DE69837980D1 - Struktur und Verfahren zum Reparieren einer integrierten Schaltung - Google Patents
Struktur und Verfahren zum Reparieren einer integrierten SchaltungInfo
- Publication number
- DE69837980D1 DE69837980D1 DE69837980T DE69837980T DE69837980D1 DE 69837980 D1 DE69837980 D1 DE 69837980D1 DE 69837980 T DE69837980 T DE 69837980T DE 69837980 T DE69837980 T DE 69837980T DE 69837980 D1 DE69837980 D1 DE 69837980D1
- Authority
- DE
- Germany
- Prior art keywords
- repairing
- integrated circuit
- integrated
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/70—Masking faults in memories by using spares or by reconfiguring
- G11C29/78—Masking faults in memories by using spares or by reconfiguring using programmable devices
- G11C29/80—Masking faults in memories by using spares or by reconfiguring using programmable devices with improved layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9712168A FR2768860B1 (fr) | 1997-09-25 | 1997-09-25 | Structure et procede de reparation de circuits integres |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69837980D1 true DE69837980D1 (de) | 2007-08-09 |
Family
ID=9511644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69837980T Expired - Lifetime DE69837980D1 (de) | 1997-09-25 | 1998-09-24 | Struktur und Verfahren zum Reparieren einer integrierten Schaltung |
Country Status (4)
Country | Link |
---|---|
US (2) | US6236228B1 (de) |
EP (1) | EP0905766B1 (de) |
DE (1) | DE69837980D1 (de) |
FR (1) | FR2768860B1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2768860B1 (fr) | 1997-09-25 | 1999-11-26 | Sgs Thomson Microelectronics | Structure et procede de reparation de circuits integres |
US7287177B2 (en) * | 2003-12-04 | 2007-10-23 | International Business Machines Corporation | Digital reliability monitor having autonomic repair and notification capability |
US20050144524A1 (en) * | 2003-12-04 | 2005-06-30 | International Business Machines Corporation | Digital reliability monitor having autonomic repair and notification capability |
KR100718216B1 (ko) * | 2004-12-13 | 2007-05-15 | 가부시끼가이샤 도시바 | 반도체 장치, 패턴 레이아웃 작성 방법, 노광 마스크 |
US9236343B2 (en) * | 2013-05-03 | 2016-01-12 | Blackcomb Design Automation Inc. | Architecture of spare wiring structures for improved engineering change orders |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5679967A (en) * | 1985-01-20 | 1997-10-21 | Chip Express (Israel) Ltd. | Customizable three metal layer gate array devices |
US5512397A (en) | 1988-05-16 | 1996-04-30 | Leedy; Glenn J. | Stepper scanner discretionary lithography and common mask discretionary lithography for integrated circuits |
EP0557079B1 (de) * | 1992-02-18 | 1998-12-23 | Elm Technology Corporation | Lithographie nach Bedarf für integrierte Schaltungen |
JPH06125067A (ja) * | 1992-10-12 | 1994-05-06 | Mitsubishi Electric Corp | 半導体集積回路及びその設計方法 |
JP2909328B2 (ja) * | 1992-11-02 | 1999-06-23 | 株式会社東芝 | フィールドプログラマブルゲートアレイ |
US5777887A (en) * | 1995-05-12 | 1998-07-07 | Crosspoint Solutions, Inc. | FPGA redundancy |
US5798937A (en) * | 1995-09-28 | 1998-08-25 | Motorola, Inc. | Method and apparatus for forming redundant vias between conductive layers of an integrated circuit |
FR2741475B1 (fr) * | 1995-11-17 | 2000-05-12 | Commissariat Energie Atomique | Procede de fabrication d'un dispositif de micro-electronique comportant sur un substrat une pluralite d'elements interconnectes |
US5892249A (en) * | 1996-02-23 | 1999-04-06 | National Semiconductor Corporation | Integrated circuit having reprogramming cell |
FR2768860B1 (fr) | 1997-09-25 | 1999-11-26 | Sgs Thomson Microelectronics | Structure et procede de reparation de circuits integres |
US6404226B1 (en) * | 1999-09-21 | 2002-06-11 | Lattice Semiconductor Corporation | Integrated circuit with standard cell logic and spare gates |
-
1997
- 1997-09-25 FR FR9712168A patent/FR2768860B1/fr not_active Expired - Fee Related
-
1998
- 1998-09-14 US US09/152,778 patent/US6236228B1/en not_active Expired - Lifetime
- 1998-09-24 EP EP98410107A patent/EP0905766B1/de not_active Expired - Lifetime
- 1998-09-24 DE DE69837980T patent/DE69837980D1/de not_active Expired - Lifetime
-
2001
- 2001-07-23 US US09/911,344 patent/US6586961B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2768860B1 (fr) | 1999-11-26 |
EP0905766B1 (de) | 2007-06-27 |
FR2768860A1 (fr) | 1999-03-26 |
EP0905766A1 (de) | 1999-03-31 |
US6236228B1 (en) | 2001-05-22 |
US6586961B2 (en) | 2003-07-01 |
US20020093037A1 (en) | 2002-07-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |