DE69927935D1 - Verfahren und einrichtung zum chemisch-mechanischem polieren - Google Patents
Verfahren und einrichtung zum chemisch-mechanischem polierenInfo
- Publication number
- DE69927935D1 DE69927935D1 DE69927935T DE69927935T DE69927935D1 DE 69927935 D1 DE69927935 D1 DE 69927935D1 DE 69927935 T DE69927935 T DE 69927935T DE 69927935 T DE69927935 T DE 69927935T DE 69927935 D1 DE69927935 D1 DE 69927935D1
- Authority
- DE
- Germany
- Prior art keywords
- chemical
- polishing
- mechanical polishing
- substrate
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR19980030981 | 1998-07-31 | ||
KR9830981 | 1998-07-31 | ||
KR10-1999-0030803A KR100443330B1 (ko) | 1998-07-31 | 1999-07-28 | 화학 기계적 연마 방법 및 장치 |
KR9930803 | 1999-07-28 | ||
PCT/KR1999/000419 WO2000007230A1 (en) | 1998-07-31 | 1999-07-31 | Method and apparatus for chemical mechanical polishing |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69927935D1 true DE69927935D1 (de) | 2005-12-01 |
DE69927935T2 DE69927935T2 (de) | 2006-07-06 |
Family
ID=36590880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69927935T Expired - Fee Related DE69927935T2 (de) | 1998-07-31 | 1999-07-31 | Verfahren und einrichtung zum chemisch-mechanischem polieren |
Country Status (7)
Country | Link |
---|---|
US (1) | US6315641B1 (de) |
EP (1) | EP1031166B1 (de) |
JP (1) | JP2002521839A (de) |
KR (1) | KR100443330B1 (de) |
AT (1) | ATE308116T1 (de) |
DE (1) | DE69927935T2 (de) |
WO (1) | WO2000007230A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3663348B2 (ja) * | 2000-09-26 | 2005-06-22 | Towa株式会社 | 研磨装置及び研磨方法 |
DE10132504C1 (de) * | 2001-07-05 | 2002-10-10 | Wacker Siltronic Halbleitermat | Verfahren zur beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben und seine Verwendung |
JP3843933B2 (ja) * | 2002-02-07 | 2006-11-08 | ソニー株式会社 | 研磨パッド、研磨装置および研磨方法 |
KR100776564B1 (ko) | 2006-07-18 | 2007-11-15 | 두산메카텍 주식회사 | 화학적 기계적 연마장비의 구동장치 |
GB2452091B (en) | 2007-08-24 | 2013-01-02 | Zeeko Ltd | Computer controlled work tool apparatus and method |
JP5234403B2 (ja) * | 2008-01-18 | 2013-07-10 | 株式会社ニコン | 研磨方法および研磨装置 |
US10076817B2 (en) | 2014-07-17 | 2018-09-18 | Applied Materials, Inc. | Orbital polishing with small pad |
US10207389B2 (en) | 2014-07-17 | 2019-02-19 | Applied Materials, Inc. | Polishing pad configuration and chemical mechanical polishing system |
US10105812B2 (en) | 2014-07-17 | 2018-10-23 | Applied Materials, Inc. | Polishing pad configuration and polishing pad support |
TWI692385B (zh) * | 2014-07-17 | 2020-05-01 | 美商應用材料股份有限公司 | 化學機械硏磨所用的方法、系統與硏磨墊 |
US9873179B2 (en) | 2016-01-20 | 2018-01-23 | Applied Materials, Inc. | Carrier for small pad for chemical mechanical polishing |
JP6979030B2 (ja) | 2016-03-24 | 2021-12-08 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | 化学機械研磨のためのテクスチャード加工された小型パッド |
EP4187123A1 (de) * | 2021-11-30 | 2023-05-31 | Rolls-Royce Deutschland Ltd & Co KG | Verfahren und system zur verringerung von schwingungen in rotierenden maschinen |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5177908A (en) * | 1990-01-22 | 1993-01-12 | Micron Technology, Inc. | Polishing pad |
JP2609741B2 (ja) | 1990-04-26 | 1997-05-14 | 株式会社東芝 | 自動製氷装置付冷蔵庫 |
JPH05183042A (ja) * | 1991-12-28 | 1993-07-23 | Disco Abrasive Syst Ltd | ウェーハの吸着方法 |
US5308438A (en) * | 1992-01-30 | 1994-05-03 | International Business Machines Corporation | Endpoint detection apparatus and method for chemical/mechanical polishing |
US5232875A (en) * | 1992-10-15 | 1993-08-03 | Micron Technology, Inc. | Method and apparatus for improving planarity of chemical-mechanical planarization operations |
US5876271A (en) * | 1993-08-06 | 1999-03-02 | Intel Corporation | Slurry injection and recovery method and apparatus for chemical-mechanical polishing process |
US5554064A (en) * | 1993-08-06 | 1996-09-10 | Intel Corporation | Orbital motion chemical-mechanical polishing apparatus and method of fabrication |
US5643053A (en) * | 1993-12-27 | 1997-07-01 | Applied Materials, Inc. | Chemical mechanical polishing apparatus with improved polishing control |
US5643044A (en) * | 1994-11-01 | 1997-07-01 | Lund; Douglas E. | Automatic chemical and mechanical polishing system for semiconductor wafers |
JP3637977B2 (ja) * | 1995-01-19 | 2005-04-13 | 株式会社荏原製作所 | ポリッシングの終点検知方法 |
JP3664188B2 (ja) * | 1995-12-08 | 2005-06-22 | 株式会社東京精密 | 表面加工方法及びその装置 |
KR970052698A (ko) * | 1995-12-29 | 1997-07-29 | 김광호 | 반도체 소자의 화학적 물리적 폴리슁(cmp) 방법 |
JPH10180622A (ja) * | 1996-12-26 | 1998-07-07 | Canon Inc | 精密研磨装置及び方法 |
-
1999
- 1999-07-28 KR KR10-1999-0030803A patent/KR100443330B1/ko active IP Right Grant
- 1999-07-31 WO PCT/KR1999/000419 patent/WO2000007230A1/en active IP Right Grant
- 1999-07-31 DE DE69927935T patent/DE69927935T2/de not_active Expired - Fee Related
- 1999-07-31 AT AT99935149T patent/ATE308116T1/de not_active IP Right Cessation
- 1999-07-31 EP EP99935149A patent/EP1031166B1/de not_active Expired - Lifetime
- 1999-07-31 JP JP2000562942A patent/JP2002521839A/ja not_active Ceased
- 1999-07-31 US US09/509,334 patent/US6315641B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR20000012039A (ko) | 2000-02-25 |
EP1031166A1 (de) | 2000-08-30 |
ATE308116T1 (de) | 2005-11-15 |
WO2000007230A1 (en) | 2000-02-10 |
KR100443330B1 (ko) | 2004-08-09 |
EP1031166B1 (de) | 2005-10-26 |
DE69927935T2 (de) | 2006-07-06 |
US6315641B1 (en) | 2001-11-13 |
JP2002521839A (ja) | 2002-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: DOOSAN MECATEC CO.LTD., CHANGWON GYEONGSANGNAM, KR |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: K. C. TECH CO., LTD., ANSONG, KYONGGI, KR |
|
8339 | Ceased/non-payment of the annual fee |