DE69810389D1 - Verfahren und Vorrichtung zur Befestigung von elektronischen Bauelementen auf einer Leiterplatte - Google Patents
Verfahren und Vorrichtung zur Befestigung von elektronischen Bauelementen auf einer LeiterplatteInfo
- Publication number
- DE69810389D1 DE69810389D1 DE69810389T DE69810389T DE69810389D1 DE 69810389 D1 DE69810389 D1 DE 69810389D1 DE 69810389 T DE69810389 T DE 69810389T DE 69810389 T DE69810389 T DE 69810389T DE 69810389 D1 DE69810389 D1 DE 69810389D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- electronic components
- fastening electronic
- fastening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15893697A JP3907786B2 (ja) | 1997-06-16 | 1997-06-16 | 電子部品実装方法及び装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69810389D1 true DE69810389D1 (de) | 2003-02-06 |
DE69810389T2 DE69810389T2 (de) | 2003-11-20 |
Family
ID=15682588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69810389T Expired - Fee Related DE69810389T2 (de) | 1997-06-16 | 1998-06-12 | Verfahren und Vorrichtung zur Befestigung von elektronischen Bauelementen auf einer Leiterplatte |
Country Status (5)
Country | Link |
---|---|
US (2) | US6158117A (de) |
EP (1) | EP0886465B1 (de) |
JP (1) | JP3907786B2 (de) |
CN (1) | CN1124779C (de) |
DE (1) | DE69810389T2 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3659003B2 (ja) * | 1998-07-03 | 2005-06-15 | 松下電器産業株式会社 | 電子部品実装方法 |
JP4331301B2 (ja) * | 1999-02-24 | 2009-09-16 | 富士機械製造株式会社 | 電気部品装着機および電気部品装着方法 |
JP2001015992A (ja) * | 1999-06-29 | 2001-01-19 | Sony Corp | 部品装着装置における校正方法 |
CN1223258C (zh) * | 2000-03-28 | 2005-10-12 | 西门子公司 | 在基板插装机中检查电气元件的方法和装置 |
JP4399088B2 (ja) * | 2000-06-01 | 2010-01-13 | 富士機械製造株式会社 | 電気部品装着装置 |
KR100387472B1 (ko) * | 2000-12-30 | 2003-06-18 | 현대자동차주식회사 | 차량용 크래쉬 패드 자동 투입 시스템 및 그 제어방법 |
JP2003058601A (ja) * | 2001-08-14 | 2003-02-28 | Matsushita Electric Ind Co Ltd | 画像処理装置用教示データの配送方法及びシステム |
JP4421991B2 (ja) * | 2004-10-04 | 2010-02-24 | ヤマハ発動機株式会社 | 移載装置、表面実装機、誤差テーブルの作成方法、プログラムおよび記憶媒体 |
JP5113406B2 (ja) * | 2007-03-15 | 2013-01-09 | Juki株式会社 | 電子部品実装装置 |
DE112008000767T5 (de) * | 2007-04-03 | 2010-04-29 | Panasonic Corporation, Kadoma-shi | Verfahren zum Bestücken von Bauelementen |
JP4909255B2 (ja) * | 2007-12-28 | 2012-04-04 | ヤマハ発動機株式会社 | 部品実装装置におけるヘッド移動位置補正方法及び同装置 |
WO2011001675A1 (ja) * | 2009-06-30 | 2011-01-06 | 株式会社アルバック | ロボットのティーチング装置及びロボットのティーチング方法 |
JP2011041986A (ja) * | 2009-08-19 | 2011-03-03 | Hitachi Computer Peripherals Co Ltd | ノズル吸引式の対象物の搬送装置、搬送方法及びこれらに用いられるプログラム |
KR20130079031A (ko) * | 2012-01-02 | 2013-07-10 | 삼성전자주식회사 | 반도체 칩 실장 장치 |
US9778647B2 (en) * | 2012-12-28 | 2017-10-03 | Fuji Machine Mfg. Co., Ltd. | Working machine and positional deviation data acquisition method |
JP6043966B2 (ja) * | 2013-07-05 | 2016-12-14 | パナソニックIpマネジメント株式会社 | ヘッドメンテナンス方法 |
CN109952017B (zh) * | 2013-10-11 | 2021-02-23 | 株式会社富士 | 元件装配机 |
CN106660213B (zh) * | 2014-07-15 | 2019-01-01 | 株式会社富士 | 检查方法 |
WO2016063328A1 (ja) * | 2014-10-20 | 2016-04-28 | 富士機械製造株式会社 | ロータリーヘッド型部品実装機の部品吸着位置補正システム及び部品吸着位置補正方法 |
CN104607939B (zh) * | 2015-02-05 | 2017-04-12 | 东莞市安达自动化设备有限公司 | 一种多功能全自动组装机 |
US10712729B2 (en) * | 2015-04-09 | 2020-07-14 | Panasonic Intellectual Property Management Co., Ltd. | Setting support system for setting operational parameter |
EP3340760B1 (de) * | 2015-08-20 | 2020-08-05 | FUJI Corporation | Komponentenmontagevorrichtung |
JP6745170B2 (ja) * | 2016-08-29 | 2020-08-26 | Juki株式会社 | 実装装置、キャリブレーション方法及びキャリブレーションプログラム |
CN109997426B (zh) * | 2016-11-17 | 2020-11-24 | 株式会社富士 | 作业机 |
JP6906158B2 (ja) * | 2017-02-15 | 2021-07-21 | パナソニックIpマネジメント株式会社 | 部品搭載装置および部品搭載方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3408080A1 (de) * | 1984-03-05 | 1985-09-05 | Rhein-Bayern-Fahrzeugbau GmbH & Co KG, 8950 Kaufbeuren | Abdeckung fuer montagegruben |
US4862510A (en) * | 1987-03-24 | 1989-08-29 | Emhart Industries, Inc. | Lead sense system for component insertion machine |
US4950011A (en) * | 1988-10-24 | 1990-08-21 | Nicky Borcea | Tool for precisely positioning a workpiece |
JPH03203399A (ja) * | 1989-12-29 | 1991-09-05 | Matsushita Electric Ind Co Ltd | 部品装着装置 |
JPH0824234B2 (ja) * | 1990-01-24 | 1996-03-06 | 松下電器産業株式会社 | 電子部品の吸着装置 |
JPH0494600A (ja) * | 1990-08-11 | 1992-03-26 | Tdk Corp | 電子部品装着方法及び装置 |
JP2599510B2 (ja) * | 1991-03-28 | 1997-04-09 | 松下電器産業株式会社 | 部品装着機 |
US5285888A (en) * | 1991-09-25 | 1994-02-15 | Kabushiki Kaisha Toshiba | Parts mounting apparatus |
EP0578136B1 (de) * | 1992-07-01 | 1995-11-22 | Yamaha Hatsudoki Kabushiki Kaisha | Verfahren zum Montieren von Komponenten und Vorrichtung dafür |
JP2554437B2 (ja) * | 1992-08-07 | 1996-11-13 | ヤマハ発動機株式会社 | 部品装着方法及び同装置 |
US5741114A (en) * | 1992-08-07 | 1998-04-21 | Yamaha Hatsudoki Kabushiki Kaisha | Method for mounting components and apparatus therefor |
JPH07115296A (ja) * | 1993-10-15 | 1995-05-02 | Sanyo Electric Co Ltd | 部品実装機の制御装置 |
KR0140167B1 (ko) * | 1994-12-28 | 1998-08-17 | 배순훈 | 칩마운트 시스템의 카메라 편차각도 보정방법 |
JP2937785B2 (ja) * | 1995-02-02 | 1999-08-23 | ヤマハ発動機株式会社 | 実装機の部品状態検出装置 |
US5926950A (en) * | 1995-12-28 | 1999-07-27 | Fuji Machine Mfg. Co., Ltd. | Electronic component transferring device and method, and electronic component mounting system and method |
JP3310882B2 (ja) * | 1996-08-26 | 2002-08-05 | 山形カシオ株式会社 | 電子部品装着装置 |
-
1997
- 1997-06-16 JP JP15893697A patent/JP3907786B2/ja not_active Expired - Fee Related
-
1998
- 1998-06-12 DE DE69810389T patent/DE69810389T2/de not_active Expired - Fee Related
- 1998-06-12 EP EP98110751A patent/EP0886465B1/de not_active Expired - Lifetime
- 1998-06-15 US US09/094,982 patent/US6158117A/en not_active Expired - Lifetime
- 1998-06-16 CN CN98102974A patent/CN1124779C/zh not_active Expired - Fee Related
-
2000
- 2000-09-28 US US09/670,691 patent/US6263559B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1207644A (zh) | 1999-02-10 |
CN1124779C (zh) | 2003-10-15 |
EP0886465A1 (de) | 1998-12-23 |
DE69810389T2 (de) | 2003-11-20 |
US6158117A (en) | 2000-12-12 |
US6263559B1 (en) | 2001-07-24 |
JPH118497A (ja) | 1999-01-12 |
JP3907786B2 (ja) | 2007-04-18 |
EP0886465B1 (de) | 2003-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |