DE69933025D1 - Reinigungsflüssigkeit und reinigungsverfahren für halbleiterbearbeitungsmaschinenkomponente - Google Patents

Reinigungsflüssigkeit und reinigungsverfahren für halbleiterbearbeitungsmaschinenkomponente

Info

Publication number
DE69933025D1
DE69933025D1 DE69933025T DE69933025T DE69933025D1 DE 69933025 D1 DE69933025 D1 DE 69933025D1 DE 69933025 T DE69933025 T DE 69933025T DE 69933025 T DE69933025 T DE 69933025T DE 69933025 D1 DE69933025 D1 DE 69933025D1
Authority
DE
Germany
Prior art keywords
cleaning
semiconductor machining
machining components
cleaning liquid
cleaning method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69933025T
Other languages
English (en)
Other versions
DE69933025T2 (de
Inventor
Kenichi Hirota
Hitoshi Yamada
Kiyoshi Yuasa
Eiji Yamaguchi
Shinichi Kawaguchi
Takahiro Shimoda
Nobuyuki Nagayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69933025D1 publication Critical patent/DE69933025D1/de
Application granted granted Critical
Publication of DE69933025T2 publication Critical patent/DE69933025T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2068—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/28—Heterocyclic compounds containing nitrogen in the ring
    • C11D2111/20—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/905—Cleaning of reaction chamber
DE69933025T 1998-05-26 1999-05-25 Reinigungsflüssigkeit und reinigungsverfahren für halbleiterbearbeitungsmaschinenkomponente Expired - Lifetime DE69933025T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP18323098 1998-05-26
JP18323098 1998-05-26
PCT/JP1999/002745 WO1999061573A1 (fr) 1998-05-26 1999-05-25 Fluide de lavage et procede de lavage de composants d'un appareil de traitement de semi-conducteurs

Publications (2)

Publication Number Publication Date
DE69933025D1 true DE69933025D1 (de) 2006-10-12
DE69933025T2 DE69933025T2 (de) 2007-03-08

Family

ID=16132068

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69933025T Expired - Lifetime DE69933025T2 (de) 1998-05-26 1999-05-25 Reinigungsflüssigkeit und reinigungsverfahren für halbleiterbearbeitungsmaschinenkomponente

Country Status (7)

Country Link
US (1) US6805135B1 (de)
EP (1) EP1083219B1 (de)
JP (1) JP4398091B2 (de)
KR (1) KR100568381B1 (de)
DE (1) DE69933025T2 (de)
TW (1) TW436881B (de)
WO (1) WO1999061573A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375831B1 (en) * 2000-02-01 2002-04-23 Betzdearborn Inc. Inhibiting deposits in coke oven gas processing equipment
JP2002198355A (ja) * 2000-12-26 2002-07-12 Tokyo Electron Ltd プラズマ処理装置
US6394107B1 (en) * 2001-04-24 2002-05-28 3M Innovative Properties Company Use of fluorinated ketones as wet cleaning agents for vapor reactors and vapor reactor components
US7461614B2 (en) * 2003-11-12 2008-12-09 Tokyo Electron Limited Method and apparatus for improved baffle plate
JP4352880B2 (ja) * 2003-12-02 2009-10-28 セイコーエプソン株式会社 洗浄方法および洗浄装置
DE102004031713B3 (de) * 2004-06-30 2005-12-22 Fujitsu Siemens Computers Gmbh Verfahren zum Reinigen einer Reinigunsvorrichtung eines Lötofen und Lötofen zur Durchführung des Verfahrens
US7198677B2 (en) * 2005-03-09 2007-04-03 Wafermasters, Inc. Low temperature wafer backside cleaning
KR100836760B1 (ko) * 2006-11-15 2008-06-10 삼성전자주식회사 세정 용액 및 이를 이용한 기판 세정 방법
JP6544902B2 (ja) * 2014-09-18 2019-07-17 東京エレクトロン株式会社 プラズマ処理装置
US20190136159A1 (en) * 2017-10-24 2019-05-09 Kyzen Corporation Butylpyrrolidone based cleaning agent for removal of contaminates from electronic and semiconductor devices

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4156619A (en) * 1975-06-11 1979-05-29 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for cleaning semi-conductor discs
US4664721A (en) * 1981-12-07 1987-05-12 Intercontinental Chemical Corporation Printing screen cleaning and reclaiming compositions
EP0081355B1 (de) * 1981-12-07 1987-04-29 Intercontinental Chemical Corporation Verfahren und Verwendung einer Zusammensetzung zur Reinigung und/oder Regenerierung der Druckschirme
US5102573A (en) * 1987-04-10 1992-04-07 Colgate Palmolive Co. Detergent composition
DE4124246A1 (de) * 1991-07-22 1993-01-28 Henkel Kgaa Reinigungsmittel fuer elektronische und elektrische baugruppen
DE4228461C1 (de) * 1992-08-27 1994-01-20 Chemie X 2000 Schrupstock Gmbh Reinigungsmediumzusammensetzung
KR960701186A (ko) * 1993-03-30 1996-02-24 테릴 켄트 퀼리 다표면 세정 조성물 및 그것의 사용방법(multi-surface cleaning compositions and method of use)
JP3452406B2 (ja) 1993-10-07 2003-09-29 有限会社ケントス 有機系付着物の除去性能を有する組成物
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
MY117988A (en) 1995-10-03 2004-08-30 Nor Ind Inc Cleaning compositions for oil and gas well, lines, casings, formations and equipment and methods of use
JP3755785B2 (ja) 1996-12-27 2006-03-15 東京応化工業株式会社 剥離処理用リンス液組成物及びそれを用いた基板の処理方法
WO1999031212A1 (en) * 1997-12-12 1999-06-24 Black Robert H Composition for cleaning hard surfaces

Also Published As

Publication number Publication date
KR20010043824A (ko) 2001-05-25
WO1999061573A1 (fr) 1999-12-02
EP1083219A1 (de) 2001-03-14
EP1083219B1 (de) 2006-08-30
DE69933025T2 (de) 2007-03-08
EP1083219A4 (de) 2002-06-05
KR100568381B1 (ko) 2006-04-05
JP4398091B2 (ja) 2010-01-13
US6805135B1 (en) 2004-10-19
TW436881B (en) 2001-05-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition