DE69727001D1 - Verfahren zur Herstellung eines Sensors - Google Patents

Verfahren zur Herstellung eines Sensors

Info

Publication number
DE69727001D1
DE69727001D1 DE69727001T DE69727001T DE69727001D1 DE 69727001 D1 DE69727001 D1 DE 69727001D1 DE 69727001 T DE69727001 T DE 69727001T DE 69727001 T DE69727001 T DE 69727001T DE 69727001 D1 DE69727001 D1 DE 69727001D1
Authority
DE
Germany
Prior art keywords
sensor
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69727001T
Other languages
English (en)
Other versions
DE69727001T2 (de
Inventor
Henry G Hughes
Marilyn J Stuckey
Margaret L Kniffin
Ping-Chang Lue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of DE69727001D1 publication Critical patent/DE69727001D1/de
Publication of DE69727001T2 publication Critical patent/DE69727001T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004Gaseous mixtures, e.g. polluted air
    • G01N33/0009General constructional details of gas analysers, e.g. portable test equipment
    • G01N33/0011Sample conditioning
    • G01N33/0014Sample conditioning by eliminating a gas
DE69727001T 1996-03-25 1997-03-19 Verfahren zur Herstellung eines Sensors Expired - Lifetime DE69727001T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US620729 1996-03-25
US08/620,729 US5798556A (en) 1996-03-25 1996-03-25 Sensor and method of fabrication

Publications (2)

Publication Number Publication Date
DE69727001D1 true DE69727001D1 (de) 2004-02-05
DE69727001T2 DE69727001T2 (de) 2004-11-11

Family

ID=24487150

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69727001T Expired - Lifetime DE69727001T2 (de) 1996-03-25 1997-03-19 Verfahren zur Herstellung eines Sensors

Country Status (3)

Country Link
US (2) US5798556A (de)
EP (1) EP0798554B1 (de)
DE (1) DE69727001T2 (de)

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US9126165B1 (en) 2002-04-24 2015-09-08 The University Of North Carolina At Greensboro Nucleic acid arrays to monitor water and other ecosystems
US8048623B1 (en) 2002-04-24 2011-11-01 The University Of North Carolina At Greensboro Compositions, products, methods and systems to monitor water and other ecosystems
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US20050147489A1 (en) * 2003-12-24 2005-07-07 Tian-An Chen Wafer supporting system for semiconductor wafers
CN1938588B (zh) * 2004-01-27 2011-11-09 H2Scan公司 隔离的气体传感器结构
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DE102005016751B3 (de) * 2005-04-11 2006-12-14 Schott Ag Verfahren zur Herstellung gehäuster elektronischer Bauelemente
US7893697B2 (en) 2006-02-21 2011-02-22 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
JP2009527764A (ja) 2006-02-21 2009-07-30 サイバーオプティクス セミコンダクタ インコーポレイテッド 半導体加工ツールにおける静電容量距離検出
KR100787228B1 (ko) * 2006-06-12 2007-12-21 삼성전자주식회사 2축 지자기 센서 및 그 제작방법
DE112007002309T5 (de) 2006-09-29 2009-07-30 Cyberoptics Semiconductor, Inc., Beaverton Substratähnlicher Teilchensensor
JP4739166B2 (ja) * 2006-10-24 2011-08-03 本田技研工業株式会社 ガスセンサ
DE102006060113A1 (de) * 2006-12-20 2008-06-26 Appliedsensor Gmbh Sensor und Herstellungsverfahren eines Sensors
WO2008105197A1 (ja) * 2007-02-28 2008-09-04 Yamatake Corporation フローセンサ
EP2128573A1 (de) * 2007-02-28 2009-12-02 Yamatake Corporation Sensor, sensortemperaturregelverfahren und abnormitätsbehebungsverfahren
US7778793B2 (en) 2007-03-12 2010-08-17 Cyberoptics Semiconductor, Inc. Wireless sensor for semiconductor processing systems
WO2009034843A1 (ja) * 2007-09-11 2009-03-19 The Ritsumeikan Trust 半導体式ガスセンサ及びその製造方法
KR100942439B1 (ko) * 2007-12-28 2010-02-17 전자부품연구원 마이크로 가스센서 및 제조방법
DE102010041763A1 (de) * 2010-09-30 2012-04-05 Siemens Aktiengesellschaft Mikromechanisches Substrat
EP2565635B1 (de) 2011-09-02 2017-11-15 Sensirion AG Sensorchip und Verfahren zur Herstellung eines Sensorchips
WO2013187910A1 (en) * 2012-06-15 2013-12-19 Empire Technology Development Llc Self-cleaning lens
CN102730621B (zh) * 2012-06-15 2015-05-27 西安交通大学 一种加热丝嵌入式硅基微热板及加工方法
DE102013212735B4 (de) 2013-06-28 2021-07-22 Robert Bosch Gmbh Sensorbauteil für einen Gas- und/oder Flüssigkeitssensor, Herstellungsverfahren für ein Sensorbauteil für einen Gas- und/oder Flüssigkeitssensor und Verfahren zum Detektieren mindestens eines Stoffs in einem gasförmigen und/oder flüssigen Medium
US9461190B2 (en) * 2013-09-24 2016-10-04 Optiz, Inc. Low profile sensor package with cooling feature and method of making same
KR101649586B1 (ko) * 2014-04-07 2016-08-19 주식회사 모다이노칩 센서
DE102016112871A1 (de) * 2015-07-31 2017-02-02 Infineon Technologies Ag Mikrofiltrationsvorrichtung
DE102017122043A1 (de) * 2017-09-22 2019-03-28 Tdk Electronics Ag MEMS-Gassensor
KR102437764B1 (ko) * 2017-12-20 2022-08-30 삼성전자주식회사 센서 패키지, 센서 패키지의 제조 방법, 및 리드 구조체의 제조 방법
DE102019201228B4 (de) * 2019-01-31 2023-10-05 Robert Bosch Gmbh Verfahren zum Herstellen einer Mehrzahl von Sensoreinrichtungen und Sensoreinrichtung
DE102020203868B4 (de) * 2020-03-25 2022-04-28 Vitesco Technologies GmbH Gassensor für ein Fahrzeug
EP4105650A1 (de) * 2021-06-15 2022-12-21 MEAS France Sensorvorrichtung mit deckschicht
SE545362C2 (en) * 2021-12-22 2023-07-18 Senseair Ab Capped semiconductor based sensor and method for its fabrication

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Also Published As

Publication number Publication date
EP0798554A3 (de) 1997-10-15
EP0798554B1 (de) 2004-01-02
US6326228B1 (en) 2001-12-04
DE69727001T2 (de) 2004-11-11
EP0798554A2 (de) 1997-10-01
US5798556A (en) 1998-08-25

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Legal Events

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8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FREESCALE SEMICONDUCTOR, INC., AUSTIN, TEX., US