DE69715715D1 - Streifenleiter mit Luft als Dielektrikum - Google Patents

Streifenleiter mit Luft als Dielektrikum

Info

Publication number
DE69715715D1
DE69715715D1 DE69715715T DE69715715T DE69715715D1 DE 69715715 D1 DE69715715 D1 DE 69715715D1 DE 69715715 T DE69715715 T DE 69715715T DE 69715715 T DE69715715 T DE 69715715T DE 69715715 D1 DE69715715 D1 DE 69715715D1
Authority
DE
Germany
Prior art keywords
stripline
dielectric
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69715715T
Other languages
English (en)
Other versions
DE69715715T2 (de
Inventor
Timothy W Dittmer
George Cabrera
Dale J Doyle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of DE69715715D1 publication Critical patent/DE69715715D1/de
Application granted granted Critical
Publication of DE69715715T2 publication Critical patent/DE69715715T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H01P3/087—Suspended triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
DE69715715T 1996-04-12 1997-03-12 Streifenleiter mit Luft als Dielektrikum Expired - Fee Related DE69715715T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/631,580 US5712607A (en) 1996-04-12 1996-04-12 Air-dielectric stripline

Publications (2)

Publication Number Publication Date
DE69715715D1 true DE69715715D1 (de) 2002-10-31
DE69715715T2 DE69715715T2 (de) 2003-08-14

Family

ID=24531831

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69715715T Expired - Fee Related DE69715715T2 (de) 1996-04-12 1997-03-12 Streifenleiter mit Luft als Dielektrikum

Country Status (5)

Country Link
US (1) US5712607A (de)
EP (1) EP0801433B1 (de)
JP (1) JPH1041710A (de)
CA (1) CA2199655C (de)
DE (1) DE69715715T2 (de)

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US6518844B1 (en) * 2000-04-13 2003-02-11 Raytheon Company Suspended transmission line with embedded amplifier
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KR100654703B1 (ko) 2004-08-09 2006-12-06 주식회사 극동통신 하니콤 에어스트립라인의 지지구조
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US7276989B2 (en) * 2005-06-02 2007-10-02 Raytheon Company Attenuator circuit comprising a plurality of quarter wave transformers and lump element resistors
TWI364399B (en) * 2006-12-30 2012-05-21 Rohm & Haas Elect Mat Three-dimensional microstructures and methods of formation thereof
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KR100987191B1 (ko) * 2008-04-18 2010-10-11 (주)기가레인 신호전송라인 주위의 본딩 시트를 제거한 인쇄회로기판
US8659371B2 (en) * 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
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US8164397B2 (en) * 2009-08-17 2012-04-24 International Business Machines Corporation Method, structure, and design structure for an impedance-optimized microstrip transmission line for multi-band and ultra-wide band applications
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US8264848B2 (en) * 2009-10-30 2012-09-11 Research In Motion Limited Electrical assembly having impedance controlled signal traces
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
KR101796098B1 (ko) 2010-01-22 2017-11-10 누보트로닉스, 인크. 열관리
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
CN102378501B (zh) * 2010-07-13 2013-06-26 富葵精密组件(深圳)有限公司 电路板制作方法
JP5666270B2 (ja) * 2010-11-29 2015-02-12 株式会社ヨコオ 信号伝送媒体、高周波信号伝送媒体
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
KR101982887B1 (ko) 2011-07-13 2019-05-27 누보트로닉스, 인크. 전자 및 기계 구조체들을 제조하는 방법들
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
JP6285638B2 (ja) * 2013-04-25 2018-02-28 日本メクトロン株式会社 プリント配線板およびプリント配線板製造方法
JP6535347B2 (ja) 2014-01-17 2019-06-26 ヌボトロニクス、インク． ウエハースケールのテスト・インターフェース・ユニット：高速および高密度の混合信号インターコネクトおよびコンタクタのための低損失および高絶縁性の装置および方法
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
EP3224899A4 (de) 2014-12-03 2018-08-22 Nuvotronics, Inc. Systeme und verfahren zur herstellung von gestapelten schaltungen und übertragungsleitungen
CN105792501B (zh) * 2014-12-23 2018-10-30 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法
CN208608339U (zh) * 2016-01-27 2019-03-15 株式会社村田制作所 信号传输线路
US10347961B2 (en) * 2016-10-26 2019-07-09 Raytheon Company Radio frequency interconnect systems and methods
US9883578B1 (en) 2016-12-21 2018-01-30 Deere & Company Cooling conductive trace with pressurized air or gas
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
KR101938105B1 (ko) * 2018-01-25 2019-01-14 주식회사 기가레인 접합 위치 정확성이 개선된 연성회로기판
US10257921B1 (en) 2018-04-12 2019-04-09 Google Llc Embedded air gap transmission lines
CN108511858B (zh) * 2018-04-13 2020-04-14 京东方科技集团股份有限公司 一种液晶移相器以及电子设备
CN108633167A (zh) * 2018-05-28 2018-10-09 维沃移动通信有限公司 一种电路板、信号传输线及其制作方法
US11043727B2 (en) 2019-01-15 2021-06-22 Raytheon Company Substrate integrated waveguide monopulse and antenna system
CN111755806A (zh) * 2019-03-29 2020-10-09 康普技术有限责任公司 用于天线的辐射器和基站天线
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CN113747654B (zh) * 2020-05-27 2023-08-04 宏启胜精密电子(秦皇岛)有限公司 柔性电路板及其制作方法
CN112105150B (zh) * 2020-11-04 2021-08-13 生益电子股份有限公司 一种内埋空腔的制作方法及pcb
CN112261802B (zh) * 2020-11-04 2021-08-13 生益电子股份有限公司 一种内埋空腔的制作方法及pcb
WO2022113618A1 (ja) * 2020-11-30 2022-06-02 株式会社村田製作所 伝送線路及び電子機器
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Also Published As

Publication number Publication date
EP0801433A1 (de) 1997-10-15
EP0801433B1 (de) 2002-09-25
JPH1041710A (ja) 1998-02-13
CA2199655C (en) 2005-01-25
CA2199655A1 (en) 1997-10-12
DE69715715T2 (de) 2003-08-14
US5712607A (en) 1998-01-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee