DE69810117T2 - Polieren von halbleiterscheiben - Google Patents

Polieren von halbleiterscheiben

Info

Publication number
DE69810117T2
DE69810117T2 DE69810117T DE69810117T DE69810117T2 DE 69810117 T2 DE69810117 T2 DE 69810117T2 DE 69810117 T DE69810117 T DE 69810117T DE 69810117 T DE69810117 T DE 69810117T DE 69810117 T2 DE69810117 T2 DE 69810117T2
Authority
DE
Germany
Prior art keywords
polishing semiconductor
semiconductor discs
discs
polishing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69810117T
Other languages
English (en)
Other versions
DE69810117D1 (de
Inventor
Walter Dudovicz
Brian Lombardo
Alfred A Conklin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Praxair Surface Technologies Inc
Original Assignee
Peripheral Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peripheral Products Inc filed Critical Peripheral Products Inc
Publication of DE69810117D1 publication Critical patent/DE69810117D1/de
Application granted granted Critical
Publication of DE69810117T2 publication Critical patent/DE69810117T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/06—Connecting the ends of materials, e.g. for making abrasive belts
DE69810117T 1997-07-30 1998-07-21 Polieren von halbleiterscheiben Expired - Fee Related DE69810117T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US90300497A 1997-07-30 1997-07-30
US08/941,386 US6736714B2 (en) 1997-07-30 1997-09-30 Polishing silicon wafers
PCT/GB1998/002174 WO1999006182A1 (en) 1997-07-30 1998-07-21 Polishing semiconductor wafers

Publications (2)

Publication Number Publication Date
DE69810117D1 DE69810117D1 (de) 2003-01-23
DE69810117T2 true DE69810117T2 (de) 2003-11-13

Family

ID=27129340

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69810117T Expired - Fee Related DE69810117T2 (de) 1997-07-30 1998-07-21 Polieren von halbleiterscheiben

Country Status (8)

Country Link
US (3) US6736714B2 (de)
EP (1) EP0999918B1 (de)
JP (1) JP2001512057A (de)
KR (1) KR100646490B1 (de)
AU (1) AU8453298A (de)
DE (1) DE69810117T2 (de)
TW (1) TW365561B (de)
WO (1) WO1999006182A1 (de)

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US6261168B1 (en) 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
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SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
US10593574B2 (en) * 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
TWI713526B (zh) * 2016-05-20 2020-12-21 智勝科技股份有限公司 基底層、具有基底層的研磨墊及研磨方法
KR102318482B1 (ko) * 2017-03-24 2021-10-29 주식회사 케이씨텍 연마 패드 및 이를 구비하는 기판 연마 장치, 연마 패드의 제조 방법
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
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KR102438398B1 (ko) * 2021-01-15 2022-08-31 주식회사 엘에이티 웨이퍼를 이송하기 위한 컨베이어 모듈 및 이를 포함하는 웨이퍼 이송 시스템
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
WO2023069557A1 (en) * 2021-10-23 2023-04-27 Rajeev Bajaj Post cmp brush and method of manufacture

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Also Published As

Publication number Publication date
DE69810117D1 (de) 2003-01-23
JP2001512057A (ja) 2001-08-21
AU8453298A (en) 1999-02-22
WO1999006182A1 (en) 1999-02-11
US20010034197A1 (en) 2001-10-25
US20030087594A1 (en) 2003-05-08
EP0999918B1 (de) 2002-12-11
US6736714B2 (en) 2004-05-18
KR20010022464A (ko) 2001-03-15
KR100646490B1 (ko) 2006-11-14
TW365561B (en) 1999-08-01
EP0999918A1 (de) 2000-05-17
US6971950B2 (en) 2005-12-06
US20040087262A1 (en) 2004-05-06

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