DE69829536D1 - Wärmeleitendes Substrat, das in einer Öffnung einer PC-Platine pressmontiert ist, um Wärme vom IC zu einer Wärmesenke zu transferieren - Google Patents

Wärmeleitendes Substrat, das in einer Öffnung einer PC-Platine pressmontiert ist, um Wärme vom IC zu einer Wärmesenke zu transferieren

Info

Publication number
DE69829536D1
DE69829536D1 DE69829536T DE69829536T DE69829536D1 DE 69829536 D1 DE69829536 D1 DE 69829536D1 DE 69829536 T DE69829536 T DE 69829536T DE 69829536 T DE69829536 T DE 69829536T DE 69829536 D1 DE69829536 D1 DE 69829536D1
Authority
DE
Germany
Prior art keywords
board
opening
thermally conductive
conductive substrate
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69829536T
Other languages
English (en)
Other versions
DE69829536T2 (de
Inventor
Paul A Rubens
Charlie W Gilson
Brian G Spreadbury
Horst F Irmscher
Tim J Jondrow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69829536D1 publication Critical patent/DE69829536D1/de
Application granted granted Critical
Publication of DE69829536T2 publication Critical patent/DE69829536T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
DE69829536T 1997-10-28 1998-09-23 Wärmeleitendes Substrat, das in einer Öffnung einer PC-Platine pressmontiert ist, um Wärme vom IC zu einer Wärmesenke zu transferieren Expired - Fee Related DE69829536T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US958954 1997-10-28
US08/958,954 US5960535A (en) 1997-10-28 1997-10-28 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink

Publications (2)

Publication Number Publication Date
DE69829536D1 true DE69829536D1 (de) 2005-05-04
DE69829536T2 DE69829536T2 (de) 2006-02-16

Family

ID=25501485

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69829536T Expired - Fee Related DE69829536T2 (de) 1997-10-28 1998-09-23 Wärmeleitendes Substrat, das in einer Öffnung einer PC-Platine pressmontiert ist, um Wärme vom IC zu einer Wärmesenke zu transferieren

Country Status (8)

Country Link
US (2) US5960535A (de)
EP (2) EP1496546A2 (de)
JP (1) JPH11330750A (de)
CN (1) CN1155082C (de)
DE (1) DE69829536T2 (de)
HK (1) HK1018920A1 (de)
SG (1) SG71795A1 (de)
TW (1) TW430961B (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6235991B1 (en) * 1998-06-30 2001-05-22 Lucent Technologies Inc. Recessed mechanical fasteners for circuit boards
TW451535B (en) 1998-09-04 2001-08-21 Sony Corp Semiconductor device and package, and fabrication method thereof
US6352203B1 (en) * 1999-03-17 2002-03-05 Compaq Information Technologies Group, L.P. Automated semiconductor identification system
US6188579B1 (en) * 1999-07-12 2001-02-13 Lucent Technologies Inc. Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage
US6219243B1 (en) * 1999-12-14 2001-04-17 Intel Corporation Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units
US6428189B1 (en) * 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
DE10142987A1 (de) * 2001-09-01 2003-04-03 Conti Temic Microelectronic Wärmeableitelement für elektronische Bauteile
US6563696B1 (en) * 2001-10-17 2003-05-13 Ciena Corporation Solderless laser assembly
WO2003077101A2 (en) * 2002-03-06 2003-09-18 Z-Kat, Inc. System and method for using a haptic device in combination with a computer-assisted surgery system
JP3583762B2 (ja) * 2002-03-07 2004-11-04 株式会社東芝 電子機器
DE60209423T2 (de) * 2002-11-08 2006-08-10 Agilent Technologies Inc., A Delaware Corp., Palo Alto Mikrochip-Kühlung auf Leiterplatte
JP3790225B2 (ja) * 2003-03-25 2006-06-28 東芝キヤリア株式会社 放熱装置
EP1480269A1 (de) * 2003-05-13 2004-11-24 Agilent Technologies Inc Leiterplatte mit verbesserter Kühlung der elektrischen Komponenten
DE10335129B3 (de) * 2003-07-31 2005-06-23 Kathrein-Werke Kg Kühlanordnung für auf einer Leiterplatte angeordnete elektrische Bauelemente, insbesondere SMD-Bausteine
CN1296918C (zh) * 2003-10-13 2007-01-24 华硕电脑股份有限公司 光学读写头的控制芯片散热机构
US7145774B2 (en) * 2003-12-29 2006-12-05 Intel Corporation Backside cooling apparatus for modular platforms
US20050236716A1 (en) * 2004-04-22 2005-10-27 Hsuch-Chung Chen Heat dissipation structure and method thereof
US7199496B2 (en) * 2005-01-18 2007-04-03 Oriental Motor Boston Technology Group Incorporated Integrated electric motor and drive, optimized for high-temperature operation
JP4538359B2 (ja) * 2005-03-31 2010-09-08 株式会社日立産機システム 電気回路モジュール
DE102005049872B4 (de) * 2005-10-18 2010-09-23 Continental Automotive Gmbh IC-Bauelement mit Kühlanordnung
TWI340010B (en) * 2006-08-04 2011-04-01 Everlight Electronics Co Ltd Circuit board with cooling functionality
CN101026953B (zh) * 2007-03-29 2010-07-28 杭州华三通信技术有限公司 压力安装装置及压力安装方法
US7706144B2 (en) * 2007-12-17 2010-04-27 Lynch Thomas W Heat dissipation system and related method
US7724528B2 (en) * 2008-07-11 2010-05-25 Cisco Technology, Inc. Thermal dissipation heat slug sandwich
JP4789997B2 (ja) * 2008-11-20 2011-10-12 三菱電機株式会社 電子基板装置
CN102347437A (zh) * 2010-07-30 2012-02-08 欧司朗有限公司 电子发热模块及其制造方法
JP2012142391A (ja) * 2010-12-28 2012-07-26 Sumitomo Electric Ind Ltd 電気機器および電気機器の製造方法
FR2973942B1 (fr) * 2011-04-08 2013-09-06 Continental Automotive France Composant électronique avec pastille de dissipation thermique et carte utilisant ce composant
US9209106B2 (en) * 2012-06-21 2015-12-08 Ati Technologies Ulc Thermal management circuit board for stacked semiconductor chip device
CN104684338B (zh) * 2013-11-26 2018-01-30 台达电子企业管理（上海）有限公司 散热基座与电子装置
CN106488686B (zh) * 2015-08-31 2020-09-29 上海伯乐电子有限公司 照明器件、电气组件、柔性电路及热传递方法
CN108781018B (zh) * 2016-03-11 2021-09-21 Itt制造企业有限责任公司 包括具有多层功率和控制印刷电路板组件的功率平面的用于驱动泵或旋转装置的电机组件
US10504813B2 (en) * 2016-09-30 2019-12-10 Astec International Limited Heat sink assemblies for surface mounted devices
US11451156B2 (en) 2020-01-21 2022-09-20 Itt Manufacturing Enterprises Llc Overvoltage clamp for a matrix converter
US11448225B2 (en) 2020-01-21 2022-09-20 Itt Manufacturing Enterprises Llc Motor assembly for driving a pump or rotary device having a cooling duct
US11394264B2 (en) 2020-01-21 2022-07-19 Itt Manufacturing Enterprises Llc Motor assembly for driving a pump or rotary device with a low inductance resistor for a matrix converter
KR20230011733A (ko) * 2021-07-14 2023-01-25 엘지이노텍 주식회사 전자장치
CN113709968A (zh) * 2021-09-10 2021-11-26 上海移远通信技术股份有限公司 一种pcb散热组件

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE39788T1 (de) * 1982-09-09 1989-01-15 Siemens Ag Einrichtung zum kuehlen einer mehrzahl von zu flachbaugruppen zusammengefassten integrierten bausteinen.
US4602314A (en) * 1983-10-14 1986-07-22 Intel Corporation Heat conduction mechanism for semiconductor devices
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
US4750089A (en) * 1985-11-22 1988-06-07 Texas Instruments Incorporated Circuit board with a chip carrier and mounting structure connected to the chip carrier
US4731693A (en) * 1986-09-29 1988-03-15 Tektronix, Inc. Connection apparatus for integrated circuit
JP2590521B2 (ja) * 1988-03-29 1997-03-12 日本電気株式会社 チップキャリア
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
JPH0279451A (ja) * 1988-09-14 1990-03-20 Hitachi Ltd 半導体装置およびその製造方法
US5095404A (en) * 1990-02-26 1992-03-10 Data General Corporation Arrangement for mounting and cooling high density tab IC chips
US5099309A (en) * 1990-04-30 1992-03-24 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
JP2745786B2 (ja) * 1990-06-15 1998-04-28 松下電器産業株式会社 Ｔａｂ半導体装置
IT1250405B (it) * 1991-01-31 1995-04-07 Sgs Thomson Microelectronics Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa
JPH0582685A (ja) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp 混成集積部品の放熱部および端子部用構造体とその構造体を用いた混成集積部品の製造方法
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
US5278724A (en) * 1992-07-06 1994-01-11 International Business Machines Corporation Electronic package and method of making same
DE4232575A1 (de) * 1992-09-29 1994-03-31 Bosch Gmbh Robert Anordnung mit einer Leiterplatte, mindestens einem Leistungsbauelement und einem Kühlkörper
KR100307465B1 (ko) * 1992-10-20 2001-12-15 야기 추구오 파워모듈
US5481136A (en) * 1992-10-28 1996-01-02 Sumitomo Electric Industries, Ltd. Semiconductor element-mounting composite heat-sink base
US5886407A (en) * 1993-04-14 1999-03-23 Frank J. Polese Heat-dissipating package for microcircuit devices
US5444296A (en) * 1993-11-22 1995-08-22 Sun Microsystems, Inc. Ball grid array packages for high speed applications
US5410451A (en) * 1993-12-20 1995-04-25 Lsi Logic Corporation Location and standoff pins for chip on tape
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
EP0742682B1 (de) * 1995-05-12 2005-02-23 STMicroelectronics, Inc. IC-Packungsfassungssystem mit niedrigem Profil
US5617294A (en) * 1995-09-29 1997-04-01 Intel Corporation Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board
US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US5856911A (en) * 1996-11-12 1999-01-05 National Semiconductor Corporation Attachment assembly for integrated circuits
US5920458A (en) * 1997-05-28 1999-07-06 Lucent Technologies Inc. Enhanced cooling of a heat dissipating circuit element

Also Published As

Publication number Publication date
EP0913861B1 (de) 2005-03-30
CN1155082C (zh) 2004-06-23
JPH11330750A (ja) 1999-11-30
EP0913861A2 (de) 1999-05-06
CN1215922A (zh) 1999-05-05
TW430961B (en) 2001-04-21
DE69829536T2 (de) 2006-02-16
US5960535A (en) 1999-10-05
US6018193A (en) 2000-01-25
EP0913861A3 (de) 1999-07-28
EP1496546A2 (de) 2005-01-12
SG71795A1 (en) 2000-04-18
HK1018920A1 (en) 2000-01-07

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