DE69833071D1 - Blattrahmen-IC-Karte und Verfahren zur Herstellung derselben - Google Patents
Blattrahmen-IC-Karte und Verfahren zur Herstellung derselbenInfo
- Publication number
- DE69833071D1 DE69833071D1 DE69833071T DE69833071T DE69833071D1 DE 69833071 D1 DE69833071 D1 DE 69833071D1 DE 69833071 T DE69833071 T DE 69833071T DE 69833071 T DE69833071 T DE 69833071T DE 69833071 D1 DE69833071 D1 DE 69833071D1
- Authority
- DE
- Germany
- Prior art keywords
- framed
- card
- sheet
- making
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18028697A JP3883652B2 (ja) | 1997-06-23 | 1997-06-23 | 板状枠体付きicキャリアとその製造方法 |
JP18028697 | 1997-06-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69833071D1 true DE69833071D1 (de) | 2006-03-30 |
DE69833071T2 DE69833071T2 (de) | 2006-08-31 |
Family
ID=16080564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69833071T Expired - Lifetime DE69833071T2 (de) | 1997-06-23 | 1998-06-23 | Blattrahmen-IC-Karte und Verfahren zur Herstellung derselben |
Country Status (4)
Country | Link |
---|---|
US (2) | US6320751B2 (de) |
EP (1) | EP0887767B1 (de) |
JP (1) | JP3883652B2 (de) |
DE (1) | DE69833071T2 (de) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3883652B2 (ja) * | 1997-06-23 | 2007-02-21 | 大日本印刷株式会社 | 板状枠体付きicキャリアとその製造方法 |
US6230006B1 (en) | 1997-09-08 | 2001-05-08 | Acterna, Llc | Test system for remotely testing switches within a telecommunications network |
FR2778769B1 (fr) * | 1998-05-15 | 2001-11-02 | Gemplus Sca | Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte |
US7020441B2 (en) * | 1998-09-03 | 2006-03-28 | Casabyte, Inc. | Test system for remotely testing switches within a telecommunications network |
WO2000070553A1 (de) * | 1999-05-14 | 2000-11-23 | Robert Bosch Gmbh | Kontaktanordnung und gegenkontaktmodul |
DE19922063A1 (de) * | 1999-05-14 | 2000-11-23 | Bosch Gmbh Robert | Adapterkarte und Kommunikationsvorrichtung |
FR2794264B1 (fr) * | 1999-05-27 | 2001-11-02 | Gemplus Card Int | Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte |
US7487908B1 (en) | 1999-10-23 | 2009-02-10 | Ultracard, Inc. | Article having an embedded accessible storage member, apparatus and method for using same |
DE10008851A1 (de) * | 2000-02-25 | 2001-08-30 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung laserbeschriftbarer Datenträger und damit hergestellte Datenträger |
DE10016283C2 (de) * | 2000-03-31 | 2003-03-27 | Orga Kartensysteme Gmbh | Datenträgerkarte |
JP2001344581A (ja) * | 2000-05-31 | 2001-12-14 | Kobayashi Kirokushi Co Ltd | Icカード |
US6641049B2 (en) * | 2000-08-31 | 2003-11-04 | Pacusma Company, Ltd. | Integrated circuit card with multiple integral electronic modules |
JP2002096584A (ja) * | 2000-09-21 | 2002-04-02 | Dainippon Printing Co Ltd | 顧客カード |
US6648232B1 (en) * | 2000-10-24 | 2003-11-18 | Moore North America, Inc. | High temperature tag having enclosed transceiver |
JP4770031B2 (ja) * | 2001-02-08 | 2011-09-07 | 大日本印刷株式会社 | 板状枠体付きicキャリアとその製造方法 |
US6653565B2 (en) * | 2001-04-27 | 2003-11-25 | Matsushita Electric Industrial Co., Ltd. | IC card with plated frame and method for manufacturing the same |
US6836670B2 (en) | 2002-05-09 | 2004-12-28 | Casabyte, Inc. | Method, apparatus and article to remotely associate wireless communications devices with subscriber identities and /or proxy wireless communications devices |
JP2004013501A (ja) * | 2002-06-06 | 2004-01-15 | Daishowa Seiki Co Ltd | 情報システム及び情報保持体 |
EP1413978A1 (de) * | 2002-10-24 | 2004-04-28 | SCHLUMBERGER Systèmes | Datenträger |
EP1617353A1 (de) * | 2004-07-13 | 2006-01-18 | Axalto SA | Mini-plug SIM-Karte mit verbesserter Positionierungseinrichtung |
FR2885718B1 (fr) * | 2005-05-11 | 2007-09-21 | Gemplus Sa | Adaptateur de format a adhesif pour dispositif a memoire et procede de fabrication |
FR2895116B1 (fr) * | 2005-12-16 | 2009-05-22 | Oberthur Card Syst Sa | Procede de fabrication de cartes a microcircuit |
US7193161B1 (en) * | 2006-02-15 | 2007-03-20 | Sandisk Corporation | SiP module with a single sided lid |
EP1911599A1 (de) * | 2006-10-11 | 2008-04-16 | Setec Oy | Verfahren zur Herstellung eines Datenträgers und damit hergestellter Datenträger |
KR100938214B1 (ko) | 2008-01-25 | 2010-01-22 | (주)아이씨코리아 | 고용량 메모리칩 카드의 제조방법 |
US20100078485A1 (en) * | 2008-09-29 | 2010-04-01 | Dynacard Co., Ltd. | Subscriber identity module card |
DE102009006341A1 (de) * | 2009-01-27 | 2010-07-29 | Giesecke & Devrient Gmbh | Datenträgeranordnung |
DE102009009263A1 (de) * | 2009-02-17 | 2010-08-19 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung einer ein Fenster enthaltenden Abschlußschicht für einen tragbaren Datenträger und Abschlußschicht |
DE102010011517A1 (de) * | 2010-03-15 | 2011-09-15 | Smartrac Ip B.V. | Laminataufbau für eine Chipkarte und Verfahren zu dessen Herstellung |
CH703738B1 (de) | 2010-08-31 | 2018-05-31 | Swisscom Ag | SIM-Karte und Verfahren zur Herstellung derselben. |
US8446728B1 (en) * | 2011-01-03 | 2013-05-21 | Wade S. McDonald | Flash memory card carrier |
EP2533175B1 (de) | 2011-06-10 | 2016-11-09 | Oberthur Technologies | Datenträger mit einer Kontaktplatte mit darauf befindlichem Aufdruck |
EP2568418B1 (de) * | 2011-09-12 | 2015-08-19 | Oberthur Technologies | Mikrochipkarte sowie Werkzeug und Verfahren zur Herstellung dieser Karte |
USD691610S1 (en) | 2011-11-07 | 2013-10-15 | Blackberry Limited | Device smart card |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8950681B2 (en) | 2011-11-07 | 2015-02-10 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD702693S1 (en) * | 2011-11-23 | 2014-04-15 | Digital Hard Copy | Digital storage medium card |
USD702692S1 (en) * | 2011-11-23 | 2014-04-15 | Digital Hard Copy | Card for holding a digital storage medium |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) * | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
EP2674897B1 (de) * | 2012-06-15 | 2019-03-06 | IDEMIA France | Datenträger mit einer Chipkarte und entsprechendes Herstellungsverfahren |
USD707682S1 (en) * | 2012-12-05 | 2014-06-24 | Logomotion, S.R.O. | Memory card |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
USD759022S1 (en) | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
USD729808S1 (en) * | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
EP3168788A1 (de) | 2015-11-11 | 2017-05-17 | Mastercard International Incorporated | Chipkarte |
EP3168787A1 (de) * | 2015-11-11 | 2017-05-17 | Mastercard International Incorporated | Chipkarte |
DE202019101581U1 (de) * | 2019-02-19 | 2019-06-14 | ZIFFEREINS Beteiligungs-GmbH | Anordnung zum Erfassen von in der Wildnis befindlichen Objekten |
EP3726432B1 (de) * | 2019-04-18 | 2023-06-07 | MK Smart JSC | Chipkartenmodul mit mustern |
US20230025063A1 (en) * | 2019-12-13 | 2023-01-26 | Covestro Deutschland Ag | Layered structures with cutting lines |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3723547C2 (de) * | 1987-07-16 | 1996-09-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
US4855583A (en) * | 1987-08-17 | 1989-08-08 | Figgie International, Inc. | Structure and method of making combination proximity/insertion identification cards |
US5208450A (en) * | 1988-04-20 | 1993-05-04 | Matsushita Electric Industrial Co., Ltd. | IC card and a method for the manufacture of the same |
US5244840A (en) * | 1989-05-23 | 1993-09-14 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing an encapsulated IC card having a molded frame and a circuit board |
CA2007748C (en) * | 1989-08-31 | 1996-01-02 | Eiji Tamura | Food packaging container |
DE4007221A1 (de) * | 1990-03-07 | 1991-09-12 | Gao Ges Automation Org | Pruefkopf fuer kontaktflaechen von wertkarten mit eingelagertem halbleiterchip |
JP2602343B2 (ja) * | 1990-05-07 | 1997-04-23 | 三菱電機株式会社 | Icカード |
FR2678753B1 (fr) * | 1991-07-02 | 1996-12-20 | Gemplus Card Int | Fabrication de cartes a puce a module autodetachable. |
DE4132720A1 (de) | 1991-10-01 | 1993-04-08 | Gao Ges Automation Org | Chipkarte und verfahren zur herstellung derselben |
US5534905A (en) * | 1992-10-13 | 1996-07-09 | Fuji Photo Film Co., Ltd. | Thermal-transfer recording process |
US5501900A (en) * | 1993-03-03 | 1996-03-26 | Dai Nippon Printing Co., Ltd. | Black matrix substrate, and color filter and liquid crystal display device using the same |
JP3117322B2 (ja) * | 1993-04-05 | 2000-12-11 | 富士写真フイルム株式会社 | 感光性平版印刷版およびその支持体の製造方法 |
US5581065A (en) * | 1993-08-02 | 1996-12-03 | Dai Nippon Printing Co., Ltd. | Sheet-framed IC carrier, method for producing the same, and IC carrier case |
JPH07101188A (ja) * | 1993-10-05 | 1995-04-18 | Canon Inc | 複合カード |
US5542175A (en) * | 1994-12-20 | 1996-08-06 | International Business Machines Corporation | Method of laminating and circuitizing substrates having openings therein |
US5733814A (en) * | 1995-04-03 | 1998-03-31 | Aptek Industries, Inc. | Flexible electronic card and method |
KR100209259B1 (ko) * | 1996-04-25 | 1999-07-15 | 이해규 | Ic 카드 및 그 제조방법 |
US5786988A (en) * | 1996-07-02 | 1998-07-28 | Sandisk Corporation | Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture |
WO1998015980A1 (fr) * | 1996-10-10 | 1998-04-16 | Samsung Electronics Co., Ltd. | Circuit integre hybride et de grande puissance |
DE19703122C1 (de) * | 1997-01-29 | 1998-05-20 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung von Datenträgern |
JP3883652B2 (ja) * | 1997-06-23 | 2007-02-21 | 大日本印刷株式会社 | 板状枠体付きicキャリアとその製造方法 |
DE19906570A1 (de) * | 1999-02-17 | 2000-08-24 | Giesecke & Devrient Gmbh | Tragbarer Datenträger mit herausnehmbarer Minichipkate |
-
1997
- 1997-06-23 JP JP18028697A patent/JP3883652B2/ja not_active Expired - Fee Related
-
1998
- 1998-06-18 US US09/099,395 patent/US6320751B2/en not_active Expired - Fee Related
- 1998-06-23 EP EP98111549A patent/EP0887767B1/de not_active Expired - Lifetime
- 1998-06-23 DE DE69833071T patent/DE69833071T2/de not_active Expired - Lifetime
-
2001
- 2001-10-02 US US09/967,973 patent/US6581840B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20010018984A1 (en) | 2001-09-06 |
EP0887767A1 (de) | 1998-12-30 |
JPH1111066A (ja) | 1999-01-19 |
US20020007554A1 (en) | 2002-01-24 |
JP3883652B2 (ja) | 2007-02-21 |
US6320751B2 (en) | 2001-11-20 |
US6581840B2 (en) | 2003-06-24 |
EP0887767B1 (de) | 2006-01-04 |
DE69833071T2 (de) | 2006-08-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |