DE69826846D1 - Verfahren und vorrichtung zum aufspulen von bauteilen - Google Patents

Verfahren und vorrichtung zum aufspulen von bauteilen

Info

Publication number
DE69826846D1
DE69826846D1 DE69826846T DE69826846T DE69826846D1 DE 69826846 D1 DE69826846 D1 DE 69826846D1 DE 69826846 T DE69826846 T DE 69826846T DE 69826846 T DE69826846 T DE 69826846T DE 69826846 D1 DE69826846 D1 DE 69826846D1
Authority
DE
Germany
Prior art keywords
rewinding
components
rewinding components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69826846T
Other languages
English (en)
Other versions
DE69826846T2 (de
DE69826846T8 (de
Inventor
Osamu Hikita
Susumu Kubo
Kazunori Oshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
DAIICHI Co Ltd
Nihon Garter Co Ltd
Daiichi Co Ltd
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DAIICHI Co Ltd, Nihon Garter Co Ltd, Daiichi Co Ltd, Matsushita Electric Industrial Co Ltd filed Critical DAIICHI Co Ltd
Application granted granted Critical
Publication of DE69826846D1 publication Critical patent/DE69826846D1/de
Publication of DE69826846T2 publication Critical patent/DE69826846T2/de
Publication of DE69826846T8 publication Critical patent/DE69826846T8/de
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003Placing of components on belts holding the terminals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53039Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048Multiple station assembly or disassembly apparatus
    • Y10T29/53052Multiple station assembly or disassembly apparatus including position sensor
DE69826846T 1997-01-17 1998-01-14 Verfahren und vorrichtung zum aufspulen von bauteilen Expired - Fee Related DE69826846T8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP635097 1997-01-17
JP00635097A JP3749585B2 (ja) 1997-01-17 1997-01-17 部品のテーピング方法と装置
PCT/JP1998/000117 WO1998032160A1 (en) 1997-01-17 1998-01-14 Component taping method and apparatus

Publications (3)

Publication Number Publication Date
DE69826846D1 true DE69826846D1 (de) 2004-11-11
DE69826846T2 DE69826846T2 (de) 2006-02-02
DE69826846T8 DE69826846T8 (de) 2006-04-27

Family

ID=11635929

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69826846T Expired - Fee Related DE69826846T8 (de) 1997-01-17 1998-01-14 Verfahren und vorrichtung zum aufspulen von bauteilen

Country Status (5)

Country Link
US (1) US6571530B1 (de)
EP (1) EP0974157B1 (de)
JP (1) JP3749585B2 (de)
DE (1) DE69826846T8 (de)
WO (1) WO1998032160A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19830562A1 (de) * 1998-07-08 2000-01-20 Siemens Ag Einrichtung zum Aufnehmen von ausgemusterten elektrischen Bauelementen
EP1076357A1 (de) 1999-08-11 2001-02-14 SiMoTec GmbH Montagevorrichtung zur Herstellung microsystemtechnischer Produkte
DE10017742C2 (de) * 2000-04-10 2002-05-29 Infineon Technologies Ag Vorrichtung zum Handling von Bauelementen
US20070042532A1 (en) * 2005-08-19 2007-02-22 Taiwan Semiconductor Manufacturing Co., Ltd. System and methods for packing in turnkey services
TWI337154B (en) * 2008-04-17 2011-02-11 Gudeng Prec Industral Co Ltd Gas filling apparatus and gas filling port thereof
JP5570772B2 (ja) * 2009-07-30 2014-08-13 ウルマ パッケージング テクノロジカル センター エス コープ ヒートシール包装装置及びヒートシール包装方法
US20120024671A1 (en) * 2010-07-30 2012-02-02 Cheng Uei Precision Industry Co., Ltd. Transferring mechanism of contact test
TWI739361B (zh) * 2020-03-26 2021-09-11 南茂科技股份有限公司 清潔裝置及捲帶自動接合封裝結構的製造設備

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3830608A (en) * 1971-12-30 1974-08-20 Mallet & Co Inc Automatic machine for greasing bakery pans and depositing batter therein
US3840198A (en) * 1972-08-09 1974-10-08 J Moore Spring-loaded expandable reel
US4093143A (en) * 1977-04-11 1978-06-06 Escue Jesse W Stock winding apparatus
JPS60183769U (ja) * 1984-05-18 1985-12-05 竹内 忍 リ−ル
US4681221A (en) 1986-10-30 1987-07-21 International Business Machines Corporation Holder for plastic leaded chip carrier
US4810154A (en) * 1988-02-23 1989-03-07 Molex Incorporated Component feeder apparatus and method for vision-controlled robotic placement system
US5289625A (en) * 1989-04-05 1994-03-01 Canon Kabushiki Kaisha Method for supplying articles and apparatus therefor
US5191693A (en) * 1989-12-29 1993-03-09 Canon Kabushiki Kaisha Tape type work conveying method and conveying apparatus
JPH046055A (ja) 1990-04-13 1992-01-10 Matsushita Electric Ind Co Ltd 部品収納体
US5235164A (en) * 1990-09-19 1993-08-10 Matsushita Electric Industrial Co., Ltd. Parts supply device, parts supply method, parts managing system, and parts managing apparatus
JPH07114319B2 (ja) * 1991-01-22 1995-12-06 松下電器産業株式会社 チップ形電子部品の供給装置
JP2894119B2 (ja) 1992-11-20 1999-05-24 松下電器産業株式会社 部品収納体と部品集合体ならびに部品集合体の製造方法
US5670429A (en) * 1993-06-30 1997-09-23 Rohm Co. Ltd. Process of conveying an encapsulated electronic component by engaging an integral resin projection
EP0660655B1 (de) * 1993-12-27 1998-01-28 GOLD INDUSTRIES Co. Ltd. Behältereinrichtungen-Zusammenbau zum Transportieren von Präzisionsvorrichtung
JPH07193397A (ja) * 1993-12-27 1995-07-28 Yamaha Motor Co Ltd 実装機の吸着ポイント補正装置
US5472085A (en) * 1994-05-16 1995-12-05 Gpax International, Inc. Gated-pocket tape-form packaging system
JP3526625B2 (ja) * 1994-07-20 2004-05-17 松下電器産業株式会社 部品集合体とその供給装置
KR100404559B1 (ko) * 1995-09-22 2004-04-21 마쯔시다덴기산교 가부시키가이샤 부품리테이너와이것의제조방법및이부품리테이너를사용하는부품공급장치
US5622333A (en) * 1996-01-03 1997-04-22 Ipl Inc. Adjustable wire reel

Also Published As

Publication number Publication date
EP0974157B1 (de) 2004-10-06
JPH10209672A (ja) 1998-08-07
US6571530B1 (en) 2003-06-03
DE69826846T2 (de) 2006-02-02
WO1998032160A1 (en) 1998-07-23
DE69826846T8 (de) 2006-04-27
JP3749585B2 (ja) 2006-03-01
EP0974157A1 (de) 2000-01-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., KADOMA,

Owner name: NIHON GARTER CO., LTD., OUME, TOKYO, JP

Owner name: DAIICHI CO., LTD., IRUMA, SAITAMA, JP

8327 Change in the person/name/address of the patent owner

Owner name: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., KADO, JP

8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee