DE69727869D1 - Anorganischer Füllstoff, Epoxyharzzusammensetzung und Halbleitervorrichtung - Google Patents

Anorganischer Füllstoff, Epoxyharzzusammensetzung und Halbleitervorrichtung

Info

Publication number
DE69727869D1
DE69727869D1 DE69727869T DE69727869T DE69727869D1 DE 69727869 D1 DE69727869 D1 DE 69727869D1 DE 69727869 T DE69727869 T DE 69727869T DE 69727869 T DE69727869 T DE 69727869T DE 69727869 D1 DE69727869 D1 DE 69727869D1
Authority
DE
Germany
Prior art keywords
semiconductor device
resin composition
epoxy resin
inorganic filler
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69727869T
Other languages
English (en)
Other versions
DE69727869T2 (de
Inventor
Noriaki Higuchi
Takaaki Fukumoto
Toshio Shiobara
Eiichi Asano
K Tomiyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Mitsubishi Electric Corp
Original Assignee
Shin Etsu Chemical Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd, Mitsubishi Electric Corp filed Critical Shin Etsu Chemical Co Ltd
Publication of DE69727869D1 publication Critical patent/DE69727869D1/de
Application granted granted Critical
Publication of DE69727869T2 publication Critical patent/DE69727869T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3009—Physical treatment, e.g. grinding; treatment with ultrasonic vibrations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/04—Physical treatment, e.g. grinding, treatment with ultrasonic vibrations
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
DE69727869T 1996-08-29 1997-08-25 Anorganischer Füllstoff, Epoxyharzzusammensetzung und Halbleitervorrichtung Expired - Lifetime DE69727869T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP24702596A JP3611066B2 (ja) 1996-08-29 1996-08-29 無機質充填剤及びエポキシ樹脂組成物の製造方法
JP24702596 1996-08-29

Publications (2)

Publication Number Publication Date
DE69727869D1 true DE69727869D1 (de) 2004-04-08
DE69727869T2 DE69727869T2 (de) 2005-02-03

Family

ID=17157294

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69727869T Expired - Lifetime DE69727869T2 (de) 1996-08-29 1997-08-25 Anorganischer Füllstoff, Epoxyharzzusammensetzung und Halbleitervorrichtung

Country Status (9)

Country Link
US (2) US5935314A (de)
EP (1) EP0829455B1 (de)
JP (1) JP3611066B2 (de)
KR (1) KR100255340B1 (de)
CN (1) CN1080746C (de)
DE (1) DE69727869T2 (de)
MY (2) MY121624A (de)
SG (1) SG55369A1 (de)
TW (1) TW495530B (de)

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JP3417354B2 (ja) 1999-08-19 2003-06-16 ソニーケミカル株式会社 接着材料及び回路接続方法
US6500891B1 (en) 2000-05-19 2002-12-31 Loctite Corporation Low viscosity thermally conductive compositions containing spherical thermally conductive particles
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JP4438973B2 (ja) * 2000-05-23 2010-03-24 アムコア テクノロジー，インコーポレイテッド シート状樹脂組成物及びそれを用いた半導体装置の製造方法
US6737467B1 (en) * 2000-11-21 2004-05-18 E. I. Du Pont De Nemours And Company Low gloss powder coatings
DE10137666A1 (de) * 2001-08-01 2003-02-27 Infineon Technologies Ag Schutzvorrichtung für Baugruppen und Verfahren zu ihrer Herstellung
ATE482608T1 (de) * 2002-05-23 2010-10-15 3M Innovative Properties Co Elektronische baugruppe und verfahren zur herstellung einer elektronischen baugruppe
TW200726784A (en) * 2003-04-07 2007-07-16 Hitachi Chemical Co Ltd Epoxy resin molding material for sealing use and semiconductor device
DE602004002623T2 (de) * 2003-07-17 2007-01-18 Nitto Denko Corporation, Ibaraki Verfahren zur Herstellung eines Harzverkapselungsscheibchens für Halbleiter
KR101073423B1 (ko) * 2005-04-19 2011-10-17 덴끼 가가꾸 고교 가부시키가이샤 금속 베이스 회로 기판, ｌｅｄ, 및 ｌｅｄ 광원 유닛
US20070134844A1 (en) * 2005-12-13 2007-06-14 Shin-Etsu Chemical Co., Ltd. Process for producing flip-chip type semiconductor device and semiconductor device produced by the process
KR101148140B1 (ko) 2007-12-24 2012-05-23 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물　및 이를 이용한 반도체 소자
KR101202042B1 (ko) 2008-12-17 2012-11-16 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
JP2011014885A (ja) * 2009-06-01 2011-01-20 Shin-Etsu Chemical Co Ltd 多層半導体装置用アンダーフィル材のダム材組成物、及び該ダム材組成物を用いた多層半導体装置の製造方法
TWI432477B (zh) * 2010-08-18 2014-04-01 Benq Materials Corp 環氧樹脂組成物
EP2693476A4 (de) * 2011-03-31 2014-10-15 Mitsubishi Chem Corp Laminat für einen dreidimensionalen integrierten schaltkreis und zwischenschichtfüllmaterial für das laminat für einen dreidimensionalen integrierten schaltkreis
CN104497490B (zh) * 2014-12-22 2017-08-25 科化新材料泰州有限公司 用于全包封器件的高导热环氧树脂组合物及其制备方法
CN104788911B (zh) * 2015-04-29 2017-10-31 华中科技大学 一种环氧树脂复合材料、其制备方法及应用
JP6958546B2 (ja) 2016-04-28 2021-11-02 Ａｇｃ株式会社 含フッ素共重合体組成物、その製造方法、および成形体
JP2018104649A (ja) * 2016-12-28 2018-07-05 日東電工株式会社 樹脂シート
JP6288344B1 (ja) * 2017-03-31 2018-03-07 日立化成株式会社 電子回路用保護材、電子回路用保護材用封止材、封止方法及び半導体装置の製造方法
JP6292334B1 (ja) * 2017-03-31 2018-03-14 日立化成株式会社 電子回路用保護材、電子回路用保護材用封止材、封止方法及び半導体装置の製造方法
KR102450897B1 (ko) * 2017-03-31 2022-10-04 쇼와덴코머티리얼즈가부시끼가이샤 전자 회로용 보호재, 전자 회로용 보호재용 밀봉재, 밀봉 방법 및 반도체 장치의 제조 방법
KR102359057B1 (ko) * 2017-07-31 2022-02-07 엘지이노텍 주식회사 열전 소자
JP6547819B2 (ja) * 2017-12-14 2019-07-24 日立化成株式会社 電子回路用保護材、電子回路用保護材用封止材、封止方法及び半導体装置の製造方法
JP6547818B2 (ja) * 2017-12-14 2019-07-24 日立化成株式会社 電子回路用保護材、電子回路用保護材用封止材、封止方法及び半導体装置の製造方法
JP6930555B2 (ja) * 2017-12-14 2021-09-01 昭和電工マテリアルズ株式会社 電子回路用保護材、電子回路用保護材用封止材、封止方法及び半導体装置の製造方法
JP6870706B2 (ja) * 2019-06-27 2021-05-12 昭和電工マテリアルズ株式会社 電子回路用保護材、電子回路用保護材用封止材、封止方法及び半導体装置の製造方法

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Also Published As

Publication number Publication date
EP0829455A3 (de) 1998-11-18
US5935314A (en) 1999-08-10
KR19980019141A (ko) 1998-06-05
MY124820A (en) 2006-07-31
US6207296B1 (en) 2001-03-27
SG55369A1 (en) 1998-12-21
TW495530B (en) 2002-07-21
JPH1067883A (ja) 1998-03-10
KR100255340B1 (ko) 2000-05-01
EP0829455B1 (de) 2004-03-03
MY121624A (en) 2006-02-28
EP0829455A2 (de) 1998-03-18
DE69727869T2 (de) 2005-02-03
CN1080746C (zh) 2002-03-13
CN1176276A (zh) 1998-03-18
JP3611066B2 (ja) 2005-01-19

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition