DE69819779D1 - Apparat und methode für die mechanische und chemisch-mechanische planarisierung von mikroelektroniksubstraten - Google Patents

Apparat und methode für die mechanische und chemisch-mechanische planarisierung von mikroelektroniksubstraten

Info

Publication number
DE69819779D1
DE69819779D1 DE69819779T DE69819779T DE69819779D1 DE 69819779 D1 DE69819779 D1 DE 69819779D1 DE 69819779 T DE69819779 T DE 69819779T DE 69819779 T DE69819779 T DE 69819779T DE 69819779 D1 DE69819779 D1 DE 69819779D1
Authority
DE
Germany
Prior art keywords
film
micro
features
planarizing
selected pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69819779T
Other languages
English (en)
Other versions
DE69819779T2 (de
Inventor
E Moore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Publication of DE69819779D1 publication Critical patent/DE69819779D1/de
Application granted granted Critical
Publication of DE69819779T2 publication Critical patent/DE69819779T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
DE69819779T 1997-12-30 1998-12-29 Apparat und methode für die mechanische und chemisch-mechanische planarisierung von mikroelektroniksubstraten Expired - Lifetime DE69819779T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1333 1997-12-30
US09/001,333 US6139402A (en) 1997-12-30 1997-12-30 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
PCT/US1998/027773 WO1999033615A1 (en) 1997-12-30 1998-12-29 Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates

Publications (2)

Publication Number Publication Date
DE69819779D1 true DE69819779D1 (de) 2003-12-18
DE69819779T2 DE69819779T2 (de) 2004-09-23

Family

ID=21695502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69819779T Expired - Lifetime DE69819779T2 (de) 1997-12-30 1998-12-29 Apparat und methode für die mechanische und chemisch-mechanische planarisierung von mikroelektroniksubstraten

Country Status (8)

Country Link
US (9) US6139402A (de)
EP (1) EP1042105B1 (de)
JP (2) JP3774367B2 (de)
KR (1) KR100563758B1 (de)
AT (1) ATE254012T1 (de)
AU (1) AU2208799A (de)
DE (1) DE69819779T2 (de)
WO (1) WO1999033615A1 (de)

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US7011566B2 (en) 2002-08-26 2006-03-14 Micron Technology, Inc. Methods and systems for conditioning planarizing pads used in planarizing substrates
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US7008299B2 (en) 2002-08-29 2006-03-07 Micron Technology, Inc. Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces
US7074114B2 (en) 2003-01-16 2006-07-11 Micron Technology, Inc. Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces
US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US6899612B2 (en) 2003-02-25 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad apparatus and methods
US6872132B2 (en) 2003-03-03 2005-03-29 Micron Technology, Inc. Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
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US7131891B2 (en) 2003-04-28 2006-11-07 Micron Technology, Inc. Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces
US7030603B2 (en) 2003-08-21 2006-04-18 Micron Technology, Inc. Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece
US7040965B2 (en) * 2003-09-18 2006-05-09 Micron Technology, Inc. Methods for removing doped silicon material from microfeature workpieces
US6939211B2 (en) * 2003-10-09 2005-09-06 Micron Technology, Inc. Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions
US7018274B2 (en) * 2003-11-13 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad having slurry utilization enhancing grooves
US7086927B2 (en) 2004-03-09 2006-08-08 Micron Technology, Inc. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces
US7198549B2 (en) * 2004-06-16 2007-04-03 Cabot Microelectronics Corporation Continuous contour polishing of a multi-material surface
US7066792B2 (en) 2004-08-06 2006-06-27 Micron Technology, Inc. Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods
US7033253B2 (en) 2004-08-12 2006-04-25 Micron Technology, Inc. Polishing pad conditioners having abrasives and brush elements, and associated systems and methods
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
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FI121654B (sv) 2006-07-10 2011-02-28 Kwh Mirka Ab Oy Förfarande för tillverkning av en flexibel sliprondell och en flexibel sliprondell
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Also Published As

Publication number Publication date
KR100563758B1 (ko) 2006-03-24
US6652370B2 (en) 2003-11-25
AU2208799A (en) 1999-07-19
US6364757B2 (en) 2002-04-02
US20010006875A1 (en) 2001-07-05
JP2001526970A (ja) 2001-12-25
US6354930B1 (en) 2002-03-12
US6514130B2 (en) 2003-02-04
US20010009841A1 (en) 2001-07-26
ATE254012T1 (de) 2003-11-15
US6390910B1 (en) 2002-05-21
US20010049254A1 (en) 2001-12-06
KR20010033809A (ko) 2001-04-25
EP1042105A1 (de) 2000-10-11
US6913519B2 (en) 2005-07-05
US6139402A (en) 2000-10-31
US20040097175A1 (en) 2004-05-20
WO1999033615A1 (en) 1999-07-08
EP1042105B1 (de) 2003-11-12
US6537190B2 (en) 2003-03-25
US6419572B2 (en) 2002-07-16
US20020094765A1 (en) 2002-07-18
US20020031984A1 (en) 2002-03-14
US20020173171A1 (en) 2002-11-21
JP2006108710A (ja) 2006-04-20
JP3774367B2 (ja) 2006-05-10
DE69819779T2 (de) 2004-09-23

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