DE69807780T2 - Trägerplatte mit einer Substrateserkennungseinrichtung für eine chemisch-mechanische Poliervorrichtung - Google Patents
Trägerplatte mit einer Substrateserkennungseinrichtung für eine chemisch-mechanische PoliervorrichtungInfo
- Publication number
- DE69807780T2 DE69807780T2 DE69807780T DE69807780T DE69807780T2 DE 69807780 T2 DE69807780 T2 DE 69807780T2 DE 69807780 T DE69807780 T DE 69807780T DE 69807780 T DE69807780 T DE 69807780T DE 69807780 T2 DE69807780 T2 DE 69807780T2
- Authority
- DE
- Germany
- Prior art keywords
- mechanical polishing
- carrier plate
- chemical mechanical
- substrate detection
- detection device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/862,350 US5957751A (en) | 1997-05-23 | 1997-05-23 | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69807780D1 DE69807780D1 (de) | 2002-10-17 |
DE69807780T2 true DE69807780T2 (de) | 2003-05-08 |
Family
ID=25338293
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69807780T Expired - Lifetime DE69807780T2 (de) | 1997-05-23 | 1998-05-22 | Trägerplatte mit einer Substrateserkennungseinrichtung für eine chemisch-mechanische Poliervorrichtung |
Country Status (7)
Country | Link |
---|---|
US (6) | US5957751A (de) |
EP (1) | EP0879678B1 (de) |
JP (1) | JP3326109B2 (de) |
KR (1) | KR100366919B1 (de) |
DE (1) | DE69807780T2 (de) |
SG (1) | SG71109A1 (de) |
TW (1) | TW431938B (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112005000473B4 (de) * | 2004-03-09 | 2014-02-27 | Mks Instruments, Inc. | System und Verfahren zur Druckregelung in entfernt angeordneten Zonen |
US8689822B2 (en) | 2004-03-09 | 2014-04-08 | Mks Instruments, Inc. | Pressure regulation in remote zones |
Families Citing this family (109)
Publication number | Priority date | Publication date | Assignee | Title |
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US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
JP3705670B2 (ja) | 1997-02-19 | 2005-10-12 | 株式会社荏原製作所 | ポリッシング装置及び方法 |
US5957751A (en) | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US6398621B1 (en) | 1997-05-23 | 2002-06-04 | Applied Materials, Inc. | Carrier head with a substrate sensor |
US6191038B1 (en) | 1997-09-02 | 2001-02-20 | Matsushita Electronics Corporation | Apparatus and method for chemical/mechanical polishing |
DE19755975A1 (de) * | 1997-12-16 | 1999-06-17 | Wolters Peter Werkzeugmasch | Halter für flache Werkstücke, insbesondere Halbleiterwafer |
US6200199B1 (en) | 1998-03-31 | 2001-03-13 | Applied Materials, Inc. | Chemical mechanical polishing conditioner |
JPH11285966A (ja) * | 1998-04-02 | 1999-10-19 | Speedfam-Ipec Co Ltd | キャリア及びcmp装置 |
FR2778129B1 (fr) | 1998-05-04 | 2000-07-21 | St Microelectronics Sa | Disque support de membrane d'une machine de polissage et procede de fonctionnement d'une telle machine |
US6251215B1 (en) * | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
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US6162116A (en) * | 1999-01-23 | 2000-12-19 | Applied Materials, Inc. | Carrier head for chemical mechanical polishing |
US6227955B1 (en) * | 1999-04-20 | 2001-05-08 | Micron Technology, Inc. | Carrier heads, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
US6431968B1 (en) | 1999-04-22 | 2002-08-13 | Applied Materials, Inc. | Carrier head with a compressible film |
KR100335485B1 (ko) * | 1999-07-02 | 2002-05-04 | 윤종용 | 화학적-기계적 폴리싱 장치 및 방법 |
JP2001018169A (ja) | 1999-07-07 | 2001-01-23 | Ebara Corp | 研磨装置 |
JP2001018161A (ja) * | 1999-07-07 | 2001-01-23 | Ebara Corp | 研磨装置 |
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US6776692B1 (en) | 1999-07-09 | 2004-08-17 | Applied Materials Inc. | Closed-loop control of wafer polishing in a chemical mechanical polishing system |
