DE69730271D1 - Semisolide, thermische Zwischenlage mit geringem Flusswiderstand - Google Patents

Semisolide, thermische Zwischenlage mit geringem Flusswiderstand

Info

Publication number
DE69730271D1
DE69730271D1 DE69730271T DE69730271T DE69730271D1 DE 69730271 D1 DE69730271 D1 DE 69730271D1 DE 69730271 T DE69730271 T DE 69730271T DE 69730271 T DE69730271 T DE 69730271T DE 69730271 D1 DE69730271 D1 DE 69730271D1
Authority
DE
Germany
Prior art keywords
semi
insulating
intermediate layer
flow resistance
low flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69730271T
Other languages
English (en)
Other versions
DE69730271T2 (de
Inventor
Kevin L Hanson
Mark Green
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bergquist Co Inc
Original Assignee
Bergquist Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bergquist Co Inc filed Critical Bergquist Co Inc
Application granted granted Critical
Publication of DE69730271D1 publication Critical patent/DE69730271D1/de
Publication of DE69730271T2 publication Critical patent/DE69730271T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049—Nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12507—More than two components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542—More than one such component
    • Y10T428/12549—Adjacent to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12576—Boride, carbide or nitride component
DE69730271T 1996-06-14 1997-06-12 Semisolide, thermische Zwischenlage mit geringem Flusswiderstand Expired - Lifetime DE69730271T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/663,800 US5950066A (en) 1996-06-14 1996-06-14 Semisolid thermal interface with low flow resistance
US663800 1996-06-14

Publications (2)

Publication Number Publication Date
DE69730271D1 true DE69730271D1 (de) 2004-09-23
DE69730271T2 DE69730271T2 (de) 2005-09-15

Family

ID=24663308

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69730271T Expired - Lifetime DE69730271T2 (de) 1996-06-14 1997-06-12 Semisolide, thermische Zwischenlage mit geringem Flusswiderstand

Country Status (6)

Country Link
US (1) US5950066A (de)
EP (1) EP0813244B1 (de)
JP (1) JP3663032B2 (de)
CA (1) CA2207114C (de)
DE (1) DE69730271T2 (de)
TW (1) TW360906B (de)

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US5880244A (en) * 1997-05-13 1999-03-09 Lexmark International, Inc. Sealant materials for toner cartridges
JP2941801B1 (ja) * 1998-09-17 1999-08-30 北川工業株式会社 熱伝導材
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JP3504882B2 (ja) * 1999-05-24 2004-03-08 富士高分子工業株式会社 熱伝導性・電気絶縁性シリコーン組成物及びこれを用いたシリコーン成形物
DE19924289A1 (de) * 1999-05-27 2000-12-07 Siemens Ag Elektronisches Schaltungsmodul mit flexibler Zwischenschicht zwischen elektronischen Bauelementen und einem Kühlkörper
US20040009353A1 (en) * 1999-06-14 2004-01-15 Knowles Timothy R. PCM/aligned fiber composite thermal interface
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
US6457086B1 (en) * 1999-11-16 2002-09-24 Apple Computers, Inc. Method and apparatus for accelerating detection of serial bus device speed signals
EP1143511B1 (de) * 2000-04-05 2008-01-02 The Bergquist Company Herstellung thermisch leitender Stoffe durch flüssigmetallüberbrückte Teilchengruppen
US6339120B1 (en) 2000-04-05 2002-01-15 The Bergquist Company Method of preparing thermally conductive compounds by liquid metal bridged particle clusters
US6984685B2 (en) * 2000-04-05 2006-01-10 The Bergquist Company Thermal interface pad utilizing low melting metal with retention matrix
US6618785B1 (en) 2000-04-21 2003-09-09 Apple Computer, Inc. Method and apparatus for automatic detection and healing of signal pair crossover on a high performance serial bus
US6660241B2 (en) * 2000-05-01 2003-12-09 Saint-Gobain Ceramics & Plastics, Inc. Highly delaminated hexagonal boron nitride powders, process for making, and uses thereof
US6794435B2 (en) 2000-05-18 2004-09-21 Saint Gobain Ceramics & Plastics, Inc. Agglomerated hexagonal boron nitride powders, method of making, and uses thereof
US6764975B1 (en) * 2000-11-28 2004-07-20 Saint-Gobain Ceramics & Plastics, Inc. Method for making high thermal diffusivity boron nitride powders
JP4459470B2 (ja) * 2001-04-06 2010-04-28 信越化学工業株式会社 電子部品の放熱構造体及びそれに用いる放熱シート
JP2004525242A (ja) * 2001-04-30 2004-08-19 サンーゴバン セラミックス アンド プラスティクス，インコーポレイティド ポリマー加工助剤およびポリマーの加工方法
US6645612B2 (en) 2001-08-07 2003-11-11 Saint-Gobain Ceramics & Plastics, Inc. High solids hBN slurry, hBN paste, spherical hBN powder, and methods of making and using them
JP2003113313A (ja) * 2001-09-21 2003-04-18 Three M Innovative Properties Co 熱伝導性組成物
JP3938681B2 (ja) * 2001-11-21 2007-06-27 信越化学工業株式会社 放熱構造体
US6620515B2 (en) * 2001-12-14 2003-09-16 Dow Corning Corporation Thermally conductive phase change materials
US6946190B2 (en) * 2002-02-06 2005-09-20 Parker-Hannifin Corporation Thermal management materials
EP1472728B1 (de) * 2002-02-06 2008-09-24 Parker Hannifin Corporation Wärmesteuerungsmaterialien mit phasenumwandlungsdispersion
WO2003088315A2 (en) * 2002-04-11 2003-10-23 Honeywell International Inc. Thermally conductive coating compositions, methods of production and uses thereof
US6815486B2 (en) 2002-04-12 2004-11-09 Dow Corning Corporation Thermally conductive phase change materials and methods for their preparation and use
US7147367B2 (en) * 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
US6657297B1 (en) 2002-08-15 2003-12-02 The Bergquist Company Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
US6783692B2 (en) 2002-10-17 2004-08-31 Dow Corning Corporation Heat softening thermally conductive compositions and methods for their preparation
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US20040120129A1 (en) * 2002-12-24 2004-06-24 Louis Soto Multi-layer laminated structures for mounting electrical devices and method for fabricating such structures
US6831835B2 (en) * 2002-12-24 2004-12-14 Ault, Inc. Multi-layer laminated structures, method for fabricating such structures, and power supply including such structures
US7861768B1 (en) 2003-06-11 2011-01-04 Apple Inc. Heat sink
US20050016714A1 (en) * 2003-07-09 2005-01-27 Chung Deborah D.L. Thermal paste for improving thermal contacts
US7494635B2 (en) * 2003-08-21 2009-02-24 Saint-Gobain Ceramics & Plastics, Inc. Boron nitride agglomerated powder
US20050049350A1 (en) * 2003-08-25 2005-03-03 Sandeep Tonapi Thin bond-line silicone adhesive composition and method for preparing the same
US7193307B2 (en) * 2004-03-25 2007-03-20 Ault Incorporated Multi-layer FET array and method of fabricating
JP2005330426A (ja) * 2004-05-21 2005-12-02 Shin Etsu Chem Co Ltd 放熱用シリコーングリース組成物
TWI385246B (zh) 2004-05-21 2013-02-11 Shinetsu Chemical Co 聚矽氧烷潤滑油組成物
DE602005023531D1 (de) * 2004-12-16 2010-10-21 Dow Corning Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung
TWI291480B (en) * 2005-12-20 2007-12-21 Ind Tech Res Inst Composition for thermal interface materials
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8445102B2 (en) * 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8076773B2 (en) 2007-12-26 2011-12-13 The Bergquist Company Thermal interface with non-tacky surface
CN102190802B (zh) * 2011-03-23 2013-06-26 南京天诗新材料科技有限公司 交联聚合物蜡微粉的制备方法
JP6532475B2 (ja) 2014-02-13 2019-06-19 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 圧縮性熱界面材料
CN105170542A (zh) * 2015-09-25 2015-12-23 无锡市博阳超声电器有限公司 一种可加热的超声波清洗槽
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
WO2022210780A1 (ja) * 2021-03-31 2022-10-06 積水化学工業株式会社 側鎖型アルキル変性シリコーン樹脂
WO2022210782A1 (ja) * 2021-03-31 2022-10-06 積水化学工業株式会社 側鎖型アルキル変性シリコーン樹脂
CN117120518A (zh) * 2021-03-31 2023-11-24 积水化学工业株式会社 侧链型烷基改性有机硅树脂
CN116814081B (zh) * 2023-03-20 2024-03-29 深圳市雷兹盾新材料有限公司 一种超高导热低介电的界面材料及其制备方法

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Also Published As

Publication number Publication date
EP0813244B1 (de) 2004-08-18
DE69730271T2 (de) 2005-09-15
JPH1067910A (ja) 1998-03-10
JP3663032B2 (ja) 2005-06-22
EP0813244A2 (de) 1997-12-17
US5950066A (en) 1999-09-07
CA2207114C (en) 2004-03-30
CA2207114A1 (en) 1997-12-14
EP0813244A3 (de) 1998-07-08
TW360906B (en) 1999-06-11

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