DE69715952T2 - Poliervorrichtung - Google Patents
PoliervorrichtungInfo
- Publication number
- DE69715952T2 DE69715952T2 DE69715952T DE69715952T DE69715952T2 DE 69715952 T2 DE69715952 T2 DE 69715952T2 DE 69715952 T DE69715952 T DE 69715952T DE 69715952 T DE69715952 T DE 69715952T DE 69715952 T2 DE69715952 T2 DE 69715952T2
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13098796A JPH09295262A (ja) | 1996-04-26 | 1996-04-26 | ポリッシング装置 |
JP15760896A JPH09320997A (ja) | 1996-05-28 | 1996-05-28 | ポリッシング装置と洗浄装置の配管構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69715952D1 DE69715952D1 (de) | 2002-11-07 |
DE69715952T2 true DE69715952T2 (de) | 2003-08-07 |
Family
ID=26465955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69715952T Expired - Fee Related DE69715952T2 (de) | 1996-04-26 | 1997-04-25 | Poliervorrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US6227954B1 (de) |
EP (1) | EP0803326B1 (de) |
KR (1) | KR100415406B1 (de) |
DE (1) | DE69715952T2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3770752B2 (ja) | 1998-08-11 | 2006-04-26 | 株式会社日立製作所 | 半導体装置の製造方法及び加工装置 |
US6409580B1 (en) * | 2001-03-26 | 2002-06-25 | Speedfam-Ipec Corporation | Rigid polishing pad conditioner for chemical mechanical polishing tool |
US9245783B2 (en) | 2013-05-24 | 2016-01-26 | Novellus Systems, Inc. | Vacuum robot with linear translation carriage |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63207559A (ja) | 1987-02-19 | 1988-08-26 | Disco Abrasive Syst Ltd | ウエ−ハ自動研削装置 |
US5036625A (en) * | 1988-12-07 | 1991-08-06 | Anatoly Gosis | Lapping plate for a lapping and polishing machine |
JPH0615565A (ja) * | 1991-12-18 | 1994-01-25 | Shin Etsu Handotai Co Ltd | ウエーハ自動ラッピング装置 |
US5733171A (en) * | 1996-07-18 | 1998-03-31 | Speedfam Corporation | Apparatus for the in-process detection of workpieces in a CMP environment |
US5679059A (en) | 1994-11-29 | 1997-10-21 | Ebara Corporation | Polishing aparatus and method |
KR100390293B1 (ko) | 1993-09-21 | 2003-09-02 | 가부시끼가이샤 도시바 | 폴리싱장치 |
JP3326642B2 (ja) * | 1993-11-09 | 2002-09-24 | ソニー株式会社 | 基板の研磨後処理方法およびこれに用いる研磨装置 |
US5679060A (en) * | 1994-07-14 | 1997-10-21 | Silicon Technology Corporation | Wafer grinding machine |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
US5679055A (en) * | 1996-05-31 | 1997-10-21 | Memc Electronic Materials, Inc. | Automated wafer lapping system |
-
1997
- 1997-04-25 DE DE69715952T patent/DE69715952T2/de not_active Expired - Fee Related
- 1997-04-25 KR KR1019970015480A patent/KR100415406B1/ko not_active IP Right Cessation
- 1997-04-25 EP EP97106937A patent/EP0803326B1/de not_active Expired - Lifetime
- 1997-04-25 US US08/845,423 patent/US6227954B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6227954B1 (en) | 2001-05-08 |
DE69715952D1 (de) | 2002-11-07 |
KR970077251A (ko) | 1997-12-12 |
EP0803326A2 (de) | 1997-10-29 |
EP0803326B1 (de) | 2002-10-02 |
EP0803326A3 (de) | 1998-04-15 |
KR100415406B1 (ko) | 2004-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69712658D1 (de) | Poliergerät | |
DE69709461D1 (de) | Poliermaschine | |
DE69630495D1 (de) | Poliergerät | |
ATE208395T1 (de) | Thiophenopyrimidine | |
DE69732808D1 (de) | Schleifvorrichtung | |
ATE262512T1 (de) | Arylalkanoylpyridazine | |
ID19474A (id) | Turunan tiazola | |
ATE208773T1 (de) | Chinoxalindione | |
ID18095A (id) | Turunan tetrahidrokinolin | |
DE69722537D1 (de) | Poliervorrichtung | |
DE69711254D1 (de) | Poliermaschine | |
DE69815952D1 (de) | Poliergerät | |
DE69816146D1 (de) | Poliervorrichtung | |
ATE353652T1 (de) | Östroprogestatives antikonzeptionsmittel | |
DE69838161D1 (de) | Poliervorrichtung | |
DE69525607D1 (de) | Poliervorrichtung | |
DE69715952T2 (de) | Poliervorrichtung | |
KR970012124U (ko) | 광택용 폴리셔 | |
DE29613245U1 (de) | Mahlvorrichtung | |
DE29617220U1 (de) | Handschleifmaschine | |
DE29614396U1 (de) | Bürste | |
KR950026911U (ko) | 광택기 | |
FI962571A (fi) | Hiomalaite | |
KR970053650U (ko) | 분쇄기 | |
BR7600100U (pt) | Curativo auto-suturante |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: EBARA CORP., TOKIO/TOKYO, JP |
|
8339 | Ceased/non-payment of the annual fee |