DE69730587D1 - Biegsame gedruckte Schaltungen mit pseudo-verdrillten Leitern - Google Patents

Biegsame gedruckte Schaltungen mit pseudo-verdrillten Leitern

Info

Publication number
DE69730587D1
DE69730587D1 DE69730587T DE69730587T DE69730587D1 DE 69730587 D1 DE69730587 D1 DE 69730587D1 DE 69730587 T DE69730587 T DE 69730587T DE 69730587 T DE69730587 T DE 69730587T DE 69730587 D1 DE69730587 D1 DE 69730587D1
Authority
DE
Germany
Prior art keywords
flexible printed
printed circuits
twisted conductors
pseudo twisted
pseudo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69730587T
Other languages
English (en)
Other versions
DE69730587T2 (de
Inventor
Noda Atsuhito
Okano Masato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Molex LLC
Original Assignee
Molex LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex LLC filed Critical Molex LLC
Application granted granted Critical
Publication of DE69730587D1 publication Critical patent/DE69730587D1/de
Publication of DE69730587T2 publication Critical patent/DE69730587T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/941—Crosstalk suppression

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Communication Cables (AREA)
  • Insulated Conductors (AREA)
DE69730587T 1996-12-27 1997-12-18 Biegsame gedruckte Schaltungen mit pseudo-verdrillten Leitern Expired - Fee Related DE69730587T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP35785096A JP3528484B2 (ja) 1996-12-27 1996-12-27 擬似ツイストペア平型柔軟ケーブル
JP35785096 1996-12-27

Publications (2)

Publication Number Publication Date
DE69730587D1 true DE69730587D1 (de) 2004-10-14
DE69730587T2 DE69730587T2 (de) 2005-09-15

Family

ID=18456250

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69730587T Expired - Fee Related DE69730587T2 (de) 1996-12-27 1997-12-18 Biegsame gedruckte Schaltungen mit pseudo-verdrillten Leitern

Country Status (9)

Country Link
US (1) US6057512A (de)
EP (1) EP0855854B1 (de)
JP (1) JP3528484B2 (de)
KR (1) KR100311881B1 (de)
CN (1) CN1126117C (de)
DE (1) DE69730587T2 (de)
MY (1) MY117774A (de)
SG (1) SG67455A1 (de)
TW (1) TW385906U (de)

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JP2935307B2 (ja) * 1992-02-20 1999-08-16 株式会社日立製作所 ディスプレイ
JP2860468B2 (ja) * 1996-05-24 1999-02-24 モレックス インコーポレーテッド 擬似ツイストペア平型柔軟ケーブル
US6300846B1 (en) * 1999-03-18 2001-10-09 Molex Incorporated Flat flexible cable with ground conductors
US6089923A (en) 1999-08-20 2000-07-18 Adc Telecommunications, Inc. Jack including crosstalk compensation for printed circuit board
AU2001267086A1 (en) * 2000-06-14 2001-12-24 Rambus Inc. Method and apparatus for transmitting data with reduced coupling noise
US6681338B1 (en) * 2000-06-21 2004-01-20 Rambus, Inc. Method and system for reducing signal skew by switching between multiple signal routing layers
US6462630B1 (en) * 2000-07-03 2002-10-08 Oki Electric Cable Co., Ltd. Wideband noise reducing device
US6396000B1 (en) * 2000-09-11 2002-05-28 Hewlett-Packard Co. Printed circuit board and method for reducing radio frequency interference emissions from conductive traces on a printed circuit board
US6433272B1 (en) * 2000-09-19 2002-08-13 Storage Technology Corporation Crosstalk reduction in constrained wiring assemblies
US7397320B1 (en) * 2001-05-16 2008-07-08 Cadence Design Systems, Inc. Non-uniform transmission line for reducing cross-talk from an aggressor transmission line
US8847696B2 (en) * 2002-03-18 2014-09-30 Qualcomm Incorporated Flexible interconnect cable having signal trace pairs and ground layer pairs disposed on opposite sides of a flexible dielectric
US20040074668A1 (en) * 2002-10-16 2004-04-22 Steve Somers Cable for minimizing skew delay and crosstalk
US6930888B2 (en) * 2002-11-04 2005-08-16 Intel Corporation Mechanism to cross high-speed differential pairs
US6974906B2 (en) * 2003-05-14 2005-12-13 Wing Yat Lo low interferance cable
TW591995B (en) * 2003-06-23 2004-06-11 Realtek Semiconductor Corp Symmetrically electrical connection system
US7280808B2 (en) * 2004-04-12 2007-10-09 Sony Ericsson Mobile Communications, Ab Wireless communications devices including circuit substrates with partially overlapping conductors thereon coupling power to/from power amplifier systems
CA2464834A1 (en) * 2004-04-19 2005-10-19 Nordx/Cdt Inc. Connector
JP4399337B2 (ja) * 2004-09-13 2010-01-13 株式会社フューチャービジョン 平面パターンを有する基板およびそれを用いた表示装置
US7271985B1 (en) 2004-09-24 2007-09-18 Storage Technology Corporation System and method for crosstalk reduction in a flexible trace interconnect array
US8553364B1 (en) 2005-09-09 2013-10-08 Magnecomp Corporation Low impedance, high bandwidth disk drive suspension circuit
ATE500719T1 (de) * 2006-06-06 2011-03-15 Alcatel Lucent Verringertes übersprechen in gedruckten leiterplatten mittels verdrillung von leiterbahnen
CN101389182B (zh) * 2007-09-13 2011-03-30 鸿富锦精密工业（深圳）有限公司 印刷电路板
KR101383704B1 (ko) * 2008-01-18 2014-04-10 삼성디스플레이 주식회사 회로 기판 및 이를 포함하는 표시 장치
EP2338205A4 (de) * 2008-10-17 2012-04-11 Hewlett Packard Development Co Übertragungsleitungsschaltung mit paaren sich überkreuzender leitfähiger leitungen
CN102369636B (zh) * 2009-03-30 2014-04-09 富士通株式会社 差动路径转换部件、印制基板以及电子装置
US20100307798A1 (en) * 2009-06-03 2010-12-09 Izadian Jamal S Unified scalable high speed interconnects technologies
CN102055051B (zh) * 2009-10-30 2015-09-30 清华大学 一种高阻抗传输线
JP2011114296A (ja) * 2009-11-30 2011-06-09 Samsung Electronics Co Ltd フレキシブル基板およびフレキシブル基板の製造方法
US9240619B2 (en) 2011-04-28 2016-01-19 Texas Instruments Incorporated Differential transmission line pairs using a coupling orthogonalization approach to reduce cross-talk
JP5352019B1 (ja) 2012-11-14 2013-11-27 太陽誘電株式会社 多層回路基板及び高周波回路モジュール
US9590339B2 (en) 2013-05-09 2017-03-07 Commscope, Inc. Of North Carolina High data rate connectors and cable assemblies that are suitable for harsh environments and related methods and systems
US9253875B2 (en) * 2013-05-15 2016-02-02 Intel IP Corporation Isolating differential transmission lines
US20150114676A1 (en) * 2013-10-31 2015-04-30 Alstom Technology Ltd. Conductor bar with multi-strand conductor element
DE202014009499U1 (de) * 2014-11-28 2015-01-16 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Winkelverbinder zur differentiellen Übertragung von Datensignalen
US9362677B1 (en) * 2014-12-04 2016-06-07 Adtran Inc. Crosstalk reducing conductor orientations and methods
JP6399969B2 (ja) * 2015-05-22 2018-10-03 三菱電機株式会社 プリント基板
US9930771B2 (en) * 2015-12-16 2018-03-27 Dell Products, Lp Aperiodic routing to mitigate floquet mode resonances
CN106020547B (zh) * 2016-05-26 2019-11-05 京东方科技集团股份有限公司 一种基板、触摸屏和触摸显示装置
KR101777716B1 (ko) 2016-08-04 2017-09-18 자화전자(주) 회로기판 및 이를 포함하는 진동 발생장치
JP2019024560A (ja) * 2017-07-25 2019-02-21 株式会社三共 遊技機
DE102019116333A1 (de) * 2019-06-17 2020-12-17 Lisa Dräxlmaier GmbH Elektrische leitungsanordnung mit einer art verdrillung und herstellungsverfahren
EP3809517A1 (de) * 2019-10-17 2021-04-21 ALCAN Systems GmbH Übertragungsleitung für hochfrequenzsignale
DE102022203881A1 (de) 2022-04-20 2023-04-13 Carl Zeiss Smt Gmbh Leiterplatte für ein optisches system, optisches system, lithographieanlage und verfahren zum herstellen einer leiterplatte für ein optisches system

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US3104363A (en) * 1960-07-25 1963-09-17 Sanders Associates Inc Strip transmission line crossover having reduced impedance discontinuity
US3761842A (en) * 1972-06-01 1973-09-25 Bell Telephone Labor Inc Twisted pair flat conductor cable with means to equalize impedance and propagation velocity
US3764727A (en) * 1972-06-12 1973-10-09 Western Electric Co Electrically conductive flat cable structures
US4034148A (en) * 1975-01-30 1977-07-05 Spectra-Strip Corporation Twisted pair multi-conductor ribbon cable with intermittent straight sections
US4359597A (en) * 1976-09-22 1982-11-16 Eltra Corporation Twisted pair multi-conductor ribbon cable with intermittent straight sections
US4593243A (en) * 1984-08-29 1986-06-03 Magnavox Government And Industrial Electronics Company Coplanar and stripline probe card apparatus
US5186647A (en) * 1992-02-24 1993-02-16 At&T Bell Laboratories High frequency electrical connector
US5299956B1 (en) * 1992-03-23 1995-10-24 Superior Modular Prod Inc Low cross talk electrical connector system
US5298680A (en) * 1992-08-07 1994-03-29 Kenny Robert D Dual twisted pairs over single jacket
US5362257A (en) * 1993-07-08 1994-11-08 The Whitaker Corporation Communications connector terminal arrays having noise cancelling capabilities
US5459284A (en) * 1993-08-31 1995-10-17 Motorola, Inc. Twisted-pair wire bond and method thereof
US5527996A (en) * 1994-06-17 1996-06-18 Digital Equipment Corporation Apparatus for increasing SCSI bus length by increasing the signal propogation velocity of only two bus signals
US5618185A (en) * 1995-03-15 1997-04-08 Hubbell Incorporated Crosstalk noise reduction connector for telecommunication system
JP2860468B2 (ja) * 1996-05-24 1999-02-24 モレックス インコーポレーテッド 擬似ツイストペア平型柔軟ケーブル

Also Published As

Publication number Publication date
DE69730587T2 (de) 2005-09-15
US6057512A (en) 2000-05-02
JPH10188685A (ja) 1998-07-21
MY117774A (en) 2004-08-30
TW385906U (en) 2000-03-21
EP0855854A2 (de) 1998-07-29
CN1126117C (zh) 2003-10-29
KR100311881B1 (ko) 2001-11-15
CN1188968A (zh) 1998-07-29
EP0855854A3 (de) 1999-11-17
KR19980064689A (ko) 1998-10-07
EP0855854B1 (de) 2004-09-08
JP3528484B2 (ja) 2004-05-17
SG67455A1 (en) 1999-09-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee