DE69724083D1 - REINIGUNGSGERäT FüR HALBLEITERSCHEIBEN - Google Patents

REINIGUNGSGERäT FüR HALBLEITERSCHEIBEN

Info

Publication number
DE69724083D1
DE69724083D1 DE69724083T DE69724083T DE69724083D1 DE 69724083 D1 DE69724083 D1 DE 69724083D1 DE 69724083 T DE69724083 T DE 69724083T DE 69724083 T DE69724083 T DE 69724083T DE 69724083 D1 DE69724083 D1 DE 69724083D1
Authority
DE
Germany
Prior art keywords
disk
cleaning device
brushes
rotational speed
semiconductor disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69724083T
Other languages
English (en)
Other versions
DE69724083T2 (de
Inventor
Herman Itzkowitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solid State Equipment Corp
Original Assignee
Solid State Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solid State Equipment Corp filed Critical Solid State Equipment Corp
Publication of DE69724083D1 publication Critical patent/DE69724083D1/de
Application granted granted Critical
Publication of DE69724083T2 publication Critical patent/DE69724083T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B08B1/32—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
    • G11B23/50—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges
    • G11B23/505—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges of disk carriers
DE69724083T 1996-06-14 1997-02-28 REINIGUNGSGERäT FüR HALBLEITERSCHEIBEN Expired - Fee Related DE69724083T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/665,157 US5675856A (en) 1996-06-14 1996-06-14 Wafer scrubbing device
US665157 1996-06-14
PCT/US1997/003215 WO1997047406A1 (en) 1996-06-14 1997-02-28 Wafer scrubbing device

Publications (2)

Publication Number Publication Date
DE69724083D1 true DE69724083D1 (de) 2003-09-18
DE69724083T2 DE69724083T2 (de) 2004-06-17

Family

ID=24668964

Family Applications (2)

Application Number Title Priority Date Filing Date
DE0847311T Pending DE847311T1 (de) 1996-06-14 1997-02-28 REINIGUNGSGERäT FüR HALBLEITERSCHEIBEN
DE69724083T Expired - Fee Related DE69724083T2 (de) 1996-06-14 1997-02-28 REINIGUNGSGERäT FüR HALBLEITERSCHEIBEN

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE0847311T Pending DE847311T1 (de) 1996-06-14 1997-02-28 REINIGUNGSGERäT FüR HALBLEITERSCHEIBEN

Country Status (9)

Country Link
US (2) US5675856A (de)
EP (1) EP0847311B1 (de)
JP (1) JP3065106B2 (de)
KR (1) KR100278425B1 (de)
AT (1) ATE246969T1 (de)
AU (1) AU1982397A (de)
CA (1) CA2223488A1 (de)
DE (2) DE847311T1 (de)
WO (1) WO1997047406A1 (de)

Cited By (1)

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CN105327924A (zh) * 2015-12-16 2016-02-17 广西玉柴机器股份有限公司 清洗海德汉lc181光栅尺专用工具

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DE69737926T2 (de) * 1996-10-21 2008-04-10 Ebara Corp. Reinigungsvorrichtung
JP3540524B2 (ja) * 1996-10-28 2004-07-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP3403108B2 (ja) * 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
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JP3290910B2 (ja) * 1997-02-19 2002-06-10 東京エレクトロン株式会社 洗浄装置
US6079073A (en) * 1997-04-01 2000-06-27 Ebara Corporation Washing installation including plural washers
JPH10314684A (ja) * 1997-05-21 1998-12-02 Speedfam Co Ltd ディスク形ワークの洗浄方法及び装置
US6059888A (en) * 1997-11-14 2000-05-09 Creative Design Corporation Wafer cleaning system
US6076217A (en) 1998-04-06 2000-06-20 Micron Technology, Inc. Brush alignment platform
TW412817B (en) 1998-06-19 2000-11-21 Matsushita Electric Ind Co Ltd A bump bonding apparatus and method
US6247197B1 (en) * 1998-07-09 2001-06-19 Lam Research Corporation Brush interflow distributor
US6299698B1 (en) 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
US6202658B1 (en) 1998-11-11 2001-03-20 Applied Materials, Inc. Method and apparatus for cleaning the edge of a thin disc
US6368183B1 (en) 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
US6290780B1 (en) * 1999-03-19 2001-09-18 Lam Research Corporation Method and apparatus for processing a wafer
US6352595B1 (en) 1999-05-28 2002-03-05 Lam Research Corporation Method and system for cleaning a chemical mechanical polishing pad
US6711775B2 (en) * 1999-06-10 2004-03-30 Lam Research Corporation System for cleaning a semiconductor wafer
KR100749709B1 (ko) * 1999-06-10 2007-08-16 램 리써치 코포레이션 반도체 웨이퍼를 세정하기 위한 방법 및 시스템
US6405399B1 (en) 1999-06-25 2002-06-18 Lam Research Corporation Method and system of cleaning a wafer after chemical mechanical polishing or plasma processing
US6718363B1 (en) * 1999-07-30 2004-04-06 Verizon Laboratories, Inc. Page aggregation for web sites
EP1077474A3 (de) * 1999-08-14 2004-05-12 Applied Materials, Inc. Rückseite ätzen in einem Schrubber
JP2001212533A (ja) * 2000-02-03 2001-08-07 Dainippon Printing Co Ltd 基板端面の洗浄装置
US6438781B1 (en) 2000-04-21 2002-08-27 Toda Citron Technologies, Inc. Washer for cleaning substrates
US6800020B1 (en) 2000-10-02 2004-10-05 Lam Research Corporation Web-style pad conditioning system and methods for implementing the same
US6818604B2 (en) 2001-10-04 2004-11-16 Speedfam-Ipec Corporation System and method for cleaning workpieces
US6951044B2 (en) 2002-02-09 2005-10-04 Kaim Wayne K Paper cleaning buff
US20050056303A1 (en) * 2003-09-16 2005-03-17 Wei-Ming Lee Oblique burnish/wipe mechanism for hard drive disk like media
US7231682B1 (en) * 2003-08-28 2007-06-19 Lam Research Corporation Method and apparatus for simultaneously cleaning the front side and back side of a wafer
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
US20050252547A1 (en) * 2004-05-11 2005-11-17 Applied Materials, Inc. Methods and apparatus for liquid chemical delivery
WO2009014587A1 (en) * 2004-12-03 2009-01-29 Solid State Equiptment Corp. Wet etching of the edge and bevel of a silicon wafer
WO2007016689A1 (en) * 2005-08-02 2007-02-08 New Way Machine Components, Inc. Method and apparatus for in-line processing and immediately sequential or simultaneous processing of flat and flexible substrates through viscous shear in thin cross section gaps for the manufacture of micro-electronic circuits or displays
DE102005041643A1 (de) * 2005-08-29 2007-03-01 Forschungsverbund Berlin E.V. Halbleitersubstrat sowie Verfahren und Maskenschicht zur Herstellung eines freistehenden Halbleitersubstrats mittels der Hydrid-Gasphasenepitaxie
US20070095367A1 (en) * 2005-10-28 2007-05-03 Yaxin Wang Apparatus and method for atomic layer cleaning and polishing
DE102006031628A1 (de) * 2006-07-06 2008-01-10 Clearaudio Electronic Gmbh Reinigungsvorrichtung zum Reinigen plattenartiger Informations- oder Datenträger
US20080156360A1 (en) * 2006-12-26 2008-07-03 Applied Materials, Inc. Horizontal megasonic module for cleaning substrates
MY150875A (en) * 2007-04-20 2014-03-14 Invenpro M Sdn Bhd Apparatus and method for cleaning substrates/media disks
KR100901239B1 (ko) * 2008-03-31 2009-06-08 신진유지보수 주식회사 상수관 터널 갱생 자동화장치용 고정장치
TWI426579B (zh) 2010-02-01 2014-02-11 Hermes Epitek Corp 半導體設備及其清潔方法
JP5775383B2 (ja) * 2011-06-30 2015-09-09 株式会社荏原製作所 基板洗浄方法
US9190881B1 (en) 2011-08-02 2015-11-17 Tooltek Engineering Corporation Rotary-powered mechanical oscillator
KR101909476B1 (ko) * 2011-08-17 2018-10-18 세메스 주식회사 브러시 유닛 및 이를 가지는 기판처리장치.
US8778087B2 (en) * 2012-04-03 2014-07-15 Illinois Tool Works Inc. Conical sponge brush for cleaning semiconductor wafers
DE102012017458A1 (de) * 2012-09-04 2014-03-06 Reitel Feinwerktechnik Gmbh Reinigungsvorrichtung
US20150087208A1 (en) * 2013-09-26 2015-03-26 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for manufacturing a semiconductor wafer
JP1556809S (de) * 2015-09-24 2016-08-22
USD800401S1 (en) * 2015-09-24 2017-10-17 Ebara Corporation Roller for substrate cleaning
US10269555B2 (en) 2015-09-30 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Post-CMP cleaning and apparatus
JP7232615B2 (ja) * 2017-12-13 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
US11139182B2 (en) 2017-12-13 2021-10-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR102573572B1 (ko) * 2017-12-20 2023-09-01 삼성전자주식회사 웨이퍼 세정 장치
CN111632168B (zh) * 2020-06-10 2021-01-05 青岛市黄岛区中心医院 一种用于医疗手术钳的旋转循环式消毒机

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JPS60143634A (ja) * 1983-12-29 1985-07-29 Fujitsu Ltd ウエ−ハ処理方法及び装置
US4556433A (en) * 1984-04-16 1985-12-03 Allsop, Inc. Apparatus and method for cleaning digital audio discs
US4654917A (en) * 1985-06-17 1987-04-07 Recoton Corporation Compact disc cleaner
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US4631773A (en) * 1985-10-21 1986-12-30 Essex Group, Inc. Apparatus for removing fines from copper wires
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JPS63239953A (ja) * 1987-03-27 1988-10-05 Nec Corp 半導体ウエハ−の洗浄装置
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EP0640969B1 (de) * 1993-08-31 1999-10-27 Kabushiki Kaisha Shoyo Seiki Reinigungsgerät

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105327924A (zh) * 2015-12-16 2016-02-17 广西玉柴机器股份有限公司 清洗海德汉lc181光栅尺专用工具

Also Published As

Publication number Publication date
US5675856A (en) 1997-10-14
EP0847311A4 (de) 2000-09-13
EP0847311A1 (de) 1998-06-17
USRE36767E (en) 2000-07-11
JP3065106B2 (ja) 2000-07-12
DE69724083T2 (de) 2004-06-17
EP0847311B1 (de) 2003-08-13
KR100278425B1 (ko) 2001-01-15
DE847311T1 (de) 1999-04-22
CA2223488A1 (en) 1997-12-18
ATE246969T1 (de) 2003-08-15
JPH10510473A (ja) 1998-10-13
KR19990036434A (ko) 1999-05-25
WO1997047406A1 (en) 1997-12-18
AU1982397A (en) 1998-01-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee