DE69732174D1 - Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte - Google Patents

Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte

Info

Publication number
DE69732174D1
DE69732174D1 DE69732174T DE69732174T DE69732174D1 DE 69732174 D1 DE69732174 D1 DE 69732174D1 DE 69732174 T DE69732174 T DE 69732174T DE 69732174 T DE69732174 T DE 69732174T DE 69732174 D1 DE69732174 D1 DE 69732174D1
Authority
DE
Germany
Prior art keywords
mounting
circuit board
printed circuit
electromagnetic shielding
shielding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69732174T
Other languages
English (en)
Other versions
DE69732174T2 (de
Inventor
Riet Johan Te
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of DE69732174D1 publication Critical patent/DE69732174D1/de
Publication of DE69732174T2 publication Critical patent/DE69732174T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
DE69732174T 1997-03-19 1997-03-19 Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte Expired - Lifetime DE69732174T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP97200822A EP0866648B1 (de) 1997-03-19 1997-03-19 Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte

Publications (2)

Publication Number Publication Date
DE69732174D1 true DE69732174D1 (de) 2005-02-10
DE69732174T2 DE69732174T2 (de) 2005-12-29

Family

ID=8228126

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69732174T Expired - Lifetime DE69732174T2 (de) 1997-03-19 1997-03-19 Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte

Country Status (9)

Country Link
US (1) US6181573B1 (de)
EP (1) EP0866648B1 (de)
JP (1) JPH10284867A (de)
KR (1) KR100337283B1 (de)
CN (1) CN1169415C (de)
CA (1) CA2230321C (de)
DE (1) DE69732174T2 (de)
HK (1) HK1017227A1 (de)
TW (1) TW484796U (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2351183B (en) * 1999-06-18 2003-10-15 Nokia Mobile Phones Ltd Shielding can for a printed circuit board
JP2001148594A (ja) * 1999-11-19 2001-05-29 Murata Mfg Co Ltd シールドケース付き電子部品
JP3492591B2 (ja) * 2000-04-19 2004-02-03 Nec液晶テクノロジー株式会社 表示装置および情報端末機器
SE0003930D0 (sv) * 2000-10-27 2000-10-27 Allgon Ab Shielded housing
US6445583B1 (en) * 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
US6560125B1 (en) * 2001-12-28 2003-05-06 Motorola, Inc. Shield for shielding radio components
FI20020992A (fi) * 2002-05-27 2003-11-28 Nokia Corp Komponentin kiinnitysrakenne
JP4195975B2 (ja) 2002-10-16 2008-12-17 パナソニック株式会社 高周波装置
TWI351918B (en) 2004-01-29 2011-11-01 Laird Technologies Inc Ultra-low height electromagnetic interference shie
US7113410B2 (en) * 2004-04-01 2006-09-26 Lucent Technologies, Inc. Electromagnetic shield assembly with opposed hook flanges
JP4107666B2 (ja) * 2004-06-01 2008-06-25 株式会社東芝 電子機器のシールドケースおよび電子機器
JP4453509B2 (ja) * 2004-10-05 2010-04-21 パナソニック株式会社 シールドケースを装着された高周波モジュールとこの高周波モジュールを用いた電子機器
US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7508684B2 (en) * 2006-08-18 2009-03-24 Research In Motion Limited Handheld electronic device including multi-compartment shielding container and associated methods
JP2008066524A (ja) * 2006-09-07 2008-03-21 Murata Mfg Co Ltd シールドケース
JP5233677B2 (ja) * 2007-01-29 2013-07-10 日本電気株式会社 電子機器のシールド構造、シールド部材及びこれを備える電子機器
TWM318903U (en) * 2007-04-03 2007-09-11 Chin-Fu Horng Electromagnetic shielding device
US7903431B2 (en) * 2007-06-14 2011-03-08 Laird Technologies, Inc. Electromagnetic interference shielding apparatus
JP5112006B2 (ja) * 2007-10-29 2013-01-09 京セラ株式会社 シールドケース及び無線端末装置
CN101568250A (zh) * 2008-04-22 2009-10-28 深圳富泰宏精密工业有限公司 电磁波屏蔽装置
US8208273B1 (en) * 2008-06-13 2012-06-26 Qualcomm, Incorporated RF shielded enclosure for automated testing
DE102008042449A1 (de) * 2008-09-29 2010-04-01 Robert Bosch Gmbh Radarsensor mit abgeschirmtem Signalstabilisator
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
KR100973053B1 (ko) 2009-10-06 2010-07-29 권원현 전자파 차폐용 쉴드캔 및 이의 제조 방법과 이를 포함하는 전자 장치
DE102009054517B4 (de) * 2009-12-10 2011-12-29 Robert Bosch Gmbh Elektronisches Steuergerät
JP5765334B2 (ja) * 2010-04-02 2015-08-19 日本電気株式会社 フレーム部材、フレームユニット、実装基板ユニット、及び製造方法
US20110255850A1 (en) * 2010-04-19 2011-10-20 Richard Hung Minh Dinh Electronic subassemblies for electronic devices
HUE030974T2 (en) * 2010-04-20 2017-06-28 Interplex Prec Tech (Singapore) Pte Ltd Electromagnetic Interference Shading Layout
US8188381B2 (en) * 2010-05-06 2012-05-29 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Mid-board module retention and EMI cage
CN102681221A (zh) * 2011-03-15 2012-09-19 鸿富锦精密工业(深圳)有限公司 显示装置
EP2774465A4 (de) * 2011-10-31 2015-09-09 Thomson Licensing Abschirmungsstruktur für eine elektronische vorrichtung
TWI484888B (zh) * 2012-10-24 2015-05-11 Pegatron Corp 導電組件及電子裝置
US20140218851A1 (en) 2013-02-01 2014-08-07 Microsoft Corporation Shield Can
US9462732B2 (en) * 2013-03-13 2016-10-04 Laird Technologies, Inc. Electromagnetic interference shielding (EMI) apparatus including a frame with drawn latching features
US20140286009A1 (en) * 2013-03-22 2014-09-25 Billboard Video, Inc. Modular solid state electronic display panels with electromagnetic radiation shielding
DE102014109819B4 (de) 2014-01-22 2023-09-21 iwis e-tec GmbH Abschirmgehäuse
US20170181265A1 (en) * 2015-12-22 2017-06-22 Thomson Licensing Electronic circuit board shielding with open window heat transfer path
CN105711252B (zh) * 2016-02-01 2018-06-19 江汉大学 基于电磁兼容的印刷装置
JP2018207040A (ja) * 2017-06-08 2018-12-27 株式会社東芝 シールドケース
GB2569558B (en) * 2017-12-19 2022-04-06 Harwin Plc Element, system and method for retaining a component to a surface
USD895623S1 (en) 2018-10-05 2020-09-08 Laird Technologies, Inc. Frame for shielding assembly
US10653049B2 (en) 2018-10-05 2020-05-12 Laird Technologies, Inc. Frames for shielding assemblies and shielding assemblies including the same
DE102019117552A1 (de) * 2019-06-28 2020-12-31 Connaught Electronics Ltd. Gehäuse für eine elektronische Steuereinheit
US11490548B2 (en) * 2020-09-10 2022-11-01 Tecvox, Llc Stackable frame and shield

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4754101A (en) * 1986-10-23 1988-06-28 Instrument Specialties Co., Inc. Electromagnetic shield for printed circuit board
DE3903229A1 (de) * 1989-02-03 1990-08-09 Vdo Schindling Elektronischer schaltkreis
GB2236910B (en) * 1989-09-28 1993-12-08 Technophone Ltd A housing for electronic circuitry
US5175395A (en) * 1991-11-27 1992-12-29 Rockwell International Corporation Electromagnetic shield
US5354951A (en) * 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly
US5339222A (en) 1993-04-06 1994-08-16 The Whitaker Corporation Shielded printed circuit card holder
GB2285181A (en) * 1993-12-23 1995-06-28 Hitec Sheet Metal Limited Electromagnetic radiation shielding for printed circuit boards
DE9400526U1 (de) * 1994-01-13 1994-03-03 Siemens Ag Knickbare HF-dichte Abschirmwand für gedruckte Schaltungen
US5495399A (en) * 1994-07-05 1996-02-27 Motorola, Inc. Shield with detachable grasp support member

Also Published As

Publication number Publication date
KR100337283B1 (ko) 2002-09-25
EP0866648A1 (de) 1998-09-23
TW484796U (en) 2002-04-21
US6181573B1 (en) 2001-01-30
CN1197368A (zh) 1998-10-28
HK1017227A1 (en) 1999-11-12
EP0866648B1 (de) 2005-01-05
DE69732174T2 (de) 2005-12-29
JPH10284867A (ja) 1998-10-23
CN1169415C (zh) 2004-09-29
CA2230321C (en) 2009-04-28
KR19980080042A (ko) 1998-11-25
CA2230321A1 (en) 1998-09-19

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