DE69739033D1 - System mit einer gekerbte Walze - Google Patents

System mit einer gekerbte Walze

Info

Publication number
DE69739033D1
DE69739033D1 DE69739033T DE69739033T DE69739033D1 DE 69739033 D1 DE69739033 D1 DE 69739033D1 DE 69739033 T DE69739033 T DE 69739033T DE 69739033 T DE69739033 T DE 69739033T DE 69739033 D1 DE69739033 D1 DE 69739033D1
Authority
DE
Germany
Prior art keywords
notched roller
notched
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69739033T
Other languages
English (en)
Inventor
Alan J Jensen
Norman A Mertke
William Dyson Jr
Lynn Ryle
Patrick Paino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE69739033D1 publication Critical patent/DE69739033D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • B08B1/32—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
DE69739033T 1996-08-29 1997-07-07 System mit einer gekerbte Walze Expired - Fee Related DE69739033D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/705,337 US5862560A (en) 1996-08-29 1996-08-29 Roller with treading and system including the same
PCT/US1997/011810 WO1998008622A1 (en) 1996-08-29 1997-07-07 Roller with treading and system including same

Publications (1)

Publication Number Publication Date
DE69739033D1 true DE69739033D1 (de) 2008-11-20

Family

ID=24833019

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69739033T Expired - Fee Related DE69739033D1 (de) 1996-08-29 1997-07-07 System mit einer gekerbte Walze

Country Status (7)

Country Link
US (2) US5862560A (de)
EP (1) EP0954389B1 (de)
JP (1) JP4003837B2 (de)
KR (1) KR100376564B1 (de)
AU (1) AU3516297A (de)
DE (1) DE69739033D1 (de)
WO (1) WO1998008622A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3330300B2 (ja) * 1997-02-28 2002-09-30 東京エレクトロン株式会社 基板洗浄装置
US6059888A (en) * 1997-11-14 2000-05-09 Creative Design Corporation Wafer cleaning system
JP2000228382A (ja) * 1999-02-05 2000-08-15 Sony Corp ウエハ洗浄装置
US6290780B1 (en) 1999-03-19 2001-09-18 Lam Research Corporation Method and apparatus for processing a wafer
US6308576B1 (en) * 1999-03-30 2001-10-30 Taiwan Semiconductor Manufacturing Company, Ltd Method for determining stress effect on a film during scrubber clean
US6918864B1 (en) * 1999-06-01 2005-07-19 Applied Materials, Inc. Roller that avoids substrate slippage
US6711775B2 (en) * 1999-06-10 2004-03-30 Lam Research Corporation System for cleaning a semiconductor wafer
US6540841B1 (en) * 2000-06-30 2003-04-01 Chartered Semiconductor Manufacturing Ltd. Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate
US6439245B1 (en) * 2000-06-30 2002-08-27 Lam Research Corporation Method for transferring wafers from a conveyor system to a wafer processing station
JP2002313757A (ja) * 2001-04-17 2002-10-25 Hitachi Ltd 半導体集積回路装置の製造方法
US20050172430A1 (en) * 2003-10-28 2005-08-11 Joseph Yudovsky Wafer edge cleaning
DE602005026179D1 (de) * 2005-04-20 2011-03-10 Freescale Semiconductor Inc Vorrichtung zum reinigen von schaltungssubstraten
US7115023B1 (en) * 2005-06-29 2006-10-03 Lam Research Corporation Process tape for cleaning or processing the edge of a semiconductor wafer
US8234739B2 (en) * 2006-10-03 2012-08-07 Xyratex Technology Limited Spiral brush for cleaning and conveying a substrate
US8662008B2 (en) * 2008-02-07 2014-03-04 Sunpower Corporation Edge coating apparatus for solar cell substrates
US8322300B2 (en) * 2008-02-07 2012-12-04 Sunpower Corporation Edge coating apparatus with movable roller applicator for solar cell substrates
US8250695B2 (en) * 2009-10-05 2012-08-28 Applied Materials, Inc. Roller assembly for a brush cleaning device in a cleaning module
CN101716585B (zh) * 2009-12-14 2012-11-14 中国电子科技集团公司第四十五研究所 化学机械抛光设备硅片清洗装置
JP5498886B2 (ja) * 2010-07-26 2014-05-21 三菱製紙株式会社 ドライフィルムレジストの薄膜化処理方法
US9636714B2 (en) * 2015-02-07 2017-05-02 Applied Materials, Inc. Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes
KR101742596B1 (ko) * 2016-10-27 2017-06-01 강경태 와셔 아이들러 롤러 및 이를 이용한 웨이퍼 클리너
JP6956578B2 (ja) 2017-09-19 2021-11-02 株式会社荏原製作所 ブレークイン装置及びブレークインシステム
US11664213B2 (en) * 2019-12-26 2023-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Bevel edge removal methods, tools, and systems

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2335594A (en) * 1941-08-11 1943-11-30 Fmc Corp Feed roll for corn cutters
US2646612A (en) * 1947-08-05 1953-07-28 American Viscose Corp Liquid pick-up and transfer means
US2857605A (en) * 1952-09-26 1958-10-28 Norman C Weishaar Automobile tire side-wall washing machine
US3327721A (en) * 1965-05-28 1967-06-27 Keith L Carlson Etching apparatus
US3599306A (en) * 1969-06-13 1971-08-17 Beloit Corp Roll composition
DE2354374A1 (de) * 1972-11-08 1974-07-25 Oce Van Der Grinten Nv Fixiereinrichtung
US4202071A (en) * 1978-03-20 1980-05-13 Scharpf Mike A Apparatus for washing and drying phonograph records
JPS57186340A (en) * 1981-05-12 1982-11-16 Nippon Kogaku Kk <Nikon> Positioning device for wafer
JPS60143634A (ja) * 1983-12-29 1985-07-29 Fujitsu Ltd ウエ−ハ処理方法及び装置
US4705711A (en) * 1986-01-30 1987-11-10 E. I. Du Pont De Nemours And Company Polyimide covered calender rolls
US4826071A (en) * 1988-04-25 1989-05-02 Harris Graphics Stainless steel weld clad cylinder interconnected by a groove and gap also weld covered by stainless steel
JPH02130922A (ja) * 1988-11-11 1990-05-18 Toshiba Corp 半導体基板エッチング装置
JPH02178947A (ja) * 1988-12-29 1990-07-11 Fujitsu Ltd 半導体ウェーハのノッチ合わせ機構
US5188273A (en) * 1989-02-03 1993-02-23 Helmuth Schmoock Expander roller for webs of paper and the like
KR0139785B1 (ko) * 1990-03-20 1998-07-15 카자마 젠쥬 웨이퍼 정렬 기능을 가진 웨이퍼 카운트 장치
US5129876A (en) * 1991-03-01 1992-07-14 Profold, Inc. Fold roller
JP2815493B2 (ja) * 1991-03-29 1998-10-27 トーカロ株式会社 めっき浴用ロール
JPH05259264A (ja) * 1992-03-11 1993-10-08 Fujitsu Ltd 半導体ウェーハ整列装置
US5485644A (en) * 1993-03-18 1996-01-23 Dainippon Screen Mfg. Co., Ltd. Substrate treating apparatus
US5340437A (en) * 1993-10-08 1994-08-23 Memc Electronic Materials, Inc. Process and apparatus for etching semiconductor wafers
TW275708B (de) * 1993-12-28 1996-05-11 Tokyo Electron Co Ltd
US5566466A (en) * 1994-07-01 1996-10-22 Ontrak Systems, Inc. Spindle assembly with improved wafer holder
US5475889A (en) * 1994-07-15 1995-12-19 Ontrak Systems, Inc. Automatically adjustable brush assembly for cleaning semiconductor wafers
US6003185A (en) * 1994-07-15 1999-12-21 Ontrak Systems, Inc. Hesitation free roller
US5861066A (en) * 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates

Also Published As

Publication number Publication date
AU3516297A (en) 1998-03-19
KR20000035931A (ko) 2000-06-26
US5862560A (en) 1999-01-26
KR100376564B1 (ko) 2003-03-17
JP2000517475A (ja) 2000-12-26
JP4003837B2 (ja) 2007-11-07
EP0954389A4 (de) 2006-07-26
WO1998008622A1 (en) 1998-03-05
US6059889A (en) 2000-05-09
EP0954389A1 (de) 1999-11-10
EP0954389B1 (de) 2008-10-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee