DE69725678D1 - Verwendungsmethode eines permanenten z-Achse-Materials - Google Patents
Verwendungsmethode eines permanenten z-Achse-MaterialsInfo
- Publication number
- DE69725678D1 DE69725678D1 DE69725678T DE69725678T DE69725678D1 DE 69725678 D1 DE69725678 D1 DE 69725678D1 DE 69725678 T DE69725678 T DE 69725678T DE 69725678 T DE69725678 T DE 69725678T DE 69725678 D1 DE69725678 D1 DE 69725678D1
- Authority
- DE
- Germany
- Prior art keywords
- permanent
- axis material
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/748,112 US5966593A (en) | 1996-11-08 | 1996-11-08 | Method of forming a wafer level contact sheet having a permanent z-axis material |
US748112 | 1996-11-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69725678D1 true DE69725678D1 (de) | 2003-11-27 |
DE69725678T2 DE69725678T2 (de) | 2004-07-22 |
Family
ID=25008076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69725678T Expired - Lifetime DE69725678T2 (de) | 1996-11-08 | 1997-11-05 | Verwendungsmethode eines permanenten z-Achse-Materials |
Country Status (6)
Country | Link |
---|---|
US (1) | US5966593A (de) |
EP (1) | EP0841697B1 (de) |
JP (1) | JPH10247707A (de) |
KR (1) | KR19980042136A (de) |
DE (1) | DE69725678T2 (de) |
ES (1) | ES2207708T3 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6114795A (en) * | 1997-06-24 | 2000-09-05 | Tdk Corporation | Piezoelectric component and manufacturing method thereof |
US6657313B1 (en) * | 1999-01-19 | 2003-12-02 | International Business Machines Corporation | Dielectric interposer for chip to substrate soldering |
JP3980801B2 (ja) | 1999-09-16 | 2007-09-26 | 株式会社東芝 | 三次元構造体およびその製造方法 |
US6434817B1 (en) * | 1999-12-03 | 2002-08-20 | Delphi Technologies, Inc. | Method for joining an integrated circuit |
US6531945B1 (en) * | 2000-03-10 | 2003-03-11 | Micron Technology, Inc. | Integrated circuit inductor with a magnetic core |
DE60030963D1 (de) * | 2000-06-06 | 2006-11-09 | St Microelectronics Srl | Elektronischer Halbleiterbaustein mit Wärmeverteiler |
WO2002015255A1 (en) * | 2000-08-11 | 2002-02-21 | Chem Trace Corporation | System and method for cleaning semiconductor fabrication equipment parts |
US6756797B2 (en) * | 2001-01-31 | 2004-06-29 | Wentworth Laboratories Inc. | Planarizing interposer for thermal compensation of a probe card |
JP2002353160A (ja) * | 2001-05-28 | 2002-12-06 | Murata Mfg Co Ltd | 回路基板及びその製造方法 |
US7045072B2 (en) * | 2003-07-24 | 2006-05-16 | Tan Samantha S H | Cleaning process and apparatus for silicate materials |
US7091132B2 (en) * | 2003-07-24 | 2006-08-15 | Applied Materials, Inc. | Ultrasonic assisted etch using corrosive liquids |
US6971081B2 (en) * | 2003-09-26 | 2005-11-29 | Lsi Logic Corporation | Routing for reducing impedance distortions |
US7754609B1 (en) | 2003-10-28 | 2010-07-13 | Applied Materials, Inc. | Cleaning processes for silicon carbide materials |
US8323675B2 (en) | 2004-04-20 | 2012-12-04 | Genzyme Corporation | Soft tissue prosthesis for repairing a defect of an abdominal wall or a pelvic cavity wall |
US7304490B2 (en) * | 2004-11-05 | 2007-12-04 | Solid State Measurements, Inc. | In-situ wafer and probe desorption using closed loop heating |
TWI261325B (en) * | 2005-03-25 | 2006-09-01 | Advanced Semiconductor Eng | Package structure of semiconductor and wafer-level formation thereof |
US8107777B2 (en) * | 2005-11-02 | 2012-01-31 | John Farah | Polyimide substrate bonded to other substrate |
JP5156752B2 (ja) * | 2006-11-01 | 2013-03-06 | クアンタム グローバル テクノロジーズ リミテッド ライアビリティ カンパニー | チャンバーコンポーネントを洗浄する方法及び装置 |
US9610758B2 (en) * | 2007-06-21 | 2017-04-04 | General Electric Company | Method of making demountable interconnect structure |
US9953910B2 (en) * | 2007-06-21 | 2018-04-24 | General Electric Company | Demountable interconnect structure |
TWI411073B (zh) * | 2010-08-13 | 2013-10-01 | Unimicron Technology Corp | 嵌埋被動元件之封裝基板及其製法 |
DE102012109228A1 (de) * | 2012-09-28 | 2014-04-03 | Osram Opto Semiconductors Gmbh | Verfahren zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; Vorrichtung zum Ermitteln der Permeabilität einer dielektrischen Schicht eines optoelektronischen Bauelementes; optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US26837A (en) * | 1860-01-17 | craig | ||
NL135260B (de) | 1963-08-16 | 1900-01-01 | ||
US3609547A (en) * | 1970-03-27 | 1971-09-28 | Eugene A Slusser | Integrated circuit test system |
CA962021A (en) * | 1970-05-21 | 1975-02-04 | Robert W. Gore | Porous products and process therefor |
FR2114169A6 (de) * | 1970-11-18 | 1972-06-30 | Honeywell Bull | |
CA1063730A (en) * | 1975-11-11 | 1979-10-02 | Robert F. Cobaugh | Printed circuit board assembly |
US4540229A (en) * | 1982-04-12 | 1985-09-10 | At&T Bell Laboratories | Electrical interconnection apparatus |
US4482516A (en) * | 1982-09-10 | 1984-11-13 | W. L. Gore & Associates, Inc. | Process for producing a high strength porous polytetrafluoroethylene product having a coarse microstructure |
US5007841A (en) * | 1983-05-31 | 1991-04-16 | Trw Inc. | Integrated-circuit chip interconnection system |
DE3375248D1 (en) * | 1983-07-11 | 1988-02-11 | Toshiba Chem Corp | Conductive synthetic resin molding material |
EP0151490B1 (de) * | 1984-02-09 | 1991-01-16 | Toyota Jidosha Kabushiki Kaisha | Verfahren zur Herstellung von ultrafeinen Keramikpartikeln |
US4683550A (en) * | 1984-07-30 | 1987-07-28 | Burr-Brown Corporation | Personal computer instrumentation system including carrier board having bus-oriented plug-in instrumentation modules |
DE3586893D1 (de) * | 1984-12-28 | 1993-01-21 | Micro Co Ltd | Stapelverfahren fuer gedruckte schaltungen. |
US4840570A (en) * | 1988-06-27 | 1989-06-20 | Teknekron Infoswitch Corporation | Plug-in card module |
US5440240A (en) * | 1991-06-04 | 1995-08-08 | Micron Technology, Inc. | Z-axis interconnect for discrete die burn-in for nonpackaged die |
US4985296A (en) * | 1989-03-16 | 1991-01-15 | W. L. Gore & Associates, Inc. | Polytetrafluoroethylene film |
US4963225A (en) * | 1989-10-20 | 1990-10-16 | Tektronix, Inc. | Method of fabricating a contact device |
US4968931A (en) * | 1989-11-03 | 1990-11-06 | Motorola, Inc. | Apparatus and method for burning in integrated circuit wafers |
US5007163A (en) * | 1990-04-18 | 1991-04-16 | International Business Machines Corporation | Non-destructure method of performing electrical burn-in testing of semiconductor chips |
EP0526133B1 (de) * | 1991-07-26 | 1997-03-19 | Nec Corporation | Mehrschichtige Leiterplatte aus Polyimid und Verfahren zur Herstellung |
US5252857A (en) * | 1991-08-05 | 1993-10-12 | International Business Machines Corporation | Stacked DCA memory chips |
US5541524A (en) * | 1991-08-23 | 1996-07-30 | Nchip, Inc. | Burn-in technologies for unpackaged integrated circuits |
KR100288344B1 (ko) * | 1991-09-17 | 2001-11-30 | 마쯔모또 에이찌 | 프린트배선판용검사전극유니트와그것을포함하는검사장치및프린트배선판용의검사방법 |
US5279975A (en) * | 1992-02-07 | 1994-01-18 | Micron Technology, Inc. | Method of testing individual dies on semiconductor wafers prior to singulation |
US5245750A (en) * | 1992-02-28 | 1993-09-21 | Hughes Aircraft Company | Method of connecting a spaced ic chip to a conductor and the article thereby obtained |
US5306546A (en) * | 1992-12-22 | 1994-04-26 | Hughes Aircraft Company | Multi chip module substrate |
JPH06325810A (ja) * | 1993-03-08 | 1994-11-25 | Whitaker Corp:The | コンタクトモジュール及びそれを使用するピングリッドアレイ |
FR2703839B1 (fr) * | 1993-04-09 | 1995-07-07 | Framatome Connectors France | Connecteur intermédiaire entre carte de circuit imprimé et substrat à circuits électroniques. |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
US5531942A (en) * | 1994-06-16 | 1996-07-02 | Fry's Metals, Inc. | Method of making electroconductive adhesive particles for Z-axis application |
US5498467A (en) * | 1994-07-26 | 1996-03-12 | W. L. Gore & Associates, Inc. | Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom |
US5637834A (en) * | 1995-02-03 | 1997-06-10 | Motorola, Inc. | Multilayer circuit substrate and method for forming same |
US5602491A (en) * | 1995-03-16 | 1997-02-11 | Motorola, Inc. | Integrated circuit testing board having constrained thermal expansion characteristics |
US5766979A (en) * | 1996-11-08 | 1998-06-16 | W. L. Gore & Associates, Inc. | Wafer level contact sheet and method of assembly |
-
1996
- 1996-11-08 US US08/748,112 patent/US5966593A/en not_active Expired - Lifetime
-
1997
- 1997-11-05 ES ES97308873T patent/ES2207708T3/es not_active Expired - Lifetime
- 1997-11-05 DE DE69725678T patent/DE69725678T2/de not_active Expired - Lifetime
- 1997-11-05 EP EP97308873A patent/EP0841697B1/de not_active Expired - Lifetime
- 1997-11-06 KR KR1019970058292A patent/KR19980042136A/ko active IP Right Grant
- 1997-11-10 JP JP9323808A patent/JPH10247707A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0841697A2 (de) | 1998-05-13 |
EP0841697A3 (de) | 1998-05-20 |
DE69725678T2 (de) | 2004-07-22 |
EP0841697B1 (de) | 2003-10-22 |
US5966593A (en) | 1999-10-12 |
JPH10247707A (ja) | 1998-09-14 |
KR19980042136A (ko) | 1998-08-17 |
ES2207708T3 (es) | 2004-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |