DE69803664T2 - Verfahren zur herstellung von gedruckten leiterplatten und so hergestellte gedruckte leiterplatten - Google Patents

Verfahren zur herstellung von gedruckten leiterplatten und so hergestellte gedruckte leiterplatten

Info

Publication number
DE69803664T2
DE69803664T2 DE69803664T DE69803664T DE69803664T2 DE 69803664 T2 DE69803664 T2 DE 69803664T2 DE 69803664 T DE69803664 T DE 69803664T DE 69803664 T DE69803664 T DE 69803664T DE 69803664 T2 DE69803664 T2 DE 69803664T2
Authority
DE
Germany
Prior art keywords
printed circuit
circuit boards
produced
producing
producing printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69803664T
Other languages
English (en)
Other versions
DE69803664D1 (de
Inventor
Antonio Canova
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Magnetek SpA
Original Assignee
Magnetek SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magnetek SpA filed Critical Magnetek SpA
Publication of DE69803664D1 publication Critical patent/DE69803664D1/de
Application granted granted Critical
Publication of DE69803664T2 publication Critical patent/DE69803664T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
DE69803664T 1997-02-17 1998-02-16 Verfahren zur herstellung von gedruckten leiterplatten und so hergestellte gedruckte leiterplatten Expired - Fee Related DE69803664T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT97FI000023A IT1291779B1 (it) 1997-02-17 1997-02-17 Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti
PCT/IT1998/000026 WO1998036625A1 (en) 1997-02-17 1998-02-16 Process for producing printed circuits and printed circuits thus obtained

Publications (2)

Publication Number Publication Date
DE69803664D1 DE69803664D1 (de) 2002-03-14
DE69803664T2 true DE69803664T2 (de) 2002-10-24

Family

ID=11351938

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69803664T Expired - Fee Related DE69803664T2 (de) 1997-02-17 1998-02-16 Verfahren zur herstellung von gedruckten leiterplatten und so hergestellte gedruckte leiterplatten

Country Status (7)

Country Link
US (2) US6401332B1 (de)
EP (1) EP0974249B1 (de)
DE (1) DE69803664T2 (de)
DK (1) DK0974249T3 (de)
ES (1) ES2170477T3 (de)
IT (1) IT1291779B1 (de)
WO (1) WO1998036625A1 (de)

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ITRM20020138U1 (it) * 2002-07-31 2004-02-01 Dmg Spa Pulsantiere di ascensore con pulsanti precablati.
US20050247761A1 (en) * 2004-05-04 2005-11-10 Albanese Patricia M Surface mount attachment of components
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
CN104188907A (zh) 2007-02-11 2014-12-10 Map药物公司 治疗性施用dhe用于快速减轻偏头痛而使副作用分布最小化的方法
WO2009121697A1 (de) * 2008-04-01 2009-10-08 Continental Automotive Gmbh Stromführungsbauteil mit einem träger, leiterbahnen und leiterplättchen
DE102011004526B4 (de) * 2011-02-22 2021-05-06 Vitesco Technologies GmbH Leiterplatte mit hoher Stromtragfähigkeit und Verfahren zur Herstellung einer solchen Leiterplatte
JP2014229761A (ja) * 2013-05-23 2014-12-08 株式会社東芝 電子機器
KR102059610B1 (ko) * 2015-12-18 2019-12-26 주식회사 엘지화학 고전도성 방열 패드를 이용한 인쇄회로기판의 방열 시스템
JP6412051B2 (ja) * 2016-04-18 2018-10-24 ファナック株式会社 プリント板の自動組み立ての歩留りを向上する自動組立システム及び自動組立方法

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FR2560437B1 (fr) * 1984-02-28 1987-05-29 Citroen Sa Procede de report a plat d'elements de puissance sur un reseau conducteur par brasage de leurs connexions
DE3870811D1 (de) 1987-11-10 1992-06-11 Siemens Ag Vorrichtung und verfahren zum bestuecken von leiterplatten mit bauelementen.
US4873764A (en) 1987-12-23 1989-10-17 Zenith Electronics Corporation Component mounting process for printed circuit boards
DE3813097A1 (de) 1988-04-19 1989-11-02 Adalbert Fritsch Geraet zum bestuecken und/oder verloeten bzw. verkleben von elektronischen bauelementen auf leiterplatten
DE3813096A1 (de) 1988-04-19 1989-11-02 Adalbert Fritsch Geraet zum bestuecken und/oder verloeten bzw. verkleben von elektronischen bauelementen, insbesondere smd-bauelementen, auf leiterplatten
JPH01303793A (ja) * 1988-05-31 1989-12-07 Pfu Ltd プリント配線板の製造方法及び配線板
US4982376A (en) 1989-04-20 1991-01-01 U.S. Philips Corporation Method of mounting electrical and/or electronic components on a single-sided printed board
DE3935930A1 (de) 1989-10-27 1991-05-02 Adalbert Fritsch Bestueckungsgeraet
US5157734A (en) 1989-12-19 1992-10-20 Industrial Technology Research Institute Method and apparatus for picking and placing a surface mounted device with the aid of machine vision
EP0434135B1 (de) 1989-12-20 1994-06-01 Koninklijke Philips Electronics N.V. Verfahren zum Simultananordnen und Verlöten von SMD-Bauteilen
JP2657429B2 (ja) * 1990-04-09 1997-09-24 株式会社ミクロ技術研究所 基板の回路実装方法及びその方法に使用する回路基板
US5195154A (en) 1990-04-27 1993-03-16 Ngk Insulators, Ltd. Optical surface mount technology (o-smt), optical surface mount circuit (o-smc), opto-electronic printed wiring board (oe-pwb), opto-electronic surface mount device (oe-smd), and methods of fabricating opto-electronic printed wiring board
JPH0429338A (ja) * 1990-05-24 1992-01-31 Nippon Mektron Ltd Ｉｃの搭載用回路基板及びその搭載方法
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Also Published As

Publication number Publication date
ITFI970023A0 (it) 1997-02-17
US6401332B1 (en) 2002-06-11
EP0974249B1 (de) 2002-01-30
ES2170477T3 (es) 2002-08-01
DK0974249T3 (da) 2002-05-06
IT1291779B1 (it) 1999-01-21
US6858806B2 (en) 2005-02-22
ITFI970023A1 (it) 1998-08-17
DE69803664D1 (de) 2002-03-14
WO1998036625A1 (en) 1998-08-20
EP0974249A1 (de) 2000-01-26
US20020056571A1 (en) 2002-05-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee