DE69733530D1 - Flexibler verbundstoff ohne klebstoff und verfahren zu seiner herstellung - Google Patents

Flexibler verbundstoff ohne klebstoff und verfahren zu seiner herstellung

Info

Publication number
DE69733530D1
DE69733530D1 DE69733530T DE69733530T DE69733530D1 DE 69733530 D1 DE69733530 D1 DE 69733530D1 DE 69733530 T DE69733530 T DE 69733530T DE 69733530 T DE69733530 T DE 69733530T DE 69733530 D1 DE69733530 D1 DE 69733530D1
Authority
DE
Germany
Prior art keywords
adhesive
production
flexible composite
composite
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69733530T
Other languages
English (en)
Other versions
DE69733530T2 (de
DE69733530T3 (de
Inventor
E Bergkessel
Tad Bergstresser
Shiuh-Kao Chiang
K Prokop
B Russell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Nikko Materials USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27360377&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69733530(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nikko Materials USA Inc filed Critical Nikko Materials USA Inc
Publication of DE69733530D1 publication Critical patent/DE69733530D1/de
Publication of DE69733530T2 publication Critical patent/DE69733530T2/de
Application granted granted Critical
Publication of DE69733530T3 publication Critical patent/DE69733530T3/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
DE69733530T 1996-04-18 1997-04-14 Flexibler verbundstoff ohne klebstoff und verfahren zu seiner herstellung Expired - Lifetime DE69733530T3 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US832097 1986-02-21
US1555896P 1996-04-18 1996-04-18
US15558P 1996-04-18
US1869796P 1996-05-30 1996-05-30
US18697P 1996-05-30
US08/832,097 US6171714B1 (en) 1996-04-18 1997-04-03 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
EP97918602A EP0840676B2 (de) 1996-04-18 1997-04-14 Flexibler verbundstoff ohne klebstoff und verfahren zu seiner herstellung
PCT/US1997/006144 WO1997038851A1 (en) 1996-04-18 1997-04-14 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate

Publications (3)

Publication Number Publication Date
DE69733530D1 true DE69733530D1 (de) 2005-07-21
DE69733530T2 DE69733530T2 (de) 2006-05-11
DE69733530T3 DE69733530T3 (de) 2012-01-12

Family

ID=27360377

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69733530T Expired - Lifetime DE69733530T3 (de) 1996-04-18 1997-04-14 Flexibler verbundstoff ohne klebstoff und verfahren zu seiner herstellung

Country Status (7)

Country Link
US (1) US6171714B1 (de)
EP (1) EP0840676B2 (de)
JP (1) JP3173511B2 (de)
KR (1) KR100326342B1 (de)
CN (1) CN1124203C (de)
DE (1) DE69733530T3 (de)
WO (1) WO1997038851A1 (de)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6194076B1 (en) * 1997-04-22 2001-02-27 International Business Machines Corporation Method of forming adherent metal components on a polyimide substrate
CN1289376A (zh) * 1998-01-30 2001-03-28 纳慕尔杜邦公司 金属镀液晶聚合物的方法和与其相关的组合物
US6146480A (en) * 1999-03-12 2000-11-14 Ga-Tek Inc. Flexible laminate for flexible circuit
US20020152955A1 (en) * 1999-12-30 2002-10-24 Yezdi Dordi Apparatus and method for depositing an electroless solution
CA2327801A1 (en) * 2000-03-21 2001-09-21 Rocky L. Hilburn Copper on polymer component having improved adhesion
US6629348B2 (en) 2001-05-01 2003-10-07 Oak-Mitsui, Inc. Substrate adhesion enhancement to film
JP2003011272A (ja) * 2001-07-02 2003-01-15 Mitsubishi Shindoh Co Ltd 金属化ポリイミドフィルム
JP2003133230A (ja) * 2001-10-29 2003-05-09 Mitsubishi Heavy Ind Ltd フレキシブル基板の半導体処理装置
JP3563730B2 (ja) 2002-06-07 2004-09-08 松下電器産業株式会社 フレキシブルプリント回路基板
US20040040148A1 (en) * 2002-08-29 2004-03-04 Parlex Corporation Manufacture of flexible printed circuit boards
JP4107952B2 (ja) * 2002-12-04 2008-06-25 三洋電機株式会社 回路装置の製造方法
US7134197B2 (en) * 2003-12-18 2006-11-14 Honeywell International Inc. Plastic lead frames utilizing reel-to-reel processing
KR100593741B1 (ko) * 2004-08-02 2006-06-30 도레이새한 주식회사 구리 삼성분계 화합물을 타이층으로 사용한연성회로기판용 적층구조체
KR100701645B1 (ko) * 2004-08-02 2007-03-30 도레이새한 주식회사 연성회로기판용 적층구조체의 제조방법
KR100701641B1 (ko) * 2004-08-02 2007-03-30 도레이새한 주식회사 진공증착에 의해 구리도금층을 형성하는 연성회로기판용 적층구조체의 제조방법 및 그 장치
WO2006025240A1 (ja) * 2004-09-01 2006-03-09 Sumitomo Metal Mining Co., Ltd. ２層フレキシブル基板及びその製造方法
KR100858310B1 (ko) * 2004-09-01 2008-09-11 스미토모 긴조쿠 고잔 가부시키가이샤 2층 플렉시블 기판 및 그 제조 방법
WO2006087873A1 (ja) * 2005-02-17 2006-08-24 Nippon Mining & Metals Co., Ltd. フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット
US20060251853A1 (en) * 2005-05-09 2006-11-09 Ingram William O Iii Method and apparatus for making carpet
US7379271B1 (en) 2005-05-16 2008-05-27 Magnecomp Corporation Multilayer gimbal suspension element manufacture with co-etchable layers
US20080102305A1 (en) * 2005-08-24 2008-05-01 Sumitomo Metal Mining Co., Ltd. Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof
JP2007081274A (ja) * 2005-09-16 2007-03-29 Oike Ind Co Ltd フレキシブル回路用基板
JP2007081275A (ja) * 2005-09-16 2007-03-29 Oike Ind Co Ltd フレキシブル回路用基板
US20070197922A1 (en) * 2006-02-17 2007-08-23 Honeywell International Inc. Disposable pressure sensor systems and packages therefor
JP2008168585A (ja) * 2007-01-15 2008-07-24 Mitsubishi Shindoh Co Ltd フレキシブル積層板
KR101133488B1 (ko) * 2007-03-20 2012-04-10 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 무접착제 플렉시블 라미네이트 및 그 제조 방법
JP4550080B2 (ja) 2007-03-26 2010-09-22 シャープ株式会社 半導体装置および液晶モジュール
DE502007001444D1 (de) * 2007-04-04 2009-10-15 Applied Materials Inc Vorrichtung und Verfahren zur Beschichtung eines Kunststoffsubstrates
US8309627B2 (en) 2007-09-07 2012-11-13 Nexolve Corporation Polymeric coating for the protection of objects
KR101136774B1 (ko) * 2007-10-18 2012-04-19 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 금속 피복 폴리이미드 복합체 및 그 복합체의 제조 방법 그리고 전자 회로 기판의 제조 방법
JP4477098B2 (ja) * 2007-10-18 2010-06-09 日鉱金属株式会社 金属被覆ポリイミド複合体、同複合体の製造方法及び同複合体の製造装置
US20090148715A1 (en) * 2007-12-11 2009-06-11 Toray Plastics (America), Inc. Process to produce biaxially oriented polylactic acid film at high transverse orientation rates
KR100948859B1 (ko) 2007-12-20 2010-03-22 한국과학기술연구원 고밀착력 무접착제 연성 회로기판 및 이의 연속적 제작방법
JP5223325B2 (ja) * 2007-12-21 2013-06-26 住友金属鉱山株式会社 金属被覆ポリエチレンナフタレート基板とその製造方法
WO2009098832A1 (ja) 2008-02-04 2009-08-13 Nippon Mining & Metals Co., Ltd. 無接着剤フレキシブルラミネート
JP5188823B2 (ja) * 2008-02-05 2013-04-24 Ｊｘ日鉱日石金属株式会社 金属被覆ポリイミド複合体、同複合体の製造方法及び同複合体の製造装置
EP2323788B1 (de) * 2008-08-15 2014-07-30 Toray Plastics (America) , Inc. Biaxial orientierte polymilchsäurefolie mit hoher barriere
KR101426038B1 (ko) * 2008-11-13 2014-08-01 주식회사 엠디에스 인쇄회로기판 및 그 제조방법
KR101269816B1 (ko) * 2008-12-26 2013-05-30 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 플렉시블 라미네이트 및 그 라미네이트를 사용하여 형성한 플렉시블 전자 회로 기판
EP2402152A4 (de) 2009-02-25 2014-04-09 Jx Nippon Mining & Metals Corp Metallkaschiertes polyimidharzsubstrat mit hervorragender wärmealterungsresistenz
SG173595A1 (en) * 2009-02-25 2011-09-29 Jx Nippon Mining & Metals Corp Metal-coated polyimide resin substrate with excellent thermal aging resistance properties
US9150004B2 (en) * 2009-06-19 2015-10-06 Toray Plastics (America), Inc. Biaxially oriented polylactic acid film with improved heat seal properties
US20100330382A1 (en) * 2009-06-26 2010-12-30 Toray Plastics (America), Inc. Biaxially oriented polylactic acid film with improved moisture barrier
US9221213B2 (en) * 2009-09-25 2015-12-29 Toray Plastics (America), Inc. Multi-layer high moisture barrier polylactic acid film
EP2480710B1 (de) 2009-09-25 2018-01-24 Toray Plastics (America) , Inc. Mehrschichtige polymilchsäurefolie mit hoher feuchtigkeitsbarriere sowie verfahren zu deren herstellung
EP2315495B1 (de) * 2009-10-22 2013-11-06 SMR Patents S.à.r.l. Verfahren zur Anwendung einer Heizfunktion auf Kunststoffglas
CN102771197A (zh) * 2010-02-22 2012-11-07 吉坤日矿日石金属株式会社 柔性层压基板上的电路形成方法
JP2011177899A (ja) * 2010-02-26 2011-09-15 Jx Nippon Mining & Metals Corp 無接着剤フレキシブルラミネート及びその製造方法
EP2552689B1 (de) 2010-03-31 2017-10-25 Toray Plastics (America) , Inc. Biaxial ausgerichtete polymilchsäurefolie mit vermindertem rauschpegel
US9492962B2 (en) 2010-03-31 2016-11-15 Toray Plastics (America), Inc. Biaxially oriented polylactic acid film with reduced noise level and improved moisture barrier
KR20130100333A (ko) * 2010-11-12 2013-09-10 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 플렉시블 라미네이트 기판에 대한 회로 형성 방법
JP4799710B1 (ja) * 2010-11-17 2011-10-26 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔
CN102433535A (zh) * 2011-11-23 2012-05-02 珠海宝丰堂电子科技有限公司 具有处理卷性电路板材料的等离子设备
