A (ja) * 2000-10-31 2002-05-17 Sanken Electric Co Ltd 発光半導体チップ組立体及び発光半導体リードフレーム
FI109632B (fi) 2000-11-06 2002-09-13 Nokia Corp Valkoinen valaisu
US6365922B1 (en) * 2000-11-16 2002-04-02 Harvatek Corp. Focusing cup for surface mount optoelectronic diode package
US6518600B1 (en) 2000-11-17 2003-02-11 General Electric Company Dual encapsulation for an LED
JP4683719B2 (ja) * 2000-12-21 2011-05-18 株式会社日立メディコ 酸化物蛍光体及びそれを用いた放射線検出器、並びにｘ線ｃｔ装置
KR100367854B1 (ko) * 2000-12-28 2003-01-10 대주정밀화학 주식회사 툴리움을 포함하는 백색 발광다이오드용 알루미늄산이트륨황색 형광체 및 그 제조방법
AT410266B (de) 2000-12-28 2003-03-25 Tridonic Optoelectronics Gmbh Lichtquelle mit einem lichtemittierenden element
US20020084745A1 (en) * 2000-12-29 2002-07-04 Airma Optoelectronics Corporation Light emitting diode with light conversion by dielectric phosphor powder
JP3819713B2 (ja) * 2001-01-09 2006-09-13 日本碍子株式会社 半導体発光素子
JP2002280607A (ja) * 2001-01-10 2002-09-27 Toyoda Gosei Co Ltd 発光装置
US6703780B2 (en) * 2001-01-16 2004-03-09 General Electric Company Organic electroluminescent device with a ceramic output coupler and method of making the same
JP2002217459A (ja) * 2001-01-16 2002-08-02 Stanley Electric Co Ltd 発光ダイオード及び該発光ダイオードを光源として用いた液晶表示器のバックライト装置
US6930737B2 (en) * 2001-01-16 2005-08-16 Visteon Global Technologies, Inc. LED backlighting system
MY131962A (en) 2001-01-24 2007-09-28 Nichia Corp Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
EP1244152A3 (de) * 2001-01-26 2008-12-03 Toyoda Gosei Co., Ltd. Reflektierende lichtemittierende Diode, reflektierende optische Vorrichtung und Herstellungsverfahren
JP2002232013A (ja) * 2001-02-02 2002-08-16 Rohm Co Ltd 半導体発光素子
DE10105800B4 (de) * 2001-02-07 2017-08-31 Osram Gmbh Hocheffizienter Leuchtstoff und dessen Verwendung
JP4724924B2 (ja) * 2001-02-08 2011-07-13 ソニー株式会社 表示装置の製造方法
US6541800B2 (en) 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
JP4116260B2 (ja) 2001-02-23 2008-07-09 株式会社東芝 半導体発光装置
JP2002270899A (ja) * 2001-03-14 2002-09-20 Mitsubishi Electric Lighting Corp 色温度可変ｌｅｄ光源モジュール
US6611000B2 (en) 2001-03-14 2003-08-26 Matsushita Electric Industrial Co., Ltd. Lighting device
US6630786B2 (en) * 2001-03-30 2003-10-07 Candescent Technologies Corporation Light-emitting device having light-reflective layer formed with, or/and adjacent to, material that enhances device performance
US6844903B2 (en) * 2001-04-04 2005-01-18 Lumileds Lighting U.S., Llc Blue backlight and phosphor layer for a color LCD
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP2002314138A (ja) 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
CN1268972C (zh) * 2001-04-10 2006-08-09 皇家菲利浦电子有限公司 照明装置和显示设备
JP2002309247A (ja) * 2001-04-16 2002-10-23 Nichia Chem Ind Ltd 窒化ガリウム蛍光体及びその製造方法
WO2002086978A1 (fr) * 2001-04-20 2002-10-31 Nichia Corporation Dispositif photoemetteur
US6685852B2 (en) 2001-04-27 2004-02-03 General Electric Company Phosphor blends for generating white light from near-UV/blue light-emitting devices
US6686676B2 (en) 2001-04-30 2004-02-03 General Electric Company UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same
US6658373B2 (en) * 2001-05-11 2003-12-02 Field Diagnostic Services, Inc. Apparatus and method for detecting faults and providing diagnostics in vapor compression cycle equipment
US6616862B2 (en) * 2001-05-21 2003-09-09 General Electric Company Yellow light-emitting halophosphate phosphors and light sources incorporating the same
KR100419611B1 (ko) 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
US6596195B2 (en) 2001-06-01 2003-07-22 General Electric Company Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same
US7012588B2 (en) * 2001-06-05 2006-03-14 Eastman Kodak Company Method for saving power in an organic electroluminescent display using white light emitting elements
US6642652B2 (en) * 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device
JP4114331B2 (ja) * 2001-06-15 2008-07-09 豊田合成株式会社 発光装置
US6798136B2 (en) * 2001-06-19 2004-09-28 Gelcore Llc Phosphor embedded die epoxy and lead frame modifications
US6758587B2 (en) 2001-06-25 2004-07-06 Grote Industries, Inc. Light emitting diode license lamp with reflector
TWI287569B (en) * 2001-06-27 2007-10-01 Nantex Industry Co Ltd Yttrium aluminium garnet fluorescent powder comprising at least two optical active center, its preparation and uses
DE10133352A1 (de) * 2001-07-16 2003-02-06 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
JP2003027057A (ja) * 2001-07-17 2003-01-29 Hitachi Ltd 光源およびそれを用いた画像表示装置
JP2003031856A (ja) * 2001-07-18 2003-01-31 Okaya Electric Ind Co Ltd 発光素子及びその製造方法
US20030015708A1 (en) 2001-07-23 2003-01-23 Primit Parikh Gallium nitride based diodes with low forward voltage and low reverse current operation
TW552726B (en) 2001-07-26 2003-09-11 Matsushita Electric Works Ltd Light emitting device in use of LED
CN100423296C (zh) 2001-09-03 2008-10-01 松下电器产业株式会社 半导体发光元件、发光装置及半导体发光元件的制造方法
US6791283B2 (en) * 2001-09-07 2004-09-14 Opalec Dual mode regulated light-emitting diode module for flashlights
DE10146719A1 (de) * 2001-09-20 2003-04-17 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
DE10147040A1 (de) * 2001-09-25 2003-04-24 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
DE20115914U1 (de) * 2001-09-27 2003-02-13 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
EP1447853B1 (de) * 2001-10-01 2012-08-08 Panasonic Corporation Halbleiter-lichtemissionselement und dieses verwendende lichtemissionseinrichtung
KR100624403B1 (ko) * 2001-10-06 2006-09-15 삼성전자주식회사 인체의 신경계 기반 정서 합성 장치 및 방법
JP2003124521A (ja) * 2001-10-09 2003-04-25 Rohm Co Ltd ケース付半導体発光装置
JP3948650B2 (ja) * 2001-10-09 2007-07-25 アバゴ・テクノロジーズ・イーシービーユー・アイピー（シンガポール）プライベート・リミテッド 発光ダイオード及びその製造方法
US7011421B2 (en) * 2001-10-18 2006-03-14 Ilight Technologies, Inc. Illumination device for simulating neon lighting through use of fluorescent dyes
DE10153259A1 (de) * 2001-10-31 2003-05-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP2003147351A (ja) * 2001-11-09 2003-05-21 Taiwan Lite On Electronics Inc 白色光光源の製作方法
DE10241989A1 (de) * 2001-11-30 2003-06-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US20030117794A1 (en) * 2001-12-20 2003-06-26 Tien-Rong Lu Flat color-shift medium
TW518773B (en) * 2001-12-31 2003-01-21 Solidlite Corp Manufacturing method of white LED
KR100497339B1 (ko) * 2002-01-08 2005-06-23 주식회사 이츠웰 발광 다이오드 장치 및 이를 이용한 조명 기구, 표시 장치그리고 백라이트 장치
KR20030060281A (ko) * 2002-01-08 2003-07-16 주식회사 이츠웰 발광 다이오드 장치 및 이를 이용한 디스플레이
WO2003062775A1 (en) * 2002-01-17 2003-07-31 Hutchinson Technology Inc. Spectroscopy light source
JP3973082B2 (ja) * 2002-01-31 2007-09-05 シチズン電子株式会社 両面発光ｌｅｄパッケージ
JP2003243700A (ja) * 2002-02-12 2003-08-29 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体発光素子
DE60332676D1 (de) * 2002-02-15 2010-07-01 Mitsubishi Chem Corp Lichtemittierendes Element und zughörige Beleuchtungsvorrichtung
US6881983B2 (en) * 2002-02-25 2005-04-19 Kopin Corporation Efficient light emitting diodes and lasers
JP4113017B2 (ja) * 2002-03-27 2008-07-02 シチズンホールディングス株式会社 光源装置および表示装置
TW558065U (en) * 2002-03-28 2003-10-11 Solidlite Corp Purplish pink light emitting diode
US6762432B2 (en) * 2002-04-01 2004-07-13 Micrel, Inc. Electrical field alignment vernier
JP4172196B2 (ja) * 2002-04-05 2008-10-29 豊田合成株式会社 発光ダイオード
US6911079B2 (en) * 2002-04-19 2005-06-28 Kopin Corporation Method for reducing the resistivity of p-type II-VI and III-V semiconductors
WO2003092081A1 (fr) * 2002-04-25 2003-11-06 Nichia Corporation Dispositif electroluminescent utilisant une substance fluorescente
CA2427559A1 (en) * 2002-05-15 2003-11-15 Sumitomo Electric Industries, Ltd. White color light emitting device
US8232725B1 (en) * 2002-05-21 2012-07-31 Imaging Systems Technology Plasma-tube gas discharge device
KR100449503B1 (ko) * 2002-05-29 2004-09-22 서울반도체 주식회사 백색 칩 발광 다이오드 및 그 제조 방법
KR100449502B1 (ko) * 2002-05-29 2004-09-22 서울반도체 주식회사 백색 발광 다이오드 및 그 제작 방법
KR100632659B1 (ko) * 2002-05-31 2006-10-11 서울반도체 주식회사 백색 발광 다이오드
KR20050004298A (ko) * 2002-06-11 2005-01-12 아끼덴끼 가부시끼가이샤 자전거의 전조등 및 전조등 전기 회로
US20030230977A1 (en) * 2002-06-12 2003-12-18 Epstein Howard C. Semiconductor light emitting device with fluoropolymer lens
AU2003238234A1 (en) * 2002-06-13 2003-12-31 Cree, Inc. Semiconductor emitter comprising a saturated phosphor
US6972516B2 (en) * 2002-06-14 2005-12-06 University Of Cincinnati Photopump-enhanced electroluminescent devices
EP1552560A4 (de) * 2002-06-14 2006-10-25 Lednium Pty Ltd Lampe und verfahren zur herstellung einer lampe
WO2003107444A2 (en) 2002-06-17 2003-12-24 Kopin Corporation Light-emitting diode device geometry
US7002180B2 (en) 2002-06-28 2006-02-21 Kopin Corporation Bonding pad for gallium nitride-based light-emitting device
US6734091B2 (en) 2002-06-28 2004-05-11 Kopin Corporation Electrode for p-type gallium nitride-based semiconductors
US6841802B2 (en) * 2002-06-26 2005-01-11 Oriol, Inc. Thin film light emitting diode
TW558775B (en) * 2002-06-27 2003-10-21 Solidlite Corp Package of compound type LED
US6955985B2 (en) 2002-06-28 2005-10-18 Kopin Corporation Domain epitaxy for thin film growth
US6809471B2 (en) 2002-06-28 2004-10-26 General Electric Company Phosphors containing oxides of alkaline-earth and Group-IIIB metals and light sources incorporating the same
KR20050044894A (ko) * 2002-07-16 2005-05-13 쉐프네커 비젼 시스템즈 유에스에이 인코포레이티드 백색 발광 다이오드 헤드라이트
JP4118742B2 (ja) * 2002-07-17 2008-07-16 シャープ株式会社 発光ダイオードランプおよび発光ダイオード表示装置
US20040124433A1 (en) * 2002-07-19 2004-07-01 Kelly Stephen G. Process for fabricating, and light emitting device resulting from, a homogenously mixed powder/pelletized compound
JP3923867B2 (ja) * 2002-07-26 2007-06-06 株式会社アドバンスト・ディスプレイ 面状光源装置及びそれを用いた液晶表示装置
CN100595938C (zh) 2002-08-01 2010-03-24 日亚化学工业株式会社 半导体发光元件及其制造方法、使用此的发光装置
JP2004071807A (ja) * 2002-08-06 2004-03-04 Sharp Corp 照明装置、カメラ装置及び携帯機器
US20040032728A1 (en) * 2002-08-19 2004-02-19 Robert Galli Optical assembly for LED chip package
AU2002368183A1 (en) * 2002-08-21 2004-03-11 Seoul Semiconductor Co., Ltd. White light emitting device
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
KR100499129B1 (ko) * 2002-09-02 2005-07-04 삼성전기주식회사 발광 다이오드 및 그 제조방법
US7775685B2 (en) 2003-05-27 2010-08-17 Cree, Inc. Power surface mount light emitting die package
US7264378B2 (en) * 2002-09-04 2007-09-04 Cree, Inc. Power surface mount light emitting die package
US7244965B2 (en) 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
CN1318540C (zh) * 2002-09-13 2007-05-30 北京有色金属研究总院<Del/> 一种蓝光激发的白色led用荧光粉及其制造方法
CN1682384B (zh) * 2002-09-19 2010-06-09 克里公司 包括锥形侧壁的涂有磷光体的发光二极管及其制造方法
US6815241B2 (en) * 2002-09-25 2004-11-09 Cao Group, Inc. GaN structures having low dislocation density and methods of manufacture
US7460196B2 (en) * 2002-09-25 2008-12-02 Lg Displays Co., Ltd. Backlight device for liquid crystal display and method of fabricating the same
JP4263453B2 (ja) * 2002-09-25 2009-05-13 パナソニック株式会社 無機酸化物及びこれを用いた発光装置
JP4201167B2 (ja) * 2002-09-26 2008-12-24 シチズン電子株式会社 白色発光装置の製造方法
CN1233046C (zh) * 2002-09-29 2005-12-21 光宝科技股份有限公司 一种制作白光发光二极管光源的方法
JP2004127988A (ja) * 2002-09-30 2004-04-22 Toyoda Gosei Co Ltd 白色発光装置
JP2004131567A (ja) * 2002-10-09 2004-04-30 Hamamatsu Photonics Kk 発光体と、これを用いた電子線検出器、走査型電子顕微鏡及び質量分析装置
US7554258B2 (en) 2002-10-22 2009-06-30 Osram Opto Semiconductors Gmbh Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body
US7009199B2 (en) * 2002-10-22 2006-03-07 Cree, Inc. Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current
RU2219622C1 (ru) 2002-10-25 2003-12-20 Закрытое акционерное общество "Светлана-Оптоэлектроника" Полупроводниковый источник белого света
TW586246B (en) * 2002-10-28 2004-05-01 Super Nova Optoelectronics Cor Manufacturing method of white light LED and the light-emitting device thereof
JP4040955B2 (ja) * 2002-11-06 2008-01-30 株式会社小糸製作所 車両用前照灯及びその製造方法
JP5138145B2 (ja) * 2002-11-12 2013-02-06 日亜化学工業株式会社 蛍光体積層構造及びそれを用いる光源
KR20040044701A (ko) * 2002-11-21 2004-05-31 삼성전기주식회사 발광소자 패키지 및 그 제조방법
US7595113B2 (en) * 2002-11-29 2009-09-29 Shin-Etsu Chemical Co., Ltd. LED devices and silicone resin composition therefor
JP4072632B2 (ja) * 2002-11-29 2008-04-09 豊田合成株式会社 発光装置及び発光方法
JP2004186168A (ja) * 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
TW559627B (en) * 2002-12-03 2003-11-01 Lite On Technology Corp Method for producing bright white light diode with fluorescent powder
US6897486B2 (en) * 2002-12-06 2005-05-24 Ban P. Loh LED package die having a small footprint
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US6744196B1 (en) * 2002-12-11 2004-06-01 Oriol, Inc. Thin film LED
US6975369B1 (en) * 2002-12-12 2005-12-13 Gelcore, Llc Liquid crystal display with color backlighting employing light emitting diodes
ATE357746T1 (de) * 2002-12-13 2007-04-15 Koninkl Philips Electronics Nv Beleuchtungsvorrichtung mit strahlungsquelle und fluoreszenzmaterial
DE10259945A1 (de) * 2002-12-20 2004-07-01 Tews, Walter, Dipl.-Chem. Dr.rer.nat.habil. Leuchtstoffe mit verlängerter Fluoreszenzlebensdauer
TW591811B (en) * 2003-01-02 2004-06-11 Epitech Technology Corp Ltd Color mixing light emitting diode
TWI351566B (en) 2003-01-15 2011-11-01 Semiconductor Energy Lab Liquid crystal display device
KR100639647B1 (ko) * 2003-01-20 2006-11-01 우베 고산 가부시키가이샤 광 변환용 세라믹스 복합 재료 및 그 용도
DE10307282A1 (de) * 2003-02-20 2004-09-02 Osram Opto Semiconductors Gmbh Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung
DE102004003135A1 (de) * 2003-02-20 2004-09-02 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Beschichteter Leuchtstoff und lichtemittierende Vorrichtung mit derartigem Leuchtstoff
EP2262006A3 (de) * 2003-02-26 2012-03-21 Cree, Inc. Weisslichtquelle mit Leuchtdiode und Leuchtstoffe
TWI289937B (en) * 2003-03-04 2007-11-11 Topco Scient Co Ltd White light LED
US20040173807A1 (en) * 2003-03-04 2004-09-09 Yongchi Tian Garnet phosphors, method of making the same, and application to semiconductor LED chips for manufacturing lighting devices
KR100693969B1 (ko) 2003-03-10 2007-03-12 도요다 고세이 가부시키가이샤 고체 소자 디바이스 및 그 제조 방법
TW200507226A (en) * 2003-03-12 2005-02-16 Lednium Pty Ltd A lamp and a process for producing a lamp
CN100509994C (zh) * 2003-03-13 2009-07-08 日亚化学工业株式会社 发光膜、发光装置、发光膜的制造方法以及发光装置的制造方法
JPWO2004081140A1 (ja) * 2003-03-13 2006-06-15 日亜化学工業株式会社 発光膜、発光装置、発光膜の製造方法および発光装置の製造方法
US7038370B2 (en) * 2003-03-17 2006-05-02 Lumileds Lighting, U.S., Llc Phosphor converted light emitting device
US7276025B2 (en) * 2003-03-20 2007-10-02 Welch Allyn, Inc. Electrical adapter for medical diagnostic instruments using LEDs as illumination sources
JP2006523245A (ja) * 2003-03-28 2006-10-12 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 粒子または原材料上に被覆物を形成させる方法および属する製品
US20040252488A1 (en) * 2003-04-01 2004-12-16 Innovalight Light-emitting ceiling tile
US20040196318A1 (en) * 2003-04-01 2004-10-07 Su Massharudin Bin Method of depositing phosphor on light emitting diode
US7279832B2 (en) * 2003-04-01 2007-10-09 Innovalight, Inc. Phosphor materials and illumination devices made therefrom
US7278766B2 (en) * 2003-04-04 2007-10-09 Honeywell International Inc. LED based light guide for dual mode aircraft formation lighting
JP2004311822A (ja) * 2003-04-09 2004-11-04 Solidlite Corp 赤紫色発光ダイオード
DE10316769A1 (de) * 2003-04-10 2004-10-28 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoffbassierte LED und zugehöriger Leuchtstoff
US6903380B2 (en) * 2003-04-11 2005-06-07 Weldon Technologies, Inc. High power light emitting diode
KR20040090667A (ko) * 2003-04-18 2004-10-26 삼성전기주식회사 디스플레이용 라이트 유닛
US20040207311A1 (en) * 2003-04-18 2004-10-21 Jung-Pin Cheng White light emitting device
US7368179B2 (en) * 2003-04-21 2008-05-06 Sarnoff Corporation Methods and devices using high efficiency alkaline earth metal thiogallate-based phosphors
US7125501B2 (en) * 2003-04-21 2006-10-24 Sarnoff Corporation High efficiency alkaline earth metal thiogallate-based phosphors
KR20040092512A (ko) 2003-04-24 2004-11-04 (주)그래픽테크노재팬 방열 기능을 갖는 반사판이 구비된 반도체 발광장치
KR100691143B1 (ko) * 2003-04-30 2007-03-09 삼성전기주식회사 다층 형광층을 가진 발광 다이오드 소자
JP2006525682A (ja) 2003-04-30 2006-11-09 クリー　インコーポレイテッド 高出力固体発光素子パッケージ
US7005679B2 (en) * 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US7528421B2 (en) * 2003-05-05 2009-05-05 Lamina Lighting, Inc. Surface mountable light emitting diode assemblies packaged for high temperature operation
US7777235B2 (en) 2003-05-05 2010-08-17 Lighting Science Group Corporation Light emitting diodes with improved light collimation
US7633093B2 (en) * 2003-05-05 2009-12-15 Lighting Science Group Corporation Method of making optical light engines with elevated LEDs and resulting product
US7157745B2 (en) 2004-04-09 2007-01-02 Blonder Greg E Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them
US7176501B2 (en) 2003-05-12 2007-02-13 Luxpia Co, Ltd Tb,B-based yellow phosphor, its preparation method, and white semiconductor light emitting device incorporating the same
US7108386B2 (en) 2003-05-12 2006-09-19 Illumitech Inc. High-brightness LED-phosphor coupling
US6982045B2 (en) * 2003-05-17 2006-01-03 Phosphortech Corporation Light emitting device having silicate fluorescent phosphor
JP2004352928A (ja) * 2003-05-30 2004-12-16 Mitsubishi Chemicals Corp 発光装置及び照明装置
JP3977774B2 (ja) * 2003-06-03 2007-09-19 ローム株式会社 光半導体装置
US7122841B2 (en) 2003-06-04 2006-10-17 Kopin Corporation Bonding pad for gallium nitride-based light-emitting devices
US7145125B2 (en) 2003-06-23 2006-12-05 Advanced Optical Technologies, Llc Integrating chamber cone light using LED sources
US7521667B2 (en) 2003-06-23 2009-04-21 Advanced Optical Technologies, Llc Intelligent solid state lighting
US7462983B2 (en) * 2003-06-27 2008-12-09 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. White light emitting device
US7075225B2 (en) * 2003-06-27 2006-07-11 Tajul Arosh Baroky White light emitting device
JP2005026688A (ja) * 2003-06-30 2005-01-27 Osram Opto Semiconductors Gmbh 放射放出半導体チップ、該半導体チップの作製方法および該半導体チップの明るさの調整設定方法
US7088038B2 (en) * 2003-07-02 2006-08-08 Gelcore Llc Green phosphor for general illumination applications
US7583260B2 (en) * 2003-07-16 2009-09-01 Honeywood Technologies, Llc Color preservation for spatially varying power conservation
US7580033B2 (en) * 2003-07-16 2009-08-25 Honeywood Technologies, Llc Spatial-based power savings
US7786988B2 (en) * 2003-07-16 2010-08-31 Honeywood Technologies, Llc Window information preservation for spatially varying power conservation
US7663597B2 (en) 2003-07-16 2010-02-16 Honeywood Technologies, Llc LCD plateau power conservation
US7602388B2 (en) * 2003-07-16 2009-10-13 Honeywood Technologies, Llc Edge preservation for spatially varying power conservation
US7714831B2 (en) 2003-07-16 2010-05-11 Honeywood Technologies, Llc Background plateau manipulation for display device power conservation
US6987353B2 (en) * 2003-08-02 2006-01-17 Phosphortech Corporation Light emitting device having sulfoselenide fluorescent phosphor
US7109648B2 (en) * 2003-08-02 2006-09-19 Phosphortech Inc. Light emitting device having thio-selenide fluorescent phosphor
US7112921B2 (en) * 2003-08-02 2006-09-26 Phosphortech Inc. Light emitting device having selenium-based fluorescent phosphor
KR20050016804A (ko) * 2003-08-04 2005-02-21 서울반도체 주식회사 발광 소자용 고휘도 형광체 구조 및 이를 사용하는 발광소자
JP3773525B2 (ja) * 2003-08-07 2006-05-10 松下電器産業株式会社 Ｌｅｄ照明光源
US7026755B2 (en) * 2003-08-07 2006-04-11 General Electric Company Deep red phosphor for general illumination applications
US20050104072A1 (en) 2003-08-14 2005-05-19 Slater David B.Jr. Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
EP1659335A4 (de) * 2003-08-28 2010-05-05 Mitsubishi Chem Corp Lichtabgabevorrichtung und -phosphor
TWI233697B (en) * 2003-08-28 2005-06-01 Genesis Photonics Inc AlInGaN light-emitting diode with wide spectrum and solid-state white light device
WO2005022030A2 (en) * 2003-08-29 2005-03-10 Koninklijke Philips Electronics N.V. Color-mixing lighting system
US7183587B2 (en) * 2003-09-09 2007-02-27 Cree, Inc. Solid metal block mounting substrates for semiconductor light emitting devices
US7029935B2 (en) * 2003-09-09 2006-04-18 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
JP3813144B2 (ja) * 2003-09-12 2006-08-23 ローム株式会社 発光制御回路
US7502392B2 (en) 2003-09-12 2009-03-10 Semiconductor Energy Laboratory Co., Ltd. Laser oscillator
US7204607B2 (en) * 2003-09-16 2007-04-17 Matsushita Electric Industrial Co., Ltd. LED lamp
TW200512949A (en) * 2003-09-17 2005-04-01 Nanya Plastics Corp A method to provide emission of white color light by the principle of secondary excitation and its product
JP2005089671A (ja) * 2003-09-19 2005-04-07 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物
JP4378242B2 (ja) * 2003-09-25 2009-12-02 株式会社小糸製作所 車両用灯具
EP1670073B1 (de) * 2003-09-30 2014-07-02 Kabushiki Kaisha Toshiba Lichtemittierendes bauelement
US7135129B2 (en) 2003-10-22 2006-11-14 Yano Tech (Shanghai) Limited Inorganic fluorescent material used for solid-state light source
US7094362B2 (en) * 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US7442326B2 (en) 2003-10-29 2008-10-28 Lumination Llc Red garnet phosphors for use in LEDs
US7252787B2 (en) * 2003-10-29 2007-08-07 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
KR100558446B1 (ko) * 2003-11-19 2006-03-10 삼성전기주식회사 파장변환용 몰딩 화합물 수지 태블릿 제조방법과 이를이용한 백색 발광다이오드 제조방법
JP3837588B2 (ja) 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP4654670B2 (ja) * 2003-12-16 2011-03-23 日亜化学工業株式会社 発光装置及びその製造方法
US7066623B2 (en) * 2003-12-19 2006-06-27 Soo Ghee Lee Method and apparatus for producing untainted white light using off-white light emitting diodes
TWI229462B (en) * 2003-12-22 2005-03-11 Solidlite Corp Improved method of white light LED
DE10360546A1 (de) * 2003-12-22 2005-07-14 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff
KR100610249B1 (ko) * 2003-12-23 2006-08-09 럭스피아 주식회사 황색 발광 형광체 및 그것을 채용한 백색 반도체 발광장치
US7791274B2 (en) * 2004-01-07 2010-09-07 Panasonic Corporation LED lamp
JP4231418B2 (ja) * 2004-01-07 2009-02-25 株式会社小糸製作所 発光モジュール及び車両用灯具
US7183588B2 (en) * 2004-01-08 2007-02-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emission device
JP2005209794A (ja) * 2004-01-21 2005-08-04 Koito Mfg Co Ltd 発光モジュール及び灯具
WO2005073621A1 (ja) * 2004-01-29 2005-08-11 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ照明光源
TWI250664B (en) * 2004-01-30 2006-03-01 South Epitaxy Corp White light LED
US20050179042A1 (en) * 2004-02-13 2005-08-18 Kopin Corporation Monolithic integration and enhanced light extraction in gallium nitride-based light-emitting devices
US20050179046A1 (en) * 2004-02-13 2005-08-18 Kopin Corporation P-type electrodes in gallium nitride-based light-emitting devices
EP1716218B1 (de) * 2004-02-20 2009-12-02 Philips Intellectual Property & Standards GmbH Beleuchtungssystem mit einer strahlungsquelle und einem fluoreszierenden material
EP1566426B1 (de) 2004-02-23 2015-12-02 Philips Lumileds Lighting Company LLC Lichtemittierende vorrichtung, enthaltend einen wellenlängenkonvertierenden leuchtstoff
US7250715B2 (en) * 2004-02-23 2007-07-31 Philips Lumileds Lighting Company, Llc Wavelength converted semiconductor light emitting devices
US10575376B2 (en) 2004-02-25 2020-02-25 Lynk Labs, Inc. AC light emitting diode and AC LED drive methods and apparatus
US10499465B2 (en) 2004-02-25 2019-12-03 Lynk Labs, Inc. High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same
WO2011143510A1 (en) 2010-05-12 2011-11-17 Lynk Labs, Inc. Led lighting system
CN100391020C (zh) * 2004-02-26 2008-05-28 松下电器产业株式会社 Led光源
DE102004029412A1 (de) * 2004-02-27 2005-10-13 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips
TWI262609B (en) * 2004-02-27 2006-09-21 Dowa Mining Co Phosphor and manufacturing method thereof, and light source, LED using said phosphor
TWI229465B (en) 2004-03-02 2005-03-11 Genesis Photonics Inc Single chip white light component
US7592192B2 (en) 2004-03-05 2009-09-22 Konica Minolta Holdings, Inc. White light emitting diode (white LED) and method of manufacturing white LED
US7573072B2 (en) * 2004-03-10 2009-08-11 Lumination Llc Phosphor and blends thereof for use in LEDs
DE102004012028A1 (de) * 2004-03-11 2005-10-06 Lite-On Technology Co. Phosphoreszierendes Material, sowie dieses verwendende, weißes Licht emittierende Vorrichtung
KR20070001183A (ko) * 2004-03-12 2007-01-03 애버리 데니슨 코포레이션 패시브 인광 광원을 가진 조명시스템
AU2005225984A1 (en) * 2004-03-12 2005-10-06 Avery Dennison Corporation Emergency information sign
CN100410703C (zh) * 2004-03-12 2008-08-13 艾利丹尼森公司 具有被动磷光光源的照明系统
AU2005226511B2 (en) * 2004-03-12 2009-04-23 Avery Dennison Corporation Emergency information lighting system
US6924233B1 (en) * 2004-03-19 2005-08-02 Agilent Technologies, Inc. Phosphor deposition methods
US20050205874A1 (en) * 2004-03-19 2005-09-22 Ru-Shi Liu Phosphor material and white light-emitting device using the same
JP2005272697A (ja) * 2004-03-25 2005-10-06 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物、光半導体用封止材および光半導体装置
JP2005310756A (ja) * 2004-03-26 2005-11-04 Koito Mfg Co Ltd 光源モジュールおよび車両用前照灯
JPWO2005093860A1 (ja) * 2004-03-26 2008-02-14 シャープ株式会社 発光装置
US7355284B2 (en) * 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
DE102004015570A1 (de) * 2004-03-30 2005-11-10 J.S. Technology Co., Ltd. Weiß-Licht-LED-Anordnung
US20070262702A1 (en) * 2004-03-31 2007-11-15 Shunsuke Fujita Phoshor and Light-Emitting Diode
US7514867B2 (en) 2004-04-19 2009-04-07 Panasonic Corporation LED lamp provided with optical diffusion layer having increased thickness and method of manufacturing thereof
US7462086B2 (en) * 2004-04-21 2008-12-09 Philips Lumileds Lighting Company, Llc Phosphor for phosphor-converted semiconductor light emitting device
EP2113549B1 (de) 2004-04-27 2011-12-28 Panasonic Corporation Phosphorzusammensetzung und lichtemittierende Vorrichtung damit
CN100401516C (zh) * 2004-04-28 2008-07-09 宏齐科技股份有限公司 白光发光二极管组件的制作方法
TWI228841B (en) * 2004-04-29 2005-03-01 Lite On Technology Corp Luminescence method and apparatus for color temperature adjustable white light
KR101256919B1 (ko) 2004-05-05 2013-04-25 렌슬러 폴리테크닉 인스티튜트 고체-상태 에미터 및 하향-변환 재료를 이용한 고효율 광소스
US7837348B2 (en) 2004-05-05 2010-11-23 Rensselaer Polytechnic Institute Lighting system using multiple colored light emitting sources and diffuser element
KR100655894B1 (ko) * 2004-05-06 2006-12-08 서울옵토디바이스주식회사 색온도 및 연색성이 우수한 파장변환 발광장치
US11158768B2 (en) 2004-05-07 2021-10-26 Bruce H. Baretz Vacuum light emitting diode
US7315119B2 (en) * 2004-05-07 2008-01-01 Avago Technologies Ip (Singapore) Pte Ltd Light-emitting device having a phosphor particle layer with specific thickness
KR100658700B1 (ko) * 2004-05-13 2006-12-15 서울옵토디바이스주식회사 Ｒｇｂ 발광소자와 형광체를 조합한 발광장치
US7077978B2 (en) * 2004-05-14 2006-07-18 General Electric Company Phosphors containing oxides of alkaline-earth and group-IIIB metals and white-light sources incorporating same
TWI241034B (en) * 2004-05-20 2005-10-01 Lighthouse Technology Co Ltd Light emitting diode package
US7339332B2 (en) * 2004-05-24 2008-03-04 Honeywell International, Inc. Chroma compensated backlit display
WO2005116163A1 (en) * 2004-05-27 2005-12-08 Philips Intellectual Property & Standards Gmbh Illumination system comprising a radiation source and a fluorescent material
US7456499B2 (en) 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7280288B2 (en) * 2004-06-04 2007-10-09 Cree, Inc. Composite optical lens with an integrated reflector
US8308980B2 (en) * 2004-06-10 2012-11-13 Seoul Semiconductor Co., Ltd. Light emitting device
KR100665299B1 (ko) * 2004-06-10 2007-01-04 서울반도체 주식회사 발광물질
KR100665298B1 (ko) 2004-06-10 2007-01-04 서울반도체 주식회사 발광장치
JP4583076B2 (ja) 2004-06-11 2010-11-17 スタンレー電気株式会社 発光素子
US7065534B2 (en) * 2004-06-23 2006-06-20 Microsoft Corporation Anomaly detection in data perspectives
WO2006001316A1 (ja) 2004-06-24 2006-01-05 Ube Industries, Ltd. 白色発光ダイオード装置
KR20060000313A (ko) * 2004-06-28 2006-01-06 루미마이크로 주식회사 대입경 형광 분말을 포함하는 색변환 발광 장치 그의 제조방법 및 그에 사용되는 수지 조성물
DE102004031391B4 (de) * 2004-06-29 2009-06-04 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse zum ESD-Schutz
JP4996463B2 (ja) * 2004-06-30 2012-08-08 クリー インコーポレイテッド 発光デバイスをパッケージするためのチップスケール方法およびチップスケールにパッケージされた発光デバイス
CN1981018B (zh) 2004-06-30 2011-06-22 三菱化学株式会社 荧光体和使用它的发光元件以及图像显示装置、照明装置
US7255469B2 (en) * 2004-06-30 2007-08-14 3M Innovative Properties Company Phosphor based illumination system having a light guide and an interference reflector
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US20060006366A1 (en) * 2004-07-06 2006-01-12 Vladimir Abramov Wave length shifting compositions for white emitting diode systems
EP1769050B1 (de) 2004-07-06 2013-01-16 Lightscape Materials Inc. Effiziente grünemittierende leuchtstoffe und kombinationen mit rotemittierenden leuchtstoffen
WO2006006582A1 (ja) 2004-07-13 2006-01-19 Fujikura Ltd. 蛍光体及びその蛍光体を用いた電球色光を発する電球色光発光ダイオードランプ
US7476337B2 (en) * 2004-07-28 2009-01-13 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method for the same, and light source
US8417215B2 (en) * 2004-07-28 2013-04-09 Koninklijke Philips Electronics N.V. Method for positioning of wireless medical devices with short-range radio frequency technology
US8017035B2 (en) * 2004-08-04 2011-09-13 Intematix Corporation Silicate-based yellow-green phosphors
US7311858B2 (en) * 2004-08-04 2007-12-25 Intematix Corporation Silicate-based yellow-green phosphors
US7267787B2 (en) 2004-08-04 2007-09-11 Intematix Corporation Phosphor systems for a white light emitting diode (LED)
FR2874021B1 (fr) 2004-08-09 2006-09-29 Saint Gobain Cristaux Detecteu Materiau scintillateur dense et rapide a faible luminescence retardee
US7750352B2 (en) 2004-08-10 2010-07-06 Pinion Technologies, Inc. Light strips for lighting and backlighting applications
US7259401B2 (en) * 2004-08-23 2007-08-21 Lite-On Technology Corporation Reflection-type optoelectronic semiconductor device
US20060044806A1 (en) * 2004-08-25 2006-03-02 Abramov Vladimir S Light emitting diode system packages
DE102005042778A1 (de) * 2004-09-09 2006-04-13 Toyoda Gosei Co., Ltd., Nishikasugai Optische Festkörpervorrichtung
EP1800054A2 (de) * 2004-09-10 2007-06-27 Color Kinetics Incorporated Verfahren und vorrichtungen zur beleuchtungszonensteuerung
JP4667803B2 (ja) 2004-09-14 2011-04-13 日亜化学工業株式会社 発光装置
US7217583B2 (en) 2004-09-21 2007-05-15 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
DE102004045950A1 (de) * 2004-09-22 2006-03-30 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US7372198B2 (en) * 2004-09-23 2008-05-13 Cree, Inc. Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor
TWI256149B (en) * 2004-09-27 2006-06-01 Advanced Optoelectronic Tech Light apparatus having adjustable color light and manufacturing method thereof
US20060067073A1 (en) * 2004-09-30 2006-03-30 Chu-Chi Ting White led device
JP4060841B2 (ja) * 2004-10-06 2008-03-12 住友ゴム工業株式会社 生タイヤビード部成型方法、及びそれに用いる生タイヤビード部成型装置
KR100485673B1 (ko) 2004-10-11 2005-04-27 씨엠에스테크놀로지(주) 백색 발광장치
CN101031630B (zh) * 2004-10-15 2010-10-13 三菱化学株式会社 荧光体和使用该荧光体的发光装置、以及图像显示装置和照明装置
US7733002B2 (en) 2004-10-19 2010-06-08 Nichia Corporation Semiconductor light emitting device provided with an alkaline earth metal boric halide phosphor for luminescence conversion
JP4586802B2 (ja) * 2004-10-21 2010-11-24 宇部興産株式会社 発光ダイオード素子、発光ダイオード用基板及び発光ダイオード素子の製造方法
DE102005028748A1 (de) * 2004-10-25 2006-05-04 Osram Opto Semiconductors Gmbh Elektromagnetische Strahlung emittierendes Halbleiterbauelement und Bauelementgehäuse
US20060097385A1 (en) * 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
US8134292B2 (en) * 2004-10-29 2012-03-13 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
US7670872B2 (en) * 2004-10-29 2010-03-02 LED Engin, Inc. (Cayman) Method of manufacturing ceramic LED packages
US9929326B2 (en) 2004-10-29 2018-03-27 Ledengin, Inc. LED package having mushroom-shaped lens with volume diffuser
US7473933B2 (en) * 2004-10-29 2009-01-06 Ledengin, Inc. (Cayman) High power LED package with universal bonding pads and interconnect arrangement
US7772609B2 (en) * 2004-10-29 2010-08-10 Ledengin, Inc. (Cayman) LED package with structure and materials for high heat dissipation
US8816369B2 (en) 2004-10-29 2014-08-26 Led Engin, Inc. LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
US8324641B2 (en) * 2007-06-29 2012-12-04 Ledengin, Inc. Matrix material including an embedded dispersion of beads for a light-emitting device
JP4757477B2 (ja) * 2004-11-04 2011-08-24 株式会社 日立ディスプレイズ 光源ユニット、それを用いた照明装置及びそれを用いた表示装置
US7462317B2 (en) 2004-11-10 2008-12-09 Enpirion, Inc. Method of manufacturing an encapsulated package for a magnetic device
US7426780B2 (en) 2004-11-10 2008-09-23 Enpirion, Inc. Method of manufacturing a power module
US7481562B2 (en) 2004-11-18 2009-01-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Device and method for providing illuminating light using quantum dots
US7866853B2 (en) * 2004-11-19 2011-01-11 Fujikura Ltd. Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light
EP1824944A2 (de) 2004-12-07 2007-08-29 Philips Intellectual Property & Standards GmbH Beleuchtungssystem mit strahlungsquelle und leuchtstoff
US7402831B2 (en) * 2004-12-09 2008-07-22 3M Innovative Properties Company Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission
US7745814B2 (en) * 2004-12-09 2010-06-29 3M Innovative Properties Company Polychromatic LED's and related semiconductor devices
US7719015B2 (en) * 2004-12-09 2010-05-18 3M Innovative Properties Company Type II broadband or polychromatic LED's
US20060125716A1 (en) * 2004-12-10 2006-06-15 Wong Lye Y Light-emitting diode display with compartment
WO2006064930A1 (ja) 2004-12-17 2006-06-22 Ube Industries, Ltd. 光変換構造体およびそれを利用した発光装置
JP4591071B2 (ja) * 2004-12-20 2010-12-01 日亜化学工業株式会社 半導体装置
US7322732B2 (en) 2004-12-23 2008-01-29 Cree, Inc. Light emitting diode arrays for direct backlighting of liquid crystal displays
WO2006070899A1 (ja) 2004-12-27 2006-07-06 Ube Industries, Ltd. サイアロン蛍光体粒子およびその製造方法
JP2006209076A (ja) * 2004-12-27 2006-08-10 Nichia Chem Ind Ltd 導光体およびそれを用いた面発光装置
TWI245440B (en) * 2004-12-30 2005-12-11 Ind Tech Res Inst Light emitting diode
US8125137B2 (en) 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
ATE513026T1 (de) * 2005-01-10 2011-07-15 Koninkl Philips Electronics Nv Beleuchtungssystem mit einem keramischen lumineszenzumwandler
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7564180B2 (en) 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US8012774B2 (en) * 2005-01-11 2011-09-06 SemiLEDs Optoelectronics Co., Ltd. Coating process for a light-emitting diode (LED)
US7195944B2 (en) * 2005-01-11 2007-03-27 Semileds Corporation Systems and methods for producing white-light emitting diodes
US8680534B2 (en) 2005-01-11 2014-03-25 Semileds Corporation Vertical light emitting diodes (LED) having metal substrate and spin coated phosphor layer for producing white light
US7646033B2 (en) * 2005-01-11 2010-01-12 Semileds Corporation Systems and methods for producing white-light light emitting diodes
TWI249861B (en) * 2005-01-12 2006-02-21 Lighthouse Technology Co Ltd Wavelength converting substance and light emitting device and encapsulating material comprising the same
US7304694B2 (en) * 2005-01-12 2007-12-04 Cree, Inc. Solid colloidal dispersions for backlighting of liquid crystal displays
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
KR100588209B1 (ko) 2005-01-19 2006-06-08 엘지전자 주식회사 백색 발광 소자 및 그의 제조 방법
US7602116B2 (en) * 2005-01-27 2009-10-13 Advanced Optoelectronic Technology, Inc. Light apparatus capable of emitting light of multiple wavelengths using nanometer fluorescent material, light device and manufacturing method thereof
US8148886B2 (en) * 2005-01-31 2012-04-03 Ube Industries, Ltd. Red nitride phosphor and production method thereof
KR101139891B1 (ko) * 2005-01-31 2012-04-27 렌슬러 폴리테크닉 인스티튜트 확산 반사면을 구비한 발광 다이오드 소자
EP1686630A3 (de) 2005-01-31 2009-03-04 Samsung Electronics Co., Ltd. Leuchtdiode mit diffus reflektierender Oberfläche
KR20060088228A (ko) * 2005-02-01 2006-08-04 어드밴스드 옵토일렉트로닉 테크놀로지 인코포레이티드 나노미터 형광 물질을 이용하여 다수 파장의 빛을 방출할수 있는 발광 장치, 발광 소자 및 그의 제조 방법
US7358542B2 (en) * 2005-02-02 2008-04-15 Lumination Llc Red emitting phosphor materials for use in LED and LCD applications
US7497973B2 (en) 2005-02-02 2009-03-03 Lumination Llc Red line emitting phosphor materials for use in LED applications
US20070114562A1 (en) * 2005-11-22 2007-05-24 Gelcore, Llc Red and yellow phosphor-converted LEDs for signal applications
US7648649B2 (en) * 2005-02-02 2010-01-19 Lumination Llc Red line emitting phosphors for use in led applications
DE102005008834A1 (de) * 2005-02-16 2006-08-24 Aspre Ag Display zur Erstellung von durch auffallendes Licht erkennbaren farbigen Bildern und Texten
TW201403859A (zh) * 2005-02-18 2014-01-16 Nichia Corp 具備控制配光特性用之透鏡之發光裝置
JP4669713B2 (ja) * 2005-02-18 2011-04-13 株式会社リコー 画像読取装置及び画像形成装置
JP5216330B2 (ja) * 2005-02-21 2013-06-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 放射線源および発光物質を含む照明系
CN1684279A (zh) * 2005-02-25 2005-10-19 炬鑫科技股份有限公司 发光元件
US20090008663A1 (en) * 2005-02-28 2009-01-08 Mitshubishi Chemcial Phosphor and method for production thereof, and application thereof
US20060193131A1 (en) * 2005-02-28 2006-08-31 Mcgrath William R Circuit devices which include light emitting diodes, assemblies which include such circuit devices, and methods for directly replacing fluorescent tubes
US7439668B2 (en) * 2005-03-01 2008-10-21 Lumination Llc Oxynitride phosphors for use in lighting applications having improved color quality
JP4866558B2 (ja) * 2005-03-10 2012-02-01 シチズン電子株式会社 画像撮影用照明装置
CN100454590C (zh) * 2005-03-11 2009-01-21 鸿富锦精密工业（深圳）有限公司 发光二极管、发光二极管模组及背光系统
US7274045B2 (en) * 2005-03-17 2007-09-25 Lumination Llc Borate phosphor materials for use in lighting applications
JP5286639B2 (ja) * 2005-03-18 2013-09-11 三菱化学株式会社 蛍光体混合物、発光装置、画像表示装置、及び照明装置
JP5652426B2 (ja) * 2005-03-18 2015-01-14 三菱化学株式会社 蛍光体混合物、発光装置、画像表示装置、及び照明装置
WO2006098450A1 (ja) 2005-03-18 2006-09-21 Mitsubishi Chemical Corporation 発光装置、白色発光装置、照明装置及び画像表示装置
TWI249867B (en) 2005-03-24 2006-02-21 Lighthouse Technology Co Ltd Light-emitting diode package, cold cathode fluorescence lamp and photoluminescence material thereof
US7276183B2 (en) 2005-03-25 2007-10-02 Sarnoff Corporation Metal silicate-silica-based polymorphous phosphors and lighting devices
US7316497B2 (en) * 2005-03-29 2008-01-08 3M Innovative Properties Company Fluorescent volume light source
JP2006278980A (ja) * 2005-03-30 2006-10-12 Sanyo Electric Co Ltd 半導体発光装置
KR101142519B1 (ko) 2005-03-31 2012-05-08 서울반도체 주식회사 적색 형광체 및 녹색 형광체를 갖는 백색 발광다이오드를채택한 백라이트 패널
KR20080009198A (ko) * 2005-03-31 2008-01-25 도와 일렉트로닉스 가부시키가이샤 형광체, 형광체 시트 및 그 제조 방법, 및 상기 형광체를이용한 발광 장치
US7733310B2 (en) 2005-04-01 2010-06-08 Prysm, Inc. Display screens having optical fluorescent materials
US7791561B2 (en) * 2005-04-01 2010-09-07 Prysm, Inc. Display systems having screens with optical fluorescent materials
US20060221022A1 (en) * 2005-04-01 2006-10-05 Roger Hajjar Laser vector scanner systems with display screens having optical fluorescent materials
US7474286B2 (en) 2005-04-01 2009-01-06 Spudnik, Inc. Laser displays using UV-excitable phosphors emitting visible colored light
US7893631B2 (en) * 2005-04-06 2011-02-22 Koninklijke Philips Electronics N.V. White light luminaire with adjustable correlated colour temperature
US7489073B2 (en) * 2005-04-15 2009-02-10 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Blue to yellow-orange emitting phosphor, and light source having such a phosphor
DE102006016548B9 (de) 2005-04-15 2021-12-16 Osram Gmbh Blau bis Gelb-Orange emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff
JP4972957B2 (ja) * 2005-04-18 2012-07-11 三菱化学株式会社 蛍光体、及びそれを用いた発光装置、並びに画像表示装置、照明装置
US7329371B2 (en) * 2005-04-19 2008-02-12 Lumination Llc Red phosphor for LED based lighting
CN1854858A (zh) * 2005-04-19 2006-11-01 夏普株式会社 发光装置、液晶显示装置和照明装置
JP4843990B2 (ja) * 2005-04-22 2011-12-21 日亜化学工業株式会社 蛍光体およびそれを用いた発光装置
GB2425449B (en) * 2005-04-26 2007-05-23 City Greening Engineering Comp Irrigation system
US7994702B2 (en) 2005-04-27 2011-08-09 Prysm, Inc. Scanning beams displays based on light-emitting screens having phosphors
US8000005B2 (en) 2006-03-31 2011-08-16 Prysm, Inc. Multilayered fluorescent screens for scanning beam display systems
US8089425B2 (en) 2006-03-03 2012-01-03 Prysm, Inc. Optical designs for scanning beam display systems using fluorescent screens
US7690167B2 (en) * 2005-04-28 2010-04-06 Antonic James P Structural support framing assembly
JP4535928B2 (ja) * 2005-04-28 2010-09-01 シャープ株式会社 半導体発光装置
JP4738049B2 (ja) * 2005-05-02 2011-08-03 ユニ・チャーム株式会社 吸収性物品
KR100704492B1 (ko) * 2005-05-02 2007-04-09 한국화학연구원 형광체를 이용한 백색 발광 다이오드의 제조 방법
US7760210B2 (en) 2005-05-04 2010-07-20 Honeywood Technologies, Llc White-based power savings
US7602408B2 (en) 2005-05-04 2009-10-13 Honeywood Technologies, Llc Luminance suppression power conservation
TWI260799B (en) * 2005-05-06 2006-08-21 Harvatek Corp Multi-wavelength white light light-emitting diode
DE102005023134A1 (de) * 2005-05-19 2006-11-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Lumineszenzkonversions-LED
WO2006126567A1 (ja) * 2005-05-24 2006-11-30 Mitsubishi Chemical Corporation 蛍光体及びその利用
TWI323947B (en) 2005-05-24 2010-04-21 Seoul Semiconductor Co Ltd Light emitting device and phosphor of alkaline earth sulfide therefor
US7632000B2 (en) * 2005-05-25 2009-12-15 Samsung Electronics Co., Ltd. Backlight assembly and liquid crystal display device having the same
TW200704283A (en) * 2005-05-27 2007-01-16 Lamina Ceramics Inc Solid state LED bridge rectifier light engine
JP2007049114A (ja) 2005-05-30 2007-02-22 Sharp Corp 発光装置とその製造方法
US7753553B2 (en) * 2005-06-02 2010-07-13 Koniklijke Philips Electronics N.V. Illumination system comprising color deficiency compensating luminescent material
US8718437B2 (en) 2006-03-07 2014-05-06 Qd Vision, Inc. Compositions, optical component, system including an optical component, devices, and other products
TWI311820B (en) * 2005-06-07 2009-07-01 Fujikura Ltd Substrate for mounting light-emitting element, light-emitting element module, iluumination apparatus, display apparatus, and traffic signal device
US8128272B2 (en) 2005-06-07 2012-03-06 Oree, Inc. Illumination apparatus
US8215815B2 (en) 2005-06-07 2012-07-10 Oree, Inc. Illumination apparatus and methods of forming the same
US8272758B2 (en) 2005-06-07 2012-09-25 Oree, Inc. Illumination apparatus and methods of forming the same
JP2006343500A (ja) * 2005-06-08 2006-12-21 Olympus Corp 光源装置及び投影光学装置
US9412926B2 (en) 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
US20060290133A1 (en) * 2005-06-13 2006-12-28 Westrim, Inc. Postbound album
JP5124978B2 (ja) * 2005-06-13 2013-01-23 日亜化学工業株式会社 発光装置
CN101851432B (zh) * 2005-06-14 2012-10-17 电气化学工业株式会社 含有荧光体的树脂组合物及片材，以及使用其的发光元件
US7980743B2 (en) 2005-06-14 2011-07-19 Cree, Inc. LED backlighting for displays
JP2006351773A (ja) * 2005-06-15 2006-12-28 Rohm Co Ltd 半導体発光装置
KR100638868B1 (ko) * 2005-06-20 2006-10-27 삼성전기주식회사 금속 반사 층을 형성한 엘이디 패키지 및 그 제조 방법
WO2007002234A1 (en) 2005-06-23 2007-01-04 Rensselaer Polytechnic Institute Package design for producing white light with short-wavelength leds and down-conversion materials
CN101795510A (zh) 2005-06-28 2010-08-04 首尔Opto仪器股份有限公司 发光装置
US8896216B2 (en) 2005-06-28 2014-11-25 Seoul Viosys Co., Ltd. Illumination system
TWI422044B (zh) * 2005-06-30 2014-01-01 Cree Inc 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置
DE102005038698A1 (de) * 2005-07-08 2007-01-18 Tridonic Optoelectronics Gmbh Optoelektronische Bauelemente mit Haftvermittler
JP2007027431A (ja) * 2005-07-15 2007-02-01 Toshiba Corp 発光装置
KR100649679B1 (ko) * 2005-07-19 2006-11-27 삼성전기주식회사 측면 발광형 엘이디 패키지 및 이를 이용한 백 라이트 유닛
TW200717866A (en) * 2005-07-29 2007-05-01 Toshiba Kk Semiconductor light emitting device
US20070025106A1 (en) * 2005-07-29 2007-02-01 Korry Electronics Co. Night vision compatible area light fixture
WO2007015732A2 (en) * 2005-08-01 2007-02-08 Intex Recreation Corp. A method of varying the color of light emitted by a light-emitting device
KR100533922B1 (ko) * 2005-08-05 2005-12-06 알티전자 주식회사 황색 형광체 및 이를 이용한 백색 발광 장치
JP5029362B2 (ja) * 2005-08-10 2012-09-19 宇部興産株式会社 発光ダイオード用基板及び発光ダイオード
EP1913646A1 (de) * 2005-08-11 2008-04-23 Merck Patent GmbH Photonisches material mit regelmässig angeordneten kavitäten
US7329907B2 (en) 2005-08-12 2008-02-12 Avago Technologies, Ecbu Ip Pte Ltd Phosphor-converted LED devices having improved light distribution uniformity
US20070045641A1 (en) * 2005-08-23 2007-03-01 Yin Chua Janet B Light source with UV LED and UV reflector
KR100691273B1 (ko) * 2005-08-23 2007-03-12 삼성전기주식회사 복합 형광체 분말, 이를 이용한 발광 장치 및 복합 형광체분말의 제조 방법
CN101248533B (zh) 2005-08-23 2010-06-02 株式会社东芝 发光器件及使用该发光器件的背光源和液晶显示装置
US7847302B2 (en) * 2005-08-26 2010-12-07 Koninklijke Philips Electronics, N.V. Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature
US20070052342A1 (en) * 2005-09-01 2007-03-08 Sharp Kabushiki Kaisha Light-emitting device
JP2007067326A (ja) * 2005-09-02 2007-03-15 Shinko Electric Ind Co Ltd 発光ダイオード及びその製造方法
WO2007032520A1 (en) * 2005-09-13 2007-03-22 Showa Denko K.K. Light-emitting device
JP2007110090A (ja) * 2005-09-13 2007-04-26 Sony Corp ＧａＮ系半導体発光素子、発光装置、画像表示装置、面状光源装置、及び、液晶表示装置組立体
JP4966530B2 (ja) 2005-09-15 2012-07-04 国立大学法人 新潟大学 蛍光体
DE102005045649A1 (de) * 2005-09-23 2007-03-29 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Lichtmodul und Lichtsystem
JP5127455B2 (ja) * 2005-09-29 2013-01-23 株式会社東芝 白色発光装置とその製造方法、およびそれを用いたバックライト並びに液晶表示装置
KR20080059418A (ko) * 2005-09-30 2008-06-27 더 리전츠 오브 더 유니버시티 오브 캘리포니아 고상 조명용 질화 및 산질화 세륨계 형광물질들
JP4281839B2 (ja) * 2005-09-30 2009-06-17 日亜化学工業株式会社 発光装置及びそれを用いたバックライトユニット
KR100724591B1 (ko) 2005-09-30 2007-06-04 서울반도체 주식회사 발광 소자 및 이를 포함한 ｌｅｄ 백라이트
US8631560B2 (en) 2005-10-05 2014-01-21 Enpirion, Inc. Method of forming a magnetic device having a conductive clip
US8139362B2 (en) * 2005-10-05 2012-03-20 Enpirion, Inc. Power module with a magnetic device having a conductive clip
US7688172B2 (en) 2005-10-05 2010-03-30 Enpirion, Inc. Magnetic device having a conductive clip
US8701272B2 (en) 2005-10-05 2014-04-22 Enpirion, Inc. Method of forming a power module with a magnetic device having a conductive clip
US7479660B2 (en) 2005-10-21 2009-01-20 Perkinelmer Elcos Gmbh Multichip on-board LED illumination device
KR100693463B1 (ko) * 2005-10-21 2007-03-12 한국광기술원 2 이상의 물질을 포함하는 봉지층을 구비한 광 확산 발광다이오드
US7360934B2 (en) * 2005-10-24 2008-04-22 Sumitomo Electric Industries, Ltd. Light supply unit, illumination unit, and illumination system
KR100571882B1 (ko) * 2005-10-27 2006-04-17 알티전자 주식회사 황색 형광체 및 이를 포함하는 백색 발광 장치
KR100771779B1 (ko) * 2005-11-04 2007-10-30 삼성전기주식회사 황색 형광체 및 이를 이용한 백색 발광 장치
TWI291247B (en) * 2005-11-11 2007-12-11 Univ Nat Chiao Tung Nanoparticle structure and manufacturing process of multi-wavelength light emitting devices
KR101258397B1 (ko) * 2005-11-11 2013-04-30 서울반도체 주식회사 구리 알칼리토 실리케이트 혼성 결정 형광체
US20070114561A1 (en) * 2005-11-22 2007-05-24 Comanzo Holly A High efficiency phosphor for use in LEDs
CN101313048B (zh) * 2005-11-24 2012-06-20 皇家飞利浦电子股份有限公司 具有固态荧光材料的显示器件
WO2007060593A1 (en) * 2005-11-28 2007-05-31 Koninklijke Philips Electronics N.V. Apparatus for and method of recording data on a rewritable optical record carrier
US20070128745A1 (en) * 2005-12-01 2007-06-07 Brukilacchio Thomas J Phosphor deposition method and apparatus for making light emitting diodes
US20070125984A1 (en) * 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US8906262B2 (en) 2005-12-02 2014-12-09 Lightscape Materials, Inc. Metal silicate halide phosphors and LED lighting devices using the same
CN100334185C (zh) * 2005-12-09 2007-08-29 天津理工大学 稀土钇铝石榴石发光材料及气相制备法
KR101303370B1 (ko) * 2005-12-14 2013-09-03 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 조명 장치 및 그 제조 방법
JP2007165728A (ja) * 2005-12-15 2007-06-28 Toshiba Discrete Technology Kk 発光装置及び可視光通信用照明装置
KR101055772B1 (ko) 2005-12-15 2011-08-11 서울반도체 주식회사 발광장치
JP2007165811A (ja) 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置
DE102005061204A1 (de) * 2005-12-21 2007-07-05 Perkinelmer Elcos Gmbh Beleuchtungsvorrichtung, Beleuchtungssteuergerät und Beleuchtungssystem
KR101332139B1 (ko) 2005-12-21 2013-11-21 크리, 인코포레이티드 조명 장치 및 조명 방법
JP5614766B2 (ja) 2005-12-21 2014-10-29 クリー インコーポレイテッドＣｒｅｅ Ｉｎｃ． 照明装置
WO2007075730A2 (en) * 2005-12-21 2007-07-05 Cree Led Lighting Solutions, Inc Sign and method for lighting
TWI396814B (zh) 2005-12-22 2013-05-21 克里公司 照明裝置
US20070158660A1 (en) * 2005-12-22 2007-07-12 Acol Technologies S.A. Optically active compositions and combinations of same with InGaN semiconductors
US7474287B2 (en) * 2005-12-23 2009-01-06 Hong Kong Applied Science And Technology Light emitting device
US7659544B2 (en) * 2005-12-23 2010-02-09 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Light emitting device with at least two alternately driven light emitting diodes
CN1988188A (zh) * 2005-12-23 2007-06-27 香港应用科技研究院有限公司 具有荧光层结构的发光二极管晶粒及其制造方法
CN101331357B (zh) 2005-12-27 2010-09-08 昭和电工株式会社 平面光源器件和显示器件
KR100728134B1 (ko) * 2005-12-30 2007-06-13 김재조 발광 장치
US9351355B2 (en) 2005-12-30 2016-05-24 Seoul Semiconductor Co., Ltd. Illumination system having color temperature control and method for controlling the same
EP1974389A4 (de) 2006-01-05 2010-12-29 Illumitex Inc Separate optische vorrichtung zur lichtorientierung von einer led
DE102006001195A1 (de) 2006-01-10 2007-07-12 Sms Demag Ag Verfahren zum Gieß-Walzen mit erhöhter Gießgeschwindigkeit und daran anschließendem Warmwalzen von relativ dünnen Metall-,insbesondere Stahlwerkstoff-Strängen,und Gieß-Walz-Einrichtung
CN100464233C (zh) * 2006-01-17 2009-02-25 群康科技(深圳)有限公司 背光模块
KR100821684B1 (ko) * 2006-01-17 2008-04-11 주식회사 에스티앤아이 백색 발광 다이오드 소자
WO2007083828A1 (ja) 2006-01-19 2007-07-26 Ube Industries, Ltd. セラミックス複合体光変換部材およびそれを用いた発光装置
US8441179B2 (en) 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP2009524247A (ja) * 2006-01-20 2009-06-25 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド ルミファー膜を空間的に分離することにより固体光発光素子におけるスペクトル内容をシフトすること
JP2007226190A (ja) * 2006-01-30 2007-09-06 Konica Minolta Holdings Inc 映像表示装置およびヘッドマウントディスプレイ
DE102006005042A1 (de) 2006-02-03 2007-08-09 Tridonic Optoelectronics Gmbh Licht emittierende Vorrichtung mit nicht-aktiviertem Leuchtstoff
RU2315135C2 (ru) * 2006-02-06 2008-01-20 Владимир Семенович Абрамов Метод выращивания неполярных эпитаксиальных гетероструктур на основе нитридов элементов iii группы
TWI317756B (en) * 2006-02-07 2009-12-01 Coretronic Corp Phosphor, fluorescent gel, and light emitting diode device
KR20080103527A (ko) 2006-02-14 2008-11-27 메사츄세츠 인스티튜트 어브 테크놀로지 백색 발광 장치들
US7884816B2 (en) 2006-02-15 2011-02-08 Prysm, Inc. Correcting pyramidal error of polygon scanner in scanning beam display systems
US8451195B2 (en) 2006-02-15 2013-05-28 Prysm, Inc. Servo-assisted scanning beam display systems using fluorescent screens
US20080000467A1 (en) * 2006-02-16 2008-01-03 Design Annex Disposable charcoal lighting apparatus
US20070194684A1 (en) * 2006-02-21 2007-08-23 Chen Yi-Yi Light emitting diode structure
KR100735453B1 (ko) * 2006-02-22 2007-07-04 삼성전기주식회사 백색 발광 장치
JP5027427B2 (ja) * 2006-02-23 2012-09-19 パナソニック株式会社 発光ダイオードを用いた白色照明装置
JP4992250B2 (ja) * 2006-03-01 2012-08-08 日亜化学工業株式会社 発光装置
US7737634B2 (en) 2006-03-06 2010-06-15 Avago Technologies General Ip (Singapore) Pte. Ltd. LED devices having improved containment for liquid encapsulant
US9874674B2 (en) 2006-03-07 2018-01-23 Samsung Electronics Co., Ltd. Compositions, optical component, system including an optical component, devices, and other products
JP2007250629A (ja) * 2006-03-14 2007-09-27 Toshiba Corp 発光装置及びその製造方法、並びに蛍光パターン形成物
KR100746749B1 (ko) * 2006-03-15 2007-08-09 (주)케이디티 광 여기 시트
US7795600B2 (en) * 2006-03-24 2010-09-14 Goldeneye, Inc. Wavelength conversion chip for use with light emitting diodes and method for making same
JP5032043B2 (ja) * 2006-03-27 2012-09-26 豊田合成株式会社 フェラスメタルアルカリ土類金属ケイ酸塩混合結晶蛍光体およびこれを用いた発光装置
KR100875443B1 (ko) 2006-03-31 2008-12-23 서울반도체 주식회사 발광 장치
JP4980640B2 (ja) * 2006-03-31 2012-07-18 三洋電機株式会社 照明装置
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
JP5068472B2 (ja) * 2006-04-12 2012-11-07 昭和電工株式会社 発光装置の製造方法
US8513875B2 (en) 2006-04-18 2013-08-20 Cree, Inc. Lighting device and lighting method
US7821194B2 (en) 2006-04-18 2010-10-26 Cree, Inc. Solid state lighting devices including light mixtures
US9084328B2 (en) 2006-12-01 2015-07-14 Cree, Inc. Lighting device and lighting method
WO2007123938A2 (en) 2006-04-18 2007-11-01 Cree Led Lighting Solutions, Inc. Lighting device and lighting method
EP2008019B1 (de) 2006-04-20 2015-08-05 Cree, Inc. Beleuchtungsvorrichtung und beleuchtungsverfahren
CN102437152A (zh) 2006-04-24 2012-05-02 克利公司 侧视表面安装式白光led
FR2900382B1 (fr) * 2006-04-26 2009-02-27 Benotec Soc Par Actions Simpli Chariot de manutention a au moins trois roues directrices
US7888868B2 (en) * 2006-04-28 2011-02-15 Avago Technologies General Ip (Singapore) Pte. Ltd. LED light source with light-directing structures
EP2549330B1 (de) 2006-05-05 2017-08-30 Prysm, Inc. Phosphorzusammensetzungen und andere Leuchtstoffmaterialien für Anzeigesysteme und -vorrichtungen
KR101340682B1 (ko) 2006-05-05 2013-12-12 크리, 인코포레이티드 조명 장치
US20070262288A1 (en) * 2006-05-09 2007-11-15 Soshchin Naum Inorganic fluorescent powder as a solid light source
TWI357435B (en) 2006-05-12 2012-02-01 Lextar Electronics Corp Light emitting diode and wavelength converting mat
WO2007135707A1 (ja) 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
JP4188404B2 (ja) 2006-05-19 2008-11-26 三井金属鉱業株式会社 白色蛍光体および白色発光素子乃至装置
US7846391B2 (en) 2006-05-22 2010-12-07 Lumencor, Inc. Bioanalytical instrumentation using a light source subsystem
WO2007139781A2 (en) 2006-05-23 2007-12-06 Cree Led Lighting Solutions, Inc. Lighting device
JP2009538531A (ja) * 2006-05-23 2009-11-05 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド 照明装置、および、製造方法
US20070274093A1 (en) * 2006-05-25 2007-11-29 Honeywell International, Inc. LED backlight system for LCD displays
JP2009538536A (ja) 2006-05-26 2009-11-05 クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド 固体発光デバイス、および、それを製造する方法
CN101077973B (zh) 2006-05-26 2010-09-29 大连路明发光科技股份有限公司 硅酸盐荧光材料及其制造方法以及使用其的发光装置
CN100467170C (zh) * 2006-05-28 2009-03-11 揭朝奎 可焊性粉末冶金轴承及生产工艺
CN101501870B (zh) * 2006-05-31 2012-10-31 株式会社藤仓 发光元件安装用基板、发光元件模块以及显示装置
BRPI0712439B1 (pt) 2006-05-31 2019-11-05 Cree Led Lighting Solutions Inc dispositivo de iluminação e método de iluminação
US20070280622A1 (en) * 2006-06-02 2007-12-06 3M Innovative Properties Company Fluorescent light source having light recycling means
US20070279914A1 (en) * 2006-06-02 2007-12-06 3M Innovative Properties Company Fluorescent volume light source with reflector
JP4899651B2 (ja) * 2006-06-07 2012-03-21 ソニー株式会社 発光ダイオード点灯回路、照明装置及び液晶表示装置
US20070284565A1 (en) * 2006-06-12 2007-12-13 3M Innovative Properties Company Led device with re-emitting semiconductor construction and optical element
US7952110B2 (en) 2006-06-12 2011-05-31 3M Innovative Properties Company LED device with re-emitting semiconductor construction and converging optical element
US7863634B2 (en) * 2006-06-12 2011-01-04 3M Innovative Properties Company LED device with re-emitting semiconductor construction and reflector
CN101467271B (zh) * 2006-06-12 2012-04-25 3M创新有限公司 具有再发光半导体构造和会聚光学元件的led装置
US7902542B2 (en) 2006-06-14 2011-03-08 3M Innovative Properties Company Adapted LED device with re-emitting semiconductor construction
JP5088320B2 (ja) * 2006-06-21 2012-12-05 株式会社村田製作所 透光性セラミック、ならびに光学部品および光学装置
JP4282693B2 (ja) * 2006-07-04 2009-06-24 株式会社東芝 半導体発光素子及びその製造方法
CN100590172C (zh) 2006-07-26 2010-02-17 北京有色金属研究总院 一种含硅的led荧光粉及其制造方法和所制成的发光器件
JP4520437B2 (ja) * 2006-07-26 2010-08-04 信越化学工業株式会社 Ｌｅｄ用蛍光物質入り硬化性シリコーン組成物およびその組成物を使用するｌｅｄ発光装置。
US7804147B2 (en) 2006-07-31 2010-09-28 Cree, Inc. Light emitting diode package element with internal meniscus for bubble free lens placement
US7943952B2 (en) 2006-07-31 2011-05-17 Cree, Inc. Method of uniform phosphor chip coating and LED package fabricated using method
US20080029720A1 (en) 2006-08-03 2008-02-07 Intematix Corporation LED lighting arrangement including light emitting phosphor
JP4957110B2 (ja) * 2006-08-03 2012-06-20 日亜化学工業株式会社 発光装置
US20080029774A1 (en) * 2006-08-04 2008-02-07 Acol Technologies S.A. Semiconductor light source packages with broadband and angular uniformity support
WO2008022552A1 (fr) 2006-08-15 2008-02-28 Luming Science And Technology Group Co., Ltd. Matériau luminescent à base de silicate avec pic multi-émission, son procédé de fabrication et son utilisation dans un dispositif d'éclairage
US20080113877A1 (en) * 2006-08-16 2008-05-15 Intematix Corporation Liquid solution deposition of composition gradient materials
TWI317562B (en) * 2006-08-16 2009-11-21 Ind Tech Res Inst Light-emitting device
WO2008024761A2 (en) 2006-08-21 2008-02-28 Innotec Corporation Electrical device having boardless electrical component mounting arrangement
US7763478B2 (en) 2006-08-21 2010-07-27 Cree, Inc. Methods of forming semiconductor light emitting device packages by liquid injection molding
JP5100059B2 (ja) * 2006-08-24 2012-12-19 スタンレー電気株式会社 蛍光体、その製造方法およびそれを用いた発光装置
KR101258227B1 (ko) * 2006-08-29 2013-04-25 서울반도체 주식회사 발광 소자
US7703942B2 (en) 2006-08-31 2010-04-27 Rensselaer Polytechnic Institute High-efficient light engines using light emitting diodes
US7910938B2 (en) 2006-09-01 2011-03-22 Cree, Inc. Encapsulant profile for light emitting diodes
US8425271B2 (en) 2006-09-01 2013-04-23 Cree, Inc. Phosphor position in light emitting diodes
JP5157909B2 (ja) 2006-09-25 2013-03-06 宇部興産株式会社 光変換用セラミックス複合体およびそれを用いた発光装置
US7857457B2 (en) * 2006-09-29 2010-12-28 3M Innovative Properties Company Fluorescent volume light source having multiple fluorescent species
JP2010506402A (ja) 2006-10-02 2010-02-25 イルミテックス， インコーポレイテッド Ｌｅｄのシステムおよび方法
US20090275157A1 (en) * 2006-10-02 2009-11-05 Illumitex, Inc. Optical device shaping
CN101605867B (zh) * 2006-10-03 2013-05-08 渲染材料公司 金属硅酸盐卤化物磷光体以及使用它们的led照明器件
GB2442505A (en) * 2006-10-04 2008-04-09 Sharp Kk A display with a primary light source for illuminating a nanophosphor re-emission material
EP2074668B1 (de) * 2006-10-10 2018-02-28 Tridonic Jennersdorf GmbH Leuchtstoffumgesetzte leuchtdiode
US8310144B2 (en) * 2006-10-18 2012-11-13 Koninklijke Philips Electronics N.V. Illumination system and display device
US8133461B2 (en) 2006-10-20 2012-03-13 Intematix Corporation Nano-YAG:Ce phosphor compositions and their methods of preparation
US9120975B2 (en) 2006-10-20 2015-09-01 Intematix Corporation Yellow-green to yellow-emitting phosphors based on terbium-containing aluminates
US8475683B2 (en) 2006-10-20 2013-07-02 Intematix Corporation Yellow-green to yellow-emitting phosphors based on halogenated-aluminates
US8529791B2 (en) 2006-10-20 2013-09-10 Intematix Corporation Green-emitting, garnet-based phosphors in general and backlighting applications
JP2010508651A (ja) * 2006-10-31 2010-03-18 ティーアイアール テクノロジー エルピー 光励起可能媒体を含む光源
US8029155B2 (en) 2006-11-07 2011-10-04 Cree, Inc. Lighting device and lighting method
US10295147B2 (en) * 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
CN101182416B (zh) 2006-11-13 2010-09-22 北京有色金属研究总院 含二价金属元素的铝酸盐荧光粉及制造方法和发光器件
TWI496315B (zh) * 2006-11-13 2015-08-11 Cree Inc 照明裝置、被照明的殼體及照明方法
US7769066B2 (en) 2006-11-15 2010-08-03 Cree, Inc. Laser diode and method for fabricating same
US8045595B2 (en) 2006-11-15 2011-10-25 Cree, Inc. Self aligned diode fabrication method and self aligned laser diode
US7813400B2 (en) 2006-11-15 2010-10-12 Cree, Inc. Group-III nitride based laser diode and method for fabricating same
US7889421B2 (en) 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
US7521862B2 (en) * 2006-11-20 2009-04-21 Philips Lumileds Lighting Co., Llc Light emitting device including luminescent ceramic and light-scattering material
WO2008063657A2 (en) * 2006-11-21 2008-05-29 Qd Vision, Inc. Light emitting devices and displays with improved performance
US7692263B2 (en) 2006-11-21 2010-04-06 Cree, Inc. High voltage GaN transistors
JP5367218B2 (ja) 2006-11-24 2013-12-11 シャープ株式会社 蛍光体の製造方法および発光装置の製造方法
US9441793B2 (en) 2006-12-01 2016-09-13 Cree, Inc. High efficiency lighting device including one or more solid state light emitters, and method of lighting
EP2095011A1 (de) 2006-12-04 2009-09-02 Cree Led Lighting Solutions, Inc. Beleuchtungsanordnung und beleuchtungsverfahren
CN101622493A (zh) 2006-12-04 2010-01-06 科锐Led照明科技公司 照明装置和照明方法
JP5153783B2 (ja) 2006-12-07 2013-02-27 クリー インコーポレイテッド 照明デバイスおよび照明方法
JP5028562B2 (ja) * 2006-12-11 2012-09-19 株式会社ジャパンディスプレイイースト 照明装置及びこの照明装置を用いた表示装置
TWI460881B (zh) 2006-12-11 2014-11-11 Univ California 透明發光二極體
ATE469530T1 (de) * 2006-12-12 2010-06-15 Inverto Nv Led-beleuchtung mit kontinuierlicher und einstellbarer farbtemperatur (ct) unter aufrechterhaltung eines hohen cri
US8013506B2 (en) 2006-12-12 2011-09-06 Prysm, Inc. Organic compounds for adjusting phosphor chromaticity
TWI359857B (en) * 2006-12-25 2012-03-11 Ind Tech Res Inst White light illumination device
KR100788556B1 (ko) * 2007-01-03 2007-12-26 삼성에스디아이 주식회사 광흡수층을 갖는 액정 표시 장치용 연성 회로 기판
JP4660507B2 (ja) * 2007-01-03 2011-03-30 三星モバイルディスプレイ株式會社 フレキシブル回路基板及びこれを有する液晶表示装置
KR100788557B1 (ko) * 2007-01-03 2007-12-26 삼성에스디아이 주식회사 광흡수층을 갖는 액정 표시 장치용 연성 회로 기판
JP2008186802A (ja) * 2007-01-04 2008-08-14 Toshiba Corp バックライト装置、液晶表示装置
US8836212B2 (en) 2007-01-11 2014-09-16 Qd Vision, Inc. Light emissive printed article printed with quantum dot ink
US7800304B2 (en) * 2007-01-12 2010-09-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multi-chip packaged LED light source
TWI325186B (en) * 2007-01-19 2010-05-21 Harvatek Corp Led chip package structure using ceramic material as a substrate
US7834367B2 (en) 2007-01-19 2010-11-16 Cree, Inc. Low voltage diode with reduced parasitic resistance and method for fabricating
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
CN101250408B (zh) * 2007-01-22 2011-03-23 罗维鸿 暖白色发光二极管及其带橙黄辐射的荧光粉
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US8232564B2 (en) 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
US7781783B2 (en) * 2007-02-07 2010-08-24 SemiLEDs Optoelectronics Co., Ltd. White light LED device
US20080192458A1 (en) * 2007-02-12 2008-08-14 Intematix Corporation Light emitting diode lighting system
US7709853B2 (en) * 2007-02-12 2010-05-04 Cree, Inc. Packaged semiconductor light emitting devices having multiple optical elements
US9061450B2 (en) 2007-02-12 2015-06-23 Cree, Inc. Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding
US20080197369A1 (en) * 2007-02-20 2008-08-21 Cree, Inc. Double flip semiconductor device and method for fabrication
JP5476128B2 (ja) * 2007-02-22 2014-04-23 クリー インコーポレイテッド 照明装置、照明方法、光フィルタ、および光をフィルタリングする方法
DE102007009820A1 (de) * 2007-02-28 2008-09-04 Osram Opto Semiconductors Gmbh Optische Anordnung und optisches Verfahren
US20080218998A1 (en) * 2007-03-08 2008-09-11 Quest William J Device having multiple light sources and methods of use
TWI390748B (zh) * 2007-03-09 2013-03-21 Light energy of the battery efficiency film
KR100818518B1 (ko) * 2007-03-14 2008-03-31 삼성전기주식회사 Ｌｅｄ 패키지
US8408773B2 (en) 2007-03-19 2013-04-02 Innotec Corporation Light for vehicles
US7712933B2 (en) 2007-03-19 2010-05-11 Interlum, Llc Light for vehicles
US7687816B2 (en) * 2007-03-20 2010-03-30 International Business Machines Corporation Light emitting diode
WO2008116123A1 (en) * 2007-03-20 2008-09-25 Spudnik, Inc. Delivering and displaying advertisement or other application data to display systems
TWI338957B (en) 2007-03-23 2011-03-11 Lite On Technology Corp Light-emitting device with open-loop control and manufacturing method thereof
KR100848872B1 (ko) * 2007-03-29 2008-07-29 서울반도체 주식회사 Ｒｇｂ를 이용한 발광장치
TWI378138B (en) * 2007-04-02 2012-12-01 Univ Nat Chiao Tung Green-emitting phosphors and process for producing the same
DE102008017039A1 (de) 2007-04-05 2008-10-09 Koito Manufacturing Co., Ltd. Leuchtstoff
US8169454B1 (en) 2007-04-06 2012-05-01 Prysm, Inc. Patterning a surface using pre-objective and post-objective raster scanning systems
US7697183B2 (en) 2007-04-06 2010-04-13 Prysm, Inc. Post-objective scanning beam systems
US7964888B2 (en) * 2007-04-18 2011-06-21 Cree, Inc. Semiconductor light emitting device packages and methods
WO2008134056A1 (en) * 2007-04-26 2008-11-06 Deak-Lam Inc. Photon energy coversion structure
US7910944B2 (en) 2007-05-04 2011-03-22 Cree, Inc. Side mountable semiconductor light emitting device packages and panels
CN101688943A (zh) * 2007-05-04 2010-03-31 诺克特龙金融控股有限公司 照明装置及具有这种照明装置的液晶屏幕
DE102007026795A1 (de) * 2007-05-04 2008-11-06 Noctron Holding S.A. Beleuchtungsvorrichtung sowie Flüssigkristall-Bildschirm mit einer solchen Beleuchtungsvorrichtung
DE102007025573A1 (de) * 2007-05-31 2008-12-04 Noctron Holding S.A. Flüssigkristall-Anzeigefeld
US7781779B2 (en) * 2007-05-08 2010-08-24 Luminus Devices, Inc. Light emitting devices including wavelength converting material
EP2142844B1 (de) 2007-05-08 2017-08-23 Cree, Inc. Beleuchtungsvorrichtung und beleuchtungsverfahren
EP2142843B1 (de) * 2007-05-08 2016-12-14 Cree, Inc. Beleuchtungsvorrichtung und beleuchtungsverfahren
TW200912204A (en) 2007-05-08 2009-03-16 Cree Led Lighting Solutions Lighting device and lighting method
EP2153113B1 (de) 2007-05-08 2016-01-06 Cree, Inc. Beleuchtungsvorrichtung und beleuchtungsverfahren
CN101688644B (zh) 2007-05-08 2011-06-15 科锐Led照明科技公司 照明装置及照明方法
TWI349694B (en) * 2007-05-14 2011-10-01 Univ Nat Chiao Tung A novel phosphor for white light-emitting diodes and fabrication of the same
RU2442197C2 (ru) 2007-05-17 2012-02-10 Призм, Инк. Многослойные экраны со светоизлучающими полосками для систем отображения со сканирующим лучом
EP2158429A2 (de) * 2007-05-29 2010-03-03 Oree, Advanced Illumination Solutions INC. Verfahren und vorrichtung für eine rundumbeleuchtung
KR100886785B1 (ko) * 2007-06-04 2009-03-04 박기운 발광 장치 및 그 제조방법 및 백색계 발광 다이오드
US7999283B2 (en) 2007-06-14 2011-08-16 Cree, Inc. Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes
US8767215B2 (en) 2007-06-18 2014-07-01 Leddartech Inc. Method for detecting objects with light
US8319949B2 (en) * 2007-06-18 2012-11-27 Leddartech Inc. Method for detecting objects with visible light
US7942556B2 (en) * 2007-06-18 2011-05-17 Xicato, Inc. Solid state illumination device
DE102007028120A1 (de) 2007-06-19 2008-12-24 Osram Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Chlorosilikat-Leuchtstoffs und damit hergestellter Leuchtstoff
JP4925119B2 (ja) * 2007-06-21 2012-04-25 シャープ株式会社 酸化物蛍光体および発光装置
US8556430B2 (en) 2007-06-27 2013-10-15 Prysm, Inc. Servo feedback control based on designated scanning servo beam in scanning beam display systems with light-emitting screens
US7878657B2 (en) 2007-06-27 2011-02-01 Prysm, Inc. Servo feedback control based on invisible scanning servo beam in scanning beam display systems with light-emitting screens
TWI365546B (en) * 2007-06-29 2012-06-01 Ind Tech Res Inst Light emitting diode device and fabrication method thereof
JP5368985B2 (ja) 2007-07-09 2013-12-18 シャープ株式会社 蛍光体粒子群およびそれを用いた発光装置
US7852523B2 (en) * 2007-07-11 2010-12-14 Samsung Electronics Co., Ltd. Scanner module and image scanning apparatus employing the same
US10505083B2 (en) * 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
KR101279034B1 (ko) * 2007-07-11 2013-07-02 삼성전자주식회사 스캐너 모듈 및 이를 채용한 화상독취장치
US7924478B2 (en) * 2007-07-11 2011-04-12 Samsung Electronics Co., Ltd. Scanner module and image scanning apparatus employing the same
EP2015614B1 (de) 2007-07-12 2010-12-15 Koito Manufacturing Co., Ltd. Lichtemittierende Vorrichtung
WO2009012301A2 (en) * 2007-07-16 2009-01-22 Lumination Llc Red line emitting complex fluoride phosphors activated with mn4+
US8123384B2 (en) 2007-07-17 2012-02-28 Cree, Inc. Optical elements with internal optical features and methods of fabricating same
WO2009014707A2 (en) 2007-07-23 2009-01-29 Qd Vision, Inc. Quantum dot light enhancement substrate and lighting device including same
TWI384052B (zh) * 2007-07-25 2013-02-01 Univ Nat Chiao Tung 新穎螢光體與其製造方法
TWI363085B (en) 2007-07-26 2012-05-01 Univ Nat Chiao Tung A novel phosphor and fabrication of the same
DE102007036226A1 (de) * 2007-08-02 2009-02-05 Perkinelmer Elcos Gmbh Anbringungsstruktur für LEDs, LED-Baugruppe, LED-Baugruppensockel, Verfahren zum Ausbilden einer Anbringungsstruktur
US8098375B2 (en) 2007-08-06 2012-01-17 Lumencor, Inc. Light emitting diode illumination system
US7863635B2 (en) 2007-08-07 2011-01-04 Cree, Inc. Semiconductor light emitting devices with applied wavelength conversion materials
US7652301B2 (en) * 2007-08-16 2010-01-26 Philips Lumileds Lighting Company, Llc Optical element coupled to low profile side emitting LED
CN101784636B (zh) 2007-08-22 2013-06-12 首尔半导体株式会社 非化学计量四方铜碱土硅酸盐磷光体及其制备方法
WO2009028869A2 (en) * 2007-08-27 2009-03-05 Lg Electronics Inc. Light emitting device package and lighting apparatus using the same
KR101055769B1 (ko) 2007-08-28 2011-08-11 서울반도체 주식회사 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치
US8128249B2 (en) 2007-08-28 2012-03-06 Qd Vision, Inc. Apparatus for selectively backlighting a material
US7791093B2 (en) * 2007-09-04 2010-09-07 Koninklijke Philips Electronics N.V. LED with particles in encapsulant for increased light extraction and non-yellow off-state color
US7851990B2 (en) * 2007-09-06 2010-12-14 He Shan Lide Electronic Enterprise Company Ltd. Method for generating low color temperature light and light emitting device adopting the same
US8866185B2 (en) * 2007-09-06 2014-10-21 SemiLEDs Optoelectronics Co., Ltd. White light LED with multiple encapsulation layers
US7920042B2 (en) 2007-09-10 2011-04-05 Enpirion, Inc. Micromagnetic device and method of forming the same
US8133529B2 (en) 2007-09-10 2012-03-13 Enpirion, Inc. Method of forming a micromagnetic device
US8018315B2 (en) 2007-09-10 2011-09-13 Enpirion, Inc. Power converter employing a micromagnetic device
US7955868B2 (en) 2007-09-10 2011-06-07 Enpirion, Inc. Method of forming a micromagnetic device
DE102007049005A1 (de) * 2007-09-11 2009-03-12 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
DE102007043355A1 (de) * 2007-09-12 2009-03-19 Lumitech Produktion Und Entwicklung Gmbh LED-Modul, LED-Leuchtmittel und LED Leuchte für die energie-effiziente Wiedergabe von weißem Licht
US8519437B2 (en) 2007-09-14 2013-08-27 Cree, Inc. Polarization doping in nitride based diodes
DE102007053286A1 (de) * 2007-09-20 2009-04-02 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelements
JP5075552B2 (ja) * 2007-09-25 2012-11-21 株式会社東芝 蛍光体およびそれを用いたｌｅｄランプ
JP2009081379A (ja) 2007-09-27 2009-04-16 Showa Denko Kk Ｉｉｉ族窒化物半導体発光素子
KR100891020B1 (ko) * 2007-09-28 2009-03-31 한국과학기술원 새로운 조성의 황색 발광 Ｃｅ3+부활 칼슘 실리케이트 황색형광체 및 그 제조방법
US20090117672A1 (en) * 2007-10-01 2009-05-07 Intematix Corporation Light emitting devices with phosphor wavelength conversion and methods of fabrication thereof
US8883528B2 (en) * 2007-10-01 2014-11-11 Intematix Corporation Methods of producing light emitting device with phosphor wavelength conversion
US11317495B2 (en) 2007-10-06 2022-04-26 Lynk Labs, Inc. LED circuits and assemblies
US11297705B2 (en) 2007-10-06 2022-04-05 Lynk Labs, Inc. Multi-voltage and multi-brightness LED lighting devices and methods of using same
US9012937B2 (en) 2007-10-10 2015-04-21 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same
WO2009049019A1 (en) * 2007-10-10 2009-04-16 Cree Led Lighting Solutions, Inc. Lighting device and method of making
CN100546058C (zh) * 2007-10-15 2009-09-30 佛山市国星光电股份有限公司 功率发光二极管封装结构
US7984999B2 (en) * 2007-10-17 2011-07-26 Xicato, Inc. Illumination device with light emitting diodes and moveable light adjustment member
US7915627B2 (en) * 2007-10-17 2011-03-29 Intematix Corporation Light emitting device with phosphor wavelength conversion
US9086213B2 (en) 2007-10-17 2015-07-21 Xicato, Inc. Illumination device with light emitting diodes
KR101294849B1 (ko) * 2007-10-23 2013-08-08 엘지디스플레이 주식회사 백라이트 어셈블리
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8018139B2 (en) * 2007-11-05 2011-09-13 Enertron, Inc. Light source and method of controlling light spectrum of an LED light engine
US8119028B2 (en) * 2007-11-14 2012-02-21 Cree, Inc. Cerium and europium doped single crystal phosphors
TWI334047B (en) * 2007-11-22 2010-12-01 Au Optronics Corp Liquid crystal display
DE102007056562A1 (de) 2007-11-23 2009-05-28 Oerlikon Textile Gmbh & Co. Kg Vorrichtung zur optischen Detektion von Verunreinigungen in längsbewegtem Garn
JP2009130301A (ja) * 2007-11-27 2009-06-11 Sharp Corp 発光素子および発光素子の製造方法
JP5558665B2 (ja) * 2007-11-27 2014-07-23 パナソニック株式会社 発光装置
KR100998233B1 (ko) 2007-12-03 2010-12-07 서울반도체 주식회사 슬림형 ｌｅｄ 패키지
CN101453804B (zh) * 2007-12-05 2010-04-07 亿镫光电科技股份有限公司 白光发光装置
TWI336015B (en) * 2007-12-06 2011-01-11 Au Optronics Corp Liquid crystal display
WO2009072539A1 (ja) 2007-12-07 2009-06-11 Kabushiki Kaisha Toshiba 蛍光体およびそれを用いたｌｅｄ発光装置
WO2009076579A2 (en) 2007-12-12 2009-06-18 Innotec Corporation Overmolded circuit board and method
US8167674B2 (en) 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9431589B2 (en) * 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US8182128B2 (en) 2007-12-19 2012-05-22 Oree, Inc. Planar white illumination apparatus
US8172447B2 (en) 2007-12-19 2012-05-08 Oree, Inc. Discrete lighting elements and planar assembly thereof
US20090159915A1 (en) * 2007-12-19 2009-06-25 Shaul Branchevsky Led insert module and multi-layer lens
US8118447B2 (en) 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
JP5003464B2 (ja) * 2007-12-21 2012-08-15 三菱電機株式会社 光伝送モジュール
JP2009153712A (ja) 2007-12-26 2009-07-16 Olympus Corp 光源装置およびそれを備えた内視鏡装置
US7815339B2 (en) 2008-01-09 2010-10-19 Innotec Corporation Light module
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
CN101482247A (zh) * 2008-01-11 2009-07-15 富士迈半导体精密工业（上海）有限公司 照明装置
US8058088B2 (en) * 2008-01-15 2011-11-15 Cree, Inc. Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
US8940561B2 (en) * 2008-01-15 2015-01-27 Cree, Inc. Systems and methods for application of optical materials to optical elements
US20090309114A1 (en) * 2008-01-16 2009-12-17 Luminus Devices, Inc. Wavelength converting light-emitting devices and methods of making the same
US8337029B2 (en) * 2008-01-17 2012-12-25 Intematix Corporation Light emitting device with phosphor wavelength conversion
US20090185113A1 (en) * 2008-01-22 2009-07-23 Industrial Technology Research Institute Color Filter Module and Device of Having the Same
CN101493216B (zh) * 2008-01-24 2011-11-09 富士迈半导体精密工业（上海）有限公司 发光二极管光源模组
US9151884B2 (en) * 2008-02-01 2015-10-06 3M Innovative Properties Company Fluorescent volume light source with active chromphore
EP2240968A1 (de) 2008-02-08 2010-10-20 Illumitex, Inc. System und verfahren zur bildung einer emitterschicht
CN101946336B (zh) 2008-02-18 2012-06-27 株式会社小糸制作所 白色发光装置以及使用该白色发光装置的车辆用灯具
US8651723B2 (en) * 2008-02-21 2014-02-18 Koninklijke Philips N.V. LED light source with a luminescent layer
CN101953230B (zh) 2008-02-21 2013-03-27 日东电工株式会社 具有半透明陶瓷板的发光装置
CN101514801A (zh) * 2008-02-22 2009-08-26 富士迈半导体精密工业（上海）有限公司 照明装置
US8163203B2 (en) 2008-02-27 2012-04-24 The Regents Of The University Of California Yellow emitting phosphors based on Ce3+-doped aluminate and via solid solution for solid-state lighting applications
JP2009206459A (ja) * 2008-02-29 2009-09-10 Sharp Corp 色変換部材およびそれを用いた発光装置
WO2009109974A2 (en) 2008-03-05 2009-09-11 Oree, Advanced Illumination Solutions Inc. Illumination apparatus and methods of forming the same
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US9525148B2 (en) 2008-04-03 2016-12-20 Qd Vision, Inc. Device including quantum dots
KR101995370B1 (ko) 2008-04-03 2019-07-02 삼성 리서치 아메리카 인코포레이티드 양자점들을 포함하는 발광 소자
TWI521266B (zh) * 2008-04-03 2016-02-11 友達光電股份有限公司 液晶顯示器
US9246390B2 (en) 2008-04-16 2016-01-26 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8692532B2 (en) 2008-04-16 2014-04-08 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8686698B2 (en) 2008-04-16 2014-04-01 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US8541991B2 (en) 2008-04-16 2013-09-24 Enpirion, Inc. Power converter with controller operable in selected modes of operation
US20110037376A1 (en) * 2008-04-23 2011-02-17 Koninklijke Philips Electronics N.V. Luminous device
DE102009018603B9 (de) 2008-04-25 2021-01-14 Samsung Electronics Co., Ltd. Leuchtvorrichtung und Herstellungsverfahren derselben
US20090268461A1 (en) * 2008-04-28 2009-10-29 Deak David G Photon energy conversion structure
DE102008021438A1 (de) 2008-04-29 2009-12-31 Schott Ag Konversionsmaterial insbesondere für eine, eine Halbleiterlichtquelle umfassende weiße oder farbige Lichtquelle, Verfahren zu dessen Herstellung sowie dieses Konversionsmaterial umfassende Lichtquelle
DE102008021658A1 (de) 2008-04-30 2009-11-05 Ledon Lighting Jennersdorf Gmbh Lichtemittierende Vorrichtung mit Volumenstrukturierung
DE202008005987U1 (de) * 2008-04-30 2009-09-03 Ledon Lighting Jennersdorf Gmbh LED-Modul mit kalottenförmiger Farbkonversionsschicht
US9287469B2 (en) 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
US9207385B2 (en) 2008-05-06 2015-12-08 Qd Vision, Inc. Lighting systems and devices including same
WO2009137053A1 (en) 2008-05-06 2009-11-12 Qd Vision, Inc. Optical components, systems including an optical component, and devices
WO2009151515A1 (en) 2008-05-06 2009-12-17 Qd Vision, Inc. Solid state lighting devices including quantum confined semiconductor nanoparticles
DE102008022888A1 (de) * 2008-05-08 2009-11-19 Lok-F Gmbh Leuchtvorrichtung
TWI362769B (en) 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
JP2009277887A (ja) * 2008-05-15 2009-11-26 Shin Etsu Chem Co Ltd 発光装置
US20100176751A1 (en) * 2008-05-20 2010-07-15 Panasonic Corporation Semiconductor light-emitting device as well as light source device and lighting system including the same
US8242525B2 (en) * 2008-05-20 2012-08-14 Lightscape Materials, Inc. Silicate-based phosphors and LED lighting devices using the same
US8360599B2 (en) 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US8461613B2 (en) 2008-05-27 2013-06-11 Interlight Optotech Corporation Light emitting device
DE102008025318A1 (de) * 2008-05-27 2009-12-10 Setrinx S.A.R.L. Leuchtchip und Leuchtvorrichtung mit einem solchen
US7868340B2 (en) 2008-05-30 2011-01-11 Bridgelux, Inc. Method and apparatus for generating white light from solid state light emitting devices
US8097081B2 (en) 2008-06-05 2012-01-17 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US20090301388A1 (en) * 2008-06-05 2009-12-10 Soraa Inc. Capsule for high pressure processing and method of use for supercritical fluids
US9157167B1 (en) 2008-06-05 2015-10-13 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US8871024B2 (en) * 2008-06-05 2014-10-28 Soraa, Inc. High pressure apparatus and method for nitride crystal growth
US7906766B2 (en) * 2008-06-16 2011-03-15 Northrop Grumman Systems Corporation Systems and methods for simulating a vehicle exhaust plume
US8240875B2 (en) 2008-06-25 2012-08-14 Cree, Inc. Solid state linear array modules for general illumination
US20090320745A1 (en) * 2008-06-25 2009-12-31 Soraa, Inc. Heater device and method for high pressure processing of crystalline materials
US20090321758A1 (en) * 2008-06-25 2009-12-31 Wen-Huang Liu Led with improved external light extraction efficiency
EP2304312A4 (de) * 2008-06-25 2015-03-25 Mario W Cardullo Uv-lichtquelle zur erzeugung von sichtbarem licht
KR101448153B1 (ko) * 2008-06-25 2014-10-08 삼성전자주식회사 발광 다이오드용 멀티칩 패키지 및 멀티칩 패키지 방식의발광 다이오드 소자
WO2010005914A1 (en) * 2008-07-07 2010-01-14 Soraa, Inc. High quality large area bulk non-polar or semipolar gallium based substrates and methods
US9404197B2 (en) 2008-07-07 2016-08-02 Soraa, Inc. Large area, low-defect gallium-containing nitride crystals, method of making, and method of use
US8297786B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
US8301002B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
JP2010027704A (ja) * 2008-07-16 2010-02-04 Stanley Electric Co Ltd 蛍光体セラミック板を用いた発光装置の製造方法
TW201005075A (en) * 2008-07-24 2010-02-01 Univ Nat Chiao Tung White-emitting phosphors and lighting apparatus thereof
US7869112B2 (en) * 2008-07-25 2011-01-11 Prysm, Inc. Beam scanning based on two-dimensional polygon scanner for display and other applications
US7946729B2 (en) 2008-07-31 2011-05-24 Altair Engineering, Inc. Fluorescent tube replacement having longitudinally oriented LEDs
US8430958B2 (en) * 2008-08-07 2013-04-30 Soraa, Inc. Apparatus and method for seed crystal utilization in large-scale manufacturing of gallium nitride
US8979999B2 (en) * 2008-08-07 2015-03-17 Soraa, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US10036099B2 (en) 2008-08-07 2018-07-31 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of gallium nitride boules
US20100033077A1 (en) * 2008-08-08 2010-02-11 Glory Science Co., Ltd. Light emitting device and method of manufacturing the light emitting device
DE102008038249A1 (de) 2008-08-18 2010-02-25 Osram Gesellschaft mit beschränkter Haftung alpha-Sialon-Leuchtstoff
CN101577301B (zh) * 2008-09-05 2011-12-21 佛山市国星光电股份有限公司 白光led的封装方法及使用该方法制作的led器件
US20120181919A1 (en) * 2008-08-27 2012-07-19 Osram Sylvania Inc. Luminescent Ceramic Composite Converter and Method of Making the Same
US8164710B2 (en) * 2008-09-04 2012-04-24 Seoul Semiconductor Co., Ltd. Backlight assembly and liquid crystal display apparatus having the same
US20100058837A1 (en) * 2008-09-05 2010-03-11 Quest William J Device having multiple light sources and methods of use
US20100060198A1 (en) * 2008-09-05 2010-03-11 Lite-On It Corporation LED Lamp and Method for Producing a LED Lamp
US8143769B2 (en) * 2008-09-08 2012-03-27 Intematix Corporation Light emitting diode (LED) lighting device
GB0816557D0 (en) 2008-09-10 2008-10-15 Merck Patent Gmbh Electro-optical switching element and electro-optical display
US8256924B2 (en) 2008-09-15 2012-09-04 Ilumisys, Inc. LED-based light having rapidly oscillating LEDs
EP2163593A1 (de) 2008-09-15 2010-03-17 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Herstellung von nitridbasiertem Phosphor
US8342712B2 (en) 2008-09-30 2013-01-01 Disney Enterprises, Inc. Kinetic flame device
US9054086B2 (en) 2008-10-02 2015-06-09 Enpirion, Inc. Module having a stacked passive element and method of forming the same
US8153473B2 (en) 2008-10-02 2012-04-10 Empirion, Inc. Module having a stacked passive element and method of forming the same
US8266793B2 (en) 2008-10-02 2012-09-18 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
US8339802B2 (en) 2008-10-02 2012-12-25 Enpirion, Inc. Module having a stacked magnetic device and semiconductor device and method of forming the same
DE102008051256B4 (de) * 2008-10-10 2018-05-24 Ivoclar Vivadent Ag Halbleiter-Strahlungsquelle
US8075165B2 (en) * 2008-10-14 2011-12-13 Ledengin, Inc. Total internal reflection lens and mechanical retention and locating device
US20100098377A1 (en) * 2008-10-16 2010-04-22 Noam Meir Light confinement using diffusers
CN102187478B (zh) 2008-10-17 2013-06-05 株式会社小糸制作所 发光模块、发光模块的制造方法及灯具单元
US7938562B2 (en) 2008-10-24 2011-05-10 Altair Engineering, Inc. Lighting including integral communication apparatus
US8324817B2 (en) 2008-10-24 2012-12-04 Ilumisys, Inc. Light and light sensor
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US8444292B2 (en) 2008-10-24 2013-05-21 Ilumisys, Inc. End cap substitute for LED-based tube replacement light
US8653984B2 (en) 2008-10-24 2014-02-18 Ilumisys, Inc. Integration of LED lighting control with emergency notification systems
US8214084B2 (en) 2008-10-24 2012-07-03 Ilumisys, Inc. Integration of LED lighting with building controls
US8022631B2 (en) * 2008-11-03 2011-09-20 General Electric Company Color control of light sources employing phosphors
US20100109025A1 (en) * 2008-11-05 2010-05-06 Koninklijke Philips Electronics N.V. Over the mold phosphor lens for an led
US20100117106A1 (en) * 2008-11-07 2010-05-13 Ledengin, Inc. Led with light-conversion layer
JP4868427B2 (ja) * 2008-11-13 2012-02-01 国立大学法人名古屋大学 半導体発光装置
JP2010116522A (ja) * 2008-11-14 2010-05-27 Mitsubishi Plastics Inc 蓄光フィルム及び発光装置
TWI384591B (zh) * 2008-11-17 2013-02-01 Everlight Electronics Co Ltd 發光二極體電路板
US9052416B2 (en) 2008-11-18 2015-06-09 Cree, Inc. Ultra-high efficacy semiconductor light emitting devices
US8004172B2 (en) * 2008-11-18 2011-08-23 Cree, Inc. Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same
US8853712B2 (en) 2008-11-18 2014-10-07 Cree, Inc. High efficacy semiconductor light emitting devices employing remote phosphor configurations
US8220971B2 (en) 2008-11-21 2012-07-17 Xicato, Inc. Light emitting diode module with three part color matching
US8456082B2 (en) 2008-12-01 2013-06-04 Ifire Ip Corporation Surface-emission light source with uniform illumination
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
USRE47114E1 (en) 2008-12-12 2018-11-06 Slt Technologies, Inc. Polycrystalline group III metal nitride with getter and method of making
US9589792B2 (en) 2012-11-26 2017-03-07 Soraa, Inc. High quality group-III metal nitride crystals, methods of making, and methods of use
US8987156B2 (en) 2008-12-12 2015-03-24 Soraa, Inc. Polycrystalline group III metal nitride with getter and method of making
US8878230B2 (en) * 2010-03-11 2014-11-04 Soraa, Inc. Semi-insulating group III metal nitride and method of manufacture
US9543392B1 (en) 2008-12-12 2017-01-10 Soraa, Inc. Transparent group III metal nitride and method of manufacture
US20100147210A1 (en) * 2008-12-12 2010-06-17 Soraa, Inc. high pressure apparatus and method for nitride crystal growth
US7834372B2 (en) * 2008-12-16 2010-11-16 Jinhui Zhai High luminous flux warm white solid state lighting device
US8507300B2 (en) * 2008-12-24 2013-08-13 Ledengin, Inc. Light-emitting diode with light-conversion layer
JP2010171379A (ja) * 2008-12-25 2010-08-05 Seiko Instruments Inc 発光デバイス
KR101493708B1 (ko) * 2008-12-26 2015-02-16 삼성전자주식회사 백색 발광 장치
US8698463B2 (en) 2008-12-29 2014-04-15 Enpirion, Inc. Power converter with a dynamically configurable controller based on a power conversion mode
US9548714B2 (en) 2008-12-29 2017-01-17 Altera Corporation Power converter with a dynamically configurable controller and output filter
US8390193B2 (en) 2008-12-31 2013-03-05 Intematix Corporation Light emitting device with phosphor wavelength conversion
US8556452B2 (en) 2009-01-15 2013-10-15 Ilumisys, Inc. LED lens
US8362710B2 (en) 2009-01-21 2013-01-29 Ilumisys, Inc. Direct AC-to-DC converter for passive component minimization and universal operation of LED arrays
US8664880B2 (en) 2009-01-21 2014-03-04 Ilumisys, Inc. Ballast/line detection circuit for fluorescent replacement lamps
US20100181582A1 (en) * 2009-01-22 2010-07-22 Intematix Corporation Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof
TWI449996B (zh) * 2009-01-23 2014-08-21 Au Optronics Corp 高色彩飽合度之顯示裝置及其使用之色彩調整方法
US8242462B2 (en) 2009-01-23 2012-08-14 Lumencor, Inc. Lighting design of high quality biomedical devices
JP2010171342A (ja) * 2009-01-26 2010-08-05 Sony Corp 色変換部材およびその製造方法、発光装置、表示装置
US20110100291A1 (en) * 2009-01-29 2011-05-05 Soraa, Inc. Plant and method for large-scale ammonothermal manufacturing of gallium nitride boules
JP2010177620A (ja) * 2009-02-02 2010-08-12 Showa Denko Kk 発光装置の製造方法
JP2012517106A (ja) * 2009-02-04 2012-07-26 リンデール インコーポレイテッド 蛍光体複合物を被覆した拡散デバイスおよび方法
US20100208470A1 (en) * 2009-02-10 2010-08-19 Yosi Shani Overlapping illumination surfaces with reduced linear artifacts
KR101077264B1 (ko) * 2009-02-17 2011-10-27 (주)포인트엔지니어링 광소자용 기판, 이를 갖는 광소자 패키지 및 이의 제조 방법
US8137587B2 (en) * 2009-02-19 2012-03-20 Nitto Denko Corporation Method of manufacturing phosphor translucent ceramics and light emitting devices
US8123981B2 (en) * 2009-02-19 2012-02-28 Nitto Denko Corporation Method of fabricating translucent phosphor ceramics
US20110301672A1 (en) * 2009-02-25 2011-12-08 Koninklijke Philips Electronics N.V. Uv-emitting discharge lamp
KR20110113655A (ko) 2009-03-03 2011-10-17 우베 고산 가부시키가이샤 발광 소자 형성용 복합 기판, 발광 다이오드 소자, 백색 발광 다이오드 소자, 및 그 제조 방법
US8541931B2 (en) * 2009-03-17 2013-09-24 Intematix Corporation LED based lamp including reflective hood to reduce variation in illuminance
TWM374153U (en) * 2009-03-19 2010-02-11 Intematix Technology Ct Corp Light emitting device applied to AC drive
TWI405838B (zh) * 2009-03-27 2013-08-21 Chunghwa Picture Tubes Ltd 紅光螢光材料及其製造方法、及白光發光裝置
US8624527B1 (en) 2009-03-27 2014-01-07 Oree, Inc. Independently controllable illumination device
KR100984126B1 (ko) 2009-03-30 2010-09-28 서울대학교산학협력단 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법
TW201037059A (en) * 2009-04-01 2010-10-16 Chunghwa Picture Tubes Ltd Red light fluorescent material and manufacturing method thereof, and white light luminescent device
CN102365345A (zh) * 2009-04-06 2012-02-29 夏普株式会社 荧光体粒子组以及使用该荧光体粒子组的发光装置、液晶电视
US8384097B2 (en) 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
US7985000B2 (en) * 2009-04-08 2011-07-26 Ledengin, Inc. Lighting apparatus having multiple light-emitting diodes with individual light-conversion layers
US8598793B2 (en) 2011-05-12 2013-12-03 Ledengin, Inc. Tuning of emitter with multiple LEDs to a single color bin
CN102414850B (zh) * 2009-04-21 2014-07-09 皇家飞利浦电子股份有限公司 具有磷光体的照明装置
KR101004713B1 (ko) * 2009-04-22 2011-01-04 주식회사 에피밸리 디스플레이의 디밍 제어방법
US8192048B2 (en) * 2009-04-22 2012-06-05 3M Innovative Properties Company Lighting assemblies and systems
WO2010129374A2 (en) 2009-04-28 2010-11-11 Qd Vision, Inc. Optical materials, optical components, and methods
DE102009020569B4 (de) 2009-05-08 2019-02-21 Schott Ag Leuchtstoffe auf Basis Eu2+-(co-) dotierter Yttrium-Aluminium-Granat-Kristalle und deren Verwendung
WO2010132517A2 (en) * 2009-05-12 2010-11-18 David Gershaw Led retrofit for miniature bulbs
US20100320904A1 (en) * 2009-05-13 2010-12-23 Oree Inc. LED-Based Replacement Lamps for Incandescent Fixtures
US8330381B2 (en) 2009-05-14 2012-12-11 Ilumisys, Inc. Electronic circuit for DC conversion of fluorescent lighting ballast
US8597963B2 (en) * 2009-05-19 2013-12-03 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
US8227276B2 (en) * 2009-05-19 2012-07-24 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
US8227269B2 (en) * 2009-05-19 2012-07-24 Intematix Corporation Manufacture of light emitting devices with phosphor wavelength conversion
US8440500B2 (en) * 2009-05-20 2013-05-14 Interlight Optotech Corporation Light emitting device
US8509275B1 (en) 2009-05-29 2013-08-13 Soraa, Inc. Gallium nitride based laser dazzling device and method
US9800017B1 (en) 2009-05-29 2017-10-24 Soraa Laser Diode, Inc. Laser device and method for a vehicle
US9250044B1 (en) 2009-05-29 2016-02-02 Soraa Laser Diode, Inc. Gallium and nitrogen containing laser diode dazzling devices and methods of use
WO2010141235A1 (en) * 2009-06-01 2010-12-09 Nitto Denko Corporation Light-emitting divice comprising a dome-shaped ceramic phosphor
EP2438139B1 (de) * 2009-06-01 2017-03-01 Nitto Denko Corporation Lumineszente keramik und lichtemittierendes element damit
US8299695B2 (en) 2009-06-02 2012-10-30 Ilumisys, Inc. Screw-in LED bulb comprising a base having outwardly projecting nodes
US8921876B2 (en) 2009-06-02 2014-12-30 Cree, Inc. Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
KR20120039631A (ko) 2009-06-16 2012-04-25 더 리전츠 오브 더 유니버시티 오브 캘리포니아 옥시플루오라이드 형광체들 및 옥시플루오라이드 형광체를 포함하는 고체 조명 제품용 백색 발광 다이오드들
US8651692B2 (en) 2009-06-18 2014-02-18 Intematix Corporation LED based lamp and light emitting signage
US8426871B2 (en) * 2009-06-19 2013-04-23 Honeywell International Inc. Phosphor converting IR LEDs
EP2446715A4 (de) 2009-06-23 2013-09-11 Ilumisys Inc Beleuchtungsvorrichtung mit leds und schaltstromsteuerungssystem
WO2010150202A2 (en) 2009-06-24 2010-12-29 Oree, Advanced Illumination Solutions Inc. Illumination apparatus with high conversion efficiency and methods of forming the same
DE102009030205A1 (de) * 2009-06-24 2010-12-30 Litec-Lp Gmbh Leuchtstoffe mit Eu(II)-dotierten silikatischen Luminophore
KR101055762B1 (ko) * 2009-09-01 2011-08-11 서울반도체 주식회사 옥시오소실리케이트 발광체를 갖는 발광 물질을 채택한 발광 장치
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
EP2461377A4 (de) 2009-07-28 2012-06-06 Anatoly Vasilyevich Vishnyakov Anorganisches lumineszenzmaterial für festkörper-weisslichtquellen
DE102009035100A1 (de) * 2009-07-29 2011-02-03 Osram Opto Semiconductors Gmbh Leuchtdiode und Konversionselement für eine Leuchtdiode
JP5444919B2 (ja) * 2009-07-29 2014-03-19 ソニー株式会社 照明装置、及び液晶表示装置
JP2009260390A (ja) * 2009-08-05 2009-11-05 Osram-Melco Ltd 可変色発光ダイオード素子
KR101172143B1 (ko) * 2009-08-10 2012-08-07 엘지이노텍 주식회사 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 ｌｅｄ 소자
DE102009037186A1 (de) 2009-08-12 2011-02-17 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauteil
US8197105B2 (en) * 2009-08-13 2012-06-12 Intematix Corporation LED-based lamps
CN105713599B (zh) 2009-08-14 2018-09-11 三星电子株式会社 发光器件、用于发光器件的光学元件、以及方法
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
JP5406639B2 (ja) * 2009-08-31 2014-02-05 カシオ計算機株式会社 光源装置及びプロジェクタ
JP5406638B2 (ja) * 2009-08-31 2014-02-05 カシオ計算機株式会社 光源装置及びプロジェクタ
KR101163902B1 (ko) 2010-08-10 2012-07-09 엘지이노텍 주식회사 발광 소자
US9909058B2 (en) * 2009-09-02 2018-03-06 Lg Innotek Co., Ltd. Phosphor, phosphor manufacturing method, and white light emitting device
TWI385782B (zh) * 2009-09-10 2013-02-11 Lextar Electronics Corp 白光發光元件
CN102630288B (zh) 2009-09-25 2015-09-09 科锐公司 具有低眩光和高亮度级均匀性的照明设备
US7977641B2 (en) * 2009-09-29 2011-07-12 General Electric Company Scintillator, associated detecting device and method
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
US9175418B2 (en) 2009-10-09 2015-11-03 Soraa, Inc. Method for synthesis of high quality large area bulk gallium based crystals
DE102009049056A1 (de) 2009-10-12 2011-04-14 Osram Gesellschaft mit beschränkter Haftung Verfahren zur Beschichtung eines Silikat-Leuchtstoffs
TWI403005B (zh) 2009-10-12 2013-07-21 Intematix Technology Ct Corp 發光二極體及其製作方法
US8089086B2 (en) * 2009-10-19 2012-01-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light source
US20110090669A1 (en) * 2009-10-20 2011-04-21 Tsung-Ting Sun Led lighting device and light source module for the same
US8440104B2 (en) * 2009-10-21 2013-05-14 General Electric Company Kimzeyite garnet phosphors
US9435493B2 (en) 2009-10-27 2016-09-06 Cree, Inc. Hybrid reflector system for lighting device
CN101760197B (zh) * 2009-10-27 2013-08-07 上海祥羚光电科技发展有限公司 一种白光led用黄色荧光粉及其制备方法
US8535565B2 (en) 2009-10-30 2013-09-17 The Regents Of The University Of California Solid solution phosphors based on oxyfluoride and white light emitting diodes including the phosphors for solid state white lighting applications
WO2011060180A1 (en) 2009-11-11 2011-05-19 Qd Vision, Inc. Device including quantum dots
JP4888853B2 (ja) * 2009-11-12 2012-02-29 学校法人慶應義塾 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置
KR101020998B1 (ko) * 2009-11-12 2011-03-09 엘지이노텍 주식회사 발광소자 및 그 제조방법
TWI531088B (zh) * 2009-11-13 2016-04-21 首爾偉傲世有限公司 具有分散式布拉格反射器的發光二極體晶片
US8963178B2 (en) * 2009-11-13 2015-02-24 Seoul Viosys Co., Ltd. Light emitting diode chip having distributed bragg reflector and method of fabricating the same
US8779685B2 (en) 2009-11-19 2014-07-15 Intematix Corporation High CRI white light emitting devices and drive circuitry
JP5565793B2 (ja) * 2009-12-08 2014-08-06 学校法人立命館 深紫外発光素子及びその製造方法
US20120236213A1 (en) * 2009-12-08 2012-09-20 Sharp Kabushiki Kaisha Lighting device, display device and television receiver
US8466611B2 (en) 2009-12-14 2013-06-18 Cree, Inc. Lighting device with shaped remote phosphor
US8604461B2 (en) 2009-12-16 2013-12-10 Cree, Inc. Semiconductor device structures with modulated doping and related methods
US8536615B1 (en) 2009-12-16 2013-09-17 Cree, Inc. Semiconductor device structures with modulated and delta doping and related methods
JP5707697B2 (ja) * 2009-12-17 2015-04-30 日亜化学工業株式会社 発光装置
US8303141B2 (en) * 2009-12-17 2012-11-06 Ledengin, Inc. Total internal reflection lens with integrated lamp cover
CN101847680A (zh) * 2009-12-21 2010-09-29 深圳市成光兴实业发展有限公司 采用丝网印刷工艺的白光led荧光粉膜层及制作方法
KR101646255B1 (ko) * 2009-12-22 2016-08-05 엘지이노텍 주식회사 발광 소자, 발광 소자 패키지 및 발광 소자 제조방법
CN101760196B (zh) * 2009-12-29 2012-11-21 四川大学 一种白光led用黄色荧光粉的合成方法
KR20110076447A (ko) * 2009-12-29 2011-07-06 삼성전자주식회사 발광 장치 및 이를 포함하는 표시 장치
CN101797698B (zh) * 2009-12-30 2012-01-18 马勒三环气门驱动(湖北)有限公司 气门轴向尺寸的控制方法
US9480133B2 (en) 2010-01-04 2016-10-25 Cooledge Lighting Inc. Light-emitting element repair in array-based lighting devices
US8653539B2 (en) 2010-01-04 2014-02-18 Cooledge Lighting, Inc. Failure mitigation in arrays of light-emitting devices
CN102656248B (zh) 2010-01-08 2014-07-16 夏普株式会社 荧光体、发光装置及使用它的液晶显示装置
KR101768010B1 (ko) 2010-02-04 2017-08-14 닛토덴코 가부시키가이샤 발광 세라믹 적층체 및 이를 제조하는 방법
US9631782B2 (en) * 2010-02-04 2017-04-25 Xicato, Inc. LED-based rectangular illumination device
JPWO2011096171A1 (ja) * 2010-02-08 2013-06-10 パナソニック株式会社 発光装置およびこれを用いた面光源装置
KR20110094996A (ko) * 2010-02-18 2011-08-24 엘지이노텍 주식회사 발광소자 패키지, 그 제조방법 및 조명시스템
WO2011105666A1 (ko) * 2010-02-24 2011-09-01 Shim Hyun-Seop 엘이디 색변환용 유브이 코팅 조성물
GB2478287A (en) 2010-03-01 2011-09-07 Merck Patent Gmbh Electro-optical switching element and electro-optical display
US8716038B2 (en) 2010-03-02 2014-05-06 Micron Technology, Inc. Microelectronic workpiece processing systems and associated methods of color correction
US8632196B2 (en) 2010-03-03 2014-01-21 Cree, Inc. LED lamp incorporating remote phosphor and diffuser with heat dissipation features
US8562161B2 (en) 2010-03-03 2013-10-22 Cree, Inc. LED based pedestal-type lighting structure
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
JP5769290B2 (ja) * 2010-03-03 2015-08-26 国立研究開発法人産業技術総合研究所 照明装置
US8104908B2 (en) * 2010-03-04 2012-01-31 Xicato, Inc. Efficient LED-based illumination module with high color rendering index
US20110220920A1 (en) * 2010-03-09 2011-09-15 Brian Thomas Collins Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices
BR112012022991A8 (pt) * 2010-03-16 2018-04-03 Koninklijke Philips Electronics Nv Aparelho de iluminação, método de fabricação para fabricar um aparelho de iluminação e método de iluminação
JP5749327B2 (ja) 2010-03-19 2015-07-15 日東電工株式会社 発光装置用ガーネット系蛍光体セラミックシート
US8324798B2 (en) * 2010-03-19 2012-12-04 Nitto Denko Corporation Light emitting device using orange-red phosphor with co-dopants
KR101666442B1 (ko) * 2010-03-25 2016-10-17 엘지이노텍 주식회사 발광 다이오드 및 이를 포함하는 발광 소자 패키지
CA2792940A1 (en) 2010-03-26 2011-09-19 Ilumisys, Inc. Led light with thermoelectric generator
WO2011119907A2 (en) 2010-03-26 2011-09-29 Altair Engineering, Inc. Led light tube with dual sided light distribution
US8540401B2 (en) 2010-03-26 2013-09-24 Ilumisys, Inc. LED bulb with internal heat dissipating structures
CN102823001A (zh) * 2010-03-30 2012-12-12 三菱化学株式会社 发光装置
US8940187B2 (en) 2010-03-31 2015-01-27 Ube Industries, Ltd Ceramic composite for light conversion, process for production thereof, and light-emitting devices provided with same
US8322884B2 (en) 2010-03-31 2012-12-04 Abl Ip Holding Llc Solid state lighting with selective matching of index of refraction
KR101774434B1 (ko) 2010-03-31 2017-09-04 오스람 실바니아 인코포레이티드 형광체 및 이를 함유한 ｌｅｄ
US9345095B2 (en) 2010-04-08 2016-05-17 Ledengin, Inc. Tunable multi-LED emitter module
US9080729B2 (en) 2010-04-08 2015-07-14 Ledengin, Inc. Multiple-LED emitter for A-19 lamps
US8858022B2 (en) 2011-05-05 2014-10-14 Ledengin, Inc. Spot TIR lens system for small high-power emitter
US8395312B2 (en) * 2010-04-19 2013-03-12 Bridgelux, Inc. Phosphor converted light source having an additional LED to provide long wavelength light
TWI394827B (zh) * 2010-04-20 2013-05-01 China Glaze Co Ltd 螢光材料與白光發光裝置
TWI374179B (en) * 2010-05-07 2012-10-11 Chi Mei Corp Fluorescent substance and light-emitting device
EP2571066B1 (de) 2010-05-14 2015-09-23 Panasonic Intellectual Property Management Co., Ltd. Led-modul, led-lampe und beleuchtungsvorrichtung damit
JP2011242536A (ja) * 2010-05-17 2011-12-01 Canon Inc 表示装置
CN102869502B (zh) * 2010-05-20 2014-09-17 大连路明发光科技股份有限公司 可剥离型光转换发光膜
US8684559B2 (en) 2010-06-04 2014-04-01 Cree, Inc. Solid state light source emitting warm light with high CRI
US8596821B2 (en) 2010-06-08 2013-12-03 Cree, Inc. LED light bulbs
JP5323131B2 (ja) 2010-06-09 2013-10-23 信越化学工業株式会社 蛍光粒子及び発光ダイオード並びにこれらを用いた照明装置及び液晶パネル用バックライト装置
CN102277164B (zh) * 2010-06-10 2013-11-06 奇美实业股份有限公司 荧光粉体及发光装置
US8888318B2 (en) 2010-06-11 2014-11-18 Intematix Corporation LED spotlight
US8807799B2 (en) 2010-06-11 2014-08-19 Intematix Corporation LED-based lamps
US9564320B2 (en) 2010-06-18 2017-02-07 Soraa, Inc. Large area nitride crystal and method for making it
WO2011162198A1 (ja) 2010-06-22 2011-12-29 東洋紡績株式会社 液晶表示装置、偏光板および偏光子保護フィルム
WO2011162479A2 (en) 2010-06-24 2011-12-29 Seoul Opto Device Co., Ltd. Light emitting diode
US9371973B2 (en) 2010-06-28 2016-06-21 Shenzhen Liown Electronics Company Ltd. Electronic lighting device and method for manufacturing same
CN102959708B (zh) 2010-06-29 2016-05-04 柯立芝照明有限公司 具有易弯曲基板的电子装置
US8454193B2 (en) 2010-07-08 2013-06-04 Ilumisys, Inc. Independent modules for LED fluorescent light tube replacement
JP2012019062A (ja) * 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
WO2012006289A1 (en) 2010-07-09 2012-01-12 Nitto Denko Corporation Phosphor composition and light emitting device using the same
EP2593714A2 (de) 2010-07-12 2013-05-22 iLumisys, Inc. Leiterplattenhalterung für eine led-lichtröhre
US20130049575A1 (en) * 2010-07-14 2013-02-28 Shunsuke Fujita Phosphor composite member, led device and method for manufacturing phosphor composite member
US8941135B2 (en) 2010-07-15 2015-01-27 Nitto Denko Corporation Light emissive ceramic laminate and method of making same
DE102010031755A1 (de) * 2010-07-21 2012-02-09 Merck Patent Gmbh Aluminat-Leuchtstoffe
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
CN102339936B (zh) * 2010-07-27 2015-04-29 展晶科技(深圳)有限公司 发光装置封装结构及其制造方法
CN103053036B (zh) * 2010-07-28 2015-11-25 首尔伟傲世有限公司 具有分布式布拉格反射器的发光二极管
US10451251B2 (en) 2010-08-02 2019-10-22 Ideal Industries Lighting, LLC Solid state lamp with light directing optics and diffuser
CN103201213B (zh) 2010-08-04 2016-04-13 宇部兴产株式会社 硅氮化物磷光体用氮化硅粉末、利用该粉末的CaAlSiN3磷光体、利用该粉末的Sr2Si5N8磷光体、利用该粉末的(Sr,Ca)AlSiN3磷光体、利用该粉末的La3Si6N11磷光体和该磷光体的制造方法
CN102376860A (zh) 2010-08-05 2012-03-14 夏普株式会社 发光装置及其制造方法
US8946998B2 (en) 2010-08-09 2015-02-03 Intematix Corporation LED-based light emitting systems and devices with color compensation
US8852455B2 (en) 2010-08-17 2014-10-07 Intematix Corporation Europium-activated, beta-SiAlON based green phosphors
WO2012024591A1 (en) 2010-08-20 2012-02-23 Research Triangle Institute, International Photoluminescent nanofiber composites, methods for fabrication, and related lighting devices
US9441811B2 (en) 2010-08-20 2016-09-13 Research Triangle Institute Lighting devices utilizing optical waveguides and remote light converters, and related methods
US9562671B2 (en) 2010-08-20 2017-02-07 Research Triangle Institute Color-tunable lighting devices and methods of use
US20120051045A1 (en) 2010-08-27 2012-03-01 Xicato, Inc. Led Based Illumination Module Color Matched To An Arbitrary Light Source
EP2426186B1 (de) 2010-09-03 2016-03-23 Stcube, Inc. Harzzusammensetzung zur umwandlung von led-licht und led-element damit
TWI486254B (zh) 2010-09-20 2015-06-01 Nitto Denko Corp 發光陶瓷層板及其製造方法
DE102010041236A1 (de) 2010-09-23 2012-03-29 Osram Ag Optoelektronisches Halbleiterbauelement
US8354784B2 (en) 2010-09-28 2013-01-15 Intematix Corporation Solid-state light emitting devices with photoluminescence wavelength conversion
US8614539B2 (en) 2010-10-05 2013-12-24 Intematix Corporation Wavelength conversion component with scattering particles
US8610341B2 (en) 2010-10-05 2013-12-17 Intematix Corporation Wavelength conversion component
US9546765B2 (en) 2010-10-05 2017-01-17 Intematix Corporation Diffuser component having scattering particles
US8957585B2 (en) 2010-10-05 2015-02-17 Intermatix Corporation Solid-state light emitting devices with photoluminescence wavelength conversion
US8604678B2 (en) 2010-10-05 2013-12-10 Intematix Corporation Wavelength conversion component with a diffusing layer
CN103155024B (zh) 2010-10-05 2016-09-14 英特曼帝克司公司 具光致发光波长转换的固态发光装置及标牌
DE102010042217A1 (de) 2010-10-08 2012-04-12 Osram Ag Optoelektronisches Halbleiterbauelement und Verfahren zu seiner Herstellung
US8729559B2 (en) 2010-10-13 2014-05-20 Soraa, Inc. Method of making bulk InGaN substrates and devices thereon
US8846172B2 (en) 2010-10-18 2014-09-30 Nitto Denko Corporation Light emissive ceramic laminate and method of making same
WO2012053924A1 (ru) 2010-10-22 2012-04-26 Vishnyakov Anatoly Vasilyevich Люминесцирующий материал для твердотельных источников белого света
WO2012058556A2 (en) 2010-10-29 2012-05-03 Altair Engineering, Inc. Mechanisms for reducing risk of shock during installation of light tube
JP6369774B2 (ja) * 2010-10-29 2018-08-08 株式会社光波 発光装置
JP5545866B2 (ja) * 2010-11-01 2014-07-09 シチズン電子株式会社 半導体発光装置
US8329484B2 (en) * 2010-11-02 2012-12-11 Tsmc Solid State Lighting Ltd. Phosphor with Ce3+/Ce3+, Li+ doped luminescent materials
CN102456294A (zh) * 2010-11-02 2012-05-16 展晶科技(深圳)有限公司 Led显示装置
DE102010050832A1 (de) * 2010-11-09 2012-05-10 Osram Opto Semiconductors Gmbh Lumineszenzkonversionselement, Verfahren zu dessen Herstellung und optoelektronisches Bauteil mit Lumineszenzkonversionselement
US8651681B2 (en) 2010-11-10 2014-02-18 Osram Sylvania Inc. Luminescent ceramic converter and LED containing same
US20150188002A1 (en) * 2010-11-11 2015-07-02 Auterra, Inc. Light emitting devices having rare earth and transition metal activated phosphors and applications thereof
WO2012066425A2 (en) 2010-11-16 2012-05-24 Saint-Gobain Cristaux Et Detecteurs Scintillation compound including a rare earth element and a process of forming the same
CN102097571A (zh) * 2010-11-16 2011-06-15 深圳市瑞丰光电子股份有限公司 一种黄绿光二极管、背光源、手机及照明指示装置
CN103210509B (zh) 2010-11-18 2016-03-16 日本电气硝子株式会社 波长变换元件和具备该波长变换元件的光源
KR20120054484A (ko) * 2010-11-19 2012-05-30 엘지이노텍 주식회사 발광 소자 패키지 및 이의 제조방법
TWI460892B (zh) * 2010-11-19 2014-11-11 Advanced Optoelectronic Tech 發光二極體封裝結構
US8816377B2 (en) 2010-11-30 2014-08-26 Panasonic Corporation Phosphor and light emitting device
US8343785B2 (en) * 2010-11-30 2013-01-01 Taiwan Semiconductor Manufacturing Company, Ltd. Nitridosilicate phosphor tunable light-emitting diodes by using UV and blue chips
KR101843760B1 (ko) 2010-12-01 2018-05-14 닛토 덴코 가부시키가이샤 도펀트 농도 구배를 갖는 방사성 세라믹 재료들 및 그것을 제조하고 사용하는 방법들
US20120138874A1 (en) 2010-12-02 2012-06-07 Intematix Corporation Solid-state light emitting devices and signage with photoluminescence wavelength conversion and photoluminescent compositions therefor
US8556469B2 (en) 2010-12-06 2013-10-15 Cree, Inc. High efficiency total internal reflection optic for solid state lighting luminaires
US8870415B2 (en) 2010-12-09 2014-10-28 Ilumisys, Inc. LED fluorescent tube replacement light with reduced shock hazard
WO2012081566A1 (ja) 2010-12-16 2012-06-21 宇部興産株式会社 光変換用セラミック複合体、その製造方法、及びそれを備えた発光装置
US8867295B2 (en) 2010-12-17 2014-10-21 Enpirion, Inc. Power converter for a memory module
US8772817B2 (en) 2010-12-22 2014-07-08 Cree, Inc. Electronic device submounts including substrates with thermally conductive vias
EP2655961A4 (de) 2010-12-23 2014-09-03 Qd Vision Inc Optisches element mit quantenpunkten
CN102140690B (zh) * 2010-12-31 2013-05-01 陈哲艮 光致发光晶片及其制备方法和应用
KR101340552B1 (ko) * 2010-12-31 2013-12-11 제일모직주식회사 모바일 폰의 모듈 조립 방법
US9617469B2 (en) 2011-01-06 2017-04-11 Shin-Etsu Chemical Co., Ltd. Phosphor particles, making method, and light-emitting diode
US8865022B2 (en) 2011-01-06 2014-10-21 Shin-Etsu Chemical Co., Ltd. Phosphor particles and making method
US8354684B2 (en) 2011-01-09 2013-01-15 Bridgelux, Inc. Packaging photon building blocks having only top side connections in an interconnect structure
US8389957B2 (en) 2011-01-14 2013-03-05 Lumencor, Inc. System and method for metered dosage illumination in a bioanalysis or other system
US8466436B2 (en) 2011-01-14 2013-06-18 Lumencor, Inc. System and method for metered dosage illumination in a bioanalysis or other system
JP5445473B2 (ja) 2011-01-14 2014-03-19 信越化学工業株式会社 光学材料形成用シリコーン樹脂組成物及び光学材料
KR101210066B1 (ko) 2011-01-31 2012-12-07 엘지이노텍 주식회사 광 변환 부재 및 이를 포함하는 표시장치
US9508904B2 (en) 2011-01-31 2016-11-29 Cree, Inc. Structures and substrates for mounting optical elements and methods and devices for providing the same background
US9234655B2 (en) 2011-02-07 2016-01-12 Cree, Inc. Lamp with remote LED light source and heat dissipating elements
US9068701B2 (en) 2012-01-26 2015-06-30 Cree, Inc. Lamp structure with remote LED light source
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
JP5654378B2 (ja) * 2011-02-18 2015-01-14 パナソニックＩｐマネジメント株式会社 発光装置
WO2012116114A1 (en) * 2011-02-24 2012-08-30 Nitto Denko Corporation Light emitting composite with phosphor components
TWI431813B (zh) * 2011-02-24 2014-03-21 Genesis Photonics Inc Light emitting diode components
TWM407494U (en) * 2011-02-25 2011-07-11 Unity Opto Technology Co Ltd LED package structure
JP5631509B2 (ja) * 2011-03-01 2014-11-26 オスラム ゲーエムベーハーＯＳＲＡＭ ＧｍｂＨ 蛍光体エレメントを有する照明装置
US8278806B1 (en) 2011-03-02 2012-10-02 Osram Sylvania Inc. LED reflector lamp
JP2012182376A (ja) * 2011-03-02 2012-09-20 Stanley Electric Co Ltd 波長変換部材および光源装置
US9085732B2 (en) 2011-03-11 2015-07-21 Intematix Corporation Millisecond decay phosphors for AC LED lighting applications
EP2688114B1 (de) 2011-03-15 2017-03-22 Kabushiki Kaisha Toshiba Weisslichtquelle
US9004705B2 (en) 2011-04-13 2015-04-14 Intematix Corporation LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion
KR101337999B1 (ko) * 2011-04-20 2013-12-06 조성매 단일상 형광체를 포함하는 백색 발광 다이오드
CN102563543B (zh) 2011-05-09 2015-01-07 深圳市绎立锐光科技开发有限公司 基于光波长转换产生高亮度单色光的方法及光源
WO2013019299A2 (en) 2011-05-11 2013-02-07 Qd Vision, Inc. Method for processing devices including quantum dots and devices
US8513900B2 (en) 2011-05-12 2013-08-20 Ledengin, Inc. Apparatus for tuning of emitter with multiple LEDs to a single color bin
US10180597B2 (en) 2011-05-18 2019-01-15 Toyobo Co., Ltd. Liquid crystal display device, polarizing plate, and polarizer protection film
JP6180113B2 (ja) * 2011-05-18 2017-08-16 東洋紡株式会社 三次元画像表示対応液晶表示装置に適した偏光板及び液晶表示装置
CN102305370B (zh) * 2011-05-18 2013-04-17 福建华映显示科技有限公司 背光模块及选取暨配置背光模块的发光组件的方法
US8860056B2 (en) 2011-12-01 2014-10-14 Tsmc Solid State Lighting Ltd. Structure and method for LED with phosphor coating
US8747697B2 (en) * 2011-06-07 2014-06-10 Cree, Inc. Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same
TWI467808B (zh) * 2011-06-27 2015-01-01 Delta Electronics Inc 發光二極體元件、其製作方法以及發光裝置
US8663501B2 (en) 2011-06-29 2014-03-04 General Electric Company Green emitting phosphor
CN103222026A (zh) 2011-07-04 2013-07-24 松下电器产业株式会社 等离子体显示面板
EP2730637B1 (de) 2011-07-05 2017-06-14 Panasonic Corporation Fluoreszierende seltenerd-aluminium-granatsubstanz und daraus hergestellte lichtemittierende vorrichtung
KR101305696B1 (ko) 2011-07-14 2013-09-09 엘지이노텍 주식회사 표시장치 및 광학 부재
KR20130009020A (ko) 2011-07-14 2013-01-23 엘지이노텍 주식회사 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법
US8492185B1 (en) 2011-07-14 2013-07-23 Soraa, Inc. Large area nonpolar or semipolar gallium and nitrogen containing substrate and resulting devices
KR101241549B1 (ko) 2011-07-18 2013-03-11 엘지이노텍 주식회사 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법
KR101893494B1 (ko) 2011-07-18 2018-08-30 엘지이노텍 주식회사 광학 부재 및 이를 포함하는 표시장치
KR101262520B1 (ko) 2011-07-18 2013-05-08 엘지이노텍 주식회사 광학 부재 및 이를 포함하는 표시장치
KR101294415B1 (ko) 2011-07-20 2013-08-08 엘지이노텍 주식회사 광학 부재 및 이를 포함하는 표시장치
JP5396439B2 (ja) * 2011-07-22 2014-01-22 学校法人慶應義塾 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置
JP5559108B2 (ja) * 2011-08-05 2014-07-23 株式会社東芝 半導体発光装置
WO2013024910A1 (ko) * 2011-08-16 2013-02-21 삼성전자주식회사 색온도 조절이 가능한 ｌｅｄ 장치
WO2013028965A2 (en) 2011-08-24 2013-02-28 Ilumisys, Inc. Circuit board mount for led light
JP5899485B2 (ja) * 2011-08-29 2016-04-06 パナソニックＩｐマネジメント株式会社 樹脂塗布装置および樹脂塗布方法
KR101823930B1 (ko) 2011-08-29 2018-01-31 삼성전자주식회사 발광소자 패키지 어레이 및 발광소자 패키지 제조 방법
WO2013031942A1 (ja) 2011-09-02 2013-03-07 三菱化学株式会社 照明方法及び発光装置
EP3565383A1 (de) 2011-09-02 2019-11-06 Citizen Electronics Co., Ltd. Beleuchtungsverfahren und lichtemittierende vorrichtung
CN103827576B (zh) 2011-09-08 2018-02-09 Lg伊诺特有限公司 发光模组
US8912021B2 (en) 2011-09-12 2014-12-16 SemiLEDs Optoelectronics Co., Ltd. System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers
US8492746B2 (en) 2011-09-12 2013-07-23 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode (LED) dice having wavelength conversion layers
US8410508B1 (en) 2011-09-12 2013-04-02 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method
US8841146B2 (en) 2011-09-12 2014-09-23 SemiLEDs Optoelectronics Co., Ltd. Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics
DE102011113802A1 (de) 2011-09-20 2013-03-21 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen
US10688527B2 (en) 2011-09-22 2020-06-23 Delta Electronics, Inc. Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks
TWI448806B (zh) 2011-09-22 2014-08-11 Delta Electronics Inc 螢光劑裝置及其所適用之光源系統及投影設備
US10310363B2 (en) 2011-09-22 2019-06-04 Delta Electronics, Inc. Phosphor device with spectrum of converted light comprising at least a color light
JP5690696B2 (ja) 2011-09-28 2015-03-25 富士フイルム株式会社 平版印刷版の製版方法
US20130088848A1 (en) 2011-10-06 2013-04-11 Intematix Corporation Solid-state lamps with improved radial emission and thermal performance
US8992051B2 (en) 2011-10-06 2015-03-31 Intematix Corporation Solid-state lamps with improved radial emission and thermal performance
US9365766B2 (en) 2011-10-13 2016-06-14 Intematix Corporation Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion
US9115868B2 (en) 2011-10-13 2015-08-25 Intematix Corporation Wavelength conversion component with improved protective characteristics for remote wavelength conversion
WO2013056009A1 (en) 2011-10-13 2013-04-18 Intematix Corporation Photoluminescence wavelength conversion components for solid-state light emitting devices and lamps
US9694158B2 (en) 2011-10-21 2017-07-04 Ahmad Mohamad Slim Torque for incrementally advancing a catheter during right heart catheterization
US10029955B1 (en) 2011-10-24 2018-07-24 Slt Technologies, Inc. Capsule for high pressure, high temperature processing of materials and methods of use
CN102495495B (zh) 2011-10-28 2015-03-11 友达光电股份有限公司 具可透视性的显示装置及其使用的影像显示方法
KR101251815B1 (ko) * 2011-11-07 2013-04-09 엘지이노텍 주식회사 광학 시트 및 이를 포함하는 표시장치
US8591072B2 (en) 2011-11-16 2013-11-26 Oree, Inc. Illumination apparatus confining light by total internal reflection and methods of forming the same
US9864121B2 (en) 2011-11-22 2018-01-09 Samsung Electronics Co., Ltd. Stress-resistant component for use with quantum dots
WO2013082609A1 (en) 2011-12-02 2013-06-06 Lynk Labs, Inc. Color temperature controlled and low thd led lighting devices and systems and methods of driving the same
JP5712916B2 (ja) * 2011-12-22 2015-05-07 信越化学工業株式会社 イットリウムセリウムアルミニウムガーネット蛍光体及び発光装置
EP2607449B1 (de) 2011-12-22 2014-04-02 Shin-Etsu Chemical Co., Ltd. Herstellung von Yttrium-Cer-Aluminium-Granatphosphor
CN103173217B (zh) * 2011-12-23 2017-03-01 李建立 耐温氮化物荧光材料及含有其的发光装置
US8482104B2 (en) 2012-01-09 2013-07-09 Soraa, Inc. Method for growth of indium-containing nitride films
US8967811B2 (en) 2012-01-20 2015-03-03 Lumencor, Inc. Solid state continuous white light source
WO2013112542A1 (en) 2012-01-25 2013-08-01 Intematix Corporation Long decay phosphors for lighting applications
EP2647689A4 (de) 2012-02-08 2015-01-14 Panasonic Corp Yttrium-aluminium-granat-phosphor
EP2814071A4 (de) 2012-02-08 2015-01-07 Panasonic Corp Lichtemittierende vorrichtung
JP5893429B2 (ja) * 2012-02-21 2016-03-23 スタンレー電気株式会社 メタンガスセンサ用蛍光体、メタンガスセンサ用光源及びメタンガスセンサ
DE102012202927B4 (de) 2012-02-27 2021-06-10 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
WO2013131002A1 (en) 2012-03-02 2013-09-06 Ilumisys, Inc. Electrical connector header for an led-based light
US11032884B2 (en) 2012-03-02 2021-06-08 Ledengin, Inc. Method for making tunable multi-led emitter module
KR20150023225A (ko) 2012-03-06 2015-03-05 닛토덴코 가부시키가이샤 발광 디바이스들을 위한 세라믹 본체
US9068717B2 (en) * 2012-03-12 2015-06-30 L-3 Communications Corporation Backlight display using photoluminescent material tuned to improve NVIS compatibility
US9581311B2 (en) * 2012-03-12 2017-02-28 L-3 Communications Corporation Backlight display using photoluminescent material tuned to improve NVIS compatibility
US9488359B2 (en) 2012-03-26 2016-11-08 Cree, Inc. Passive phase change radiators for LED lamps and fixtures
US9897284B2 (en) 2012-03-28 2018-02-20 Ledengin, Inc. LED-based MR16 replacement lamp
CN104245881B (zh) 2012-03-30 2015-11-25 宇部兴产株式会社 光转换用陶瓷复合体及使用其的发光装置
US10559939B1 (en) 2012-04-05 2020-02-11 Soraa Laser Diode, Inc. Facet on a gallium and nitrogen containing laser diode
US9800016B1 (en) 2012-04-05 2017-10-24 Soraa Laser Diode, Inc. Facet on a gallium and nitrogen containing laser diode
JP2015121569A (ja) * 2012-04-16 2015-07-02 シャープ株式会社 表示装置
CN104254802B (zh) 2012-04-20 2019-03-15 默克专利股份有限公司 电光切换元件和电光显示装置
EP3240052A1 (de) 2012-04-26 2017-11-01 Intematix Corporation Verfahren und vorrichtung zur implementierung einer farbkonsistenz in einer ferngesteuerten wellenlängeumwandlung
US8907809B2 (en) 2012-05-03 2014-12-09 Abl Ip Holding Llc Visual perception and acuity disruption techniques and systems
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
CA2910550C (en) 2012-05-07 2020-09-22 Pavle RADOVANOVIC Light emitting material and method for production thereof
DE112013002508B4 (de) 2012-05-16 2020-09-24 Panasonic Intellectual Property Management Co., Ltd. Wellenlängen-Umwandlungselement, Verfahren zu seiner Herstellung und LED-Element und Laserlicht emittierendes Halbleiterbauteil, die das Wellenlängen-Umwandlungselement verwenden
JP5672622B2 (ja) 2012-05-22 2015-02-18 パナソニックＩｐマネジメント株式会社 波長変換素子およびその製造方法ならびに波長変換素子を用いたｌｅｄ素子および半導体レーザ発光装置
JP5304939B1 (ja) 2012-05-31 2013-10-02 大日本印刷株式会社 光学積層体、偏光板、偏光板の製造方法、画像表示装置、画像表示装置の製造方法及び画像表示装置の視認性改善方法
US20150077982A1 (en) * 2012-05-31 2015-03-19 Panasonic Corporation Led module, lighting device, and lamp
US10145026B2 (en) 2012-06-04 2018-12-04 Slt Technologies, Inc. Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules
US9231178B2 (en) 2012-06-07 2016-01-05 Cooledge Lighting, Inc. Wafer-level flip chip device packages and related methods
JP5789564B2 (ja) * 2012-06-11 2015-10-07 学校法人慶應義塾 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置
WO2013188678A1 (en) 2012-06-13 2013-12-19 Innotec, Corp. Flexible light pipe
KR20130140462A (ko) 2012-06-14 2013-12-24 삼성디스플레이 주식회사 포토루미네슨스 표시 장치
US9217561B2 (en) 2012-06-15 2015-12-22 Lumencor, Inc. Solid state light source for photocuring
US9857519B2 (en) 2012-07-03 2018-01-02 Oree Advanced Illumination Solutions Ltd. Planar remote phosphor illumination apparatus
WO2014008463A1 (en) 2012-07-06 2014-01-09 Ilumisys, Inc. Power supply assembly for led-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US8994056B2 (en) 2012-07-13 2015-03-31 Intematix Corporation LED-based large area display
TWI563690B (en) * 2012-07-20 2016-12-21 Mitsubishi Eng Plastics Corp A wavelength conversion member and application thereof
JP2014170895A (ja) * 2013-03-05 2014-09-18 Mitsubishi Chemicals Corp 波長変換部材及びこれを用いた発光装置
JP2014130998A (ja) * 2012-07-20 2014-07-10 Mitsubishi Chemicals Corp 発光装置、波長変換部材、蛍光体組成物、及び蛍光体混合物
JP2014019860A (ja) 2012-07-24 2014-02-03 Shin Etsu Chem Co Ltd 蛍光体前駆体の製造方法、蛍光体の製造方法及び波長変換部品
US9275912B1 (en) 2012-08-30 2016-03-01 Soraa, Inc. Method for quantification of extended defects in gallium-containing nitride crystals
JP6126103B2 (ja) 2012-08-31 2017-05-10 シチズン電子株式会社 照明方法及び発光装置
US9299555B1 (en) 2012-09-28 2016-03-29 Soraa, Inc. Ultrapure mineralizers and methods for nitride crystal growth
WO2014050183A1 (ja) 2012-09-28 2014-04-03 シャープ株式会社 蛍光体含有封止材の製造方法、蛍光体含有封止材、発光装置の製造方法およびディスペンサー
RU2533709C2 (ru) * 2012-10-05 2014-11-20 Общество с ограниченной ответственностью "Минерал" Монокристаллический люминофорный материал для светодиодов белого света
EP2733190B1 (de) 2012-11-16 2020-01-01 LG Innotek Co., Ltd. Phosphorzusammensetzung und lichtemittierende Vorrichtung damit
DE102012220980A1 (de) 2012-11-16 2014-05-22 Osram Gmbh Optoelektronisches halbleiterbauelement
JP6140730B2 (ja) * 2012-12-10 2017-05-31 株式会社エルム 蛍光体層の作成方法
TWM450828U (zh) * 2012-12-14 2013-04-11 Litup Technology Co Ltd 熱電分離的發光二極體模組和相關的散熱載板
US9437788B2 (en) * 2012-12-19 2016-09-06 Cree, Inc. Light emitting diode (LED) component comprising a phosphor with improved excitation properties
EP2937315B1 (de) 2012-12-20 2018-02-14 Panasonic Intellectual Property Management Co., Ltd. Anorganisches seltenerd-aluminiumgranatoxid, leuchtstoff und lichtemittierende vorrichtung damit
JP6089686B2 (ja) * 2012-12-25 2017-03-08 日亜化学工業株式会社 発光装置
US20140185269A1 (en) 2012-12-28 2014-07-03 Intermatix Corporation Solid-state lamps utilizing photoluminescence wavelength conversion components
US9474116B2 (en) 2013-01-03 2016-10-18 Avago Technologies General Ip (Singapore) Pte. Ltd. Minimized color shift lighting arrangement during dimming
TW201429009A (zh) * 2013-01-11 2014-07-16 Ecocera Optronics Co Ltd 發光二極體裝置及散熱基板的製造方法
TW201428087A (zh) 2013-01-11 2014-07-16 kai-xiong Cai 發光裝置及其耐溫碳化物螢光材料
CN103943759B (zh) 2013-01-21 2018-04-27 圣戈本陶瓷及塑料股份有限公司 包括发光含钆材料的物件及其形成工艺
US9217543B2 (en) 2013-01-28 2015-12-22 Intematix Corporation Solid-state lamps with omnidirectional emission patterns
DE102013100888A1 (de) * 2013-01-29 2014-07-31 Schott Ag Licht-Konzentrator oder -Verteiler
US8754435B1 (en) 2013-02-19 2014-06-17 Cooledge Lighting Inc. Engineered-phosphor LED package and related methods
US8933478B2 (en) 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
CN104885571B (zh) 2013-03-04 2017-06-09 西铁城电子株式会社 发光装置、发光装置的设计方法、发光装置的驱动方法、照明方法和发光装置的制造方法
CN104968763B (zh) 2013-03-08 2016-12-21 松下知识产权经营株式会社 稀土类铝石榴石型无机氧化物、荧光体以及使用了该荧光体的发光装置
US9754807B2 (en) * 2013-03-12 2017-09-05 Applied Materials, Inc. High density solid state light source array
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US9234801B2 (en) 2013-03-15 2016-01-12 Ledengin, Inc. Manufacturing method for LED emitter with high color consistency
EP2973751A4 (de) 2013-03-15 2016-11-16 Gary Wayne Jones Umwandlungsvorrichtung für spektrales umgebungslicht
TWI627371B (zh) * 2013-03-15 2018-06-21 英特曼帝克司公司 光致發光波長轉換組件
JP5718398B2 (ja) * 2013-03-18 2015-05-13 オリンパス株式会社 内視鏡装置
JP5698780B2 (ja) * 2013-03-18 2015-04-08 オリンパス株式会社 光源装置およびそれを備えた内視鏡装置
JP5698779B2 (ja) * 2013-03-18 2015-04-08 オリンパス株式会社 光源装置を有する内視鏡装置
CZ2013301A3 (cs) 2013-04-22 2014-07-16 Crytur Spol. S R. O. Dioda emitující bílé světlo s monokrystalickým luminoforem a způsob výroby
JP6286026B2 (ja) * 2013-04-25 2018-02-28 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 発光ダイオードコンポーネント
JP6102763B2 (ja) 2013-04-26 2017-03-29 日亜化学工業株式会社 蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法
JP6167913B2 (ja) 2013-04-26 2017-07-26 日亜化学工業株式会社 蛍光体及びそれを用いた発光装置
US8941295B2 (en) 2013-04-29 2015-01-27 Kai-Shon Tsai Fluorescent material and illumination device
US9231168B2 (en) 2013-05-02 2016-01-05 Industrial Technology Research Institute Light emitting diode package structure
JP2013179335A (ja) * 2013-05-08 2013-09-09 Mitsubishi Chemicals Corp 白色発光素子
WO2014188847A1 (ja) * 2013-05-21 2014-11-27 セントラル硝子株式会社 広帯域発光材料及び白色光発光材料
JP6054526B2 (ja) 2013-05-28 2016-12-27 シャープ株式会社 発光装置の製造方法
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
JP6165248B2 (ja) * 2013-06-18 2017-07-19 シャープ株式会社 発光装置
KR102098589B1 (ko) 2013-07-04 2020-04-09 삼성전자주식회사 파장변환부재 및 그 제조방법과, 이를 구비한 반도체 발광장치
CN104332539B (zh) 2013-07-22 2017-10-24 中国科学院福建物质结构研究所 GaN基LED外延结构及其制造方法
TW201508207A (zh) * 2013-08-27 2015-03-01 Hon Hai Prec Ind Co Ltd 車燈模組
JP6139334B2 (ja) * 2013-08-28 2017-05-31 東芝マテリアル株式会社 蛍光体およびその製造方法、並びにその蛍光体を用いたｌｅｄランプ
US9863595B2 (en) 2013-08-28 2018-01-09 Sharp Kabushiki Kaisha Light-emitting unit with optical plate reflecting excitation light and transmitting fluorescent light, and light-emitting device, illumination device, and vehicle headlight including the unit
KR102106143B1 (ko) 2013-09-02 2020-05-04 대주전자재료 주식회사 적색 형광체 및 이를 이용한 백색 발광 장치
US9840666B2 (en) 2013-09-30 2017-12-12 Panasonic Intellectual Property Management Co., Ltd. Phosphor having inorganic oxide with cerium and terbium activators, light-emitting device illumination light source, and illumination device using same
KR20170095409A (ko) 2013-10-08 2017-08-22 오스람 옵토 세미컨덕터스 게엠베하 발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
JP5620562B1 (ja) 2013-10-23 2014-11-05 株式会社光波 単結晶蛍光体及び発光装置
JP6384893B2 (ja) 2013-10-23 2018-09-05 株式会社光波 単結晶蛍光体及び発光装置
FR3012677B1 (fr) * 2013-10-25 2015-12-25 Commissariat Energie Atomique Dispositif emissif lumineux, dispositif et procede d'ajustement d'une emission lumineuse d'une diode electroluminescente a phosphore
JP6609554B2 (ja) 2013-11-13 2019-11-20 エルジー イノテック カンパニー リミテッド 青緑色蛍光体、それを含む発光素子パッケージ及び照明装置
US9499740B2 (en) 2013-11-22 2016-11-22 Nitto Denko Corporation Light extraction element
US10288233B2 (en) 2013-12-10 2019-05-14 Gary W. Jones Inverse visible spectrum light and broad spectrum light source for enhanced vision
US9551468B2 (en) 2013-12-10 2017-01-24 Gary W. Jones Inverse visible spectrum light and broad spectrum light source for enhanced vision
JP6222452B2 (ja) 2013-12-17 2017-11-01 日本電気硝子株式会社 波長変換部材及び発光デバイス
EP3091585A4 (de) 2013-12-27 2017-07-26 Citizen Electronics Co., Ltd Lichtemittierende vorrichtung und verfahren zum entwerfen einer lichtemittierenden vorrichtung
CN111554790B (zh) 2013-12-27 2023-09-15 西铁城电子株式会社 发光装置的设计方法
EP3097748A1 (de) 2014-01-22 2016-11-30 iLumisys, Inc. Beleuchtung auf led-basis mit adressierten leds
US9406654B2 (en) 2014-01-27 2016-08-02 Ledengin, Inc. Package for high-power LED devices
JP6528418B2 (ja) 2014-01-29 2019-06-12 日亜化学工業株式会社 蛍光体及びこれを用いた発光装置
CN103779488A (zh) * 2014-01-31 2014-05-07 芜湖市神龙新能源科技有限公司 一种白色led灯光电玻璃
JP6038824B2 (ja) 2014-02-07 2016-12-07 信越化学工業株式会社 硬化性組成物、半導体装置、及びエステル結合含有有機ケイ素化合物
KR101501020B1 (ko) * 2014-02-17 2015-03-13 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements
KR102219263B1 (ko) 2014-02-28 2021-02-24 대주전자재료 주식회사 산질화물계 적색 형광체 및 이를 이용한 백색 발광 장치
US9442245B2 (en) * 2014-03-13 2016-09-13 Norman Napaul Pepin Light scaffold electric arc sound effect
US9680067B2 (en) 2014-03-18 2017-06-13 GE Lighting Solutions, LLC Heavily phosphor loaded LED packages having higher stability
US9590148B2 (en) 2014-03-18 2017-03-07 GE Lighting Solutions, LLC Encapsulant modification in heavily phosphor loaded LED packages for improved stability
JP2015199640A (ja) 2014-04-01 2015-11-12 日本電気硝子株式会社 波長変換部材及びそれを用いてなる発光デバイス
KR102213650B1 (ko) 2014-04-18 2021-02-08 대주전자재료 주식회사 산질화물계 형광체 및 이를 이용한 백색 발광 장치
US9593812B2 (en) 2014-04-23 2017-03-14 Cree, Inc. High CRI solid state lighting devices with enhanced vividness
US9241384B2 (en) 2014-04-23 2016-01-19 Cree, Inc. Solid state lighting devices with adjustable color point
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US9215761B2 (en) 2014-05-15 2015-12-15 Cree, Inc. Solid state lighting devices with color point non-coincident with blackbody locus
JP2016027613A (ja) 2014-05-21 2016-02-18 日本電気硝子株式会社 波長変換部材及びそれを用いた発光装置
CN103980902A (zh) * 2014-05-21 2014-08-13 烟台建塬光电技术有限公司 掺杂Ga、Bi的铝酸盐绿色荧光粉及其制备方法
US9318670B2 (en) 2014-05-21 2016-04-19 Intematix Corporation Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements
DE102014107321B4 (de) 2014-05-23 2019-06-27 Tailorlux Gmbh Infrarot LED
KR101476217B1 (ko) 2014-05-28 2014-12-24 엘지전자 주식회사 황색 발광 형광체 및 이를 이용한 발광 소자 패키지
US9192013B1 (en) 2014-06-06 2015-11-17 Cree, Inc. Lighting devices with variable gamut
US9515056B2 (en) 2014-06-06 2016-12-06 Cree, Inc. Solid state lighting device including narrow spectrum emitter
JP6406109B2 (ja) 2014-07-08 2018-10-17 日亜化学工業株式会社 蛍光体およびそれを用いた発光装置ならびに蛍光体の製造方法
KR101467808B1 (ko) 2014-07-14 2014-12-03 엘지전자 주식회사 황색 발광 형광체 및 이를 이용한 발광 소자 패키지
US20160064630A1 (en) * 2014-08-26 2016-03-03 Texas Instruments Incorporated Flip chip led package
KR102275147B1 (ko) 2014-09-12 2021-07-09 대주전자재료 주식회사 산질화물계 형광체 및 이를 이용한 발광 장치
US9528876B2 (en) 2014-09-29 2016-12-27 Innovative Science Tools, Inc. Solid state broad band near-infrared light source
RU2684998C2 (ru) * 2014-09-30 2019-04-16 ФОРД ГЛОУБАЛ ТЕКНОЛОДЖИЗ, ЭлЭлСи Устройство подсветки и система освещения для транспортного средства (варианты)
CN105567236B (zh) * 2014-10-15 2018-07-20 有研稀土新材料股份有限公司 石榴石型荧光粉和制备方法及包含该荧光粉的装置
CN107004677B (zh) 2014-11-26 2020-08-25 硅谷光擎 用于温暖调光的且颜色可调谐的灯的紧凑型发射器
US9701411B2 (en) * 2014-12-10 2017-07-11 Airbus Operations Gmbh Evacuation slide with a guidance marking
JP6486099B2 (ja) * 2014-12-19 2019-03-20 シチズン電子株式会社 Ｌｅｄ発光モジュール
JP6514510B2 (ja) * 2015-01-14 2019-05-15 株式会社小糸製作所 車両用灯具
US9702524B2 (en) 2015-01-27 2017-07-11 Cree, Inc. High color-saturation lighting devices
US9530944B2 (en) 2015-01-27 2016-12-27 Cree, Inc. High color-saturation lighting devices with enhanced long wavelength illumination
EP3828250A1 (de) 2015-02-26 2021-06-02 Saint-Gobain Cristaux & Detecteurs Szintillationskristall mit einem co-dotierten seltenerdsilikat, strahlungsdetekionsvorrichtung mit dem szintillationskristall und verfahren zur formung davon
US9530943B2 (en) 2015-02-27 2016-12-27 Ledengin, Inc. LED emitter packages with high CRI
US9681510B2 (en) 2015-03-26 2017-06-13 Cree, Inc. Lighting device with operation responsive to geospatial position
US10249802B2 (en) * 2015-04-02 2019-04-02 Nichia Corporation Light emitting device and method for manufacturing the same
US9509217B2 (en) 2015-04-20 2016-11-29 Altera Corporation Asymmetric power flow controller for a power converter and method of operating the same
US9974138B2 (en) 2015-04-21 2018-05-15 GE Lighting Solutions, LLC Multi-channel lamp system and method with mixed spectrum
US9943042B2 (en) 2015-05-18 2018-04-17 Biological Innovation & Optimization Systems, LLC Grow light embodying power delivery and data communications features
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
US9900957B2 (en) 2015-06-11 2018-02-20 Cree, Inc. Lighting device including solid state emitters with adjustable control
KR102069081B1 (ko) 2015-06-12 2020-01-22 가부시끼가이샤 도시바 형광체 및 그 제조 방법, 그리고 led 램프
JP6544082B2 (ja) * 2015-06-30 2019-07-17 日亜化学工業株式会社 発光装置
CN106328008B (zh) * 2015-06-30 2019-03-22 光宝光电(常州)有限公司 胶体填充至壳体的制法、发光二极管的数字显示器及制法
JP6555672B2 (ja) * 2015-07-22 2019-08-07 パナソニックＩｐマネジメント株式会社 ガーネット化合物及びその製造方法、当該ガーネット化合物を用いた発光装置及び装飾物、並びに当該ガーネット化合物の使用方法
CN106501994B (zh) * 2015-09-08 2021-10-29 青岛海信电器股份有限公司 一种量子点发光器件、背光模组及显示装置
US9844116B2 (en) 2015-09-15 2017-12-12 Biological Innovation & Optimization Systems, LLC Systems and methods for controlling the spectral content of LED lighting devices
US9788387B2 (en) 2015-09-15 2017-10-10 Biological Innovation & Optimization Systems, LLC Systems and methods for controlling the spectral content of LED lighting devices
CA2994308C (en) 2015-09-29 2020-02-25 Cabatech, Llc Horticulture grow lights
JP2017107071A (ja) 2015-12-10 2017-06-15 日本電気硝子株式会社 波長変換部材及び波長変換素子、並びにそれらを用いた発光装置
JP6681581B2 (ja) * 2015-12-21 2020-04-15 パナソニックＩｐマネジメント株式会社 発光装置、及び、照明装置
US10354938B2 (en) 2016-01-12 2019-07-16 Greentech LED Lighting device using short thermal path cooling technology and other device cooling by placing selected openings on heat sinks
EP3402845B1 (de) 2016-01-14 2020-03-11 Basf Se Perylenbismide mit starren 2,2'-biphenoxy-brücken
CN108603112B (zh) 2016-03-08 2021-10-22 松下知识产权经营株式会社 荧光体和发光装置
EP3428697B1 (de) 2016-03-10 2023-03-01 Panasonic Intellectual Property Management Co., Ltd. Lichtemittierende vorrichtung
US20190096954A1 (en) * 2016-03-10 2019-03-28 Lumileds Holding B.V. Led module
US10054485B2 (en) 2016-03-17 2018-08-21 Raytheon Company UV LED-phosphor based hyperspectral calibrator
JP6917986B2 (ja) 2016-05-20 2021-08-11 東芝マテリアル株式会社 白色光源
JP2018003006A (ja) 2016-06-24 2018-01-11 パナソニック株式会社 蛍光体およびその製造方法、ならびに発光装置
JP6880528B2 (ja) 2016-06-27 2021-06-02 日本電気硝子株式会社 波長変換部材及びそれを用いてなる発光デバイス
JP6906277B2 (ja) 2016-06-27 2021-07-21 日本電気硝子株式会社 波長変換部材及びそれを用いてなる発光デバイス
EP3505594A4 (de) 2016-08-29 2019-07-03 Panasonic Intellectual Property Management Co., Ltd. Phosphor und lichtemittierende vorrichtung
US10595376B2 (en) 2016-09-13 2020-03-17 Biological Innovation & Optimization Systems, LLC Systems and methods for controlling the spectral content of LED lighting devices
CN115623630A (zh) * 2016-09-14 2023-01-17 路创技术有限责任公司 用于调节模拟输出中的周期性改变的照明设备和方法
JP2018058383A (ja) * 2016-09-30 2018-04-12 トヨタ自動車株式会社 車両下部構造
CN109803969B (zh) 2016-10-06 2022-08-05 巴斯夫欧洲公司 2-苯基苯氧基取代的苝双酰亚胺化合物及其用途
US10219345B2 (en) 2016-11-10 2019-02-26 Ledengin, Inc. Tunable LED emitter with continuous spectrum
KR101961030B1 (ko) * 2016-11-18 2019-03-22 효성화학 주식회사 휘도 향상 필름과 그 제조방법
KR102500396B1 (ko) 2016-11-28 2023-02-15 메르크 파텐트 게엠베하 나노사이즈의 발광 재료를 포함하는 조성물
EP3553153B1 (de) 2016-12-07 2023-02-08 Konoshima Chemical Co., Ltd. Keramikzusammensetzung
TW201828505A (zh) * 2017-01-20 2018-08-01 聯京光電股份有限公司 光電封裝體及其製造方法
US10465869B2 (en) 2017-01-30 2019-11-05 Ideal Industries Lighting Llc Skylight fixture
US10451229B2 (en) 2017-01-30 2019-10-22 Ideal Industries Lighting Llc Skylight fixture
US10174438B2 (en) 2017-03-30 2019-01-08 Slt Technologies, Inc. Apparatus for high pressure reaction
DE102017108136B4 (de) 2017-04-13 2019-03-14 X-Fab Semiconductor Foundries Ag Geometrisch geformte Bauelemente in einer Anordnung für einen Überführungsdruck (Transfer Print) und zugehörige Verfahren
JP6917179B2 (ja) * 2017-04-18 2021-08-11 スタンレー電気株式会社 白色発光装置
US10824910B2 (en) 2017-05-04 2020-11-03 Htc Corporation Image processing method, non-transitory computer readable storage medium and image processing system
JP6863071B2 (ja) * 2017-05-19 2021-04-21 日亜化学工業株式会社 希土類アルミニウム・ガリウム酸塩の組成を有する蛍光体及び発光装置
DE102017116936A1 (de) * 2017-07-26 2019-01-31 Ledvance Gmbh Verbindung eines elektrischen Leitelements mit einer Leiterplatte eines Leuchtmittels
US11079077B2 (en) 2017-08-31 2021-08-03 Lynk Labs, Inc. LED lighting system and installation methods
EP3685636A4 (de) * 2017-09-20 2021-04-28 Materion Precision Optics (Shanghai) Limited Leuchtstoffrad mit anorganischem bindemittel
JP7022367B2 (ja) 2017-09-27 2022-02-18 日本電気硝子株式会社 波長変換材料に用いられるガラス、波長変換材料、波長変換部材及び発光デバイス
JP7002275B2 (ja) * 2017-10-03 2022-02-21 株式会社小糸製作所 車両用灯具
KR102428755B1 (ko) * 2017-11-24 2022-08-02 엘지디스플레이 주식회사 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛
JP7268315B2 (ja) 2017-12-12 2023-05-08 日本電気硝子株式会社 波長変換部材及びその製造方法、並びに発光装置
KR20200100702A (ko) 2017-12-19 2020-08-26 바스프 에스이 시아노아릴 치환된 벤즈(오티)오크산텐 화합물
CN108264234A (zh) * 2018-01-11 2018-07-10 武汉理工大学 一种嵌有GYAGG：Ce微晶相的闪烁微晶玻璃及其制备方法
US20190219874A1 (en) * 2018-01-16 2019-07-18 Huizhou China Star Optoelectronics Technology Co., Ltd. Backlight module and display device
DE102019202785B4 (de) 2018-03-02 2024-01-18 Coorstek Kk Glaselement
US10575374B2 (en) 2018-03-09 2020-02-25 Ledengin, Inc. Package for flip-chip LEDs with close spacing of LED chips
JP7250897B2 (ja) 2018-03-20 2023-04-03 ビーエーエスエフ ソシエタス・ヨーロピア 黄色発光素子
CN112119445A (zh) * 2018-05-17 2020-12-22 株式会社半导体能源研究所 显示装置
EP3588187A1 (de) 2018-06-22 2020-01-01 Sunland Optics Srl Ein bild-projektions-system
IT201900009681A1 (it) 2019-06-20 2020-12-20 Tlpicoglass Srl Sistema di proiezione di immagini
WO2020012923A1 (ja) 2018-07-12 2020-01-16 パナソニックＩｐマネジメント株式会社 光源装置、プロジェクタ及び車両
JP6975863B2 (ja) * 2018-08-07 2021-12-01 三井金属鉱業株式会社 光拡散部材、並びにこれを用いた光拡散構造体及び発光構造体
DE102018213377A1 (de) * 2018-08-09 2020-02-13 Robert Bosch Gmbh Spektrometer und Verfahren zur Kalibrierung des Spektrometers
DE112019004568T5 (de) 2018-09-12 2021-05-27 Panasonic Intellectual Property Management Co., Ltd. Wellenlängenumwandlungselement, lichtquellenvorrichtung, bei der dieses verwendet wird, projektor und fahrzeug
DE102018217889B4 (de) 2018-10-18 2023-09-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gelber Leuchtstoff und Konversions-LED
RU192820U1 (ru) * 2018-11-13 2019-10-02 Василий Сергеевич Евтеев Свето-информационное устройство
JP2022515966A (ja) * 2018-11-15 2022-02-24 レヴィン，ディーン 流体の発光デカンテーション装置および流体の光処理方法
CN111286330A (zh) 2018-12-06 2020-06-16 松下知识产权经营株式会社 荧光体及使用了它的半导体发光装置
US11421843B2 (en) 2018-12-21 2022-08-23 Kyocera Sld Laser, Inc. Fiber-delivered laser-induced dynamic light system
US11239637B2 (en) 2018-12-21 2022-02-01 Kyocera Sld Laser, Inc. Fiber delivered laser induced white light system
JP2020106831A (ja) 2018-12-27 2020-07-09 日本電気硝子株式会社 波長変換部材及び発光装置
US11466384B2 (en) 2019-01-08 2022-10-11 Slt Technologies, Inc. Method of forming a high quality group-III metal nitride boule or wafer using a patterned substrate
US11884202B2 (en) 2019-01-18 2024-01-30 Kyocera Sld Laser, Inc. Laser-based fiber-coupled white light system
JP7145096B2 (ja) 2019-02-12 2022-09-30 信越化学工業株式会社 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法
DE112020001955T5 (de) 2019-04-18 2021-12-30 Nippon Electric Glass Co., Ltd. Wellenlängen-umwandlungselement, verfahren zur herstellung desselben und lichtemittierende vorrichtung
DE112020001953T5 (de) 2019-04-18 2021-12-30 Nippon Electric Glass Co., Ltd. Wellenlängen-umwandlungselement, verfahren zu dessen herstellung und lichtemittierende vorrichtung
US11313671B2 (en) 2019-05-28 2022-04-26 Mitutoyo Corporation Chromatic confocal range sensing system with enhanced spectrum light source configuration
RU2720046C1 (ru) * 2019-07-17 2020-04-23 Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" Светодиодная гетероструктура с квантовыми ямами комбинированного профиля
RU195810U1 (ru) * 2019-09-27 2020-02-05 Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" (ТУСУР) Светоизлучающий диод
KR102230355B1 (ko) 2019-09-27 2021-03-22 강원대학교산학협력단 백색 발광 소재의 제조방법
US11561338B2 (en) 2019-09-30 2023-01-24 Nichia Corporation Light-emitting module
US11112555B2 (en) 2019-09-30 2021-09-07 Nichia Corporation Light-emitting module with a plurality of light guide plates and a gap therein
JP2021059686A (ja) 2019-10-09 2021-04-15 パナソニックＩｐマネジメント株式会社 蛍光体およびそれを使用した半導体発光装置
US11721549B2 (en) 2020-02-11 2023-08-08 Slt Technologies, Inc. Large area group III nitride crystals and substrates, methods of making, and methods of use
US11705322B2 (en) 2020-02-11 2023-07-18 Slt Technologies, Inc. Group III nitride substrate, method of making, and method of use
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device
CN111944350B (zh) * 2020-08-27 2022-01-25 兰州大学 基于YAG Ce的暖白色荧光汽车涂漆及其制备方法
EP4208521A1 (de) * 2020-09-01 2023-07-12 General Electric Company Mit nachtsichtgeräten kompatible vorrichtungen
US11444225B2 (en) 2020-09-08 2022-09-13 Dominant Opto Technologies Sdn Bhd Light emitting diode package having a protective coating
US11329206B2 (en) 2020-09-28 2022-05-10 Dominant Opto Technologies Sdn Bhd Lead frame and housing sub-assembly for use in a light emitting diode package and method for manufacturing the same
WO2022107794A1 (ja) 2020-11-19 2022-05-27 日本電気硝子株式会社 波長変換部材及びその製造方法
EP4284638A1 (de) 2021-01-26 2023-12-06 Solutia Inc. Lichtsysteme mit diffusiver pvb-zwischenschicht
JP2022158107A (ja) 2021-04-01 2022-10-17 日本電気硝子株式会社 波長変換部材及び発光デバイス
WO2023008028A1 (ja) 2021-07-29 2023-02-02 パナソニックＩｐマネジメント株式会社 発光装置及び電子機器

Family Cites Families (258)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US362048A (en) * 1887-04-26 watkins
US215074A (en) * 1879-05-06 Improvement in stamp-mills
US5816677A (en) * 1905-03-01 1998-10-06 Canon Kabushiki Kaisha Backlight device for display apparatus
US2557049A (en) * 1946-05-03 1951-06-12 Turner Of Indiana Power-driven posthole digger
US2924732A (en) * 1957-07-05 1960-02-09 Westinghouse Electric Corp Area-type light source
BE624851A (de) 1961-05-08
NL135101C (de) 1964-05-14
GB1112992A (en) * 1964-08-18 1968-05-08 Texas Instruments Inc Three-dimensional integrated circuits and methods of making same
US3342308A (en) * 1966-08-09 1967-09-19 Sperry Rand Corp Corn processing machine elevator unit structure
US3560649A (en) 1967-05-23 1971-02-02 Tektronix Inc Cathode ray tube with projection means
US3560849A (en) 1967-08-15 1971-02-02 Aai Corp Liquid temperature controlled test chamber and transport apparatus for electrical circuit assemblies
US3554776A (en) * 1967-11-24 1971-01-12 Allied Chem Novel perylenetetracarboxylic diimide compositions
US3623857A (en) * 1968-03-22 1971-11-30 Johns Manville Glass melting pot
US3510732A (en) * 1968-04-22 1970-05-05 Gen Electric Solid state lamp having a lens with rhodamine or fluorescent material dispersed therein
US3699478A (en) * 1969-05-26 1972-10-17 Bell Telephone Labor Inc Display system
SE364160B (de) * 1969-05-26 1974-02-11 Western Electric Co
BE757125A (fr) * 1969-10-06 1971-03-16 Rca Corp Procede photographique pour former l'ecran luminescent d'un tube a rayons cathodiques
US3691482A (en) * 1970-01-19 1972-09-12 Bell Telephone Labor Inc Display system
US3652956A (en) * 1970-01-23 1972-03-28 Bell Telephone Labor Inc Color visual display
US3699476A (en) * 1971-03-05 1972-10-17 Rca Corp Crystal controlled digital logic gate oscillator
JPS4717684U (de) 1971-03-27 1972-10-30
JPS4839866U (de) 1971-09-13 1973-05-18
DE2244397C3 (de) 1971-09-21 1974-07-18 Tovarna Motornih Vozil Tomos, Koper (Jugoslawien) Schalteinrichtung für ein mehrstufiges Keilriemenwechselgetriebe
JPS48102585A (de) * 1972-04-04 1973-12-22
JPS491221A (de) 1972-04-17 1974-01-08
JPS5240959B2 (de) 1972-08-07 1977-10-15
JPS4979379A (de) 1972-12-06 1974-07-31
JPS4985068U (de) * 1972-11-10 1974-07-23
FR2248663B1 (de) * 1972-12-13 1978-08-11 Radiotechnique Compelec
JPS5531825Y2 (de) 1972-12-27 1980-07-29
JPS49106283A (de) 1973-02-09 1974-10-08
JPS49112577A (de) 1973-02-23 1974-10-26
US3819974A (en) * 1973-03-12 1974-06-25 D Stevenson Gallium nitride metal-semiconductor junction light emitting diode
JPS5640994B2 (de) 1973-03-22 1981-09-25
US3842306A (en) * 1973-06-21 1974-10-15 Gen Electric Alumina coatings for an electric lamp
JPS5043913A (de) * 1973-08-20 1975-04-21
JPS5079379A (de) 1973-11-13 1975-06-27
JPS5079379U (de) * 1973-11-24 1975-07-09
US3882502A (en) 1974-01-17 1975-05-06 Us Navy Crt multiple-scan display apparatus and method providing target discrimination
JPS5713156B2 (de) * 1974-02-28 1982-03-15
US4123161A (en) * 1974-06-18 1978-10-31 Pappas George J Apparatus for and method of examining light
JPS5240959A (en) 1975-09-29 1977-03-30 Toshiba Corp Color picture tube
JPS5245181A (en) 1975-10-07 1977-04-09 Matsushita Electric Works Ltd Chain
US4001628A (en) * 1976-02-25 1977-01-04 Westinghouse Electric Corporation Low-pressure fluorescent discharge device which utilizes both inorganic and organic phosphors
US4143297A (en) * 1976-03-08 1979-03-06 Brown, Boveri & Cie Aktiengesellschaft Information display panel with zinc sulfide powder electroluminescent layers
JPS537153U (de) 1976-07-05 1978-01-21
JPS537153A (en) 1976-07-09 1978-01-23 Fujitsu Ltd Program loop detection-recording system
GB1589964A (en) 1976-09-03 1981-05-20 Johnson Matthey Co Ltd Luminescent materials
NL7707008A (nl) * 1977-06-24 1978-12-28 Philips Nv Luminescentiescherm.
JPS5441660A (en) 1977-09-09 1979-04-03 Matsushita Electric Works Ltd Timer
JPS5332545Y2 (de) 1977-09-13 1978-08-11
FR2407588A1 (fr) 1977-10-28 1979-05-25 Cit Alcatel Procede de realisation de barres d'alimentation
NL7806828A (nl) * 1978-06-26 1979-12-28 Philips Nv Luminescentiescherm.
JPS555533U (de) * 1978-06-26 1980-01-14
JPS583420B2 (ja) 1978-06-27 1983-01-21 株式会社リコー マトリクス駆動回路
JPS556687A (en) * 1978-06-29 1980-01-18 Handotai Kenkyu Shinkokai Traffic use display
US4271408A (en) * 1978-10-17 1981-06-02 Stanley Electric Co., Ltd. Colored-light emitting display
DE3117571A1 (de) * 1981-05-04 1982-11-18 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Lumineszenz-halbleiterbauelement
CA1192919A (en) 1981-12-21 1985-09-03 Bernard J. Finn Vehicle wheel suspension
JPS5930107U (ja) 1982-08-19 1984-02-24 スタンレー電気株式会社 カラ−フイルタ−付導光板
NL8203543A (nl) 1982-09-13 1984-04-02 Oce Nederland Bv Kopieerapparaat.
JPS5950445A (ja) 1982-09-16 1984-03-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 電子写真材料
JPS5950455U (ja) * 1982-09-24 1984-04-03 三洋電機株式会社 発光ダイオ−ド装置
JPS5967673A (ja) * 1982-10-12 1984-04-17 Toyo Commun Equip Co Ltd 面照明用発光ダイオ−ド
NL8205044A (nl) * 1982-12-30 1984-07-16 Philips Nv Lagedrukkwikdampontladingslamp.
JPS6073580A (ja) * 1983-09-29 1985-04-25 東芝ライテック株式会社 表示装置
JPS6081878A (ja) 1983-10-11 1985-05-09 Shinyoushiya:Kk 複合形発光ダイオ−ドの発光光色制御方法
US4550256A (en) 1983-10-17 1985-10-29 At&T Bell Laboratories Visual display system utilizing high luminosity single crystal garnet material
JPS60185457A (ja) 1984-03-05 1985-09-20 Canon Inc フアクシミリ装置
US4857228A (en) * 1984-04-24 1989-08-15 Sunstone Inc. Phosphors and methods of preparing the same
JPS60185457U (ja) * 1984-05-19 1985-12-09 セイレイ工業株式会社 枝打機のエンジンストツプセンサ−配置構造
JPS61158606A (ja) 1984-12-28 1986-07-18 株式会社小糸製作所 照明装置
NL8502025A (nl) * 1985-07-15 1987-02-02 Philips Nv Lagedrukkwikdampontladingslamp.
JPS6220237U (de) * 1985-07-23 1987-02-06
JPS62109185U (de) * 1985-12-27 1987-07-11
NL8600023A (nl) * 1986-01-08 1987-08-03 Philips Nv Lagedrukkwikdampontladingslamp.
JPS62167398A (ja) 1986-01-17 1987-07-23 花王株式会社 高密度粒状洗剤組成物
JPS62189770A (ja) 1986-02-15 1987-08-19 Fumio Inaba 接合型半導体発光素子
JPS62232827A (ja) 1986-03-31 1987-10-13 松下電器産業株式会社 照光素子付操作パネル駆動回路
EP0288014B1 (de) 1987-04-20 1998-08-05 Fuji Photo Film Co., Ltd. Kassette, Vorrichtung und Wischverfahren für ein stimulierbares Phosphorblatt
JPH079998B2 (ja) * 1988-01-07 1995-02-01 科学技術庁無機材質研究所長 立方晶窒化ほう素のＰ−ｎ接合型発光素子
JPS63291980A (ja) 1987-05-25 1988-11-29 Canon Inc 強誘電性液晶素子
JPS63299186A (ja) * 1987-05-29 1988-12-06 Hitachi Ltd 発光素子
US4929965A (en) * 1987-09-02 1990-05-29 Alps Electric Co. Optical writing head
JPH01189695A (ja) * 1988-01-25 1989-07-28 Yokogawa Electric Corp Ｌｅｄ表示装置
DE3804293A1 (de) * 1988-02-12 1989-08-24 Philips Patentverwaltung Anordnung mit einer elektrolumineszenz- oder laserdiode
JP2594609B2 (ja) 1988-04-08 1997-03-26 富士通株式会社 表示パネルのバック照明構造
JPH01260707A (ja) 1988-04-11 1989-10-18 Idec Izumi Corp 白色発光装置
JPH0218973A (ja) * 1988-07-07 1990-01-23 Shibasoku Co Ltd 発光ダイオード試験装置
US5043716A (en) * 1988-07-14 1991-08-27 Adaptive Micro Systems, Inc. Electronic display with lens matrix
JPH0291980A (ja) 1988-09-29 1990-03-30 Toshiba Lighting & Technol Corp 固体発光素子
JP2770350B2 (ja) 1988-10-20 1998-07-02 富士通株式会社 液晶表示装置
US5034965A (en) 1988-11-11 1991-07-23 Matsushita Electric Industrial Co., Ltd. Efficient coding method and its decoding method
JPH02202073A (ja) * 1989-01-31 1990-08-10 Hitachi Chem Co Ltd 電子部品
JP2704181B2 (ja) * 1989-02-13 1998-01-26 日本電信電話株式会社 化合物半導体単結晶薄膜の成長方法
JPH02271304A (ja) * 1989-04-12 1990-11-06 Seiko Epson Corp 表示体用照明装置
US4992704A (en) 1989-04-17 1991-02-12 Basic Electronics, Inc. Variable color light emitting diode
JPH0324692A (ja) 1989-06-21 1991-02-01 Fuji Electric Co Ltd 自動貸出機の制御装置
JPH0324692U (de) 1989-07-18 1991-03-14
US5221984A (en) * 1989-09-18 1993-06-22 Kabushiki Kaisha Toshiba Optical data transmission device with parallel channel paths for arrayed optical elements
JPH03152898A (ja) 1989-11-09 1991-06-28 Hitachi Maxell Ltd 分散型ｅｌ素子
US5118985A (en) * 1989-12-29 1992-06-02 Gte Products Corporation Fluorescent incandescent lamp
JP2995664B2 (ja) * 1990-05-17 1999-12-27 小糸工業株式会社 情報表示装置
NL9001193A (nl) * 1990-05-23 1991-12-16 Koninkl Philips Electronics Nv Straling-emitterende halfgeleiderinrichting en werkwijze ter vervaardiging van een dergelijke halfgeleiderinrichting.
JP2506223B2 (ja) 1990-06-28 1996-06-12 トリニティ工業株式会社 自動塗装装置
EP0500937A4 (en) 1990-06-28 1993-09-15 Daihen Corporation Method of electrically joining ceramics, device used therefor and adhesive agent therefor
JPH0463162A (ja) 1990-06-29 1992-02-28 Suzuki Motor Corp 塗装装置
US5257049A (en) 1990-07-03 1993-10-26 Agfa-Gevaert N.V. LED exposure head with overlapping electric circuits
JPH0480286A (ja) 1990-07-23 1992-03-13 Matsushita Electron Corp 蛍光高圧水銀灯
JP2924125B2 (ja) 1990-07-30 1999-07-26 東レ株式会社 不織布用ポリエステル繊維
DE9013615U1 (de) * 1990-09-28 1990-12-06 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De
JPH0463162U (de) * 1990-10-02 1992-05-29
JPH0463163U (de) 1990-10-04 1992-05-29
KR940002570B1 (ko) * 1990-11-02 1994-03-25 삼성전관 주식회사 백색발광 형광체
JPH04175265A (ja) * 1990-11-07 1992-06-23 Sumitomo Electric Ind Ltd 着色透光性ｙａｇ焼結体及びその製造方法
JP2593960B2 (ja) * 1990-11-29 1997-03-26 シャープ株式会社 化合物半導体発光素子とその製造方法
JP3160914B2 (ja) 1990-12-26 2001-04-25 豊田合成株式会社 窒化ガリウム系化合物半導体レーザダイオード
JPH04234481A (ja) * 1990-12-28 1992-08-24 Matsushita Electron Corp 蛍光高圧水銀灯
US5202777A (en) * 1991-05-31 1993-04-13 Hughes Aircraft Company Liquid crystal light value in combination with cathode ray tube containing a far-red emitting phosphor
NL9200939A (nl) * 1991-05-31 1992-12-16 Hughes Aircraft Co In het ver-rode gebied emitterend luminescerend materiaal voor kathodestraalbuizen.
JPH0543913A (ja) 1991-08-08 1993-02-23 Mitsubishi Materials Corp 相手攻撃性のきわめて低いＦｅ基焼結合金製バルブシ−ト
JPH0563068A (ja) 1991-08-30 1993-03-12 Shin Etsu Handotai Co Ltd ウエーハバスケツト
JPH0579379A (ja) 1991-09-19 1993-03-30 Hitachi Ltd 制御方法
JP2666228B2 (ja) * 1991-10-30 1997-10-22 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子
US5306662A (en) * 1991-11-08 1994-04-26 Nichia Chemical Industries, Ltd. Method of manufacturing P-type compound semiconductor
JP2540791B2 (ja) 1991-11-08 1996-10-09 日亜化学工業株式会社 ｐ型窒化ガリウム系化合物半導体の製造方法。
JPH05152609A (ja) * 1991-11-25 1993-06-18 Nichia Chem Ind Ltd 発光ダイオード
JPH05142424A (ja) 1991-11-26 1993-06-11 Nec Kansai Ltd 平面発光板
US5208462A (en) 1991-12-19 1993-05-04 Allied-Signal Inc. Wide bandwidth solid state optical source
EP0550937B1 (de) * 1992-01-07 1997-03-19 Koninklijke Philips Electronics N.V. Niederdruckquecksilberentladungslampe
JPH0560368U (ja) * 1992-01-27 1993-08-10 恵助 山下 箸
JPH0563068U (ja) 1992-01-31 1993-08-20 シャープ株式会社 樹脂封止型発光体
JPH05226676A (ja) 1992-02-14 1993-09-03 Sharp Corp 半導体装置
JP3047600B2 (ja) 1992-03-04 2000-05-29 株式会社イナックス 濾過装置付き気泡浴槽装置の制御方法
JPH0613659A (ja) * 1992-04-30 1994-01-21 Takiron Co Ltd 発光ダイオードの輝度調整装置
JPH05331584A (ja) 1992-06-02 1993-12-14 Toyota Motor Corp 高弾性・高強度アルミニウム合金
JP3365787B2 (ja) * 1992-06-18 2003-01-14 シャープ株式会社 Ｌｅｄチップ実装部品
JP2917742B2 (ja) 1992-07-07 1999-07-12 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子とその製造方法
JPH0629576A (ja) * 1992-07-09 1994-02-04 Sharp Corp 発光表示素子
JPH0627327A (ja) 1992-07-13 1994-02-04 Seiko Epson Corp 照明装置
EP0579897B1 (de) 1992-07-23 2003-10-15 Toyoda Gosei Co., Ltd. Lichtemittierende Vorrichtung aus einer Verbindung der Galliumnitridgruppe
WO1994003931A1 (fr) 1992-08-07 1994-02-17 Asahi Kasei Kogyo Kabushiki Kaisha Dispositif semi-conducteur a base de nitrure et fabrication
JPH0669546A (ja) * 1992-08-21 1994-03-11 Asahi Chem Ind Co Ltd 発光ダイオード
US5334855A (en) * 1992-08-24 1994-08-02 Motorola, Inc. Diamond/phosphor polycrystalline led and display
JPH0682633A (ja) 1992-09-03 1994-03-25 Chuo Musen Kk 面光源
JP2842739B2 (ja) 1992-09-14 1999-01-06 富士通株式会社 面光源ユニット及び液晶表示装置
DE69322607T2 (de) 1992-09-23 1999-06-17 Koninkl Philips Electronics Nv Quecksilberniederdruckentladungslampe
JPH06139973A (ja) 1992-10-26 1994-05-20 Matsushita Electric Ind Co Ltd 平板型画像表示装置
JP3284208B2 (ja) 1992-11-17 2002-05-20 東ソー株式会社 バックライト
JP2560963B2 (ja) 1993-03-05 1996-12-04 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
US5578839A (en) * 1992-11-20 1996-11-26 Nichia Chemical Industries, Ltd. Light-emitting gallium nitride-based compound semiconductor device
US5317348A (en) * 1992-12-01 1994-05-31 Knize Randall J Full color solid state laser projector system
JP2711205B2 (ja) 1993-01-20 1998-02-10 鐘紡株式会社 複合発泡ポリエステルシート
JP3467788B2 (ja) 1993-02-09 2003-11-17 東ソー株式会社 バックライト
JP2932467B2 (ja) 1993-03-12 1999-08-09 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
JPH07321407A (ja) 1993-04-05 1995-12-08 Fuji Electric Co Ltd 樹脂封止形レーザーダイオード装置
JPH06296043A (ja) * 1993-04-08 1994-10-21 Matsushita Electric Ind Co Ltd 発光ダイオード
JPH06314826A (ja) * 1993-04-28 1994-11-08 Victor Co Of Japan Ltd 発光ダイオードアレイ
JPH0742152A (ja) 1993-07-29 1995-02-10 Hitachi Constr Mach Co Ltd パイルハンマ
US5514179A (en) * 1993-08-10 1996-05-07 Brennan; H. George Modular facial implant system
JP2584562Y2 (ja) 1993-09-01 1998-11-05 ダイハツ工業株式会社 ラックアンドピニオン式ステアリングのラックガイド
JPH0799345A (ja) * 1993-09-28 1995-04-11 Nichia Chem Ind Ltd 発光ダイオード
JPH07114904A (ja) 1993-10-18 1995-05-02 Hitachi Ltd バックライト光源用蛍光放電灯
JPH07120754A (ja) * 1993-10-26 1995-05-12 Fujikura Ltd 照光モジュール
JPH0732638U (ja) 1993-11-15 1995-06-16 ミネベア株式会社 面状光源装置
JPH07176794A (ja) * 1993-12-17 1995-07-14 Nichia Chem Ind Ltd 面状光源
JP3190774B2 (ja) * 1993-12-24 2001-07-23 株式会社東芝 Ｌｅｄランプ用リードフレーム及びｌｅｄ表示装置
JP2606025Y2 (ja) * 1993-12-24 2000-09-11 日亜化学工業株式会社 発光ダイオード素子
JPH07193281A (ja) 1993-12-27 1995-07-28 Mitsubishi Materials Corp 指向性の少ない赤外可視変換発光ダイオード
EP0664586A1 (de) * 1994-01-20 1995-07-26 Fuji Electric Co., Ltd. In Harz versiegelte Diodenlaservorrichtung
US5505986A (en) 1994-02-14 1996-04-09 Planar Systems, Inc. Multi-source reactive deposition process for the preparation of blue light emitting phosphor layers for AC TFEL devices
JPH07225378A (ja) * 1994-02-15 1995-08-22 Asahi Optical Co Ltd Ｌｃｄ照明装置
JPH07235207A (ja) 1994-02-21 1995-09-05 Copal Co Ltd バックライト
JPH07248495A (ja) 1994-03-14 1995-09-26 Hitachi Ltd 液晶表示装置
JPH07253594A (ja) * 1994-03-15 1995-10-03 Fujitsu Ltd 表示装置
JPH07263748A (ja) 1994-03-22 1995-10-13 Toyoda Gosei Co Ltd ３族窒化物半導体発光素子及びその製造方法
US5640216A (en) * 1994-04-13 1997-06-17 Hitachi, Ltd. Liquid crystal display device having video signal driving circuit mounted on one side and housing
JP3329573B2 (ja) 1994-04-18 2002-09-30 日亜化学工業株式会社 Ｌｅｄディスプレイ
JPH07307491A (ja) * 1994-05-11 1995-11-21 Mitsubishi Cable Ind Ltd Ｌｅｄ集合体モジュールおよびその作製方法
JP2979961B2 (ja) 1994-06-14 1999-11-22 日亜化学工業株式会社 フルカラーｌｅｄディスプレイ
JP3116727B2 (ja) * 1994-06-17 2000-12-11 日亜化学工業株式会社 面状光源
JP3227059B2 (ja) * 1994-06-21 2001-11-12 株式会社小糸製作所 車輌用灯具
JPH0863119A (ja) 1994-08-01 1996-03-08 Motorola Inc 単色ｌｅｄを用いた全色画像表示装置
JPH0854839A (ja) * 1994-08-09 1996-02-27 Sony Corp カラー画像表示装置
JPH0864860A (ja) * 1994-08-17 1996-03-08 Mitsubishi Materials Corp 色純度の高い赤外可視変換青色発光ダイオード
JP3309939B2 (ja) 1994-09-09 2002-07-29 日亜化学工業株式会社 発光ダイオード
JPH08130329A (ja) * 1994-10-31 1996-05-21 Nichia Chem Ind Ltd Ｌｅｄ照明
US5777350A (en) * 1994-12-02 1998-07-07 Nichia Chemical Industries, Ltd. Nitride semiconductor light-emitting device
JP3127195B2 (ja) * 1994-12-06 2001-01-22 シャープ株式会社 発光デバイスおよびその製造方法
US5710628A (en) * 1994-12-12 1998-01-20 Visible Genetics Inc. Automated electrophoresis and fluorescence detection apparatus and method
JPH08170077A (ja) 1994-12-19 1996-07-02 Hitachi Ltd 蛍光体、その製造方法、発光スクリーン及びそれを用いた陰極線管
JP2735057B2 (ja) 1994-12-22 1998-04-02 日亜化学工業株式会社 窒化物半導体発光素子
JPH09511358A (ja) 1995-01-30 1997-11-11 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 照明装置
JP3542677B2 (ja) 1995-02-27 2004-07-14 セイコーエプソン株式会社 樹脂封止型半導体装置およびその製造方法
JPH08321918A (ja) * 1995-03-22 1996-12-03 Canon Inc 導光体、該導光体を有する照明装置及び該照明装置を有する情報処理装置
US5623181A (en) * 1995-03-23 1997-04-22 Iwasaki Electric Co., Ltd. Multi-layer type light emitting device
JPH08293825A (ja) * 1995-04-21 1996-11-05 Fujitsu Ltd スペースダイバーシティ受信装置
US5630741A (en) * 1995-05-08 1997-05-20 Advanced Vision Technologies, Inc. Fabrication process for a field emission display cell structure
US5594751A (en) 1995-06-26 1997-01-14 Optical Concepts, Inc. Current-apertured vertical cavity laser
US5825113A (en) * 1995-07-05 1998-10-20 Electric Power Research Institute, Inc. Doubly salient permanent magnet machine with field weakening (or boosting) capability
JPH0927642A (ja) * 1995-07-13 1997-01-28 Clarion Co Ltd 照明装置
JP3120703B2 (ja) * 1995-08-07 2000-12-25 株式会社村田製作所 導電性ペースト及び積層セラミック電子部品
JPH0964325A (ja) * 1995-08-23 1997-03-07 Sony Corp 固体撮像素子とその製造方法
US5798537A (en) * 1995-08-31 1998-08-25 Kabushiki Kaisha Toshiba Blue light-emitting device
US5949751A (en) * 1995-09-07 1999-09-07 Pioneer Electronic Corporation Optical recording medium and a method for reproducing information recorded from same
JPH09116225A (ja) * 1995-10-20 1997-05-02 Hitachi Ltd 半導体発光素子
JP3612693B2 (ja) * 1995-10-31 2005-01-19 岩崎電気株式会社 発光ダイオード配列体及び発光ダイオード
JPH09130546A (ja) * 1995-11-01 1997-05-16 Iwasaki Electric Co Ltd 線状光源用発光ダイオード
JP3476611B2 (ja) * 1995-12-14 2003-12-10 日亜化学工業株式会社 多色発光素子及びそれを用いた表示装置
US5870797A (en) * 1996-02-23 1999-02-16 Anderson; Kent George Vacuum cleaning system
US6600175B1 (en) * 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
US5949182A (en) * 1996-06-03 1999-09-07 Cornell Research Foundation, Inc. Light-emitting, nanometer scale, micromachined silicon tips
BRPI9715293B1 (pt) * 1996-06-26 2016-11-01 Osram Ag elemento de cobertura para um elemento de construção optoeletrônico
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US5684309A (en) * 1996-07-11 1997-11-04 North Carolina State University Stacked quantum well aluminum indium gallium nitride light emitting diodes
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
JPH1036835A (ja) 1996-07-29 1998-02-10 Nichia Chem Ind Ltd フォトルミネセンス蛍光体
US6608332B2 (en) * 1996-07-29 2003-08-19 Nichia Kagaku Kogyo Kabushiki Kaisha Light emitting device and display
IE820328L (en) * 1996-08-15 1983-08-16 Eaton Corp Illumination system
US6004001A (en) 1996-09-12 1999-12-21 Vdo Adolf Schindling Ag Illumination for a display
US5781363A (en) * 1996-10-15 1998-07-14 International Business Machines Corporation Servo-free velocity estimator for coil driven actuator arm in a data storage drive
US5966393A (en) 1996-12-13 1999-10-12 The Regents Of The University Of California Hybrid light-emitting sources for efficient and cost effective white lighting and for full-color applications
JP4271747B2 (ja) * 1997-07-07 2009-06-03 株式会社朝日ラバー 発光ダイオード用透光性被覆材及び蛍光カラー光源
US5847507A (en) * 1997-07-14 1998-12-08 Hewlett-Packard Company Fluorescent dye added to epoxy of light emitting diode lens
JPH1139917A (ja) * 1997-07-22 1999-02-12 Hewlett Packard Co <Hp> 高演色性光源
US6340824B1 (en) * 1997-09-01 2002-01-22 Kabushiki Kaisha Toshiba Semiconductor light emitting device including a fluorescent material
JP3541709B2 (ja) 1998-02-17 2004-07-14 日亜化学工業株式会社 発光ダイオードの形成方法
US6501091B1 (en) * 1998-04-01 2002-12-31 Massachusetts Institute Of Technology Quantum dot white and colored light emitting diodes
US6105200A (en) * 1998-04-21 2000-08-22 Cooper; Byron W. Can top cleaning device
US5959316A (en) 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6798537B1 (en) * 1999-01-27 2004-09-28 The University Of Delaware Digital color halftoning with generalized error diffusion vector green-noise masks
US6575930B1 (en) * 1999-03-12 2003-06-10 Medrad, Inc. Agitation devices and dispensing systems incorporating such agitation devices
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US6538371B1 (en) * 2000-03-27 2003-03-25 The General Electric Company White light illumination system with improved color output
WO2002032231A1 (en) * 2000-10-19 2002-04-25 Edens, Luppo Protein hydrolysates
JP2002270020A (ja) * 2001-03-08 2002-09-20 Casio Comput Co Ltd 光源装置
US6536371B2 (en) * 2001-08-01 2003-03-25 One World Technologies, Inc. Rotary direction indicator
AU2003292085B2 (en) 2002-11-27 2008-01-10 Sap Ag Avoiding data loss when refreshing a data warehouse
KR101173320B1 (ko) * 2003-10-15 2012-08-10 니치아 카가쿠 고교 가부시키가이샤 발광장치
US7318651B2 (en) * 2003-12-18 2008-01-15 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Flash module with quantum dot light conversion
US7083302B2 (en) * 2004-03-24 2006-08-01 J. S. Technology Co., Ltd. White light LED assembly
KR100655894B1 (ko) * 2004-05-06 2006-12-08 서울옵토디바이스주식회사 색온도 및 연색성이 우수한 파장변환 발광장치
US7546032B2 (en) 2004-09-30 2009-06-09 Casio Computer Co., Ltd. Electronic camera having light-emitting unit
JP4679183B2 (ja) * 2005-03-07 2011-04-27 シチズン電子株式会社 発光装置及び照明装置
JP5240959B2 (ja) 2005-11-16 2013-07-17 国立大学法人 香川大学 薬剤とその製造方法
JP4839866B2 (ja) 2006-02-02 2011-12-21 トヨタ自動車株式会社 車両側部構造
KR20090008276A (ko) 2006-03-29 2009-01-21 티티아이 엘뷰 가부시키가이샤 이온토포레시스 장치
JP4717684B2 (ja) 2006-03-30 2011-07-06 富士通テレコムネットワークス株式会社 コンデンサ充電装置
US20080144821A1 (en) 2006-10-26 2008-06-19 Marvell International Ltd. Secure video distribution
KR100930171B1 (ko) 2006-12-05 2009-12-07 삼성전기주식회사 백색 발광장치 및 이를 이용한 백색 광원 모듈
JP5079379B2 (ja) 2007-04-16 2012-11-21 長谷川香料株式会社 二次沈殿が抑制された精製クロロゲン酸類の製法
WO2008143315A1 (ja) 2007-05-22 2008-11-27 Nec San-Ei Instruments, Ltd. データ記録再生装置
US8119028B2 (en) 2007-11-14 2012-02-21 Cree, Inc. Cerium and europium doped single crystal phosphors
JP2010080935A (ja) * 2008-08-28 2010-04-08 Panasonic Corp 半導体発光装置及びこれを用いたバックライト光源、バックライト光源システム、表示装置、電子機器
JP5331584B2 (ja) 2009-06-12 2013-10-30 株式会社フジクラ 圧力センサアレイ、圧力センサアレイパッケージ、並びに圧力センサモジュール及び電子部品
JP5441660B2 (ja) 2009-12-15 2014-03-12 日本特殊陶業株式会社 キャパシタの製造方法及びキャパシタ内蔵配線基板
JP5343885B2 (ja) 2010-02-16 2013-11-13 住友電装株式会社 防水機能付き端子金具及び防水コネクタ
US8974339B2 (en) 2010-11-24 2015-03-10 Toyota Jidosha Kabushiki Kaisha Vehicle power transmission device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093616B2 (en) 2003-09-18 2015-07-28 Cree, Inc. Molded chip fabrication method and apparatus
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same

Also Published As

Publication number Publication date
JP5953514B2 (ja) 2016-07-20
CN1240144C (zh) 2006-02-01
ES2569616T3 (es) 2016-05-11
JP2005317985A (ja) 2005-11-10
BR9715263B1 (pt) 2014-10-14
CN1133218C (zh) 2003-12-31
DK0936682T4 (da) 2007-12-03
SG182008A1 (en) 2012-07-30
ES2569615T3 (es) 2016-05-11
PT2276080E (pt) 2015-10-12
JP2016178320A (ja) 2016-10-06
US20100006819A1 (en) 2010-01-14
DE29724670U1 (de) 2002-09-19
US20110297990A1 (en) 2011-12-08
EP2276080A2 (de) 2011-01-19
EP2194590A2 (de) 2010-06-09
ES2148997T5 (es) 2008-03-01
JP5177317B2 (ja) 2013-04-03
US6614179B1 (en) 2003-09-02
KR100524117B1 (ko) 2005-10-26
HK1066095A1 (en) 2005-03-11
CN100449807C (zh) 2009-01-07
HK1144980A1 (zh) 2011-03-18
JP2016086176A (ja) 2016-05-19
AU3635597A (en) 1998-02-20
DK0936682T3 (da) 2000-10-30
SG115349A1 (en) 2005-10-28
HK1149851A1 (en) 2011-10-14
KR100559346B1 (ko) 2006-03-15
KR20050044817A (ko) 2005-05-12
DK2197055T3 (en) 2016-05-02
EP2276080B1 (de) 2015-07-08
CN100424901C (zh) 2008-10-08
SG182856A1 (en) 2012-08-30
HK1052409A1 (en) 2003-12-12
US20100117516A1 (en) 2010-05-13
US7682848B2 (en) 2010-03-23
CN1495917A (zh) 2004-05-12
EP2197055A2 (de) 2010-06-16
DK1429398T3 (en) 2015-11-30
JP2014209656A (ja) 2014-11-06
US7126274B2 (en) 2006-10-24
EP2197055A3 (de) 2013-01-16
JP2016154247A (ja) 2016-08-25
EP2197053A3 (de) 2013-01-16
HK1066097A1 (en) 2005-03-11
ES2545981T3 (es) 2015-09-17
JP4124248B2 (ja) 2008-07-23
JP2013102196A (ja) 2013-05-23
HK1027668A1 (en) 2001-01-19
US20040000868A1 (en) 2004-01-01
CN100382349C (zh) 2008-04-16
DE29724764U1 (de) 2004-01-08
EP0936682B1 (de) 2000-08-23
JP2014187398A (ja) 2014-10-02
CN1893131A (zh) 2007-01-10
EP1045458A2 (de) 2000-10-18
CA2481364A1 (en) 1998-02-05
US7969090B2 (en) 2011-06-28
CN1249824C (zh) 2006-04-05
BRPI9715264B1 (pt) 2017-05-09
KR20030097609A (ko) 2003-12-31
WO1998005078A1 (en) 1998-02-05
US20070159060A1 (en) 2007-07-12
EP2194590A3 (de) 2013-01-23
CN100424902C (zh) 2008-10-08
CN1893133A (zh) 2007-01-10
JP2014212335A (ja) 2014-11-13
EP1017112A8 (de) 2004-05-12
EP1017112A9 (de) 2004-07-07
PT936682E (pt) 2001-01-31
CA2479842C (en) 2011-08-16
US20100019270A1 (en) 2010-01-28
US7215074B2 (en) 2007-05-08
US7915631B2 (en) 2011-03-29
ES2550823T3 (es) 2015-11-12
JP5725045B2 (ja) 2015-05-27
JP5214253B2 (ja) 2013-06-19
PT1017111E (pt) 2016-01-22
CN1249825C (zh) 2006-04-05
EP2197054A3 (de) 2013-01-16
US8754428B2 (en) 2014-06-17
JP2003179259A (ja) 2003-06-27
US20100001258A1 (en) 2010-01-07
US20080138918A1 (en) 2008-06-12
HK1021073A1 (en) 2000-05-26
CN1893132A (zh) 2007-01-10
US7943941B2 (en) 2011-05-17
SG182857A1 (en) 2012-08-30
PT2197053E (pt) 2015-09-04
EP0936682B2 (de) 2007-08-01
HK1144982A1 (zh) 2011-03-18
CA2262136C (en) 2005-02-22
GR3034493T3 (en) 2000-12-29
EP2194590B1 (de) 2016-04-20
EP0936682A1 (de) 1999-08-18
EP1429397B1 (de) 2017-01-25
JP2008160140A (ja) 2008-07-10
EP1017112A2 (de) 2000-07-05
EP1271664A3 (de) 2004-03-31
ES2576052T3 (es) 2016-07-05
CN1495921A (zh) 2004-05-12
KR100491481B1 (ko) 2005-05-27
BRPI9715363B1 (pt) 2016-12-06
EP1045458A3 (de) 2004-03-31
EP2276080B2 (de) 2022-06-29
EP1017111B1 (de) 2015-10-14
CA2262136A1 (en) 1998-02-05
JP2009135545A (ja) 2009-06-18
US7531960B2 (en) 2009-05-12
KR100549902B1 (ko) 2006-02-06
HK1144979A1 (en) 2011-03-18
DE69702929T4 (de) 2010-10-07
EP1017111A3 (de) 2004-04-14
US8148177B2 (en) 2012-04-03
EP2197053B1 (de) 2015-07-01
HK1052409B (zh) 2015-10-09
BR9710792A (pt) 2000-01-11
HK1066096A1 (en) 2005-03-11
CN1825646A (zh) 2006-08-30
US7329988B2 (en) 2008-02-12
US6069440A (en) 2000-05-30
US20100264842A1 (en) 2010-10-21
DE29724773U1 (de) 2004-02-12
JP2006332692A (ja) 2006-12-07
KR20000029696A (ko) 2000-05-25
US5998925A (en) 1999-12-07
JP2014078746A (ja) 2014-05-01
JP5610056B2 (ja) 2014-10-22
DE29724458U1 (de) 2001-04-26
BR9715365B1 (pt) 2013-09-03
JP5664815B2 (ja) 2015-02-04
JP2002198573A (ja) 2002-07-12
US20090315015A1 (en) 2009-12-24
EP2197056A3 (de) 2013-01-23
US20090315014A1 (en) 2009-12-24
JP2014212336A (ja) 2014-11-13
ATE195831T1 (de) 2000-09-15
DK1017111T3 (en) 2016-01-11
US8679866B2 (en) 2014-03-25
JP5821154B2 (ja) 2015-11-24
US8309375B2 (en) 2012-11-13
EP1429397A3 (de) 2010-09-22
EP1271664B1 (de) 2015-02-18
EP1429397A2 (de) 2004-06-16
JP4530094B2 (ja) 2010-08-25
KR20030097577A (ko) 2003-12-31
US20140084323A1 (en) 2014-03-27
EP2197054B1 (de) 2016-04-20
DE69702929T3 (de) 2008-03-13
CN1495919A (zh) 2004-05-12
CN1253949C (zh) 2006-04-26
PT1429398E (pt) 2015-12-16
US7855092B2 (en) 2010-12-21
DK2194590T3 (en) 2016-06-27
EP1429398B1 (de) 2015-09-23
US20110053299A1 (en) 2011-03-03
SG10201502321UA (en) 2015-05-28
KR20030097578A (ko) 2003-12-31
EP0936682A4 (de) 1999-10-06
US20040090180A1 (en) 2004-05-13
KR100434871B1 (ko) 2004-06-07
ES2576053T3 (es) 2016-07-05
EP2197053A2 (de) 2010-06-16
EP2197057B1 (de) 2016-03-30
EP2276080A3 (de) 2013-01-09
AU720234C (en) 1998-02-20
BR9715362B1 (pt) 2012-12-11
KR100517271B1 (ko) 2005-09-28
DK2197054T3 (en) 2016-06-27
KR100549906B1 (ko) 2006-02-06
BR9715361B1 (pt) 2013-08-27
ES2553570T3 (es) 2015-12-10
CA2479538A1 (en) 1998-02-05
KR20050053800A (ko) 2005-06-10
DE29724642U1 (de) 2002-08-08
CA2479538C (en) 2009-04-14
EP1017112A3 (de) 2004-04-14
EP1017111A2 (de) 2000-07-05
US20100264841A1 (en) 2010-10-21
EP1429398A3 (de) 2010-09-22
EP2197054A2 (de) 2010-06-16
JP2012231190A (ja) 2012-11-22
ES2544690T3 (es) 2015-09-02
JP3503139B2 (ja) 2004-03-02
JP3700502B2 (ja) 2005-09-28
CA2481364C (en) 2008-09-16
DK2197057T3 (en) 2016-04-18
JP6101943B2 (ja) 2017-03-29
CN1495925A (zh) 2004-05-12
DK2276080T3 (en) 2015-09-14
EP2197056A2 (de) 2010-06-16
US20040004437A1 (en) 2004-01-08
US7362048B2 (en) 2008-04-22
US7071616B2 (en) 2006-07-04
CN1268250A (zh) 2000-09-27
BR9710792B1 (pt) 2011-06-28
EP0936682B9 (de) 2007-11-28
AU720234B2 (en) 2000-05-25
US7968866B2 (en) 2011-06-28
HK1144978A1 (zh) 2011-03-18
EP2197057A3 (de) 2013-01-23
MY125748A (en) 2006-08-30
EP1271664A2 (de) 2003-01-02
EP2197057A2 (de) 2010-06-16
EP1429398A2 (de) 2004-06-16
CA2479842A1 (en) 1998-02-05
US20100019224A1 (en) 2010-01-28
US20040222435A1 (en) 2004-11-11
US20090316068A1 (en) 2009-12-24
TWI156177B (en) 2005-01-11
US8685762B2 (en) 2014-04-01
EP2197055B1 (de) 2016-03-30
CN1495920A (zh) 2004-05-12
US20070114914A1 (en) 2007-05-24
HK1030095A1 (en) 2001-04-20
US20050280357A1 (en) 2005-12-22
US9130130B2 (en) 2015-09-08
US8610147B2 (en) 2013-12-17
JP3729166B2 (ja) 2005-12-21
JP5177199B2 (ja) 2013-04-03
TW383508B (en) 2000-03-01
US7901959B2 (en) 2011-03-08
JP2000208815A (ja) 2000-07-28
CN1249823C (zh) 2006-04-05
US20110062864A1 (en) 2011-03-17
JP5692445B2 (ja) 2015-04-01
DK2197053T3 (en) 2015-09-14
US7026756B2 (en) 2006-04-11
CN1249822C (zh) 2006-04-05
CN1495918A (zh) 2004-05-12
DE69702929T2 (de) 2001-02-01
JP2011009793A (ja) 2011-01-13
ES2148997T3 (es) 2000-10-16

Similar Documents

Publication Publication Date Title
DE69702929D1 (de) Licht-emittierende vorrichtung und anzeigevorrichtung
ATE467232T1 (de) Betriebsverfahren für lichtemittierende vorrichtungen
EP1424350A4 (de) Lichtemittierende leuchtstoffverbindung, lichtemittierende leuchtstoffzusammensetzung und organisches lichtemittierendes element
TW200520271A (en) Light-emitting device using light-emitting diode chip

Legal Events

Date Code Title Description
8363 Opposition against the patent
8327 Change in the person/name/address of the patent owner

Owner name: NICHIA CORP., ANAN, TOKUSHIMA, JP

8366 Restricted maintained after opposition proceedings