DE69733450D1 - Thermoelektrischer Halbleiter und Herstellungsverfahren dafür - Google Patents

Thermoelektrischer Halbleiter und Herstellungsverfahren dafür

Info

Publication number
DE69733450D1
DE69733450D1 DE69733450T DE69733450T DE69733450D1 DE 69733450 D1 DE69733450 D1 DE 69733450D1 DE 69733450 T DE69733450 T DE 69733450T DE 69733450 T DE69733450 T DE 69733450T DE 69733450 D1 DE69733450 D1 DE 69733450D1
Authority
DE
Germany
Prior art keywords
manufacturing
method therefor
thermoelectric semiconductor
thermoelectric
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69733450T
Other languages
English (en)
Inventor
Katsuhiro Tsuno
Tsuyoshi Tosho
Hideo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ENGINEERING ADVANCEMENT ASS OF
Technova Inc
Original Assignee
ENGINEERING ADVANCEMENT ASS OF
Technova Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ENGINEERING ADVANCEMENT ASS OF, Technova Inc filed Critical ENGINEERING ADVANCEMENT ASS OF
Application granted granted Critical
Publication of DE69733450D1 publication Critical patent/DE69733450D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • H10N10/817Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/852Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/93Thermoelectric, e.g. peltier effect cooling
DE69733450T 1996-07-26 1997-07-25 Thermoelektrischer Halbleiter und Herstellungsverfahren dafür Expired - Fee Related DE69733450D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19779096A JP3459328B2 (ja) 1996-07-26 1996-07-26 熱電半導体およびその製造方法

Publications (1)

Publication Number Publication Date
DE69733450D1 true DE69733450D1 (de) 2005-07-14

Family

ID=16380401

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69733450T Expired - Fee Related DE69733450D1 (de) 1996-07-26 1997-07-25 Thermoelektrischer Halbleiter und Herstellungsverfahren dafür

Country Status (6)

Country Link
US (2) US5959341A (de)
EP (1) EP0821417B1 (de)
JP (1) JP3459328B2 (de)
CN (1) CN1155121C (de)
AU (1) AU729198B2 (de)
DE (1) DE69733450D1 (de)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0827215A3 (de) * 1996-08-27 2000-09-20 Kubota Corporation Thermoelektrische Moduln und thermoelektrische Elemente
JP3144328B2 (ja) * 1996-12-24 2001-03-12 松下電工株式会社 熱電変換素子およびその製造方法
DE19880108C2 (de) * 1997-01-09 2002-02-07 Matsushita Electric Works Ltd Blockplatte aus einem thermoelektrischen Material, daraus geschnittene rechteckige Stange sowie Verfahren zur Herstellung einer derartigen Blockplatte
US6025649A (en) * 1997-07-22 2000-02-15 International Business Machines Corporation Pb-In-Sn tall C-4 for fatigue enhancement
US6222242B1 (en) * 1998-07-27 2001-04-24 Komatsu Ltd. Thermoelectric semiconductor material and method of manufacturing same
US6586835B1 (en) * 1998-08-31 2003-07-01 Micron Technology, Inc. Compact system module with built-in thermoelectric cooling
JP4207289B2 (ja) * 1999-02-25 2009-01-14 アイシン精機株式会社 熱電半導体の製造方法
JP2000269559A (ja) * 1999-03-12 2000-09-29 Yazaki Corp 熱電素子およびその製造方法
DE19924715A1 (de) * 1999-05-29 2000-11-30 Synthesechemie Gmbh Peltier-Element
JP2001230457A (ja) * 2000-02-16 2001-08-24 Ube Ind Ltd 熱電変換モジュール及びその製造方法
DE10035840B4 (de) * 2000-07-14 2007-06-06 Hahn-Meitner-Institut Berlin Gmbh Thermoelektrisches Halbleiterbauelement
US7942010B2 (en) * 2001-02-09 2011-05-17 Bsst, Llc Thermoelectric power generating systems utilizing segmented thermoelectric elements
US7273981B2 (en) * 2001-02-09 2007-09-25 Bsst, Llc. Thermoelectric power generation systems
US6959555B2 (en) 2001-02-09 2005-11-01 Bsst Llc High power density thermoelectric systems
US6672076B2 (en) 2001-02-09 2004-01-06 Bsst Llc Efficiency thermoelectrics utilizing convective heat flow
US7946120B2 (en) 2001-02-09 2011-05-24 Bsst, Llc High capacity thermoelectric temperature control system
JP4656271B2 (ja) * 2001-03-30 2011-03-23 株式会社Ihi 熱電素子の製造方法
US6410971B1 (en) * 2001-07-12 2002-06-25 Ferrotec (Usa) Corporation Thermoelectric module with thin film substrates
JP4671553B2 (ja) * 2001-07-30 2011-04-20 京セラ株式会社 熱電半導体の製造方法
WO2003014634A1 (en) 2001-08-07 2003-02-20 Bsst Llc Thermoelectric personal environment appliance
US6812395B2 (en) * 2001-10-24 2004-11-02 Bsst Llc Thermoelectric heterostructure assemblies element
DE10230080B4 (de) * 2002-06-27 2008-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer thermoelektrischen Schichtenstruktur und Bauelemente mit einer thermoelektrischen Schichtenstruktur
US6958443B2 (en) * 2003-05-19 2005-10-25 Applied Digital Solutions Low power thermoelectric generator
US7629531B2 (en) * 2003-05-19 2009-12-08 Digital Angel Corporation Low power thermoelectric generator
DE102004025485A1 (de) * 2004-05-21 2005-12-15 Basf Ag Neue ternäre halbleitende Legierungen mit Bandlücken kleiner als 0,8 eV
CN100413109C (zh) * 2004-05-21 2008-08-20 清华大学 具有微米级热电臂的微型热电元件的微加工方法
WO2006033875A2 (en) * 2004-09-09 2006-03-30 Orobridge, Inc. Thermoelectric devices with controlled current flow and related methods
US20060090787A1 (en) * 2004-10-28 2006-05-04 Onvural O R Thermoelectric alternators and thermoelectric climate control devices with controlled current flow for motor vehicles
US20060107989A1 (en) * 2004-11-24 2006-05-25 Marlow Industries, Inc. High watt density thermoelectrics
JP4584034B2 (ja) * 2005-05-31 2010-11-17 トヨタ自動車株式会社 熱電モジュール
US7847179B2 (en) * 2005-06-06 2010-12-07 Board Of Trustees Of Michigan State University Thermoelectric compositions and process
JP2007036178A (ja) * 2005-06-24 2007-02-08 Denso Corp 熱電変換装置および冷暖装置
WO2007032801A2 (en) 2005-06-28 2007-03-22 Bsst Llc Thermoelectric power generator for variable thermal power source
US7514013B2 (en) * 2005-09-12 2009-04-07 Mark Logan Devices with thermoelectric and thermodiodic characteristics and methods for manufacturing same
US8481842B2 (en) 2006-03-01 2013-07-09 Curamik Electronics Gmbh Process for producing Peltier modules, and Peltier module
US7870745B2 (en) 2006-03-16 2011-01-18 Bsst Llc Thermoelectric device efficiency enhancement using dynamic feedback
US7952015B2 (en) 2006-03-30 2011-05-31 Board Of Trustees Of Michigan State University Pb-Te-compounds doped with tin-antimony-tellurides for thermoelectric generators or peltier arrangements
EP2167887B1 (de) 2007-05-25 2021-01-13 Gentherm Incorporated System und verfahren für verteiltes thermoelektrisches heizen und kühlen
US20080289677A1 (en) * 2007-05-25 2008-11-27 Bsst Llc Composite thermoelectric materials and method of manufacture
BRPI0906885A2 (pt) * 2008-01-14 2019-09-24 The Ohio State University Research Foundation materiais e dispositivo termoelétricos e métodos de fabrico e de uso de dispositivo termoelétrico
WO2009094571A2 (en) * 2008-01-25 2009-07-30 The Ohio State University Research Foundation Ternary thermoelectric materials and methods of fabrication
US9435571B2 (en) * 2008-03-05 2016-09-06 Sheetak Inc. Method and apparatus for switched thermoelectric cooling of fluids
US20110000224A1 (en) * 2008-03-19 2011-01-06 Uttam Ghoshal Metal-core thermoelectric cooling and power generation device
US20090269584A1 (en) * 2008-04-24 2009-10-29 Bsst, Llc Thermoelectric materials combining increased power factor and reduced thermal conductivity
EP2315987A2 (de) * 2008-06-03 2011-05-04 Bsst Llc Thermoelektrische wärmepumpe
DE102008030191A1 (de) 2008-06-25 2010-01-07 Micropelt Gmbh Verfahren zum Herstellen einer thermoelektrischen Vorrichtung
RU2011116113A (ru) 2008-10-23 2012-11-27 БиЭсЭсТи ЭлЭлСи Многорежимная система обогрева, вентиляции и кондиционирования воздуха (овик) стермоэлектрическим устройством
US9373771B2 (en) * 2008-12-04 2016-06-21 Sheetak Inc. Enhanced metal-core thermoelectric cooling and power generation device
CN102272957A (zh) * 2009-01-02 2011-12-07 坦普罗尼克斯公司 用于能量转换、电气开关和热控开关的设备
JP2010212579A (ja) * 2009-03-12 2010-09-24 Atsumi Tec:Kk 熱電変換素子の製造方法
IN2012DN01366A (de) 2009-07-17 2015-06-05 Sheetak Inc
TWI423490B (zh) * 2009-09-28 2014-01-11 C N Liao 半導體塊材之製造方法
US20110094556A1 (en) * 2009-10-25 2011-04-28 Digital Angel Corporation Planar thermoelectric generator
EP2503610A1 (de) 2011-03-22 2012-09-26 Technical University of Denmark Struktur, die zur Herstellung eines Thermogenerators, Thermogenerator, der diese Struktur umfasst, und Verfahren zu dessen Herstellung
JP5829413B2 (ja) * 2011-03-28 2015-12-09 株式会社小松製作所 積層体
WO2012135734A2 (en) 2011-04-01 2012-10-04 Zt Plus Thermoelectric materials having porosity
KR101654587B1 (ko) 2011-06-06 2016-09-06 젠썸 인코포레이티드 카트리지 기반 열전 시스템
US9006557B2 (en) 2011-06-06 2015-04-14 Gentherm Incorporated Systems and methods for reducing current and increasing voltage in thermoelectric systems
JP5859926B2 (ja) 2011-11-25 2016-02-16 ダイセル・オルネクス株式会社 層間充填用活性エネルギー線硬化性組成物
EP2807682A1 (de) 2012-01-25 2014-12-03 Alphabet Energy, Inc. Modulare thermoelektrische einheiten für wärmerückgewinnungssysteme und verfahren dafür
US9257627B2 (en) 2012-07-23 2016-02-09 Alphabet Energy, Inc. Method and structure for thermoelectric unicouple assembly
EP2880270A2 (de) 2012-08-01 2015-06-10 Gentherm Incorporated Hocheffiziente wärmeenergieerzeugung
KR102094995B1 (ko) 2012-10-08 2020-03-31 삼성전자주식회사 열전모듈, 이를 구비한 열전장치, 및 열전모듈의 제조방법
US20140102498A1 (en) * 2012-10-11 2014-04-17 Gmz Energy, Inc. Methods of Fabricating Thermoelectric Elements
US10454013B2 (en) * 2012-11-16 2019-10-22 Micropower Global Limited Thermoelectric device
US10270141B2 (en) 2013-01-30 2019-04-23 Gentherm Incorporated Thermoelectric-based thermal management system
US9065017B2 (en) 2013-09-01 2015-06-23 Alphabet Energy, Inc. Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same
US20150171304A1 (en) * 2013-12-17 2015-06-18 Evident Technologies Thermoelectric Elements Including of Axially Dependent Material Properties
JP6232312B2 (ja) * 2014-02-24 2017-11-15 直江津電子工業株式会社 熱電変換材料の製造装置及び製造方法
CN104646671B (zh) * 2015-01-04 2016-09-21 武汉理工大学 一种超快速制备Cu2Se基热电发电元器件的方法
JP6527003B2 (ja) 2015-04-06 2019-06-05 ダイセル・オルネクス株式会社 層間充填用硬化性樹脂組成物
JP2017204550A (ja) * 2016-05-11 2017-11-16 積水化学工業株式会社 熱電変換材料、熱電変換素子及び熱電変換素子の製造方法
US11233187B2 (en) 2016-06-01 2022-01-25 Lg Innotek Co., Ltd. Thermoelectric leg and thermoelectric element comprising same
KR101983627B1 (ko) * 2017-06-13 2019-05-29 한국과학기술원 3차원 밀도 구배 접합 구조를 갖는 열전 모듈 및 그 제조 방법
US11075331B2 (en) 2018-07-30 2021-07-27 Gentherm Incorporated Thermoelectric device having circuitry with structural rigidity
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
KR102621998B1 (ko) * 2019-03-29 2024-01-08 엘지이노텍 주식회사 열전 레그 및 이를 포함하는 열전 소자
JP7438685B2 (ja) * 2019-07-30 2024-02-27 株式会社Kelk 熱電モジュール及び熱電モジュールの製造方法
CN110690340B (zh) * 2019-09-27 2023-04-07 太原理工大学 一种优化碲化铅基热电材料/电极接头性能的方法
CN110707205B (zh) * 2019-09-27 2023-09-29 太原理工大学 一种提升Te基热电接头性能的方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3086068A (en) * 1959-06-10 1963-04-16 Westinghouse Electric Corp Process for the preparation of thermo-electric elements
GB952678A (en) * 1961-01-23 1964-03-18 Wfstinghouse Electric Corp Composite thermoelectric elements and devices
US3859143A (en) * 1970-07-23 1975-01-07 Rca Corp Stable bonded barrier layer-telluride thermoelectric device
US3988171A (en) * 1971-06-07 1976-10-26 Rockwell International Corporation Bonded electrical contact for thermoelectric semiconductor element
US4489742A (en) * 1983-07-21 1984-12-25 Energy Conversion Devices, Inc. Thermoelectric device and method of making and using same
US4654224A (en) * 1985-02-19 1987-03-31 Energy Conversion Devices, Inc. Method of manufacturing a thermoelectric element
US4855810A (en) * 1987-06-02 1989-08-08 Gelb Allan S Thermoelectric heat pump
US5108515A (en) * 1988-11-15 1992-04-28 Director-General, Agency Of Industrial Science And Technology Thermoelectric material and process for production thereof
JP3451107B2 (ja) * 1992-10-05 2003-09-29 株式会社エコ・トゥエンティーワン 電子冷却装置
US5439528A (en) * 1992-12-11 1995-08-08 Miller; Joel Laminated thermo element
US5441576A (en) * 1993-02-01 1995-08-15 Bierschenk; James L. Thermoelectric cooler
US5429680A (en) * 1993-11-19 1995-07-04 Fuschetti; Dean F. Thermoelectric heat pump
JP3216378B2 (ja) * 1993-12-28 2001-10-09 日産自動車株式会社 熱電装置およびその製造方法
JP3382717B2 (ja) * 1994-05-31 2003-03-04 三菱重工業株式会社 熱電発電素子の製造方法
US5981863A (en) * 1995-03-03 1999-11-09 Yamaha Corporation Process of manufacturing thermoelectric refrigerator alloy having large figure of merit
US5817188A (en) * 1995-10-03 1998-10-06 Melcor Corporation Fabrication of thermoelectric modules and solder for such fabrication
US6025554A (en) * 1995-10-16 2000-02-15 Macris; Chris Thermoelectric device and method of manufacture
US5763293A (en) * 1996-03-04 1998-06-09 Yamaha Corporation Process of fabricating a thermoelectric module formed of V-VI group compound semiconductor including the steps of rapid cooling and hot pressing
JP3541549B2 (ja) * 1996-03-19 2004-07-14 日産自動車株式会社 高温用熱電材料およびその製造方法
EP0827215A3 (de) * 1996-08-27 2000-09-20 Kubota Corporation Thermoelektrische Moduln und thermoelektrische Elemente

Also Published As

Publication number Publication date
CN1155121C (zh) 2004-06-23
EP0821417A3 (de) 1999-12-15
AU729198B2 (en) 2001-01-25
EP0821417A2 (de) 1998-01-28
CN1173742A (zh) 1998-02-18
US5959341A (en) 1999-09-28
US6172294B1 (en) 2001-01-09
AU3082197A (en) 1998-02-05
JPH1041553A (ja) 1998-02-13
EP0821417B1 (de) 2005-06-08
JP3459328B2 (ja) 2003-10-20

Similar Documents

Publication Publication Date Title
DE69733450D1 (de) Thermoelektrischer Halbleiter und Herstellungsverfahren dafür
DE69721411D1 (de) Halbleiteranordnung und Herstellungsverfahren dafür
DE69834561D1 (de) Halbleiteranordnung und herstellungsverfahren dafür
DE69737588D1 (de) Halbleiteranordnung und Herstellungsverfahren dafür
DE69527330T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE69435045D1 (de) Halbleiter-Anordnung und Herstellungsverfahren dafür
KR960009110A (ko) 반도체 장치 및 그 제조방법
DE69838597D1 (de) Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren
KR950034612A (ko) 반도체 구조물 및 그 제조 방법
DE69522514T2 (de) Halbleiteranordnung und Herstellungsverfahren
DE69526539D1 (de) Halbleiteranordnung und Herstellungsverfahren
KR960009107A (ko) 반도체장치와 그 제조방법
DE69525795D1 (de) Halbleiteranordnung und Herstellungsverfahren
DE69413602D1 (de) Halbleiteranordnung und Herstellungsverfahren
DE69435205D1 (de) Dünne Halbleitervorrichtung und Herstellungsverfahren
DE69826975D1 (de) Thermoelektrisches element und herstellungsverfahren dafür
DE69424728D1 (de) Halbleiteranordnung und zugehörige Herstellungsmethode
KR960015900A (ko) 반도체 장치 및 그 제조방법
DE69738012D1 (de) Halbleitervorrichtung und deren Herstellungsverfahren
KR970004015A (ko) 반도체장치 및 그의 제조방법
DE69727608D1 (de) Halbleiterlaservorrichtung und zugehöriges Entwurfsverfahren
KR960012313A (ko) 반도체 장치 및 그 제조방법
DE69801342D1 (de) Halbleiterlaser und dazugehöriges Herstellungsverfahren
DE69712541T2 (de) Halbleiterlaser und Herstellungsverfahren
GB2322005B (en) Semiconductor device and manufacturing method of the same

Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee