DE69722542D1 - Verbesserungen an oder in Bezug auf Halbleiteranordnungen - Google Patents

Verbesserungen an oder in Bezug auf Halbleiteranordnungen

Info

Publication number
DE69722542D1
DE69722542D1 DE69722542T DE69722542T DE69722542D1 DE 69722542 D1 DE69722542 D1 DE 69722542D1 DE 69722542 T DE69722542 T DE 69722542T DE 69722542 T DE69722542 T DE 69722542T DE 69722542 D1 DE69722542 D1 DE 69722542D1
Authority
DE
Germany
Prior art keywords
relation
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69722542T
Other languages
English (en)
Other versions
DE69722542T2 (de
Inventor
Monte A Douglas
Allen C Templeton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69722542D1 publication Critical patent/DE69722542D1/de
Application granted granted Critical
Publication of DE69722542T2 publication Critical patent/DE69722542T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D2111/22—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/902—Capping layer
DE69722542T 1996-07-25 1997-07-25 Verbesserungen an oder in Bezug auf Halbleiteranordnungen Expired - Lifetime DE69722542T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2281196P 1996-07-25 1996-07-25
US22811P 1996-07-25

Publications (2)

Publication Number Publication Date
DE69722542D1 true DE69722542D1 (de) 2003-07-10
DE69722542T2 DE69722542T2 (de) 2004-05-13

Family

ID=21811559

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69722542T Expired - Lifetime DE69722542T2 (de) 1996-07-25 1997-07-25 Verbesserungen an oder in Bezug auf Halbleiteranordnungen

Country Status (6)

Country Link
US (1) US5868856A (de)
EP (1) EP0829312B1 (de)
JP (1) JPH1099806A (de)
KR (1) KR100478865B1 (de)
DE (1) DE69722542T2 (de)
TW (1) TW399226B (de)

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US20040175948A1 (en) * 2002-10-10 2004-09-09 The University Of North Carolina At Chapel Hill Metal chelation in carbon dioxide
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US20040112409A1 (en) * 2002-12-16 2004-06-17 Supercritical Sysems, Inc. Fluoride in supercritical fluid for photoresist and residue removal
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US6875709B2 (en) * 2003-03-07 2005-04-05 Taiwan Semiconductor Manufacturing Comapny, Ltd. Application of a supercritical CO2 system for curing low k dielectric materials
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Also Published As

Publication number Publication date
EP0829312B1 (de) 2003-06-04
EP0829312A2 (de) 1998-03-18
KR100478865B1 (ko) 2005-05-16
US5868856A (en) 1999-02-09
TW399226B (en) 2000-07-21
KR980012049A (ko) 1998-04-30
DE69722542T2 (de) 2004-05-13
JPH1099806A (ja) 1998-04-21
EP0829312A3 (de) 1999-09-15

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