DE69733450D1 - Thermoelektrischer Halbleiter und Herstellungsverfahren dafür - Google Patents
Thermoelektrischer Halbleiter und Herstellungsverfahren dafürInfo
- Publication number
- DE69733450D1 DE69733450D1 DE69733450T DE69733450T DE69733450D1 DE 69733450 D1 DE69733450 D1 DE 69733450D1 DE 69733450 T DE69733450 T DE 69733450T DE 69733450 T DE69733450 T DE 69733450T DE 69733450 D1 DE69733450 D1 DE 69733450D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- method therefor
- thermoelectric semiconductor
- thermoelectric
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/93—Thermoelectric, e.g. peltier effect cooling
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19779096A JP3459328B2 (ja) | 1996-07-26 | 1996-07-26 | 熱電半導体およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69733450D1 true DE69733450D1 (de) | 2005-07-14 |
Family
ID=16380401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69733450T Expired - Fee Related DE69733450D1 (de) | 1996-07-26 | 1997-07-25 | Thermoelektrischer Halbleiter und Herstellungsverfahren dafür |
Country Status (6)
Country | Link |
---|---|
US (2) | US5959341A (de) |
EP (1) | EP0821417B1 (de) |
JP (1) | JP3459328B2 (de) |
CN (1) | CN1155121C (de) |
AU (1) | AU729198B2 (de) |
DE (1) | DE69733450D1 (de) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0827215A3 (de) * | 1996-08-27 | 2000-09-20 | Kubota Corporation | Thermoelektrische Moduln und thermoelektrische Elemente |
JP3144328B2 (ja) * | 1996-12-24 | 2001-03-12 | 松下電工株式会社 | 熱電変換素子およびその製造方法 |
DE19880108C2 (de) * | 1997-01-09 | 2002-02-07 | Matsushita Electric Works Ltd | Blockplatte aus einem thermoelektrischen Material, daraus geschnittene rechteckige Stange sowie Verfahren zur Herstellung einer derartigen Blockplatte |
US6025649A (en) * | 1997-07-22 | 2000-02-15 | International Business Machines Corporation | Pb-In-Sn tall C-4 for fatigue enhancement |
US6222242B1 (en) * | 1998-07-27 | 2001-04-24 | Komatsu Ltd. | Thermoelectric semiconductor material and method of manufacturing same |
US6586835B1 (en) * | 1998-08-31 | 2003-07-01 | Micron Technology, Inc. | Compact system module with built-in thermoelectric cooling |
JP4207289B2 (ja) * | 1999-02-25 | 2009-01-14 | アイシン精機株式会社 | 熱電半導体の製造方法 |
JP2000269559A (ja) * | 1999-03-12 | 2000-09-29 | Yazaki Corp | 熱電素子およびその製造方法 |
DE19924715A1 (de) * | 1999-05-29 | 2000-11-30 | Synthesechemie Gmbh | Peltier-Element |
JP2001230457A (ja) * | 2000-02-16 | 2001-08-24 | Ube Ind Ltd | 熱電変換モジュール及びその製造方法 |
DE10035840B4 (de) * | 2000-07-14 | 2007-06-06 | Hahn-Meitner-Institut Berlin Gmbh | Thermoelektrisches Halbleiterbauelement |
US7942010B2 (en) * | 2001-02-09 | 2011-05-17 | Bsst, Llc | Thermoelectric power generating systems utilizing segmented thermoelectric elements |
US7273981B2 (en) * | 2001-02-09 | 2007-09-25 | Bsst, Llc. | Thermoelectric power generation systems |
US6959555B2 (en) | 2001-02-09 | 2005-11-01 | Bsst Llc | High power density thermoelectric systems |
US6672076B2 (en) | 2001-02-09 | 2004-01-06 | Bsst Llc | Efficiency thermoelectrics utilizing convective heat flow |
US7946120B2 (en) | 2001-02-09 | 2011-05-24 | Bsst, Llc | High capacity thermoelectric temperature control system |
JP4656271B2 (ja) * | 2001-03-30 | 2011-03-23 | 株式会社Ihi | 熱電素子の製造方法 |
US6410971B1 (en) * | 2001-07-12 | 2002-06-25 | Ferrotec (Usa) Corporation | Thermoelectric module with thin film substrates |
JP4671553B2 (ja) * | 2001-07-30 | 2011-04-20 | 京セラ株式会社 | 熱電半導体の製造方法 |
WO2003014634A1 (en) | 2001-08-07 | 2003-02-20 | Bsst Llc | Thermoelectric personal environment appliance |
US6812395B2 (en) * | 2001-10-24 | 2004-11-02 | Bsst Llc | Thermoelectric heterostructure assemblies element |
DE10230080B4 (de) * | 2002-06-27 | 2008-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung einer thermoelektrischen Schichtenstruktur und Bauelemente mit einer thermoelektrischen Schichtenstruktur |
US6958443B2 (en) * | 2003-05-19 | 2005-10-25 | Applied Digital Solutions | Low power thermoelectric generator |
US7629531B2 (en) * | 2003-05-19 | 2009-12-08 | Digital Angel Corporation | Low power thermoelectric generator |
DE102004025485A1 (de) * | 2004-05-21 | 2005-12-15 | Basf Ag | Neue ternäre halbleitende Legierungen mit Bandlücken kleiner als 0,8 eV |
CN100413109C (zh) * | 2004-05-21 | 2008-08-20 | 清华大学 | 具有微米级热电臂的微型热电元件的微加工方法 |
WO2006033875A2 (en) * | 2004-09-09 | 2006-03-30 | Orobridge, Inc. | Thermoelectric devices with controlled current flow and related methods |
US20060090787A1 (en) * | 2004-10-28 | 2006-05-04 | Onvural O R | Thermoelectric alternators and thermoelectric climate control devices with controlled current flow for motor vehicles |
US20060107989A1 (en) * | 2004-11-24 | 2006-05-25 | Marlow Industries, Inc. | High watt density thermoelectrics |
JP4584034B2 (ja) * | 2005-05-31 | 2010-11-17 | トヨタ自動車株式会社 | 熱電モジュール |
US7847179B2 (en) * | 2005-06-06 | 2010-12-07 | Board Of Trustees Of Michigan State University | Thermoelectric compositions and process |
JP2007036178A (ja) * | 2005-06-24 | 2007-02-08 | Denso Corp | 熱電変換装置および冷暖装置 |
WO2007032801A2 (en) | 2005-06-28 | 2007-03-22 | Bsst Llc | Thermoelectric power generator for variable thermal power source |
US7514013B2 (en) * | 2005-09-12 | 2009-04-07 | Mark Logan | Devices with thermoelectric and thermodiodic characteristics and methods for manufacturing same |
US8481842B2 (en) | 2006-03-01 | 2013-07-09 | Curamik Electronics Gmbh | Process for producing Peltier modules, and Peltier module |
US7870745B2 (en) | 2006-03-16 | 2011-01-18 | Bsst Llc | Thermoelectric device efficiency enhancement using dynamic feedback |
US7952015B2 (en) | 2006-03-30 | 2011-05-31 | Board Of Trustees Of Michigan State University | Pb-Te-compounds doped with tin-antimony-tellurides for thermoelectric generators or peltier arrangements |
EP2167887B1 (de) | 2007-05-25 | 2021-01-13 | Gentherm Incorporated | System und verfahren für verteiltes thermoelektrisches heizen und kühlen |
US20080289677A1 (en) * | 2007-05-25 | 2008-11-27 | Bsst Llc | Composite thermoelectric materials and method of manufacture |
BRPI0906885A2 (pt) * | 2008-01-14 | 2019-09-24 | The Ohio State University Research Foundation | materiais e dispositivo termoelétricos e métodos de fabrico e de uso de dispositivo termoelétrico |
WO2009094571A2 (en) * | 2008-01-25 | 2009-07-30 | The Ohio State University Research Foundation | Ternary thermoelectric materials and methods of fabrication |
US9435571B2 (en) * | 2008-03-05 | 2016-09-06 | Sheetak Inc. | Method and apparatus for switched thermoelectric cooling of fluids |
US20110000224A1 (en) * | 2008-03-19 | 2011-01-06 | Uttam Ghoshal | Metal-core thermoelectric cooling and power generation device |
US20090269584A1 (en) * | 2008-04-24 | 2009-10-29 | Bsst, Llc | Thermoelectric materials combining increased power factor and reduced thermal conductivity |
EP2315987A2 (de) * | 2008-06-03 | 2011-05-04 | Bsst Llc | Thermoelektrische wärmepumpe |
DE102008030191A1 (de) | 2008-06-25 | 2010-01-07 | Micropelt Gmbh | Verfahren zum Herstellen einer thermoelektrischen Vorrichtung |
RU2011116113A (ru) | 2008-10-23 | 2012-11-27 | БиЭсЭсТи ЭлЭлСи | Многорежимная система обогрева, вентиляции и кондиционирования воздуха (овик) стермоэлектрическим устройством |
US9373771B2 (en) * | 2008-12-04 | 2016-06-21 | Sheetak Inc. | Enhanced metal-core thermoelectric cooling and power generation device |
CN102272957A (zh) * | 2009-01-02 | 2011-12-07 | 坦普罗尼克斯公司 | 用于能量转换、电气开关和热控开关的设备 |
JP2010212579A (ja) * | 2009-03-12 | 2010-09-24 | Atsumi Tec:Kk | 熱電変換素子の製造方法 |
IN2012DN01366A (de) | 2009-07-17 | 2015-06-05 | Sheetak Inc | |
TWI423490B (zh) * | 2009-09-28 | 2014-01-11 | C N Liao | 半導體塊材之製造方法 |
US20110094556A1 (en) * | 2009-10-25 | 2011-04-28 | Digital Angel Corporation | Planar thermoelectric generator |
EP2503610A1 (de) | 2011-03-22 | 2012-09-26 | Technical University of Denmark | Struktur, die zur Herstellung eines Thermogenerators, Thermogenerator, der diese Struktur umfasst, und Verfahren zu dessen Herstellung |
JP5829413B2 (ja) * | 2011-03-28 | 2015-12-09 | 株式会社小松製作所 | 積層体 |
WO2012135734A2 (en) | 2011-04-01 | 2012-10-04 | Zt Plus | Thermoelectric materials having porosity |
KR101654587B1 (ko) | 2011-06-06 | 2016-09-06 | 젠썸 인코포레이티드 | 카트리지 기반 열전 시스템 |
US9006557B2 (en) | 2011-06-06 | 2015-04-14 | Gentherm Incorporated | Systems and methods for reducing current and increasing voltage in thermoelectric systems |
JP5859926B2 (ja) | 2011-11-25 | 2016-02-16 | ダイセル・オルネクス株式会社 | 層間充填用活性エネルギー線硬化性組成物 |
EP2807682A1 (de) | 2012-01-25 | 2014-12-03 | Alphabet Energy, Inc. | Modulare thermoelektrische einheiten für wärmerückgewinnungssysteme und verfahren dafür |
US9257627B2 (en) | 2012-07-23 | 2016-02-09 | Alphabet Energy, Inc. | Method and structure for thermoelectric unicouple assembly |
EP2880270A2 (de) | 2012-08-01 | 2015-06-10 | Gentherm Incorporated | Hocheffiziente wärmeenergieerzeugung |
KR102094995B1 (ko) | 2012-10-08 | 2020-03-31 | 삼성전자주식회사 | 열전모듈, 이를 구비한 열전장치, 및 열전모듈의 제조방법 |
US20140102498A1 (en) * | 2012-10-11 | 2014-04-17 | Gmz Energy, Inc. | Methods of Fabricating Thermoelectric Elements |
US10454013B2 (en) * | 2012-11-16 | 2019-10-22 | Micropower Global Limited | Thermoelectric device |
US10270141B2 (en) | 2013-01-30 | 2019-04-23 | Gentherm Incorporated | Thermoelectric-based thermal management system |
US9065017B2 (en) | 2013-09-01 | 2015-06-23 | Alphabet Energy, Inc. | Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same |
US20150171304A1 (en) * | 2013-12-17 | 2015-06-18 | Evident Technologies | Thermoelectric Elements Including of Axially Dependent Material Properties |
JP6232312B2 (ja) * | 2014-02-24 | 2017-11-15 | 直江津電子工業株式会社 | 熱電変換材料の製造装置及び製造方法 |
CN104646671B (zh) * | 2015-01-04 | 2016-09-21 | 武汉理工大学 | 一种超快速制备Cu2Se基热电发电元器件的方法 |
JP6527003B2 (ja) | 2015-04-06 | 2019-06-05 | ダイセル・オルネクス株式会社 | 層間充填用硬化性樹脂組成物 |
JP2017204550A (ja) * | 2016-05-11 | 2017-11-16 | 積水化学工業株式会社 | 熱電変換材料、熱電変換素子及び熱電変換素子の製造方法 |
US11233187B2 (en) | 2016-06-01 | 2022-01-25 | Lg Innotek Co., Ltd. | Thermoelectric leg and thermoelectric element comprising same |
KR101983627B1 (ko) * | 2017-06-13 | 2019-05-29 | 한국과학기술원 | 3차원 밀도 구배 접합 구조를 갖는 열전 모듈 및 그 제조 방법 |
US11075331B2 (en) | 2018-07-30 | 2021-07-27 | Gentherm Incorporated | Thermoelectric device having circuitry with structural rigidity |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
KR102621998B1 (ko) * | 2019-03-29 | 2024-01-08 | 엘지이노텍 주식회사 | 열전 레그 및 이를 포함하는 열전 소자 |
JP7438685B2 (ja) * | 2019-07-30 | 2024-02-27 | 株式会社Kelk | 熱電モジュール及び熱電モジュールの製造方法 |
CN110690340B (zh) * | 2019-09-27 | 2023-04-07 | 太原理工大学 | 一种优化碲化铅基热电材料/电极接头性能的方法 |
CN110707205B (zh) * | 2019-09-27 | 2023-09-29 | 太原理工大学 | 一种提升Te基热电接头性能的方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3086068A (en) * | 1959-06-10 | 1963-04-16 | Westinghouse Electric Corp | Process for the preparation of thermo-electric elements |
GB952678A (en) * | 1961-01-23 | 1964-03-18 | Wfstinghouse Electric Corp | Composite thermoelectric elements and devices |
US3859143A (en) * | 1970-07-23 | 1975-01-07 | Rca Corp | Stable bonded barrier layer-telluride thermoelectric device |
US3988171A (en) * | 1971-06-07 | 1976-10-26 | Rockwell International Corporation | Bonded electrical contact for thermoelectric semiconductor element |
US4489742A (en) * | 1983-07-21 | 1984-12-25 | Energy Conversion Devices, Inc. | Thermoelectric device and method of making and using same |
US4654224A (en) * | 1985-02-19 | 1987-03-31 | Energy Conversion Devices, Inc. | Method of manufacturing a thermoelectric element |
US4855810A (en) * | 1987-06-02 | 1989-08-08 | Gelb Allan S | Thermoelectric heat pump |
US5108515A (en) * | 1988-11-15 | 1992-04-28 | Director-General, Agency Of Industrial Science And Technology | Thermoelectric material and process for production thereof |
JP3451107B2 (ja) * | 1992-10-05 | 2003-09-29 | 株式会社エコ・トゥエンティーワン | 電子冷却装置 |
US5439528A (en) * | 1992-12-11 | 1995-08-08 | Miller; Joel | Laminated thermo element |
US5441576A (en) * | 1993-02-01 | 1995-08-15 | Bierschenk; James L. | Thermoelectric cooler |
US5429680A (en) * | 1993-11-19 | 1995-07-04 | Fuschetti; Dean F. | Thermoelectric heat pump |
JP3216378B2 (ja) * | 1993-12-28 | 2001-10-09 | 日産自動車株式会社 | 熱電装置およびその製造方法 |
JP3382717B2 (ja) * | 1994-05-31 | 2003-03-04 | 三菱重工業株式会社 | 熱電発電素子の製造方法 |
US5981863A (en) * | 1995-03-03 | 1999-11-09 | Yamaha Corporation | Process of manufacturing thermoelectric refrigerator alloy having large figure of merit |
US5817188A (en) * | 1995-10-03 | 1998-10-06 | Melcor Corporation | Fabrication of thermoelectric modules and solder for such fabrication |
US6025554A (en) * | 1995-10-16 | 2000-02-15 | Macris; Chris | Thermoelectric device and method of manufacture |
US5763293A (en) * | 1996-03-04 | 1998-06-09 | Yamaha Corporation | Process of fabricating a thermoelectric module formed of V-VI group compound semiconductor including the steps of rapid cooling and hot pressing |
JP3541549B2 (ja) * | 1996-03-19 | 2004-07-14 | 日産自動車株式会社 | 高温用熱電材料およびその製造方法 |
EP0827215A3 (de) * | 1996-08-27 | 2000-09-20 | Kubota Corporation | Thermoelektrische Moduln und thermoelektrische Elemente |
-
1996
- 1996-07-26 JP JP19779096A patent/JP3459328B2/ja not_active Expired - Lifetime
-
1997
- 1997-07-25 AU AU30821/97A patent/AU729198B2/en not_active Ceased
- 1997-07-25 EP EP97202347A patent/EP0821417B1/de not_active Expired - Lifetime
- 1997-07-25 DE DE69733450T patent/DE69733450D1/de not_active Expired - Fee Related
- 1997-07-28 CN CNB971155682A patent/CN1155121C/zh not_active Expired - Fee Related
- 1997-07-28 US US08/901,791 patent/US5959341A/en not_active Expired - Fee Related
-
1999
- 1999-04-12 US US09/289,063 patent/US6172294B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1155121C (zh) | 2004-06-23 |
EP0821417A3 (de) | 1999-12-15 |
AU729198B2 (en) | 2001-01-25 |
EP0821417A2 (de) | 1998-01-28 |
CN1173742A (zh) | 1998-02-18 |
US5959341A (en) | 1999-09-28 |
US6172294B1 (en) | 2001-01-09 |
AU3082197A (en) | 1998-02-05 |
JPH1041553A (ja) | 1998-02-13 |
EP0821417B1 (de) | 2005-06-08 |
JP3459328B2 (ja) | 2003-10-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69733450D1 (de) | Thermoelektrischer Halbleiter und Herstellungsverfahren dafür | |
DE69721411D1 (de) | Halbleiteranordnung und Herstellungsverfahren dafür | |
DE69834561D1 (de) | Halbleiteranordnung und herstellungsverfahren dafür | |
DE69737588D1 (de) | Halbleiteranordnung und Herstellungsverfahren dafür | |
DE69527330T2 (de) | Halbleiteranordnung und Herstellungsverfahren | |
DE69435045D1 (de) | Halbleiter-Anordnung und Herstellungsverfahren dafür | |
KR960009110A (ko) | 반도체 장치 및 그 제조방법 | |
DE69838597D1 (de) | Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren | |
KR950034612A (ko) | 반도체 구조물 및 그 제조 방법 | |
DE69522514T2 (de) | Halbleiteranordnung und Herstellungsverfahren | |
DE69526539D1 (de) | Halbleiteranordnung und Herstellungsverfahren | |
KR960009107A (ko) | 반도체장치와 그 제조방법 | |
DE69525795D1 (de) | Halbleiteranordnung und Herstellungsverfahren | |
DE69413602D1 (de) | Halbleiteranordnung und Herstellungsverfahren | |
DE69435205D1 (de) | Dünne Halbleitervorrichtung und Herstellungsverfahren | |
DE69826975D1 (de) | Thermoelektrisches element und herstellungsverfahren dafür | |
DE69424728D1 (de) | Halbleiteranordnung und zugehörige Herstellungsmethode | |
KR960015900A (ko) | 반도체 장치 및 그 제조방법 | |
DE69738012D1 (de) | Halbleitervorrichtung und deren Herstellungsverfahren | |
KR970004015A (ko) | 반도체장치 및 그의 제조방법 | |
DE69727608D1 (de) | Halbleiterlaservorrichtung und zugehöriges Entwurfsverfahren | |
KR960012313A (ko) | 반도체 장치 및 그 제조방법 | |
DE69801342D1 (de) | Halbleiterlaser und dazugehöriges Herstellungsverfahren | |
DE69712541T2 (de) | Halbleiterlaser und Herstellungsverfahren | |
GB2322005B (en) | Semiconductor device and manufacturing method of the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |