DE69713108T2 - Schleifvorrichtung zum modifizieren von halbleiterwafer - Google Patents

Schleifvorrichtung zum modifizieren von halbleiterwafer

Info

Publication number
DE69713108T2
DE69713108T2 DE69713108T DE69713108T DE69713108T2 DE 69713108 T2 DE69713108 T2 DE 69713108T2 DE 69713108 T DE69713108 T DE 69713108T DE 69713108 T DE69713108 T DE 69713108T DE 69713108 T2 DE69713108 T2 DE 69713108T2
Authority
DE
Germany
Prior art keywords
grinding device
semiconductor wafers
modifying semiconductor
modifying
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69713108T
Other languages
English (en)
Other versions
DE69713108D1 (de
Inventor
R Rutherford
P Goetz
U Thomas
J Webb
J Bruxvoort
D Buhler
J Hollywood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Exclusive Design Co
Exclusive Design Co Inc
3M Co
Original Assignee
Exclusive Design Co
Exclusive Design Co Inc
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exclusive Design Co, Exclusive Design Co Inc, Minnesota Mining and Manufacturing Co filed Critical Exclusive Design Co
Application granted granted Critical
Publication of DE69713108D1 publication Critical patent/DE69713108D1/de
Publication of DE69713108T2 publication Critical patent/DE69713108T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/001—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
DE69713108T 1996-08-08 1997-08-06 Schleifvorrichtung zum modifizieren von halbleiterwafer Expired - Lifetime DE69713108T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/694,357 US5692950A (en) 1996-08-08 1996-08-08 Abrasive construction for semiconductor wafer modification
PCT/US1997/013047 WO1998006541A1 (en) 1996-08-08 1997-08-06 Abrasive construction for semiconductor wafer modification

Publications (2)

Publication Number Publication Date
DE69713108D1 DE69713108D1 (de) 2002-07-11
DE69713108T2 true DE69713108T2 (de) 2002-12-12

Family

ID=24788493

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69713108T Expired - Lifetime DE69713108T2 (de) 1996-08-08 1997-08-06 Schleifvorrichtung zum modifizieren von halbleiterwafer

Country Status (9)

Country Link
US (2) US5692950A (de)
EP (1) EP0921906B1 (de)
JP (1) JP2001505489A (de)
KR (1) KR100467400B1 (de)
CN (1) CN1068815C (de)
AU (1) AU3893297A (de)
CA (1) CA2262579A1 (de)
DE (1) DE69713108T2 (de)
WO (1) WO1998006541A1 (de)

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US6007407A (en) 1999-12-28
KR20000029865A (ko) 2000-05-25
CN1227519A (zh) 1999-09-01
EP0921906A1 (de) 1999-06-16
CN1068815C (zh) 2001-07-25
JP2001505489A (ja) 2001-04-24
DE69713108D1 (de) 2002-07-11
AU3893297A (en) 1998-03-06
CA2262579A1 (en) 1998-02-19
EP0921906B1 (de) 2002-06-05
WO1998006541A1 (en) 1998-02-19
US5692950A (en) 1997-12-02

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