DE69905085D1 - Halbleiterscheibe Poliervorrichtung mit bewegbarem Fenster - Google Patents
Halbleiterscheibe Poliervorrichtung mit bewegbarem FensterInfo
- Publication number
- DE69905085D1 DE69905085D1 DE69905085T DE69905085T DE69905085D1 DE 69905085 D1 DE69905085 D1 DE 69905085D1 DE 69905085 T DE69905085 T DE 69905085T DE 69905085 T DE69905085 T DE 69905085T DE 69905085 D1 DE69905085 D1 DE 69905085D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor wafer
- polishing device
- wafer polishing
- movable window
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/038,171 US6068539A (en) | 1998-03-10 | 1998-03-10 | Wafer polishing device with movable window |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69905085D1 true DE69905085D1 (de) | 2003-03-06 |
| DE69905085T2 DE69905085T2 (de) | 2003-10-30 |
Family
ID=21898456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69905085T Expired - Fee Related DE69905085T2 (de) | 1998-03-10 | 1999-03-09 | Halbleiterscheibe Poliervorrichtung mit bewegbarem Fenster |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6068539A (de) |
| EP (1) | EP0941806B1 (de) |
| JP (1) | JPH11320373A (de) |
| KR (1) | KR100576890B1 (de) |
| DE (1) | DE69905085T2 (de) |
| TW (1) | TW450868B (de) |
Families Citing this family (126)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US6876454B1 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
| DE69635816T2 (de) | 1995-03-28 | 2006-10-12 | Applied Materials, Inc., Santa Clara | Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
| US6395130B1 (en) * | 1998-06-08 | 2002-05-28 | Speedfam-Ipec Corporation | Hydrophobic optical endpoint light pipes for chemical mechanical polishing |
| TW414964B (en) * | 1998-09-23 | 2000-12-11 | United Microelectronics Corp | Method of reducing noise of end point detector in chemical mechanical polishing process |
| US6468139B1 (en) * | 1998-12-01 | 2002-10-22 | Nutool, Inc. | Polishing apparatus and method with a refreshing polishing belt and loadable housing |
| US6589105B2 (en) | 1998-12-01 | 2003-07-08 | Nutool, Inc. | Pad tensioning method and system in a bi-directional linear polisher |
| US20040082271A1 (en) * | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
| US6994607B2 (en) * | 2001-12-28 | 2006-02-07 | Applied Materials, Inc. | Polishing pad with window |
| US6179709B1 (en) * | 1999-02-04 | 2001-01-30 | Applied Materials, Inc. | In-situ monitoring of linear substrate polishing operations |
| US6309277B1 (en) * | 1999-03-03 | 2001-10-30 | Advanced Micro Devices, Inc. | System and method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning |
| DE60035341D1 (de) * | 1999-03-31 | 2007-08-09 | Nikon Corp | Polierkörper, poliermaschine, poliermaschinenjustierverfahren, dicken- oder endpunkt-messverfahren für die polierte schicht, herstellungsverfahren eines halbleiterbauelementes |
| US6213845B1 (en) * | 1999-04-26 | 2001-04-10 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same |
| US6146242A (en) * | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
| US6224460B1 (en) * | 1999-06-30 | 2001-05-01 | Vlsi Technology, Inc. | Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process |
| US6213848B1 (en) * | 1999-08-11 | 2001-04-10 | Advanced Micro Devices, Inc. | Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer |
| US6429146B2 (en) * | 1999-09-02 | 2002-08-06 | Micron Technology, Inc. | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing |
| US6524164B1 (en) * | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
| US6454630B1 (en) | 1999-09-14 | 2002-09-24 | Applied Materials, Inc. | Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same |
| US6726528B2 (en) * | 2002-05-14 | 2004-04-27 | Strasbaugh | Polishing pad with optical sensor |
| US6707540B1 (en) * | 1999-12-23 | 2004-03-16 | Kla-Tencor Corporation | In-situ metalization monitoring using eddy current and optical measurements |
| KR100718737B1 (ko) * | 2000-01-17 | 2007-05-15 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱 장치 |
| US6309276B1 (en) * | 2000-02-01 | 2001-10-30 | Applied Materials, Inc. | Endpoint monitoring with polishing rate change |
| US6328641B1 (en) * | 2000-02-01 | 2001-12-11 | Advanced Micro Devices, Inc. | Method and apparatus for polishing an outer edge ring on a semiconductor wafer |
| US6860793B2 (en) * | 2000-03-15 | 2005-03-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window portion with an adjusted rate of wear |
| US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
| US6924641B1 (en) * | 2000-05-19 | 2005-08-02 | Applied Materials, Inc. | Method and apparatus for monitoring a metal layer during chemical mechanical polishing |
| EP1294534B2 (de) * | 2000-05-19 | 2006-01-25 | Applied Materials Inc | Verfahren und vorrichtung zur "in-situ" überwachung der dicke während des chemisch-mechanischen planiervorganges |
| US6685537B1 (en) | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
| US6612901B1 (en) | 2000-06-07 | 2003-09-02 | Micron Technology, Inc. | Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| US6428386B1 (en) | 2000-06-16 | 2002-08-06 | Micron Technology, Inc. | Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| JP2002001647A (ja) * | 2000-06-19 | 2002-01-08 | Rodel Nitta Co | 研磨パッド |
| US6878038B2 (en) * | 2000-07-10 | 2005-04-12 | Applied Materials Inc. | Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
| US7029381B2 (en) * | 2000-07-31 | 2006-04-18 | Aviza Technology, Inc. | Apparatus and method for chemical mechanical polishing of substrates |
| CN1466676A (zh) * | 2000-07-31 | 2004-01-07 | Asml美国公司 | 在化学机械抛光中用于终点探测的现场方法和设备 |
| US6476921B1 (en) | 2000-07-31 | 2002-11-05 | Asml Us, Inc. | In-situ method and apparatus for end point detection in chemical mechanical polishing |
| WO2002015261A2 (en) * | 2000-08-11 | 2002-02-21 | Sensys Instruments Corporation | Bathless wafer measurement apparatus and method |
| US6447369B1 (en) * | 2000-08-30 | 2002-09-10 | Micron Technology, Inc. | Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates |
| US6609947B1 (en) * | 2000-08-30 | 2003-08-26 | Micron Technology, Inc. | Planarizing machines and control systems for mechanical and/or chemical-mechanical planarization of micro electronic substrates |
| US6572444B1 (en) * | 2000-08-31 | 2003-06-03 | Micron Technology, Inc. | Apparatus and methods of automated wafer-grinding using grinding surface position monitoring |
| EP1324859B1 (de) * | 2000-09-29 | 2011-01-26 | Strasbaugh, Inc. | Polierkissen mit eingebautem optischem sensor |
| US6648730B1 (en) * | 2000-10-30 | 2003-11-18 | Applied Materials, Inc. | Calibration tool |
| US20020072296A1 (en) | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
| US6609961B2 (en) | 2001-01-09 | 2003-08-26 | Lam Research Corporation | Chemical mechanical planarization belt assembly and method of assembly |
| US6623331B2 (en) | 2001-02-16 | 2003-09-23 | Cabot Microelectronics Corporation | Polishing disk with end-point detection port |
| WO2002070200A1 (en) | 2001-03-01 | 2002-09-12 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
| US6608495B2 (en) | 2001-03-19 | 2003-08-19 | Applied Materials, Inc. | Eddy-optic sensor for object inspection |
| US6336841B1 (en) * | 2001-03-29 | 2002-01-08 | Macronix International Co. Ltd. | Method of CMP endpoint detection |
| US6641470B1 (en) * | 2001-03-30 | 2003-11-04 | Lam Research Corporation | Apparatus for accurate endpoint detection in supported polishing pads |
| US6966816B2 (en) * | 2001-05-02 | 2005-11-22 | Applied Materials, Inc. | Integrated endpoint detection system with optical and eddy current monitoring |
| US20020193058A1 (en) * | 2001-06-15 | 2002-12-19 | Carter Stephen P. | Polishing apparatus that provides a window |
| JP4131632B2 (ja) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | ポリッシング装置及び研磨パッド |
| JP2003048151A (ja) * | 2001-08-08 | 2003-02-18 | Rodel Nitta Co | 研磨パッド |
| JP2003133270A (ja) | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
| US6586337B2 (en) * | 2001-11-09 | 2003-07-01 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection during chemical mechanical polishing |
| US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
| US6811466B1 (en) * | 2001-12-28 | 2004-11-02 | Applied Materials, Inc. | System and method for in-line metal profile measurement |
| US6878039B2 (en) | 2002-01-28 | 2005-04-12 | Speedfam-Ipec Corporation | Polishing pad window for a chemical-mechanical polishing tool |
| WO2003066282A2 (en) | 2002-02-04 | 2003-08-14 | Kla-Tencor Technologies Corp. | Systems and methods for characterizing a polishing process |
| US7001242B2 (en) * | 2002-02-06 | 2006-02-21 | Applied Materials, Inc. | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
| TWI273947B (en) * | 2002-02-06 | 2007-02-21 | Applied Materials Inc | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
| US6939203B2 (en) | 2002-04-18 | 2005-09-06 | Asm Nutool, Inc. | Fluid bearing slide assembly for workpiece polishing |
| US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
| US7085622B2 (en) * | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
| US6696005B2 (en) | 2002-05-13 | 2004-02-24 | Strasbaugh | Method for making a polishing pad with built-in optical sensor |
| US6752690B1 (en) * | 2002-06-12 | 2004-06-22 | Clinton O. Fruitman | Method of making polishing pad for planarization of semiconductor wafers |
| US7341502B2 (en) * | 2002-07-18 | 2008-03-11 | Micron Technology, Inc. | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
| US7040957B2 (en) * | 2002-08-14 | 2006-05-09 | Novellus Systems Inc. | Platen and manifold for polishing workpieces |
| CN100417493C (zh) * | 2002-09-25 | 2008-09-10 | Ppg工业俄亥俄公司 | 平面化用的具有窗口的抛光垫片及制备方法 |
| US7016795B2 (en) * | 2003-02-04 | 2006-03-21 | Applied Materials Inc. | Signal improvement in eddy current sensing |
| US6945845B2 (en) * | 2003-03-04 | 2005-09-20 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with non-conductive elements |
| US6913514B2 (en) * | 2003-03-14 | 2005-07-05 | Ebara Technologies, Inc. | Chemical mechanical polishing endpoint detection system and method |
| US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| CA2519942A1 (en) | 2003-03-25 | 2004-10-14 | Neopad Technologies Corporation | Chip customized polish pads for chemical mechanical planarization (cmp) |
| US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
| US20040224611A1 (en) * | 2003-04-22 | 2004-11-11 | Jsr Corporation | Polishing pad and method of polishing a semiconductor wafer |
| US6997777B2 (en) * | 2003-06-17 | 2006-02-14 | Cabot Microelectronics Corporation | Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region |
| US7025658B2 (en) * | 2003-08-18 | 2006-04-11 | Applied Materials, Inc. | Platen and head rotation rates for monitoring chemical mechanical polishing |
| US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
| US20050173259A1 (en) * | 2004-02-06 | 2005-08-11 | Applied Materials, Inc. | Endpoint system for electro-chemical mechanical polishing |
| US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
| US7654885B2 (en) * | 2003-10-03 | 2010-02-02 | Applied Materials, Inc. | Multi-layer polishing pad |
| US7528929B2 (en) | 2003-11-14 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7235154B2 (en) * | 2004-01-08 | 2007-06-26 | Strasbaugh | Devices and methods for optical endpoint detection during semiconductor wafer polishing |
| US7059936B2 (en) * | 2004-03-23 | 2006-06-13 | Cabot Microelectronics Corporation | Low surface energy CMP pad |
| US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| US7354334B1 (en) | 2004-05-07 | 2008-04-08 | Applied Materials, Inc. | Reducing polishing pad deformation |
| US7018581B2 (en) * | 2004-06-10 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a polishing pad with reduced stress window |
| US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US20060089094A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US20060089093A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於ｃｍｐ之特製拋光墊及其製造方法及其用途 |
| US20060291530A1 (en) * | 2005-06-23 | 2006-12-28 | Alexander Tregub | Treatment of CMP pad window to improve transmittance |
| US7210980B2 (en) | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
| KR100882045B1 (ko) * | 2006-02-15 | 2009-02-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 그루브형 서브패드를 구비한 폴리싱 장치 |
| US7621798B1 (en) | 2006-03-07 | 2009-11-24 | Applied Materials, Inc. | Reducing polishing pad deformation |
| US7179151B1 (en) * | 2006-03-27 | 2007-02-20 | Freescale Semiconductor, Inc. | Polishing pad, a polishing apparatus, and a process for using the polishing pad |
| US7497763B2 (en) * | 2006-03-27 | 2009-03-03 | Freescale Semiconductor, Inc. | Polishing pad, a polishing apparatus, and a process for using the polishing pad |
| TWI293910B (en) * | 2006-06-20 | 2008-03-01 | Cando Corp | Fixing board and polishing device using the same |
| US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
| US7903238B2 (en) * | 2006-07-11 | 2011-03-08 | Rudolph Technologies, Inc. | Combination of ellipsometry and optical stress generation and detection |
| CN102490112B (zh) * | 2006-10-06 | 2015-03-25 | 株式会社荏原制作所 | 加工终点检测方法、研磨方法及研磨装置 |
| DE102007015502A1 (de) * | 2007-03-30 | 2008-10-02 | Advanced Micro Devices, Inc., Sunnyvale | CMP-System mit einem Wirbelstromsensor mit geringerer Höhe |
| JP5363470B2 (ja) * | 2007-06-08 | 2013-12-11 | アプライド マテリアルズ インコーポレイテッド | 窓付きの薄い研磨パッド及び成形プロセス |
| US8337278B2 (en) * | 2007-09-24 | 2012-12-25 | Applied Materials, Inc. | Wafer edge characterization by successive radius measurements |
| EP2227350A4 (de) * | 2007-11-30 | 2011-01-12 | Innopad Inc | Kissen mit endpunkterfassungsfenster für chemisch-mechanisches polieren |
| US7967661B2 (en) * | 2008-06-19 | 2011-06-28 | Micron Technology, Inc. | Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture |
| JP5563208B2 (ja) * | 2008-08-05 | 2014-07-30 | ニッタ・ハース株式会社 | 研磨パッド |
| WO2010045162A2 (en) | 2008-10-16 | 2010-04-22 | Applied Materials, Inc. | Eddy current gain compensation |
| CN102281990A (zh) * | 2009-01-16 | 2011-12-14 | 应用材料股份有限公司 | 具有窗口支撑件的研磨垫与系统 |
| US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| US8758659B2 (en) | 2010-09-29 | 2014-06-24 | Fns Tech Co., Ltd. | Method of grooving a chemical-mechanical planarization pad |
| CN106239354A (zh) * | 2010-09-30 | 2016-12-21 | 内克斯普拉纳公司 | 用于涡电流终点检测的抛光垫 |
| US8657653B2 (en) | 2010-09-30 | 2014-02-25 | Nexplanar Corporation | Homogeneous polishing pad for eddy current end-point detection |
| US8439994B2 (en) | 2010-09-30 | 2013-05-14 | Nexplanar Corporation | Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection |
| US8628384B2 (en) * | 2010-09-30 | 2014-01-14 | Nexplanar Corporation | Polishing pad for eddy current end-point detection |
| KR101602544B1 (ko) * | 2010-11-18 | 2016-03-10 | 캐보트 마이크로일렉트로닉스 코포레이션 | 투과성 영역을 포함하는 연마 패드 |
| US9186772B2 (en) * | 2013-03-07 | 2015-11-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith |
| US9475168B2 (en) * | 2015-03-26 | 2016-10-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad window |
| US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
| CN109202693B (zh) * | 2017-10-16 | 2021-10-12 | Skc索密思株式会社 | 防泄漏抛光垫及其制造方法 |
| BR112021025284A2 (pt) * | 2019-06-14 | 2022-03-15 | Drever Int S A | Dispositivo e método para determinação sem contato de pelo menos uma propriedade de um produto de metal |
| CN114582674B (zh) * | 2022-04-18 | 2022-12-06 | 深圳瑞能电气设备有限公司 | 一种组合式大电流继电器 |
Family Cites Families (77)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3841031A (en) * | 1970-10-21 | 1974-10-15 | Monsanto Co | Process for polishing thin elements |
| US4193226A (en) * | 1977-09-21 | 1980-03-18 | Kayex Corporation | Polishing apparatus |
| US4308586A (en) * | 1980-05-02 | 1981-12-29 | Nanometrics, Incorporated | Method for the precise determination of photoresist exposure time |
| US4516855A (en) * | 1981-04-03 | 1985-05-14 | International Business Machines Corporation | Method and apparatus for determining the polarization state of a light wave field |
| US4462860A (en) * | 1982-05-24 | 1984-07-31 | At&T Bell Laboratories | End point detection |
| DE3419463C1 (de) * | 1984-05-24 | 1985-09-12 | Sagax Instrument AB, Sundbyberg | Vorrichtung zur Erfassung von Stoffeigenschaften von Probenoberflaechen |
| US4653924A (en) * | 1984-06-12 | 1987-03-31 | Victor Company Of Japan, Ltd. | Rotating analyzer type ellipsometer |
| US4710030A (en) | 1985-05-17 | 1987-12-01 | Bw Brown University Research Foundation | Optical generator and detector of stress pulses |
| US4681450A (en) * | 1985-06-21 | 1987-07-21 | Research Corporation | Photodetector arrangement for measuring the state of polarization of light |
| US4927432A (en) * | 1986-03-25 | 1990-05-22 | Rodel, Inc. | Pad material for grinding, lapping and polishing |
| US4776695A (en) * | 1986-05-16 | 1988-10-11 | Prometrix Corporation | High accuracy film thickness measurement system |
| US4811522A (en) * | 1987-03-23 | 1989-03-14 | Gill Jr Gerald L | Counterbalanced polishing apparatus |
| AU609573B2 (en) * | 1988-01-11 | 1991-05-02 | Commonwealth Of Australia, The | Differential ellipsometer |
| US4844617A (en) * | 1988-01-20 | 1989-07-04 | Tencor Instruments | Confocal measuring microscope with automatic focusing |
| US4793895A (en) * | 1988-01-25 | 1988-12-27 | Ibm Corporation | In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection |
| JPH01193166A (ja) * | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
| JPH0286128U (de) * | 1988-12-21 | 1990-07-09 | ||
| US4957368A (en) * | 1989-03-16 | 1990-09-18 | Photoacoustic Technology, Inc. | Apparatus and process for performing ellipsometric measurements of surfaces |
| US5042951A (en) * | 1989-09-19 | 1991-08-27 | Therma-Wave, Inc. | High resolution ellipsometric apparatus |
| US5166752A (en) * | 1990-01-11 | 1992-11-24 | Rudolph Research Corporation | Simultaneous multiple angle/multiple wavelength ellipsometer and method |
| US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
| US5177908A (en) * | 1990-01-22 | 1993-01-12 | Micron Technology, Inc. | Polishing pad |
| JPH03234467A (ja) * | 1990-02-05 | 1991-10-18 | Canon Inc | スタンパの金型取付面の研磨方法およびその研磨機 |
| US5067805A (en) * | 1990-02-27 | 1991-11-26 | Prometrix Corporation | Confocal scanning optical microscope |
| US5081421A (en) * | 1990-05-01 | 1992-01-14 | At&T Bell Laboratories | In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection |
| US5213655A (en) * | 1990-05-16 | 1993-05-25 | International Business Machines Corporation | Device and method for detecting an end point in polishing operation |
| US5081796A (en) * | 1990-08-06 | 1992-01-21 | Micron Technology, Inc. | Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer |
| US5036015A (en) * | 1990-09-24 | 1991-07-30 | Micron Technology, Inc. | Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers |
| IT1243537B (it) | 1990-10-19 | 1994-06-16 | Melchiorre Off Mecc | Metodo e dispositivo per il controllo al termine di ogni ciclo (post process) dei pezzi lavorati in una macchina lappatrice a doppio plateau |
| US5290396A (en) | 1991-06-06 | 1994-03-01 | Lsi Logic Corporation | Trench planarization techniques |
| US5197999A (en) * | 1991-09-30 | 1993-03-30 | National Semiconductor Corporation | Polishing pad for planarization |
| US5240552A (en) * | 1991-12-11 | 1993-08-31 | Micron Technology, Inc. | Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection |
| US5308438A (en) * | 1992-01-30 | 1994-05-03 | International Business Machines Corporation | Endpoint detection apparatus and method for chemical/mechanical polishing |
| US5329732A (en) * | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
| US5486701A (en) * | 1992-06-16 | 1996-01-23 | Prometrix Corporation | Method and apparatus for measuring reflectance in two wavelength bands to enable determination of thin film thickness |
| US5265378A (en) * | 1992-07-10 | 1993-11-30 | Lsi Logic Corporation | Detecting the endpoint of chem-mech polishing and resulting semiconductor device |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5433650A (en) * | 1993-05-03 | 1995-07-18 | Motorola, Inc. | Method for polishing a substrate |
| US5337015A (en) * | 1993-06-14 | 1994-08-09 | International Business Machines Corporation | In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage |
| US5554064A (en) * | 1993-08-06 | 1996-09-10 | Intel Corporation | Orbital motion chemical-mechanical polishing apparatus and method of fabrication |
| JP3326443B2 (ja) | 1993-08-10 | 2002-09-24 | 株式会社ニコン | ウエハ研磨方法及びその装置 |
| US5700180A (en) * | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US5486129A (en) | 1993-08-25 | 1996-01-23 | Micron Technology, Inc. | System and method for real-time control of semiconductor a wafer polishing, and a polishing head |
| US5658183A (en) * | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| IL107549A (en) * | 1993-11-09 | 1996-01-31 | Nova Measuring Instr Ltd | Device for measuring the thickness of thin films |
| US5433651A (en) * | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| JPH07193033A (ja) * | 1993-12-27 | 1995-07-28 | Toshiba Corp | 半導体表面研磨方法及び研磨装置 |
| JP3993888B2 (ja) * | 1993-12-28 | 2007-10-17 | ウォレス ティー．ワイ． タング | 薄膜を監視するための方法および装置 |
| US5413941A (en) * | 1994-01-06 | 1995-05-09 | Micron Technology, Inc. | Optical end point detection methods in semiconductor planarizing polishing processes |
| US5439551A (en) * | 1994-03-02 | 1995-08-08 | Micron Technology, Inc. | Chemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processes |
| US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
| JP3313505B2 (ja) * | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| US5461007A (en) * | 1994-06-02 | 1995-10-24 | Motorola, Inc. | Process for polishing and analyzing a layer over a patterned semiconductor substrate |
| US5593344A (en) * | 1994-10-11 | 1997-01-14 | Ontrak Systems, Inc. | Wafer polishing machine with fluid bearings and drive systems |
| JPH08195363A (ja) | 1994-10-11 | 1996-07-30 | Ontrak Syst Inc | 流体軸受を有する半導体ウェーハポリシング装置 |
| US5643044A (en) * | 1994-11-01 | 1997-07-01 | Lund; Douglas E. | Automatic chemical and mechanical polishing system for semiconductor wafers |
| US5595526A (en) * | 1994-11-30 | 1997-01-21 | Intel Corporation | Method and apparatus for endpoint detection in a chemical/mechanical process for polishing a substrate |
| JPH08240413A (ja) | 1995-01-06 | 1996-09-17 | Toshiba Corp | 膜厚測定装置及びポリシング装置 |
| DE69635816T2 (de) * | 1995-03-28 | 2006-10-12 | Applied Materials, Inc., Santa Clara | Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
| US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
| US5816891A (en) * | 1995-06-06 | 1998-10-06 | Advanced Micro Devices, Inc. | Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput |
| JP3601910B2 (ja) | 1995-07-20 | 2004-12-15 | 株式会社荏原製作所 | ポリッシング装置及び方法 |
| US5838447A (en) * | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
| JP3321338B2 (ja) * | 1995-07-24 | 2002-09-03 | 株式会社東芝 | 半導体装置の製造方法および製造装置 |
| US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
| US5597442A (en) * | 1995-10-16 | 1997-01-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Chemical/mechanical planarization (CMP) endpoint method using measurement of polishing pad temperature |
| JPH09139367A (ja) * | 1995-11-10 | 1997-05-27 | Nippon Steel Corp | 半導体装置の平坦化方法及び装置 |
| US5609517A (en) | 1995-11-20 | 1997-03-11 | International Business Machines Corporation | Composite polishing pad |
| US5961372A (en) | 1995-12-05 | 1999-10-05 | Applied Materials, Inc. | Substrate belt polisher |
| US5762536A (en) * | 1996-04-26 | 1998-06-09 | Lam Research Corporation | Sensors for a linear polisher |
| US5916012A (en) | 1996-04-26 | 1999-06-29 | Lam Research Corporation | Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher |
| US6093081A (en) | 1996-05-09 | 2000-07-25 | Canon Kabushiki Kaisha | Polishing method and polishing apparatus using the same |
| US6594542B1 (en) | 1996-10-04 | 2003-07-15 | Applied Materials, Inc. | Method and system for controlling chemical mechanical polishing thickness removal |
| US5722877A (en) | 1996-10-11 | 1998-03-03 | Lam Research Corporation | Technique for improving within-wafer non-uniformity of material removal for performing CMP |
| JP3454658B2 (ja) * | 1997-02-03 | 2003-10-06 | 大日本スクリーン製造株式会社 | 研磨処理モニター装置 |
| US5934974A (en) | 1997-11-05 | 1999-08-10 | Aplex Group | In-situ monitoring of polishing pad wear |
-
1998
- 1998-03-10 US US09/038,171 patent/US6068539A/en not_active Expired - Fee Related
-
1999
- 1999-03-09 DE DE69905085T patent/DE69905085T2/de not_active Expired - Fee Related
- 1999-03-09 EP EP99301765A patent/EP0941806B1/de not_active Expired - Lifetime
- 1999-03-10 KR KR1019990007838A patent/KR100576890B1/ko not_active IP Right Cessation
- 1999-03-10 JP JP6321199A patent/JPH11320373A/ja active Pending
- 1999-06-07 TW TW088103610A patent/TW450868B/zh not_active IP Right Cessation
- 1999-12-06 US US09/455,292 patent/US6254459B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990077726A (ko) | 1999-10-25 |
| DE69905085T2 (de) | 2003-10-30 |
| TW450868B (en) | 2001-08-21 |
| EP0941806A3 (de) | 2001-01-10 |
| US6068539A (en) | 2000-05-30 |
| EP0941806B1 (de) | 2003-01-29 |
| JPH11320373A (ja) | 1999-11-24 |
| KR100576890B1 (ko) | 2006-05-03 |
| US6254459B1 (en) | 2001-07-03 |
| EP0941806A2 (de) | 1999-09-15 |
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