DE69828879T8 - Merkmalen zur erhöhung der wärmeübertragung für halbleiterträger und halbleiteranordnungen - Google Patents

Merkmalen zur erhöhung der wärmeübertragung für halbleiterträger und halbleiteranordnungen Download PDF

Info

Publication number
DE69828879T8
DE69828879T8 DE69828879T DE69828879T DE69828879T8 DE 69828879 T8 DE69828879 T8 DE 69828879T8 DE 69828879 T DE69828879 T DE 69828879T DE 69828879 T DE69828879 T DE 69828879T DE 69828879 T8 DE69828879 T8 DE 69828879T8
Authority
DE
Germany
Prior art keywords
semiconductor
heat transmission
increasing heat
arrangements
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69828879T
Other languages
English (en)
Other versions
DE69828879T2 (de
DE69828879D1 (de
Inventor
C. Andreas PFAHNL
H. Alexander SLOCUM
H. John LIENHARD
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Application granted granted Critical
Publication of DE69828879D1 publication Critical patent/DE69828879D1/de
Publication of DE69828879T2 publication Critical patent/DE69828879T2/de
Publication of DE69828879T8 publication Critical patent/DE69828879T8/de
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69828879T 1997-07-10 1998-06-01 Merkmalen zur erhöhung der wärmeübertragung für halbleiterträger und halbleiteranordnungen Expired - Fee Related DE69828879T8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US890917 1986-07-30
US08/890,917 US6036023A (en) 1997-07-10 1997-07-10 Heat-transfer enhancing features for semiconductor carriers and devices
PCT/US1998/011066 WO1999003130A1 (en) 1997-07-10 1998-06-01 Heat-transfer enhancing features for semiconductor carriers and devices

Publications (3)

Publication Number Publication Date
DE69828879D1 DE69828879D1 (de) 2005-03-10
DE69828879T2 DE69828879T2 (de) 2006-03-30
DE69828879T8 true DE69828879T8 (de) 2006-06-08

Family

ID=25397333

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69828879T Expired - Fee Related DE69828879T8 (de) 1997-07-10 1998-06-01 Merkmalen zur erhöhung der wärmeübertragung für halbleiterträger und halbleiteranordnungen

Country Status (6)

Country Link
US (1) US6036023A (de)
EP (1) EP0995226B1 (de)
JP (1) JP4229585B2 (de)
KR (1) KR100573867B1 (de)
DE (1) DE69828879T8 (de)
WO (1) WO1999003130A1 (de)

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US6484881B1 (en) * 1999-02-05 2002-11-26 Alvite Joseph G. Electronic component package for standard and odd form components
JP3771084B2 (ja) * 1999-04-30 2006-04-26 Ｎｅｃエレクトロニクス株式会社 半導体集積回路装置用トレイ
US6488154B1 (en) * 2000-10-16 2002-12-03 Ming-Chuan Yeh Chip tray
US6474477B1 (en) * 2001-05-02 2002-11-05 Ching T. Chang Carrier assembly for semiconductor IC (integrated circuit) packages
US7032392B2 (en) * 2001-12-19 2006-04-25 Intel Corporation Method and apparatus for cooling an integrated circuit package using a cooling fluid
US20110056865A1 (en) * 2006-10-17 2011-03-10 Dikselis Mitchell B Product Container Including Surface with Bumps
US20080217341A1 (en) * 2007-03-09 2008-09-11 Nestec S.A. Hygienic baking pan and methods for producing and using same
US9048272B2 (en) * 2008-09-25 2015-06-02 Illinois Tool Works Inc. Devices and method for handling microelectronics assemblies
DE202009001817U1 (de) * 2009-01-31 2009-06-04 Roth & Rau Ag Substratträger zur Halterung einer Vielzahl von Solarzellenwafern
US20110089079A1 (en) * 2009-10-18 2011-04-21 Yu-Nan Lo Chip Carrying Tray
MY166008A (en) * 2010-03-12 2018-05-21 Illinois Tool Works A strippable hybrid tray system for electronic devices
KR20120018644A (ko) * 2010-08-23 2012-03-05 삼성전자주식회사 반도체 패키지 이송 장치
US9640954B2 (en) * 2010-10-13 2017-05-02 Komax Holding Ag Wire-processing device with deposit unit
JP6220566B2 (ja) * 2013-06-07 2017-10-25 株式会社 Ｓｙｎａｘ 電子部品の搬送装置
US10548228B2 (en) 2016-03-03 2020-01-28 International Business Machines Corporation Thermal interface adhesion for transfer molded electronic components
CN105667949B (zh) * 2016-04-15 2018-07-03 武汉华星光电技术有限公司 液晶面板包装箱
KR20200045146A (ko) 2018-10-22 2020-05-04 케이지케미칼 주식회사 철염이 포함된 고효율 폴리염화알루미늄 응집제의 제조 방법 및 그 응집제
WO2021075357A1 (ja) * 2019-10-19 2021-04-22 株式会社村田製作所 チップ状電子部品用ジグ
CN113015344B (zh) 2019-12-20 2023-03-07 奥特斯科技(重庆)有限公司 在处理阵列级部件承载件期间使阵列和分隔件本体堆叠
CN115258357A (zh) * 2022-08-18 2022-11-01 湖南越摩先进半导体有限公司 装载布局可调的托盘

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US3283992A (en) * 1964-04-17 1966-11-08 Union Carbide Canada Ltd Embossed anti-skid bags
DE2448853C3 (de) * 1974-10-14 1985-12-05 Agfa-Gevaert Ag, 5090 Leverkusen Flanschloser, stapelbarer Wickelkern für ein Magnetband
GB2040437B (en) * 1979-01-25 1983-02-09 Dale Electronics Ltd Electrical component testing chamber with air flow therein
GB8425299D0 (en) * 1984-10-06 1984-11-14 Young D N Heating oven
US5131535A (en) * 1986-06-27 1992-07-21 Symtek Systems, Inc. Electrical device transport medium
US4926118A (en) * 1988-02-22 1990-05-15 Sym-Tek Systems, Inc. Test station
KR0169467B1 (ko) * 1988-10-14 1999-01-15 야마무라 가쯔미 Ic패키지용 콘테이너 및 그 이송 방법
US5184068A (en) * 1990-09-24 1993-02-02 Symtek Systems, Inc. Electronic device test handler
US5103976A (en) * 1990-09-25 1992-04-14 R. H. Murphy Company, Inc. Tray for integrated circuits with supporting ribs
US5335771A (en) * 1990-09-25 1994-08-09 R. H. Murphy Company, Inc. Spacer trays for stacking storage trays with integrated circuits
US5746319A (en) * 1990-09-25 1998-05-05 R.H. Murphy Co., Inc. Tray for integrated circuits
US5155579A (en) * 1991-02-05 1992-10-13 Advanced Micro Devices Molded heat sink for integrated circuit package
US5290134A (en) * 1991-12-03 1994-03-01 Advantest Corporation Pick and place for automatic test handler
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling
US5203452A (en) * 1992-03-13 1993-04-20 Illinois Tool Works, Inc. Shipping tray
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US5310076A (en) * 1992-10-19 1994-05-10 Arrow Electronics, Inc. Snap-on lid for computer chip tray
US5400904C1 (en) * 1993-10-15 2001-01-16 Murphy R H Co Inc Tray for ball terminal integrated circuits
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US5584707A (en) * 1994-03-28 1996-12-17 The Whitaker Corporation Chip socket system
US5427536A (en) * 1994-03-29 1995-06-27 Minnesota Mining And Manufacturing Company Socket for tab testing
US5418692A (en) * 1994-08-22 1995-05-23 Shinon Denkisangyo Kabushiki-Kaisha Tray for semiconductor devices
US5481438A (en) * 1994-09-06 1996-01-02 Shinon Denkisangyo Kabushiki Kaisha Tray for semiconductor devices
JP2688664B2 (ja) * 1994-09-07 1997-12-10 シノン電気産業株式会社 半導体デバイス用トレー

Also Published As

Publication number Publication date
JP4229585B2 (ja) 2009-02-25
EP0995226A1 (de) 2000-04-26
WO1999003130A1 (en) 1999-01-21
DE69828879T2 (de) 2006-03-30
EP0995226B1 (de) 2005-02-02
US6036023A (en) 2000-03-14
KR100573867B1 (ko) 2006-04-26
JP2001509607A (ja) 2001-07-24
DE69828879D1 (de) 2005-03-10
KR20010021628A (ko) 2001-03-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee