DE69934229D1 - Zusammensetzung zur entschichtung von photolack und organischen materialien von substratoberflächen - Google Patents

Zusammensetzung zur entschichtung von photolack und organischen materialien von substratoberflächen

Info

Publication number
DE69934229D1
DE69934229D1 DE69934229T DE69934229T DE69934229D1 DE 69934229 D1 DE69934229 D1 DE 69934229D1 DE 69934229 T DE69934229 T DE 69934229T DE 69934229 T DE69934229 T DE 69934229T DE 69934229 D1 DE69934229 D1 DE 69934229D1
Authority
DE
Germany
Prior art keywords
photolack
dealing
composition
organic materials
substrate surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69934229T
Other languages
English (en)
Other versions
DE69934229T2 (de
Inventor
E Oberlander
S Slezak
N Khanna
L Durham
Lawrence Spinicelli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EMD Performance Materials Corp
Original Assignee
AZ Electronic Materials USA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AZ Electronic Materials USA Corp filed Critical AZ Electronic Materials USA Corp
Publication of DE69934229D1 publication Critical patent/DE69934229D1/de
Application granted granted Critical
Publication of DE69934229T2 publication Critical patent/DE69934229T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/426Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/26Organic compounds containing oxygen
    • C11D7/264Aldehydes; Ketones; Acetals or ketals
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers
    • G03F7/322Aqueous alkaline compositions
DE69934229T 1998-07-10 1999-06-30 Zusammensetzung zur entschichtung von photolack und organischen materialien von substratoberflächen Expired - Lifetime DE69934229T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/113,892 US6368421B1 (en) 1998-07-10 1998-07-10 Composition for stripping photoresist and organic materials from substrate surfaces
US113892 1998-07-10
PCT/EP1999/004498 WO2000003306A1 (en) 1998-07-10 1999-06-30 Composition for stripping photoresist and organic materials from substrate surfaces

Publications (2)

Publication Number Publication Date
DE69934229D1 true DE69934229D1 (de) 2007-01-11
DE69934229T2 DE69934229T2 (de) 2007-10-25

Family

ID=22352158

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69934229T Expired - Lifetime DE69934229T2 (de) 1998-07-10 1999-06-30 Zusammensetzung zur entschichtung von photolack und organischen materialien von substratoberflächen

Country Status (9)

Country Link
US (1) US6368421B1 (de)
EP (1) EP1097405B1 (de)
JP (1) JP2002520659A (de)
KR (1) KR100602463B1 (de)
CN (1) CN1316317C (de)
DE (1) DE69934229T2 (de)
MY (1) MY117049A (de)
TW (1) TW544551B (de)
WO (1) WO2000003306A1 (de)

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JP5306755B2 (ja) * 2008-09-16 2013-10-02 AzエレクトロニックマテリアルズIp株式会社 基板処理液およびそれを用いたレジスト基板処理方法
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CN102334069B (zh) 2009-02-25 2013-07-10 安万托特性材料股份有限公司 基于多用途酸性有机溶剂的微电子清洗组合物
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WO2012161790A1 (en) * 2011-02-24 2012-11-29 John Moore Concentrated chemical composition and method for removing photoresist during microelectric fabrication
CN102436153B (zh) * 2011-10-28 2013-06-19 绍兴文理学院 印花网版感光胶剥离剂
CN102427039A (zh) * 2011-11-02 2012-04-25 上海宏力半导体制造有限公司 光阻去除方法
ES2564426B2 (es) 2014-09-19 2016-09-12 Universidad De Oviedo Marcador de patologías oculares
US10073351B2 (en) * 2014-12-23 2018-09-11 Versum Materials Us, Llc Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation
TWI692679B (zh) * 2017-12-22 2020-05-01 美商慧盛材料美國責任有限公司 光阻剝除劑
KR102391389B1 (ko) * 2021-09-15 2022-04-28 (주)네프코 세정 용이성 및 내마모성이 우수한 친환경 포토마스크 및 이의 제조방법
CN113832471B (zh) * 2021-09-26 2024-03-08 苏州至绒新能源科技有限公司 一种用于快速剥离聚酰亚胺薄膜的清洗剂及其应用

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Also Published As

Publication number Publication date
KR20010053454A (ko) 2001-06-25
TW544551B (en) 2003-08-01
WO2000003306A1 (en) 2000-01-20
CN1308737A (zh) 2001-08-15
MY117049A (en) 2004-04-30
EP1097405A1 (de) 2001-05-09
KR100602463B1 (ko) 2006-07-19
JP2002520659A (ja) 2002-07-09
US6368421B1 (en) 2002-04-09
EP1097405B1 (de) 2006-11-29
CN1316317C (zh) 2007-05-16
DE69934229T2 (de) 2007-10-25

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