US6241593B1 (en) * | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
US6358121B1 (en) * | 1999-07-09 | 2002-03-19 | Applied Materials, Inc. | Carrier head with a flexible membrane and an edge load ring |
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EP1080841A3 (de) * | 1999-09-02 | 2001-07-11 | Mitsubishi Materials Corporation | Trägervorrichtung, Poliervorrichtung die eine solche Trägervorrichtung verwendet, und Verfahren zum Messen des Zustandes von der polierten Oberfläche |
US6663466B2 (en) * | 1999-11-17 | 2003-12-16 | Applied Materials, Inc. | Carrier head with a substrate detector |
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US6436832B1 (en) | 2000-05-23 | 2002-08-20 | Applied Materials, Inc | Method to reduce polish initiation time in a polish process |
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US20040005842A1 (en) * | 2000-07-25 | 2004-01-08 | Chen Hung Chih | Carrier head with flexible membrane |
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DE60138343D1 (de) * | 2000-07-31 | 2009-05-28 | Ebara Corp | Substrathalter und Poliervorrichtung |
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JP2616735B2 (ja) * | 1995-01-25 | 1997-06-04 | 日本電気株式会社 | ウェハの研磨方法およびその装置 |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
TW353203B (en) * | 1995-04-10 | 1999-02-21 | Matsushita Electric Ind Co Ltd | Apparatus for holding substrate to be polished |
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JP3663728B2 (ja) * | 1996-03-28 | 2005-06-22 | 信越半導体株式会社 | 薄板の研磨機 |
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US5961169A (en) | 1998-07-27 | 1999-10-05 | Strasbaugh | Apparatus for sensing the presence of a wafer |
-
1997
- 1997-05-23 US US08/862,350 patent/US5957751A/en not_active Expired - Lifetime
-
1998
- 1998-03-17 TW TW087103969A patent/TW431938B/zh not_active IP Right Cessation
- 1998-04-17 SG SG1998000873A patent/SG71109A1/en unknown
- 1998-05-22 EP EP98109369A patent/EP0879678B1/de not_active Expired - Lifetime
- 1998-05-22 DE DE69807780T patent/DE69807780T2/de not_active Expired - Lifetime
- 1998-05-22 KR KR10-1998-0018438A patent/KR100366919B1/ko not_active IP Right Cessation
- 1998-05-25 JP JP14302598A patent/JP3326109B2/ja not_active Expired - Lifetime
-
1999
- 1999-05-18 US US09/314,462 patent/US6093082A/en not_active Expired - Lifetime
- 1999-08-05 US US09/369,663 patent/US6244932B1/en not_active Expired - Lifetime
-
2000
- 2000-06-16 US US09/595,500 patent/US6343973B1/en not_active Expired - Lifetime
-
2001
- 2001-11-19 US US09/989,498 patent/US6517415B2/en not_active Expired - Lifetime
-
2003
- 2003-02-10 US US10/364,081 patent/US6705924B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112005000473B4 (de) * | 2004-03-09 | 2014-02-27 | Mks Instruments, Inc. | System und Verfahren zur Druckregelung in entfernt angeordneten Zonen |
US8689822B2 (en) | 2004-03-09 | 2014-04-08 | Mks Instruments, Inc. | Pressure regulation in remote zones |
Also Published As
Publication number | Publication date |
---|---|
US6517415B2 (en) | 2003-02-11 |
JP3326109B2 (ja) | 2002-09-17 |
EP0879678B1 (de) | 2002-09-11 |
US20020031981A1 (en) | 2002-03-14 |
JPH10337658A (ja) | 1998-12-22 |
US5957751A (en) | 1999-09-28 |
KR100366919B1 (ko) | 2003-03-17 |
US6244932B1 (en) | 2001-06-12 |
TW431938B (en) | 2001-05-01 |
US6093082A (en) | 2000-07-25 |
SG71109A1 (en) | 2000-03-21 |
US6705924B2 (en) | 2004-03-16 |
DE69807780D1 (de) | 2002-10-17 |
US20030139123A1 (en) | 2003-07-24 |
KR19980087271A (ko) | 1998-12-05 |
US6343973B1 (en) | 2002-02-05 |
EP0879678A1 (de) | 1998-11-25 |
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