DE69822426D1 - Leiterplatten-Randverbinder hoher Kontaktdichte und dessen Herstellungsverfahren - Google Patents

Leiterplatten-Randverbinder hoher Kontaktdichte und dessen Herstellungsverfahren

Info

Publication number
DE69822426D1
DE69822426D1 DE69822426T DE69822426T DE69822426D1 DE 69822426 D1 DE69822426 D1 DE 69822426D1 DE 69822426 T DE69822426 T DE 69822426T DE 69822426 T DE69822426 T DE 69822426T DE 69822426 D1 DE69822426 D1 DE 69822426D1
Authority
DE
Germany
Prior art keywords
manufacturing process
edge connector
high contact
contact density
pcb edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69822426T
Other languages
English (en)
Other versions
DE69822426T2 (de
Inventor
Stanley W Olson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FCI SA
Original Assignee
FCI SA
Framatome Connectors International SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FCI SA, Framatome Connectors International SAS filed Critical FCI SA
Application granted granted Critical
Publication of DE69822426D1 publication Critical patent/DE69822426D1/de
Publication of DE69822426T2 publication Critical patent/DE69822426T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/506—Bases; Cases composed of different pieces assembled by snap action of the parts
DE69822426T 1997-12-23 1998-12-21 Leiterplatten-Randverbinder hoher Kontaktdichte und dessen Herstellungsverfahren Expired - Fee Related DE69822426T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US6866497P 1997-12-23 1997-12-23
US68664 1997-12-23
US200114 1998-11-25
US09/200,114 US6431889B1 (en) 1997-12-23 1998-11-25 High density edge card connector

Publications (2)

Publication Number Publication Date
DE69822426D1 true DE69822426D1 (de) 2004-04-22
DE69822426T2 DE69822426T2 (de) 2005-12-22

Family

ID=26749218

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69822426T Expired - Fee Related DE69822426T2 (de) 1997-12-23 1998-12-21 Leiterplatten-Randverbinder hoher Kontaktdichte und dessen Herstellungsverfahren

Country Status (6)

Country Link
US (1) US6431889B1 (de)
EP (1) EP0926779B1 (de)
JP (1) JPH11251014A (de)
CN (1) CN1109377C (de)
DE (1) DE69822426T2 (de)
TW (1) TW399788U (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6595788B2 (en) * 1999-10-14 2003-07-22 Berg Technology, Inc. Electrical connector with continuous strip contacts
US6527597B1 (en) * 2000-03-07 2003-03-04 Fci Americas Technology, Inc. Modular electrical connector
JP4713014B2 (ja) * 2001-05-16 2011-06-29 モレックス インコーポレイテド Ｂｇａコネクタ
JP4050025B2 (ja) * 2001-09-27 2008-02-20 カルソニックカンセイ株式会社 回路基板取付部構造
US20040018773A1 (en) * 2002-07-29 2004-01-29 Fci Americas Technology, Inc. Printed circuit board assembly having a BGA connection
JP2005209407A (ja) 2004-01-20 2005-08-04 Jst Mfg Co Ltd ロック機構付きコネクタ
US7029307B1 (en) 2004-12-14 2006-04-18 Intel Corporation Systems and methods for an improved card-edge connector
US7442089B2 (en) * 2005-07-07 2008-10-28 Molex Incorporated Edge card connector assembly with high-speed terminals
US7210955B2 (en) * 2005-08-01 2007-05-01 Tyco Electronics Corporation Fully buffered press-fit DIMM connector
KR100673614B1 (ko) 2006-01-26 2007-01-24 (주)마이크로컨텍솔루션 메모리 테스트 소켓 장치
US7472477B2 (en) * 2006-10-12 2009-01-06 International Business Machines Corporation Method for manufacturing a socket that compensates for differing coefficients of thermal expansion
US7303443B1 (en) 2006-10-12 2007-12-04 International Business Machines Corporation Socket and method for compensating for differing coefficients of thermal expansion
CN201142447Y (zh) 2007-10-09 2008-10-29 番禺得意精密电子工业有限公司 电连接器
US7488192B1 (en) * 2008-01-10 2009-02-10 International Business Machines Corporation Apparatus and method that minimizing dimensional instability and solder stress in surface mounted interconnections
US10236032B2 (en) * 2008-09-18 2019-03-19 Novachips Canada Inc. Mass data storage system with non-volatile memory modules
US20110104913A1 (en) * 2009-11-02 2011-05-05 Hinkle Jonathan R Edge card connector having solder balls and related methods
US8052448B2 (en) * 2009-12-25 2011-11-08 Hon Hai Precision Ind. Co., Ltd. Card edge connector
CN201887188U (zh) * 2010-06-08 2011-06-29 富士康(昆山)电脑接插件有限公司 卡缘连接器
JP6227225B2 (ja) * 2012-04-16 2017-11-08 日本航空電子工業株式会社 コネクタ
JP6076952B2 (ja) * 2014-11-21 2017-02-08 矢崎総業株式会社 基板用端子及び端子付き基板
CN107681305B (zh) * 2017-08-30 2020-05-19 武汉船用机械有限责任公司 一种接线端子
US10720722B2 (en) * 2018-09-14 2020-07-21 Quanta Computer Inc. Electronics connector for facilitating treatment
US20210203094A1 (en) * 2021-03-16 2021-07-01 Intel Corporation Ball grid array card edge connector

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586254A (en) * 1983-08-05 1986-05-06 Elfab Corp. Method of making a modular connector
DE8713932U1 (de) 1987-10-16 1988-01-14 Du Pont De Nemours (Nederland) B.V., Dordrecht, Nl
CA2015898C (en) * 1989-05-31 1996-04-23 Wayne Samuel Davis High density ribbon cable connector
JPH0686278U (ja) * 1993-05-27 1994-12-13 日本航空電子工業株式会社 カードエッジコネクタ
US5468154A (en) * 1993-12-15 1995-11-21 Burndy Corporation Multi-piece housing card edge connector with mounting arms
US5395250A (en) 1994-01-21 1995-03-07 The Whitaker Corporation Low profile board to board connector
US5496180A (en) 1994-04-06 1996-03-05 The Whitaker Corporation Surface mountable card edge connector
US5593322A (en) * 1995-01-17 1997-01-14 Dell Usa, L.P. Leadless high density connector
US5584709A (en) * 1995-01-30 1996-12-17 Molex Incorporated Printed circuit board mounted electrical connector
US5554047A (en) * 1995-02-28 1996-09-10 The Whitaker Corporation Electrical connector with terminal supporting walls
US5609493A (en) * 1995-03-16 1997-03-11 Hon Hai Precision Ind. Co., Ltd. Device for short-circuiting for use with connector
TW395069B (en) 1995-08-23 2000-06-21 Connector Systems Tech Nv Connector
US5558528A (en) * 1995-11-13 1996-09-24 Hon Hai Precision Ind. Co., Ltd. Connector with ejector
US5931687A (en) 1996-01-11 1999-08-03 Molex Incorporated Electrical connector with terminal modules and terminal tail aligning device
US6024584A (en) * 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
US6139336A (en) 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
TW329992U (en) * 1996-11-18 1998-04-11 Hon Hai Prec Ind Co Ltd Connector ejecting device
US6116921A (en) * 1998-02-16 2000-09-12 The Whitaker Corporation Electrical connector having recessed solderball foot

Also Published As

Publication number Publication date
CN1109377C (zh) 2003-05-21
US6431889B1 (en) 2002-08-13
DE69822426T2 (de) 2005-12-22
CN1221997A (zh) 1999-07-07
JPH11251014A (ja) 1999-09-17
EP0926779B1 (de) 2004-03-17
EP0926779A1 (de) 1999-06-30
TW399788U (en) 2000-07-21

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FCI, VERSAILLES, FR

8339 Ceased/non-payment of the annual fee