DE69902441T2 - Feldeffekttransistor - Google Patents

Feldeffekttransistor

Info

Publication number
DE69902441T2
DE69902441T2 DE69902441T DE69902441T DE69902441T2 DE 69902441 T2 DE69902441 T2 DE 69902441T2 DE 69902441 T DE69902441 T DE 69902441T DE 69902441 T DE69902441 T DE 69902441T DE 69902441 T2 DE69902441 T2 DE 69902441T2
Authority
DE
Germany
Prior art keywords
effect transistor
electrode
field
semiconductor material
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69902441T
Other languages
English (en)
Other versions
DE69902441D1 (de
Inventor
Magnus Berggren
Goeran Gustafsson
Roger Karlsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ensurge Micropower ASA
Original Assignee
Thin Film Electronics ASA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NO980224A external-priority patent/NO306528B1/no
Application filed by Thin Film Electronics ASA filed Critical Thin Film Electronics ASA
Application granted granted Critical
Publication of DE69902441D1 publication Critical patent/DE69902441D1/de
Publication of DE69902441T2 publication Critical patent/DE69902441T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/6675—Amorphous silicon or polysilicon transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66848—Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66893—Unipolar field-effect transistors with a PN junction gate, i.e. JFET
    • H01L29/66916—Unipolar field-effect transistors with a PN junction gate, i.e. JFET with a PN heterojunction gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7827—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78642—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
    • H01L29/808—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with a PN junction gate, e.g. PN homojunction gate
    • H01L29/8083—Vertical transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
DE69902441T 1998-01-16 1999-01-14 Feldeffekttransistor Expired - Fee Related DE69902441T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NO980224A NO306528B1 (no) 1998-01-16 1998-01-16 Felteffekttransistor
NO985472A NO306529B1 (no) 1998-01-16 1998-11-23 Transistor
PCT/NO1999/000013 WO1999040631A1 (en) 1998-01-16 1999-01-14 A field-effect transistor

Publications (2)

Publication Number Publication Date
DE69902441D1 DE69902441D1 (de) 2002-09-12
DE69902441T2 true DE69902441T2 (de) 2003-04-17

Family

ID=26648813

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69902441T Expired - Fee Related DE69902441T2 (de) 1998-01-16 1999-01-14 Feldeffekttransistor

Country Status (14)

Country Link
US (1) US6429457B1 (de)
EP (1) EP1051754B1 (de)
JP (1) JP3495703B2 (de)
KR (1) KR100368818B1 (de)
CN (1) CN1210808C (de)
AT (1) ATE222027T1 (de)
AU (1) AU732134C (de)
CA (1) CA2317759C (de)
DE (1) DE69902441T2 (de)
DK (1) DK1051754T3 (de)
ES (1) ES2179619T3 (de)
NO (1) NO306529B1 (de)
RU (1) RU2189665C2 (de)
WO (1) WO1999040631A1 (de)

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NO315728B1 (no) 2000-03-22 2003-10-13 Thin Film Electronics Asa Multidimensjonal adresseringsarkitektur for elektroniske innretninger
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DE10045192A1 (de) 2000-09-13 2002-04-04 Siemens Ag Organischer Datenspeicher, RFID-Tag mit organischem Datenspeicher, Verwendung eines organischen Datenspeichers
DE60233486D1 (de) 2001-05-07 2009-10-08 Advanced Micro Devices Inc Floating-gate-speicherbaustein, der zusammengesetztes molekularmaterial verwendet
US6781868B2 (en) * 2001-05-07 2004-08-24 Advanced Micro Devices, Inc. Molecular memory device
JP4731794B2 (ja) * 2001-05-07 2011-07-27 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド メモリ効果を有するスイッチ素子及び該素子をスイッチングさせる方法
CN100403450C (zh) * 2001-05-07 2008-07-16 先进微装置公司 具有自组装聚合物薄膜的内存装置及其制造方法
US6873540B2 (en) * 2001-05-07 2005-03-29 Advanced Micro Devices, Inc. Molecular memory cell
WO2002091496A2 (en) * 2001-05-07 2002-11-14 Advanced Micro Devices, Inc. Reversible field-programmable electric interconnects
JP4841751B2 (ja) * 2001-06-01 2011-12-21 株式会社半導体エネルギー研究所 有機半導体装置及びその作製方法
US6756620B2 (en) * 2001-06-29 2004-06-29 Intel Corporation Low-voltage and interface damage-free polymer memory device
US6624457B2 (en) 2001-07-20 2003-09-23 Intel Corporation Stepped structure for a multi-rank, stacked polymer memory device and method of making same
US6838720B2 (en) * 2001-08-13 2005-01-04 Advanced Micro Devices, Inc. Memory device with active passive layers
CN100419906C (zh) 2001-08-13 2008-09-17 先进微装置公司 存储器单元
US6858481B2 (en) 2001-08-13 2005-02-22 Advanced Micro Devices, Inc. Memory device with active and passive layers
US6806526B2 (en) 2001-08-13 2004-10-19 Advanced Micro Devices, Inc. Memory device
US6768157B2 (en) 2001-08-13 2004-07-27 Advanced Micro Devices, Inc. Memory device
JP4247377B2 (ja) * 2001-12-28 2009-04-02 独立行政法人産業技術総合研究所 薄膜トランジスタ及びその製造方法
KR100433407B1 (ko) * 2002-02-06 2004-05-31 삼성광주전자 주식회사 업라이트형 진공청소기
US6885146B2 (en) 2002-03-14 2005-04-26 Semiconductor Energy Laboratory Co., Ltd. Display device comprising substrates, contrast medium and barrier layers between contrast medium and each of substrates
EP1367659B1 (de) * 2002-05-21 2012-09-05 Semiconductor Energy Laboratory Co., Ltd. Organischer Feldeffekt-Transistor
KR100417461B1 (ko) * 2002-07-12 2004-02-05 주식회사 하이닉스반도체 반도체 소자의 제조 방법
US6821811B2 (en) 2002-08-02 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Organic thin film transistor and method of manufacturing the same, and semiconductor device having the organic thin film transistor
CN100364108C (zh) * 2002-08-28 2008-01-23 中国科学院长春应用化学研究所 含有有机半导体的夹心型场效应晶体管及制作方法
US7012276B2 (en) * 2002-09-17 2006-03-14 Advanced Micro Devices, Inc. Organic thin film Zener diodes
CN1186822C (zh) 2002-09-23 2005-01-26 中国科学院长春应用化学研究所 有机薄膜晶体管及制备方法
US7132680B2 (en) * 2003-06-09 2006-11-07 International Business Machines Corporation Organic field-effect transistor and method of making same based on polymerizable self-assembled monolayers
EP1498957A1 (de) * 2003-07-14 2005-01-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Feldeffekttransistor und Verfahren zum Herstellen eines Feldeffekttransistors
US7659138B2 (en) * 2003-12-26 2010-02-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing an organic semiconductor element
US7554121B2 (en) * 2003-12-26 2009-06-30 Semiconductor Energy Laboratory Co., Ltd. Organic semiconductor device
RU2004133958A (ru) * 2004-11-23 2006-05-10 Брон Цой (RU) Пучковый микроэлектронный элемент
JP4667096B2 (ja) * 2005-03-25 2011-04-06 株式会社半導体エネルギー研究所 有機半導体装置及びその作製方法
CN101661993B (zh) * 2008-08-28 2011-10-26 中国科学院微电子研究所 应用于有机电路的双金属电极结构及其制备方法
GB0912034D0 (en) 2009-07-10 2009-08-19 Cambridge Entpr Ltd Patterning
GB0913456D0 (en) 2009-08-03 2009-09-16 Cambridge Entpr Ltd Printed electronic device
CN102779855B (zh) * 2012-07-06 2015-08-12 哈尔滨理工大学 双肖特基结氧化锌半导体薄膜晶体管及制作方法
US10032924B2 (en) 2014-03-31 2018-07-24 The Hong Kong University Of Science And Technology Metal oxide thin film transistor with channel, source and drain regions respectively capped with covers of different gas permeability
CN104465989B (zh) * 2014-12-26 2017-02-22 中国科学院微电子研究所 三端原子开关器件及其制备方法
US9653493B2 (en) * 2015-06-12 2017-05-16 Eastman Kodak Company Bottom-gate and top-gate VTFTs on common structure
US10504939B2 (en) 2017-02-21 2019-12-10 The Hong Kong University Of Science And Technology Integration of silicon thin-film transistors and metal-oxide thin film transistors
CN109037347A (zh) * 2018-07-28 2018-12-18 张玉英 一种具有三明治结构的钛酸铋薄膜晶体管及制备方法
KR102551995B1 (ko) * 2018-11-16 2023-07-06 엘지디스플레이 주식회사 수직 구조 트랜지스터 및 전자장치
KR102580260B1 (ko) 2021-10-12 2023-09-19 성균관대학교산학협력단 수직 성장한 결정립을 가지는 활성층을 포함하는 스페이스-프리 수직 전계 효과 트랜지스터
CN114122145B (zh) * 2021-11-15 2023-11-28 武汉华星光电半导体显示技术有限公司 薄膜晶体管、电子装置及其制备方法及显示装置

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Also Published As

Publication number Publication date
CN1293825A (zh) 2001-05-02
AU732134C (en) 2001-11-22
AU732134B2 (en) 2001-04-12
CA2317759A1 (en) 1999-08-12
ATE222027T1 (de) 2002-08-15
KR20010034186A (ko) 2001-04-25
CN1210808C (zh) 2005-07-13
JP3495703B2 (ja) 2004-02-09
CA2317759C (en) 2004-06-22
EP1051754A1 (de) 2000-11-15
NO985472L (no) 1999-07-19
EP1051754B1 (de) 2002-08-07
US6429457B1 (en) 2002-08-06
RU2189665C2 (ru) 2002-09-20
ES2179619T3 (es) 2003-01-16
DE69902441D1 (de) 2002-09-12
KR100368818B1 (ko) 2003-01-24
DK1051754T3 (da) 2002-09-02
JP2002503035A (ja) 2002-01-29
NO306529B1 (no) 1999-11-15
WO1999040631A1 (en) 1999-08-12
NO985472D0 (no) 1998-11-23
AU2552099A (en) 1999-08-23

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