KR101944795B1 (ko) 2012-01-25 2019-04-17 삼성전자주식회사 테이프 필름 패키지 및 그의 제조방법
CN102717554B (zh) * 2012-07-02 2015-08-19 武汉光谷创元电子有限公司 一种两层型挠性覆铜板
JP5706386B2 (ja) * 2012-10-16 2015-04-22 住友金属鉱山株式会社 ２層フレキシブル基板、並びに２層フレキシブル基板を基材としたプリント配線板
KR101396919B1 (ko) * 2012-12-13 2014-05-19 한국생산기술연구원 폴리머 필름과 금속층 간의 접합력 향상 방법
CN103668094A (zh) * 2013-12-05 2014-03-26 江苏科技大学 一种采用溅射法制备五层柔性无胶双面覆铜箔的方法
US9506890B2 (en) 2014-12-16 2016-11-29 Eastman Chemical Company Physical vapor deposited biosensor components
CN106413266B (zh) * 2015-07-29 2018-11-23 苏州卫鹏机电科技有限公司 一种聚酰亚胺无胶柔性印刷线路板的制备方法
KR102492818B1 (ko) * 2015-10-12 2023-01-30 에스케이넥실리스 주식회사 연성동박적층필름 및 그 제조방법
US9715459B2 (en) 2015-12-22 2017-07-25 International Business Machines Corporation Translation entry invalidation in a multithreaded data processing system
US9928119B2 (en) 2015-12-22 2018-03-27 International Business Machines Corporation Translation entry invalidation in a multithreaded data processing system
US9575815B1 (en) 2015-12-22 2017-02-21 International Business Machines Corporation Translation entry invalidation in a multithreaded data processing system
CN107371338B (zh) * 2016-05-13 2019-08-20 苏州卫鹏机电科技有限公司 一种超薄金属层的印刷线路板的制备方法
EP3472340B1 (de) 2016-06-15 2023-08-16 Eastman Chemical Company Aufgedampfte biosensorkomponenten
WO2018052713A1 (en) 2016-09-16 2018-03-22 Eastman Chemical Company Biosensor electrodes prepared by physical vapor deposition
US11624723B2 (en) 2016-09-16 2023-04-11 Eastman Chemical Company Biosensor electrodes prepared by physical vapor deposition
CN108621513B (zh) * 2017-03-22 2019-11-12 昆山雅森电子材料科技有限公司 用于超细线路fpc及cof材料的纳米金属基板及制造方法
CN106981665A (zh) * 2017-04-14 2017-07-25 深圳鑫智美科技有限公司 一种负极集流体、其制备方法及其应用
GB2561865A (en) * 2017-04-25 2018-10-31 Univ Of The West Of Scotland Apparatus and methods for depositing durable optical coatings
US11881549B2 (en) 2017-06-22 2024-01-23 Eastman Chemical Company Physical vapor deposited electrode for electrochemical sensors
CN108055790B (zh) * 2017-12-06 2019-10-18 深圳市和美源电子有限公司 一种电路板及其制作方法和应用
US10740239B2 (en) 2018-12-11 2020-08-11 International Business Machines Corporation Translation entry invalidation in a multithreaded data processing system
US10977183B2 (en) 2018-12-11 2021-04-13 International Business Machines Corporation Processing a sequence of translation entry invalidation requests with regard to draining a processor core
US10817434B2 (en) 2018-12-19 2020-10-27 International Business Machines Corporation Interruptible translation entry invalidation in a multithreaded data processing system
DE102019135296A1 (de) * 2019-07-18 2021-01-21 Tdk Electronics Ag Metallisierte Folie, Vorrichtung für die Herstellung einer metallisierten Folie, Verfahren zur Herstellung einer metallisierten Folie und Folienkondensator, der die metallisierte Folie enthält
JP7079008B2 (ja) * 2019-09-10 2022-06-01 尾池工業株式会社 積層フィルムおよび積層フィルムの製造方法
CN116334556A (zh) * 2023-03-14 2023-06-27 中国科学院兰州化学物理研究所 一种聚合物复合铜箔铜种子层的制备方法
KR102644252B1 (ko) * 2023-05-25 2024-03-07 주식회사 옥스 불소가 포함된 투명 폴리이미드 시트를 이용한 전자기판 제조방법 및 이에 의해 제조된 전자기판

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3360349A (en) 1965-04-01 1967-12-26 Sperry Rand Corp Copper layer bonded to a non-conductive layer by means of a copper alloy
US3981691A (en) 1974-07-01 1976-09-21 Minnesota Mining And Manufacturing Company Metal-clad dielectric sheeting having an improved bond between the metal and dielectric layers
JPS5149704A (en) 1974-10-28 1976-04-30 Fuji Photo Film Co Ltd Jikikirokubaitaino seiho
DE2638799C3 (de) 1976-08-27 1981-12-03 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zur Verbesserung der Haftung von metallischen Leiterzügen auf Polyimidschichten in integrierten Schaltungen
CH610596A5 (de) 1977-02-16 1979-04-30 Ebauches Sa
JPS53115069A (en) 1977-03-18 1978-10-07 Nippon Mining Co Method of producing printed circuit board
US4337279A (en) 1981-01-23 1982-06-29 Uop Inc. Method for increasing the peel strength of metal-clad polymers
US4382101A (en) 1981-01-23 1983-05-03 Uop Inc. Method for increasing the peel strength of metal-clad polymers
US4395313A (en) 1982-07-29 1983-07-26 General Motors Corporation Vacuum pretreatment process for durable electroplated coatings on ABS and PPO plastics
JPS59218789A (ja) 1983-05-06 1984-12-10 信越化学工業株式会社 フレキシブルプリント配線基板およびその製造方法
US4604168A (en) 1984-12-20 1986-08-05 General Motors Corporation Pretreatment for electroplating mineral-filled nylon
US4720401A (en) 1985-01-11 1988-01-19 International Business Machines Corporation Enhanced adhesion between metals and polymers
US4863808A (en) 1985-09-13 1989-09-05 Gould Inc. Copper-chromium-polyimide composite
US4886681A (en) 1987-01-20 1989-12-12 International Business Machines Corporation Metal-polymer adhesion by low energy bombardment
US4933060A (en) * 1987-03-02 1990-06-12 The Standard Oil Company Surface modification of fluoropolymers by reactive gas plasmas
US4865711A (en) 1987-04-08 1989-09-12 Andus Corporation Surface treatment of polymers
US4869930A (en) 1987-07-10 1989-09-26 International Business Machines Corporation Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization
JP2602329B2 (ja) * 1988-07-06 1997-04-23 インターナショナル・ビジネス・マシーンズ・コーポレーション 金属層で基板を被覆する方法
KR940004756B1 (ko) * 1988-09-28 1994-05-28 도오레 가부시기가이샤 알루미늄증착필름 및 그 제조방법
US4931310A (en) 1988-11-25 1990-06-05 International Business Machines Corporation Process for treating the surface of polyimides to improve properties to receive metal layer
DE3907004A1 (de) † 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen
US5178957A (en) 1989-05-02 1993-01-12 Minnesota Mining And Manufacturing Company Noble metal-polymer composites and flexible thin-film conductors prepared therefrom
US5387495A (en) 1989-06-28 1995-02-07 Digital Equipment Corporation Sequential multilayer process for using fluorinated hydrocarbons as a dielectric
US4975327A (en) 1989-07-11 1990-12-04 Minnesota Mining And Manufacturing Company Polyimide substrate having a textured surface and metallizing such a substrate
DE3926877A1 (de) 1989-08-16 1991-02-21 Leybold Ag Verfahren zum beschichten eines dielektrischen substrats mit kupfer
JP2775647B2 (ja) * 1989-11-17 1998-07-16 宇部興産株式会社 メタライズドポリイミドフィルムの製法
US5137791A (en) 1990-09-13 1992-08-11 Sheldahl Inc. Metal-film laminate resistant to delamination
US5112462A (en) 1990-09-13 1992-05-12 Sheldahl Inc. Method of making metal-film laminate resistant to delamination
US5151304A (en) 1991-01-22 1992-09-29 International Business Machines Corporation Structure and method for enhancing adhesion to a polyimide surface
US5128008A (en) 1991-04-10 1992-07-07 International Business Machines Corporation Method of forming a microelectronic package having a copper substrate
US5461203A (en) 1991-05-06 1995-10-24 International Business Machines Corporation Electronic package including lower water content polyimide film
US5217589A (en) 1991-10-03 1993-06-08 Motorola, Inc. Method of adherent metal coating for aluminum nitride surfaces
US5357005A (en) * 1991-12-11 1994-10-18 International Business Machines Corporation Reactive surface functionalization
JPH05209263A (ja) 1992-01-13 1993-08-20 Nec Corp スパッタ合金膜の製造方法及びその装置
EP0560384A1 (de) * 1992-03-12 1993-09-15 Kimberly-Clark Corporation Metallisiertes elastomerisches Gewebe und Verfahren zur dessen Herstellung
US5372848A (en) 1992-12-24 1994-12-13 International Business Machines Corporation Process for creating organic polymeric substrate with copper
US5589280A (en) † 1993-02-05 1996-12-31 Southwall Technologies Inc. Metal on plastic films with adhesion-promoting layer
US5484517A (en) 1994-03-08 1996-01-16 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method of forming multi-element thin hot film sensors on polyimide film
US5543222A (en) * 1994-04-29 1996-08-06 E. I. Du Pont De Nemours And Company Metallized polyimide film containing a hydrocarbyl tin compound
US5484462A (en) * 1994-09-21 1996-01-16 Texaco Inc. Low sulfur diesel fuel composition with anti-wear properties
US5574470A (en) 1994-09-30 1996-11-12 Palomar Technologies Corporation Radio frequency identification transponder apparatus and method

Also Published As

Publication number Publication date
DE69733530T2 (de) 2006-05-11
EP0840676B2 (de) 2011-06-15
DE69733530T3 (de) 2012-01-12
KR19990022707A (ko) 1999-03-25
EP0840676A1 (de) 1998-05-13
US6171714B1 (en) 2001-01-09
CN1124203C (zh) 2003-10-15
CN1189125A (zh) 1998-07-29
JP3173511B2 (ja) 2001-06-04
WO1997038851A1 (en) 1997-10-23
JP2000508265A (ja) 2000-07-04
EP0840676A4 (de) 1999-06-09
EP0840676B1 (de) 2005-06-15
KR100326342B1 (ko) 2002-04-17

Similar Documents

Publication Publication Date Title
DE69733530D1 (de) Flexibler verbundstoff ohne klebstoff und verfahren zu seiner herstellung
DE69523732T2 (de) Verbundmaterial und verfahren zu seiner herstellung
DE69814454D1 (de) Verbundwerkstoff mit elastischen abschnitten und verfahren zu seiner herstellung
DE69730259D1 (de) Schichtstoff und Verfahren zu dessen Herstellung
DE59705628D1 (de) Klebeband und Verfahren zu seiner Herstellung
DE69532895D1 (de) Biomaterial und verfahren zu dessen herstellung
DE69716129D1 (de) Seitlich ausdehnbarer tampon und verfahren zu seiner herstellung
DE69636166D1 (de) Klebstoffzusammensetzung und verfahren zu ihrer herstellung
DE69733588D1 (de) Laminat und Verfahren zu seiner Herstellung
DE69832409D1 (de) Wiederanbringbares notizblatt und verfahren zu seiner herstellung
DE59603890D1 (de) Bürste und verfahren zu deren herstellung
DE69403589T2 (de) Rotorzusammenbau und verfahren zu seiner herstellung
DE69710484T2 (de) Übergezogene süsswaren und verfahren zu deren herstellung
DE69530312D1 (de) Stabiles lycopin konzentrat und verfahren zu seiner herstellung
DE69524599D1 (de) Antiblockmittel und verfahren zu seiner herstellung
DE59603734D1 (de) Integrales plattenförmiges bauteil und verfahren zu seiner herstellung
DE69738518D1 (de) Leiterähnlicher Widerstand und Verfahren zu dessen Herstellung
DE843742T1 (de) Hartes verbundmaterial und verfahren zu seiner herstellung
DE59701854D1 (de) Kugelgelenk und verfahren zu seiner herstellung
DE69620017T2 (de) Mehrlagiges gewebe und verfahren zu seiner herstellung
DE69734918D1 (de) Beschichtetes material und verfahren zu dessen herstellung
DE69714647T2 (de) Verbundwerkstoff und Verfahren zu seiner Herstellung
DE59610140D1 (de) Cyclisches dodecapeptid und verfahren zu seiner herstellung
ATA75297A (de) Dekorlaminat und verfahren zu seiner herstellung
DE59809576D1 (de) Streifenwellenleiter und verfahren zu seiner herstellung

Legal Events

Date Code Title Description
8363 Opposition against the patent
R102 Epo decision maintaining patent in amended form now final

Ref document number: 840676

Country of ref document: EP

Effective date: 20110615