DE69837028D1 - Herstellungsverfahren eines festwertspeichers das den epromprozess mit dem standard-cmos-prozess kombiniert - Google Patents

Herstellungsverfahren eines festwertspeichers das den epromprozess mit dem standard-cmos-prozess kombiniert

Info

Publication number
DE69837028D1
DE69837028D1 DE69837028T DE69837028T DE69837028D1 DE 69837028 D1 DE69837028 D1 DE 69837028D1 DE 69837028 T DE69837028 T DE 69837028T DE 69837028 T DE69837028 T DE 69837028T DE 69837028 D1 DE69837028 D1 DE 69837028D1
Authority
DE
Germany
Prior art keywords
manufacturing
eprom
fixed memory
standard cmos
memory combining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69837028T
Other languages
English (en)
Other versions
DE69837028T2 (de
Inventor
Dominicus Verhaar
Jozef Dormans
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP BV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of DE69837028D1 publication Critical patent/DE69837028D1/de
Application granted granted Critical
Publication of DE69837028T2 publication Critical patent/DE69837028T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238Complementary field-effect transistors, e.g. CMOS
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/105Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/40Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
    • H10B41/42Simultaneous manufacture of periphery and memory cells
    • H10B41/49Simultaneous manufacture of periphery and memory cells comprising different types of peripheral transistor
DE69837028T 1997-04-01 1998-03-05 Herstellungsverfahren eines festwertspeichers das den epromprozess mit dem standard-cmos-prozess kombiniert Expired - Lifetime DE69837028T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP97200945 1997-04-01
EP97200945 1997-04-01
PCT/IB1998/000284 WO1998044552A2 (en) 1997-04-01 1998-03-05 Method of manufacturing a non-volatile memory combining an eprom with a standard cmos process

Publications (2)

Publication Number Publication Date
DE69837028D1 true DE69837028D1 (de) 2007-03-22
DE69837028T2 DE69837028T2 (de) 2008-01-10

Family

ID=8228159

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69837028T Expired - Lifetime DE69837028T2 (de) 1997-04-01 1998-03-05 Herstellungsverfahren eines festwertspeichers das den epromprozess mit dem standard-cmos-prozess kombiniert

Country Status (6)

Country Link
US (1) US6069033A (de)
EP (1) EP0914679B1 (de)
JP (1) JP2000511707A (de)
DE (1) DE69837028T2 (de)
TW (1) TW360951B (de)
WO (1) WO1998044552A2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW420874B (en) * 1998-05-04 2001-02-01 Koninkl Philips Electronics Nv Method of manufacturing a semiconductor device
KR100269510B1 (ko) * 1998-05-20 2000-10-16 윤종용 반도체 장치의 제조 방법
GB2359662B (en) * 1998-05-20 2002-01-16 Samsung Electronics Co Ltd A semiconductor device
TW415045B (en) * 1999-08-10 2000-12-11 United Microelectronics Corp Manufacture of embedded flash memory
EP1156524B1 (de) * 2000-05-15 2014-10-22 Micron Technology, Inc. Herstellungsverfahren für einen integrierten Schaltkreis mit Hochdichte- und Logik-Bauelementeteil
US6277690B1 (en) * 2000-11-02 2001-08-21 Advanced Micro Devices, Inc. Elimination of N+ implant from flash technologies by replacement with standard medium-doped-drain (Mdd) implant
CN100372068C (zh) * 2002-06-20 2008-02-27 Nxp股份有限公司 导电间隔物延伸的浮栅
EP1569274B1 (de) 2004-02-24 2010-01-20 STMicroelectronics S.r.l. Herstellungsverfahren für integrierte Halbleiter-Festwertspeicherbauelemente
US7101748B2 (en) * 2004-02-26 2006-09-05 Taiwan Semiconductor Manufacturing Company Method of integrating the formation of a shallow junction N channel device with the formation of P channel, ESD and input/output devices
US8035156B2 (en) * 2008-09-30 2011-10-11 Freescale Semiconductor, Inc. Split-gate non-volatile memory cell and method
KR20170007928A (ko) * 2015-07-13 2017-01-23 에스케이하이닉스 주식회사 비휘발성 메모리 소자 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1196997B (it) * 1986-07-25 1988-11-25 Sgs Microelettronica Spa Processo per realizzare strutture includenti celle di memoria non volatili e2prom con strati di silicio autoallineate transistori associati
US5223451A (en) * 1989-10-06 1993-06-29 Kabushiki Kaisha Toshiba Semiconductor device wherein n-channel MOSFET, p-channel MOSFET and nonvolatile memory cell are formed in one chip and method of making it
US5153143A (en) * 1990-02-26 1992-10-06 Delco Electronics Corporation Method of manufacturing CMOS integrated circuit with EEPROM
KR960009995B1 (ko) * 1992-07-31 1996-07-25 삼성전자 주식회사 반도체 장치의 제조 방법 및 그 구조
CA2107602C (en) * 1992-10-07 2004-01-20 Andrew Jan Walker Method of manufacturing an integrated circuit and integrated circuit obtained by this method
EP0595250B1 (de) * 1992-10-27 1999-01-07 Nec Corporation Verfahren zur Herstellung eines nicht-flüchtigen Halbleiter-Speicherbauteils
TW347567B (en) * 1996-03-22 1998-12-11 Philips Eloctronics N V Semiconductor device and method of manufacturing a semiconductor device

Also Published As

Publication number Publication date
US6069033A (en) 2000-05-30
JP2000511707A (ja) 2000-09-05
TW360951B (en) 1999-06-11
WO1998044552A2 (en) 1998-10-08
DE69837028T2 (de) 2008-01-10
WO1998044552A3 (en) 1999-01-21
EP0914679B1 (de) 2007-02-07
EP0914679A2 (de) 1999-05-12

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NXP B.V., EINDHOVEN, NL

8328 Change in the person/name/address of the agent

Representative=s name: EISENFUEHR, SPEISER & PARTNER, 10178 BERLIN