DE69734104D1 - Kupplungsanordnung für die geschlossene übertragung von einem flachen substrat von einem geschlossenen behälter zu einer behandlungseinrichtung - Google Patents
Kupplungsanordnung für die geschlossene übertragung von einem flachen substrat von einem geschlossenen behälter zu einer behandlungseinrichtungInfo
- Publication number
- DE69734104D1 DE69734104D1 DE69734104T DE69734104T DE69734104D1 DE 69734104 D1 DE69734104 D1 DE 69734104D1 DE 69734104 T DE69734104 T DE 69734104T DE 69734104 T DE69734104 T DE 69734104T DE 69734104 D1 DE69734104 D1 DE 69734104D1
- Authority
- DE
- Germany
- Prior art keywords
- closed
- treatment device
- clutch assembly
- flat substrate
- transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9604170A FR2747111B1 (fr) | 1996-04-03 | 1996-04-03 | Systeme d'accouplement pour un transfert confine d'un objet plat d'une boite de confinement vers une unite de traitement de l'objet |
FR9604170 | 1996-04-03 | ||
PCT/FR1997/000588 WO1997038440A1 (fr) | 1996-04-03 | 1997-04-02 | Systeme d'accouplement pour un transfert confine d'un objet plat d'une boite de confinement vers une unite de traitement de l'objet |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69734104D1 true DE69734104D1 (de) | 2005-10-06 |
DE69734104T2 DE69734104T2 (de) | 2006-06-29 |
Family
ID=9490858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69734104T Expired - Fee Related DE69734104T2 (de) | 1996-04-03 | 1997-04-02 | Kupplungsanordnung für die geschlossene übertragung von einem flachen substrat von einem geschlossenen behälter zu einer behandlungseinrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US6273664B1 (de) |
EP (1) | EP0891629B1 (de) |
JP (1) | JP2001515655A (de) |
DE (1) | DE69734104T2 (de) |
FR (1) | FR2747111B1 (de) |
WO (1) | WO1997038440A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2779421B1 (fr) * | 1998-06-08 | 2000-08-18 | Incam Solutions | Dispositif adaptateur pour des boites de confinement d'au moins un objet plat sous atmosphere ultrapropre |
JP2000286319A (ja) * | 1999-03-31 | 2000-10-13 | Canon Inc | 基板搬送方法および半導体製造装置 |
JP4628530B2 (ja) * | 2000-08-25 | 2011-02-09 | 株式会社ライト製作所 | 搬送容器の蓋着脱装置 |
JP3581310B2 (ja) * | 2000-08-31 | 2004-10-27 | Tdk株式会社 | 防塵機能を備えた半導体ウェーハ処理装置 |
US6793766B2 (en) * | 2001-01-04 | 2004-09-21 | Applied Materials Inc. | Apparatus having platforms positioned for precise centering of semiconductor wafers during processing |
KR101233101B1 (ko) * | 2004-08-19 | 2013-02-14 | 브룩스 오토메이션 인코퍼레이티드 | 저용량 캐리어 및 그 사용방법 |
US7771150B2 (en) | 2005-08-26 | 2010-08-10 | Jusung Engineering Co., Ltd. | Gate valve and substrate-treating apparatus including the same |
DE102005040741B4 (de) * | 2005-08-26 | 2007-06-14 | Asys Automatic Systems Gmbh & Co. Kg | Bearbeitungsanlage modularen Aufbaus für flächige Substrate |
US8097084B2 (en) * | 2006-01-24 | 2012-01-17 | Vat Holding Ag | Vacuum chamber system for semiconductor processing |
JP2008060513A (ja) * | 2006-09-04 | 2008-03-13 | Tokyo Electron Ltd | 処理装置及び処理方法 |
JP4343241B2 (ja) * | 2007-07-30 | 2009-10-14 | Tdk株式会社 | 収容容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
JP4438966B2 (ja) * | 2007-11-29 | 2010-03-24 | Tdk株式会社 | 収容容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
JP4488255B2 (ja) * | 2008-05-27 | 2010-06-23 | Tdk株式会社 | 密閉容器の蓋開閉システム、当該蓋開閉システムを含む収容物挿脱システム、及び当該蓋開閉システムを用いた基板処理方法 |
CN101685788B (zh) * | 2008-09-23 | 2012-05-09 | 家登精密工业股份有限公司 | 具门闩及气密结构的前开式晶圆盒 |
JP4523661B1 (ja) * | 2009-03-10 | 2010-08-11 | 三井造船株式会社 | 原子層堆積装置及び薄膜形成方法 |
JP5279576B2 (ja) * | 2009-03-27 | 2013-09-04 | 大日本スクリーン製造株式会社 | 基板処理装置 |
WO2011151041A1 (en) * | 2010-06-04 | 2011-12-08 | Oc Oerlikon Balzers Ag | Vacuum processing device |
JP5729148B2 (ja) * | 2011-06-07 | 2015-06-03 | 東京エレクトロン株式会社 | 基板搬送容器の開閉装置、蓋体の開閉装置及び半導体製造装置 |
JP6063716B2 (ja) | 2012-11-14 | 2017-01-18 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送方法 |
DE102013104030A1 (de) | 2013-04-22 | 2014-10-23 | Aixtron Se | Transportmodul für eine Halbleiterfertigungseinrichtung |
US20150118012A1 (en) * | 2013-10-31 | 2015-04-30 | Lam Research Corporation | Wafer entry port with gas concentration attenuators |
DE102017123231A1 (de) | 2017-10-06 | 2019-04-11 | Aixtron Se | Verschlusselement zum Verschlließen einer Beladeöffnung eines Innengehäuses eines CVD-Reaktors |
KR102496315B1 (ko) * | 2021-06-15 | 2023-02-08 | 주식회사 테크엑스 | 로드포트모듈 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5884439A (ja) * | 1981-11-16 | 1983-05-20 | Hitachi Ltd | 半導体製造装置 |
JP2525284B2 (ja) * | 1990-10-22 | 1996-08-14 | ティーディーケイ株式会社 | クリ―ン搬送方法及び装置 |
DE69205571T2 (de) * | 1992-08-04 | 1996-06-13 | Ibm | Unter Druck stehende Koppelsysteme zum Transferieren von einem Halbleiterwafer zwischen einem tragbaren abdichtbaren unter druckstehenden Behälter und einer Bearbeitungsanlage. |
US5291923A (en) * | 1992-09-24 | 1994-03-08 | Internatinal Business Machines Corporation | Door opening system and method |
EP0591706B1 (de) * | 1992-10-06 | 2002-04-24 | Unaxis Balzers Aktiengesellschaft | Kammer für den Transport von Werkstücken |
FR2697000B1 (fr) * | 1992-10-16 | 1994-11-25 | Commissariat Energie Atomique | Boîte plate de confinement d'un objet plat sous atmosphère spéciale. |
ES2229247T3 (es) * | 1995-03-28 | 2005-04-16 | Brooks Automation Gmbh | Estacion de carga y descarga para instalaciones de tratamiento de semiconductores. |
US5961269A (en) * | 1996-11-18 | 1999-10-05 | Applied Materials, Inc. | Three chamber load lock apparatus |
-
1996
- 1996-04-03 FR FR9604170A patent/FR2747111B1/fr not_active Expired - Fee Related
-
1997
- 1997-04-02 WO PCT/FR1997/000588 patent/WO1997038440A1/fr active IP Right Grant
- 1997-04-02 JP JP53589897A patent/JP2001515655A/ja not_active Ceased
- 1997-04-02 DE DE69734104T patent/DE69734104T2/de not_active Expired - Fee Related
- 1997-04-02 EP EP97919463A patent/EP0891629B1/de not_active Expired - Lifetime
- 1997-04-02 US US09/155,784 patent/US6273664B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0891629B1 (de) | 2005-08-31 |
US6273664B1 (en) | 2001-08-14 |
JP2001515655A (ja) | 2001-09-18 |
DE69734104T2 (de) | 2006-06-29 |
EP0891629A1 (de) | 1999-01-20 |
FR2747111A1 (fr) | 1997-10-10 |
FR2747111B1 (fr) | 1998-04-30 |
WO1997038440A1 (fr) | 1997-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |