DE69930398D1 - Belichtungssystem mit einem parallelen Verbindungsmechanismus und Belichtungsverfahren - Google Patents

Belichtungssystem mit einem parallelen Verbindungsmechanismus und Belichtungsverfahren

Info

Publication number
DE69930398D1
DE69930398D1 DE69930398T DE69930398T DE69930398D1 DE 69930398 D1 DE69930398 D1 DE 69930398D1 DE 69930398 T DE69930398 T DE 69930398T DE 69930398 T DE69930398 T DE 69930398T DE 69930398 D1 DE69930398 D1 DE 69930398D1
Authority
DE
Germany
Prior art keywords
exposure
link mechanism
parallel link
exposure method
exposure system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69930398T
Other languages
English (en)
Other versions
DE69930398T2 (de
Inventor
Keiichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of DE69930398D1 publication Critical patent/DE69930398D1/de
Application granted granted Critical
Publication of DE69930398T2 publication Critical patent/DE69930398T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20207—Tilt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H01J2237/20221—Translation
    • H01J2237/20228—Mechanical X-Y scanning
DE69930398T 1999-09-20 1999-09-20 Belichtungssystem mit einem parallelen Verbindungsmechanismus und Belichtungsverfahren Expired - Fee Related DE69930398T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/005102 WO2001022480A1 (fr) 1999-09-20 1999-09-20 Mecanisme a attelages paralleles, systeme d'exposition et procede de fabrication, et procede de fabrication de dispositifs

Publications (2)

Publication Number Publication Date
DE69930398D1 true DE69930398D1 (de) 2006-05-11
DE69930398T2 DE69930398T2 (de) 2006-10-19

Family

ID=14236757

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69930398T Expired - Fee Related DE69930398T2 (de) 1999-09-20 1999-09-20 Belichtungssystem mit einem parallelen Verbindungsmechanismus und Belichtungsverfahren

Country Status (7)

Country Link
US (1) US6940582B1 (de)
EP (1) EP1137054B1 (de)
KR (1) KR100699241B1 (de)
AU (1) AU5653699A (de)
DE (1) DE69930398T2 (de)
TW (1) TW446998B (de)
WO (1) WO2001022480A1 (de)

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60126103T2 (de) 2000-08-18 2007-11-15 Nikon Corp. Haltevorrichtung für optisches Element
JP4945864B2 (ja) * 2000-08-18 2012-06-06 株式会社ニコン 保持装置、光学素子保持装置、鏡筒及び露光装置並びにマイクロデバイスの製造方法
TWI266959B (en) 2001-06-20 2006-11-21 Asml Netherlands Bv Device manufacturing method, device manufactured thereby and a mask for use in the method
EP1271247A1 (de) * 2001-06-20 2003-01-02 ASML Netherlands B.V. Verfahren und Maske für Projektionsbelichtung
US6873478B2 (en) * 2002-06-21 2005-03-29 Nikon Corporation Kinematic lens mount with reduced clamping force
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100588124B1 (ko) 2002-11-12 2006-06-09 에이에스엠엘 네델란즈 비.브이. 리소그래피장치 및 디바이스제조방법
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
DE10261775A1 (de) 2002-12-20 2004-07-01 Carl Zeiss Smt Ag Vorrichtung zur optischen Vermessung eines Abbildungssystems
WO2004075268A1 (ja) * 2003-02-19 2004-09-02 Nikon Corporation 移動方法、露光方法及び露光装置、並びにデバイス製造方法
EP1457834A3 (de) * 2003-03-14 2008-10-29 Canon Kabushiki Kaisha Vorrichtung zur Positionierung, Belichtungsapparat und Verfahren zur Herstellung eines Artikels
KR20150036786A (ko) 2003-04-09 2015-04-07 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
EP1469348B1 (de) 2003-04-14 2012-01-18 ASML Netherlands B.V. Projektionssystem und Verfahren zu dessen Verwendung
JP2004343075A (ja) 2003-04-14 2004-12-02 Asml Netherlands Bv 投影システム及びその使用方法
JP4350429B2 (ja) * 2003-06-05 2009-10-21 キヤノン株式会社 露光装置、およびデバイスの製造方法
DE602004024302D1 (de) 2003-06-06 2010-01-07 Nippon Kogaku Kk Halteeinrichtung für optische elemente, objektivtubus, belichtungseinrichtung und herstellungsverfahren für bauelemente
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101729866B1 (ko) 2003-06-13 2017-04-24 가부시키가이샤 니콘 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
TWI251129B (en) 2003-06-27 2006-03-11 Asml Netherlands Bv Lithographic apparatus and integrated circuit manufacturing method
JP4835155B2 (ja) * 2003-07-09 2011-12-14 株式会社ニコン 露光装置及びデバイス製造方法
EP1646075B1 (de) 2003-07-09 2011-06-15 Nikon Corporation Belichtungsvorrichtung und verfahren zur bauelementeherstellung
EP1643543B1 (de) 2003-07-09 2010-11-24 Nikon Corporation Belichtungsvorrichtung und verfahren zur bauelementherstellung
EP1503244A1 (de) * 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographischer Projektionsapparat und Verfahren zur Herstellung einer Vorrichtung
WO2005010962A1 (ja) 2003-07-28 2005-02-03 Nikon Corporation 露光装置及びデバイス製造方法、並びに露光装置の制御方法
US7779781B2 (en) * 2003-07-31 2010-08-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4370924B2 (ja) * 2003-08-27 2009-11-25 株式会社ニコン 真空装置、真空装置の運転方法、露光装置、及び露光装置の運転方法
TWI263859B (en) 2003-08-29 2006-10-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
JP4517367B2 (ja) 2003-09-03 2010-08-04 株式会社ニコン 露光装置及びデバイス製造方法
KR101335736B1 (ko) 2003-09-29 2013-12-02 가부시키가이샤 니콘 노광장치, 노광방법 및 디바이스 제조방법
ATE475907T1 (de) 2003-10-02 2010-08-15 Zeiss Carl Smt Ag Projektionsobjektiv für die halbleiter- lithographie
TW201738932A (zh) 2003-10-09 2017-11-01 Nippon Kogaku Kk 曝光裝置及曝光方法、元件製造方法
TWI474132B (zh) 2003-10-28 2015-02-21 尼康股份有限公司 照明光學裝置、投影曝光裝置、曝光方法以及元件製造方法
US7110083B2 (en) * 2003-11-19 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI612338B (zh) 2003-11-20 2018-01-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法
KR101442448B1 (ko) 2003-12-03 2014-09-22 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법, 그리고 광학 부품
JP4080992B2 (ja) * 2003-12-25 2008-04-23 オークマ株式会社 パラレルメカニズム機械の制御方法および制御装置
WO2005064382A1 (ja) 2003-12-25 2005-07-14 Nikon Corporation 光学素子の保持装置、鏡筒、露光装置、及びデバイスの製造方法
TWI505329B (zh) 2004-02-06 2015-10-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法以及元件製造方法
KR101368523B1 (ko) 2004-06-04 2014-02-27 칼 짜이스 에스엠테 게엠베하 광학적 결상 시스템의 결상 품질을 측정하기 위한 시스템
CH696993A5 (de) * 2004-06-24 2008-02-29 Miniswys Sa Antriebseinheit.
US7738193B2 (en) 2004-06-29 2010-06-15 Carl Zeiss Smt Ag Positioning unit and alignment device for an optical element
KR101202230B1 (ko) 2004-07-12 2012-11-16 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR20070039926A (ko) * 2004-07-23 2007-04-13 가부시키가이샤 니콘 지지 장치, 스테이지 장치, 노광 장치, 및 디바이스의 제조방법
EP1794650A4 (de) * 2004-09-30 2008-09-10 Nikon Corp Optische projektionseinrichtung und belichtungsvorrichtung
ATE538404T1 (de) * 2004-10-26 2012-01-15 Nikon Corp Optisches system, objektivtubus; belichtungssystem und bauelemente- herstellungsverfahren
JP2006140366A (ja) * 2004-11-15 2006-06-01 Nikon Corp 投影光学系及び露光装置
US7282701B2 (en) * 2005-02-28 2007-10-16 Asml Netherlands B.V. Sensor for use in a lithographic apparatus
JP4650619B2 (ja) * 2005-03-09 2011-03-16 株式会社ニコン 駆動ユニット、光学ユニット、光学装置、並びに露光装置
KR101504765B1 (ko) 2005-05-12 2015-03-30 가부시키가이샤 니콘 투영 광학계, 노광 장치 및 노광 방법
JP2006349769A (ja) * 2005-06-13 2006-12-28 Ono Sokki Co Ltd 整合装置
WO2006133800A1 (en) 2005-06-14 2006-12-21 Carl Zeiss Smt Ag Lithography projection objective, and a method for correcting image defects of the same
EP1744215B1 (de) * 2005-07-16 2012-09-12 Integrated Dynamics Engineering GmbH Tragevorrichtung für vibrationsempfindliche Komponente
JP2007048794A (ja) * 2005-08-08 2007-02-22 Japan Steel Works Ltd:The レーザ投影装置
US7433050B2 (en) 2005-10-05 2008-10-07 Nikon Corporation Exposure apparatus and exposure method
WO2007040254A1 (ja) * 2005-10-05 2007-04-12 Nikon Corporation 露光装置及び露光方法
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100590173C (zh) * 2006-03-24 2010-02-17 北京有色金属研究总院 一种荧光粉及其制造方法和所制成的电光源
US20080142728A1 (en) * 2006-10-30 2008-06-19 Applied Materials, Inc. Mechanical scanner
US7898204B2 (en) * 2007-01-05 2011-03-01 Active Precision, Inc. High-speed substrate manipulator
US20090033895A1 (en) * 2007-07-30 2009-02-05 Nikon Corporation Lithography apparatus with flexibly supported optical system
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
EP2179330A1 (de) 2007-10-16 2010-04-28 Nikon Corporation Optisches beleuchtungssystem, belichtungsvorrichtung und bauelementeherstellungsverfahren
SG10201602750RA (en) 2007-10-16 2016-05-30 Nikon Corp Illumination Optical System, Exposure Apparatus, And Device Manufacturing Method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
CN101910817B (zh) 2008-05-28 2016-03-09 株式会社尼康 照明光学系统、曝光装置以及器件制造方法
DE102009024870A1 (de) * 2008-06-10 2009-12-31 Carl Zeiss Smt Ag Optische Einrichtung mit einstellbarer Kraftwirkung auf ein optisches Modul
US8952342B2 (en) * 2009-12-17 2015-02-10 Mapper Lithography Ip B.V. Support and positioning structure, semiconductor equipment system and method for positioning
JP5675258B2 (ja) * 2010-10-14 2015-02-25 Ntn株式会社 リンク作動装置
NL2008157A (en) 2011-02-22 2012-08-24 Asml Netherlands Bv Lithographic apparatus and lithographic projection method.
KR101801148B1 (ko) * 2011-08-16 2017-11-27 삼성전자주식회사 초정밀 위치 제어 장치 및 그 6자유도 스테이지의 위치 및 자세 정보 산출 방법
TWI413786B (zh) * 2011-08-19 2013-11-01 Chroma Ate Inc High pressure test method and equipment for rapid detection of contact loop
US9939728B2 (en) 2011-09-12 2018-04-10 Mapper Lithography Ip B.V. Vacuum chamber with a thick aluminum base plate
NL2007423C2 (en) * 2011-09-15 2013-03-18 Mapper Lithography Ip Bv Vacuum chamber with base plate.
US8644964B2 (en) * 2012-05-03 2014-02-04 Deere & Company Method and system for controlling movement of an end effector on a machine
TWI479154B (zh) * 2013-02-04 2015-04-01 King Yuan Electronics Co Ltd 連桿式動態測試機及使用該測試機之動態測試設備
JP6271852B2 (ja) * 2013-03-29 2018-01-31 株式会社荏原製作所 電子線応用装置の鏡筒部へ真空ポンプを接続する真空ポンプ用接続装置、及び該接続装置の設置方法
US10048598B2 (en) 2013-06-28 2018-08-14 Nikon Corporation Movable body apparatus, exposure apparatus, and device manufacturing method
EP3766608A1 (de) 2014-11-14 2021-01-20 Nikon Corporation Formungsvorrichtung und formungsverfahren
JP6840540B2 (ja) 2014-11-14 2021-03-10 株式会社ニコン 造形装置
CN107664921B (zh) * 2016-07-29 2019-12-24 上海微电子装备（集团）股份有限公司 可调平的版库设备
KR101742920B1 (ko) * 2016-10-24 2017-06-01 한국기초과학지원연구원 전자 현미경용 시료 홀더의 구동기 및 이를 포함하는 스테이지
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WO2018203362A1 (ja) 2017-05-01 2018-11-08 株式会社ニコン 加工装置及び加工方法
KR102130441B1 (ko) * 2017-10-30 2020-07-07 주식회사 이엠텍 탄성 사출 프레임을 구비하는 선형 진동자
JP2019121688A (ja) * 2018-01-05 2019-07-22 株式会社ニューフレアテクノロジー 制振システム及び、その制振システムを備える光学装置
CN112977895A (zh) * 2021-03-31 2021-06-18 中国科学院长春光学精密机械与物理研究所 可折叠可见光与合成孔径雷达复合一体化轻量化结构
CN114476075A (zh) * 2022-01-13 2022-05-13 中国电子科技集团公司第三研究所 一种吊装载荷姿态稳定平台

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62226435A (ja) 1986-03-28 1987-10-05 Canon Inc 光学系駆動装置
JPH0438810Y2 (de) * 1987-04-28 1992-09-10
AT391773B (de) 1987-10-12 1990-11-26 Thallner Erich Vorrichtung zum exponieren eines halbleitersubstrates gegen ein strahlungsmuster
US5203199A (en) * 1990-10-12 1993-04-20 Teledyne Industries, Inc. Controlled acceleration platform
JPH04250988A (ja) 1991-01-09 1992-09-07 Tokimec Inc 歩行ロボットの脚機構
US5241188A (en) * 1991-02-01 1993-08-31 Nikon Corporation Apparatus for detecting a focussing position
US6400444B2 (en) * 1992-07-09 2002-06-04 Canon Kabushiki Kaisha Exposure apparatus and device producing method using the same
US5545962A (en) 1992-08-18 1996-08-13 Canon Kabushiki Kaisha Positioning system
JP2821837B2 (ja) * 1992-11-06 1998-11-05 キヤノン株式会社 加速度フィードバック付き微動位置決め装置
US5559584A (en) * 1993-03-08 1996-09-24 Nikon Corporation Exposure apparatus
US6246204B1 (en) 1994-06-27 2001-06-12 Nikon Corporation Electromagnetic alignment and scanning apparatus
JP3117118B2 (ja) 1995-07-31 2000-12-11 ヒーハイスト精工株式会社 多自由度位置決め機構
JP3005461B2 (ja) * 1995-11-24 2000-01-31 日本電気株式会社 静電チャック
US5870228A (en) * 1996-05-24 1999-02-09 U.S. Precision Lens Inc. Projection lenses having larger back focal length to focal length ratios
JPH10260277A (ja) * 1997-03-21 1998-09-29 Olympus Optical Co Ltd パラレルリンクステージ機構
US6283361B1 (en) * 1998-05-27 2001-09-04 Calsonic Corporation General-purpose jig
US6048750A (en) * 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
JP4194160B2 (ja) * 1998-02-19 2008-12-10 キヤノン株式会社 投影露光装置
JPH11274031A (ja) * 1998-03-20 1999-10-08 Canon Inc 露光装置およびデバイス製造方法ならびに位置決め装置

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AU5653699A (en) 2001-04-24
KR100699241B1 (ko) 2007-03-27
KR20010107969A (ko) 2001-12-07
TW446998B (en) 2001-07-21
EP1137054A4 (de) 2003-11-19
US6940582B1 (en) 2005-09-06
WO2001022480A1 (fr) 2001-03-29
EP1137054B1 (de) 2006-03-15
EP1137054A1 (de) 2001-09-26
DE69930398T2 (de) 2006-10-19

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