DE69918489D1 - Erdungsklemme und dessen Montagestruktur auf einer Leiterplatte - Google Patents

Erdungsklemme und dessen Montagestruktur auf einer Leiterplatte

Info

Publication number
DE69918489D1
DE69918489D1 DE69918489T DE69918489T DE69918489D1 DE 69918489 D1 DE69918489 D1 DE 69918489D1 DE 69918489 T DE69918489 T DE 69918489T DE 69918489 T DE69918489 T DE 69918489T DE 69918489 D1 DE69918489 D1 DE 69918489D1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
mounting structure
grounding clamp
grounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69918489T
Other languages
English (en)
Other versions
DE69918489T2 (de
Inventor
Hideo Yumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Application granted granted Critical
Publication of DE69918489D1 publication Critical patent/DE69918489D1/de
Publication of DE69918489T2 publication Critical patent/DE69918489T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
DE69918489T 1998-04-30 1999-04-28 Erdungsklemme und dessen Montagestruktur auf einer Leiterplatte Expired - Lifetime DE69918489T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12061698 1998-04-30
JP10120616A JP3068557B2 (ja) 1998-04-30 1998-04-30 プリント配線板の接地構造及び当該接地構造に用いられる導電部材

Publications (2)

Publication Number Publication Date
DE69918489D1 true DE69918489D1 (de) 2004-08-12
DE69918489T2 DE69918489T2 (de) 2004-12-02

Family

ID=14790661

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69918489T Expired - Lifetime DE69918489T2 (de) 1998-04-30 1999-04-28 Erdungsklemme und dessen Montagestruktur auf einer Leiterplatte

Country Status (4)

Country Link
US (3) US6300579B1 (de)
EP (1) EP0954067B1 (de)
JP (1) JP3068557B2 (de)
DE (1) DE69918489T2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3068557B2 (ja) * 1998-04-30 2000-07-24 北川工業株式会社 プリント配線板の接地構造及び当該接地構造に用いられる導電部材
JP3064756U (ja) * 1999-06-10 2000-01-21 トーマス アンド ベッツ インターナショナル，インク． ア―ス用端子
JP3605564B2 (ja) * 2000-12-28 2004-12-22 日本圧着端子製造株式会社 接続用端子及びこの端子の回路基板への取付け方法
JP3675719B2 (ja) * 2001-01-19 2005-07-27 日本電気株式会社 電子機器内部実装基板の低インピーダンス実装方法及び実装構造
JP3520277B2 (ja) 2001-11-05 2004-04-19 北川工業株式会社 導電部材
US7159180B2 (en) * 2001-12-14 2007-01-02 America Online, Inc. Proxy platform integration system
JP3978174B2 (ja) 2003-03-07 2007-09-19 北川工業株式会社 コンタクト
JP3841351B2 (ja) * 2003-05-19 2006-11-01 日本航空電子工業株式会社 コネクタ
US7094062B2 (en) * 2003-07-24 2006-08-22 Molex Incorporated Land grid array connector
DE102004016168A1 (de) * 2004-04-01 2005-10-27 Siemens Ag Verfahren zur Montage eines Schaltungsträgers in einem Gehäuse, Schaltungsmodul, Gehäuse und Klemmelement
US20070284049A1 (en) * 2004-08-27 2007-12-13 Sensormatic Electronics Corporation Radio Frequency Identification (Rfid) Label Applicator
JP4787653B2 (ja) * 2006-04-06 2011-10-05 株式会社やまびこ 携帯型作業機のエンジン停止装置
JP5280108B2 (ja) * 2008-05-29 2013-09-04 京セラ株式会社 端子部品及び携帯電子機器
JP2010073341A (ja) * 2008-09-16 2010-04-02 Kitagawa Ind Co Ltd 表面実装コンタクト
CN101925291A (zh) * 2009-06-09 2010-12-22 鸿富锦精密工业（深圳）有限公司 防电磁辐射装置
US20110019378A1 (en) * 2009-07-27 2011-01-27 Tod A. Byquist Composite micro-contacts
KR101606371B1 (ko) * 2009-10-13 2016-03-28 삼성전자주식회사 휴대 단말기의 커넥터 접지 구조
EP2363919B1 (de) * 2010-02-22 2012-07-04 Tyco Electronics Nederland B.V. Kontaktelement für elektrische Steckverbinder
EP2589269B1 (de) 2010-07-02 2020-09-02 InterDigital Madison Patent Holdings Elektronische vorrichtung mit dem system zur erdung
TWI414928B (zh) * 2011-01-14 2013-11-11 Pegatron Corp 電子裝置
JP6026166B2 (ja) * 2012-07-30 2016-11-16 東洋技研株式会社 断路端子台
JP6117661B2 (ja) * 2013-09-19 2017-04-19 日立オートモティブシステムズ株式会社 電子制御装置
JP2016091701A (ja) * 2014-10-31 2016-05-23 北川工業株式会社 コンタクト部材
JP6528146B2 (ja) * 2014-11-06 2019-06-12 北川工業株式会社 導電部材
JP6376050B2 (ja) * 2015-06-18 2018-08-22 株式会社オートネットワーク技術研究所 コネクタ
TWI620893B (zh) * 2016-10-26 2018-04-11 Luminescence Technology Corporation Oled平面燈源模組
US11165182B2 (en) * 2016-12-21 2021-11-02 Amotech Co., Ltd. Functional contactor
US10879638B2 (en) 2017-11-13 2020-12-29 Te Connectivity Corporation Socket connector for an electronic package
KR102527075B1 (ko) * 2018-02-22 2023-05-02 주식회사 아모텍 기능성 컨택터
KR101974816B1 (ko) * 2018-06-18 2019-05-03 박상량 판 스프링 타입의 연결핀
WO2020044182A1 (en) * 2018-08-29 2020-03-05 Avx Corporation Contact carrier
DE102020105298A1 (de) * 2020-02-28 2021-09-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Leiterplatte mit einer Kontaktstelle
JP7187506B2 (ja) * 2020-07-13 2022-12-12 矢崎総業株式会社 ワイヤハーネス製造装置及びワイヤハーネス製造方法
KR102484924B1 (ko) * 2021-08-26 2023-01-06 에코캡 주식회사 변형방지구조를 갖는 어스단자

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3504095A (en) 1968-01-30 1970-03-31 Instr Specialties Co Inc Shielding gaskets
US4204104A (en) * 1978-10-30 1980-05-20 Stackpole Components Company Slide switch
US4422128A (en) * 1981-08-06 1983-12-20 General Motors Corporation Push-on terminal clip and assembly
JPS5853372A (ja) 1981-09-26 1983-03-29 Mitsubishi Electric Corp ダイボンデイング用ろう材供給装置
US4605278A (en) * 1985-05-24 1986-08-12 North American Specialties Corporation Solder-bearing leads
US4553192A (en) * 1983-08-25 1985-11-12 International Business Machines Corporation High density planar interconnected integrated circuit package
JPS6295978A (ja) 1985-10-22 1987-05-02 Mitsubishi Electric Corp ア−ム短絡防止回路
US4823235A (en) * 1986-02-06 1989-04-18 Fujitsu Limited Earth connection device in metal core printed circuit board
JP2524108B2 (ja) 1986-02-24 1996-08-14 富士写真フイルム株式会社 光走査記録装置
US4954087A (en) * 1988-04-27 1990-09-04 I-Stat Corporation Static-free interrogating connector for electric components
US5029254A (en) 1990-03-23 1991-07-02 Instrument Specialties Company, Inc. Clip mounted electromagnetic shielding device
US5441429A (en) * 1990-04-13 1995-08-15 North American Specialties Corporation Solder-bearing land
WO1995014312A1 (en) * 1993-11-15 1995-05-26 Berg Technology, Inc. Solderable connector for high density electronic assemblies
US5655913A (en) * 1995-09-26 1997-08-12 Motorola, Inc. Electrical interconnect contact
AU709434B2 (en) * 1996-01-18 1999-08-26 Rittal-Werk Rudolf Loh Gmbh & Co. Kg Device for electrically connecting the frame or cabinet housing of a switching cabinet with the door
US5749741A (en) * 1996-07-12 1998-05-12 Minnesota Mining And Manufacturing Company Electrical connector with ground clip
TW357332B (en) * 1997-03-12 1999-05-01 Seiko Epson Corp Electronic parts module and the electronic machine
DE19804590C2 (de) * 1998-02-05 2001-06-21 Siemens Ag Gehäuseanordnung für eine bauteilbestückte Leiterplatte
JP3068557B2 (ja) * 1998-04-30 2000-07-24 北川工業株式会社 プリント配線板の接地構造及び当該接地構造に用いられる導電部材
JP2000323216A (ja) * 1999-05-07 2000-11-24 Kyoshin Kogyo Co Ltd 接続用端子及びテーピング接続用端子

Also Published As

Publication number Publication date
US6465738B2 (en) 2002-10-15
US6300579B1 (en) 2001-10-09
DE69918489T2 (de) 2004-12-02
EP0954067B1 (de) 2004-07-07
US20020062989A1 (en) 2002-05-30
JP3068557B2 (ja) 2000-07-24
JPH11317250A (ja) 1999-11-16
EP0954067A3 (de) 2001-04-11
US6674018B2 (en) 2004-01-06
US20020053468A1 (en) 2002-05-09
EP0954067A2 (de) 1999-11-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition