DE69936008D1 - Keramischer Kondensator - Google Patents

Keramischer Kondensator

Info

Publication number
DE69936008D1
DE69936008D1 DE69936008T DE69936008T DE69936008D1 DE 69936008 D1 DE69936008 D1 DE 69936008D1 DE 69936008 T DE69936008 T DE 69936008T DE 69936008 T DE69936008 T DE 69936008T DE 69936008 D1 DE69936008 D1 DE 69936008D1
Authority
DE
Germany
Prior art keywords
ceramic capacitor
capacitor
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69936008T
Other languages
English (en)
Other versions
DE69936008T2 (de
Inventor
Takaya Ishigaki
Masatoshi Ishikawa
Takeshi Kamiya
Syunji Itakura
Yuji Aiba
Masanori Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP00188498A external-priority patent/JP3206734B2/ja
Priority claimed from JP01756598A external-priority patent/JP3206735B2/ja
Priority claimed from JP2762998A external-priority patent/JP3206736B2/ja
Priority claimed from JP14222698A external-priority patent/JPH11329892A/ja
Application filed by TDK Corp filed Critical TDK Corp
Publication of DE69936008D1 publication Critical patent/DE69936008D1/de
Application granted granted Critical
Publication of DE69936008T2 publication Critical patent/DE69936008T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H01F2027/295—Surface mounted devices with flexible terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
DE69936008T 1998-01-07 1999-01-05 Keramischer Kondensator Expired - Lifetime DE69936008T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP188498 1998-01-07
JP00188498A JP3206734B2 (ja) 1997-06-27 1998-01-07 セラミックコンデンサ
JP1756598 1998-01-29
JP01756598A JP3206735B2 (ja) 1998-01-29 1998-01-29 セラミックコンデンサ
JP2762998A JP3206736B2 (ja) 1998-02-09 1998-02-09 セラミックコンデンサ
JP2762998 1998-02-09
JP14222698 1998-05-08
JP14222698A JPH11329892A (ja) 1998-05-08 1998-05-08 複合セラミックコンデンサ並びに同コンデンサの製造方法

Publications (2)

Publication Number Publication Date
DE69936008D1 true DE69936008D1 (de) 2007-06-21
DE69936008T2 DE69936008T2 (de) 2008-01-10

Family

ID=27453500

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69936008T Expired - Lifetime DE69936008T2 (de) 1998-01-07 1999-01-05 Keramischer Kondensator

Country Status (4)

Country Link
US (3) US6191933B1 (de)
EP (1) EP0929087B1 (de)
DE (1) DE69936008T2 (de)
TW (1) TW394963B (de)

Families Citing this family (118)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
DE69936008T2 (de) * 1998-01-07 2008-01-10 Tdk Corp. Keramischer Kondensator
EP0949642B1 (de) 1998-03-31 2010-11-03 TDK Corporation Elektronisches Bauelement in Chipbauweise und Verfahren zu seiner Herstellung
EP1011117A3 (de) * 1998-12-15 2004-11-10 Murata Manufacturing Co., Ltd. Monolithischer keramischer kondensator
JP2000223359A (ja) * 1999-01-29 2000-08-11 Murata Mfg Co Ltd セラミック電子部品
JP2001189233A (ja) * 1999-12-28 2001-07-10 Murata Mfg Co Ltd 積層コンデンサ
JP4130525B2 (ja) * 2000-09-18 2008-08-06 株式会社東芝 コンデンサの実装構造
US6418009B1 (en) * 2000-09-28 2002-07-09 Nortel Networks Limited Broadband multi-layer capacitor
TW569016B (en) 2001-01-29 2004-01-01 Semiconductor Energy Lab Light emitting device
SG107573A1 (en) * 2001-01-29 2004-12-29 Semiconductor Energy Lab Light emitting device
US6707230B2 (en) * 2001-05-29 2004-03-16 University Of North Carolina At Charlotte Closed loop control systems employing relaxor ferroelectric actuators
JP4166035B2 (ja) * 2001-06-18 2008-10-15 富士通テン株式会社 高周波回路部品の実装構造、実装方法及び実装装置
JP4187184B2 (ja) * 2002-02-28 2008-11-26 Ｔｄｋ株式会社 電子部品
US6704189B2 (en) * 2002-04-09 2004-03-09 Tdk Corporation Electronic device with external terminals and method of production of the same
US7576968B2 (en) 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
TW200409153A (en) * 2002-09-04 2004-06-01 Nec Corp Strip line element, printed circuit board carrying member, circuit board, semiconductor package and method for forming same
US6958899B2 (en) * 2003-03-20 2005-10-25 Tdk Corporation Electronic device
US20070122698A1 (en) 2004-04-02 2007-05-31 Maxwell Technologies, Inc. Dry-particle based adhesive and dry film and methods of making same
US7352558B2 (en) * 2003-07-09 2008-04-01 Maxwell Technologies, Inc. Dry particle based capacitor and methods of making same
US20050250011A1 (en) * 2004-04-02 2005-11-10 Maxwell Technologies, Inc. Particle packaging systems and methods
US7508651B2 (en) 2003-07-09 2009-03-24 Maxwell Technologies, Inc. Dry particle based adhesive and dry film and methods of making same
US7791860B2 (en) 2003-07-09 2010-09-07 Maxwell Technologies, Inc. Particle based electrodes and methods of making same
US7342770B2 (en) 2003-07-09 2008-03-11 Maxwell Technologies, Inc. Recyclable dry particle based adhesive electrode and methods of making same
JP3883528B2 (ja) * 2003-08-19 2007-02-21 Ｔｄｋ株式会社 電子部品
US7920371B2 (en) 2003-09-12 2011-04-05 Maxwell Technologies, Inc. Electrical energy storage devices with separator between electrodes and methods for fabricating the devices
US7495349B2 (en) * 2003-10-20 2009-02-24 Maxwell Technologies, Inc. Self aligning electrode
WO2005062318A1 (ja) * 2003-12-18 2005-07-07 Matsushita Electric Industrial Co., Ltd. 電子部品
US7133275B2 (en) * 2004-02-06 2006-11-07 Avx Corporation Integrated capacitor assembly
US7384433B2 (en) 2004-02-19 2008-06-10 Maxwell Technologies, Inc. Densification of compressible layers during electrode lamination
US20060246343A1 (en) * 2004-04-02 2006-11-02 Maxwell Technologies, Inc. Dry particle packaging systems and methods of making same
DE102004045948A1 (de) * 2004-09-22 2006-04-06 Epcos Ag Oberflächenmontierbares Bauelement
US7630188B2 (en) 2005-03-01 2009-12-08 X2Y Attenuators, Llc Conditioner with coplanar conductors
US7440258B2 (en) 2005-03-14 2008-10-21 Maxwell Technologies, Inc. Thermal interconnects for coupling energy storage devices
DE102005012395A1 (de) * 2005-03-17 2006-09-21 Epcos Ag Durchführungsfilter und elektrisches Mehrschicht-Bauelement
JP2006295076A (ja) * 2005-04-14 2006-10-26 Rohm Co Ltd セラミック製チップ型電子部品とその製造方法
TWI348341B (en) * 2005-05-18 2011-09-01 Chunghwa Picture Tubes Ltd Electronic element module and electronic device using the same
JP2006324555A (ja) * 2005-05-20 2006-11-30 Nec Tokin Corp 積層型コンデンサ及びその製造方法
US7453114B2 (en) * 2005-08-05 2008-11-18 Sbe, Inc. Segmented end electrode capacitor and method of segmenting an end electrode of a capacitor
US7164573B1 (en) * 2005-08-31 2007-01-16 Kemet Electronic Corporation High ESR or fused ceramic chip capacitor
JP4654854B2 (ja) * 2005-09-13 2011-03-23 パナソニック株式会社 積層コンデンサ及びモールドコンデンサ
JP4428355B2 (ja) * 2006-03-30 2010-03-10 Ｔｄｋ株式会社 電子部品の評価方法
TWI303543B (en) * 2006-10-16 2008-11-21 Delta Electronics Inc Stacked electronic device and the clipping device thereof
JP4385385B2 (ja) * 2006-12-14 2009-12-16 Ｔｄｋ株式会社 積層コンデンサ
US20080174931A1 (en) * 2007-01-18 2008-07-24 Skamser Daniel J Vertical electrode layer design to minimize flex cracks in capacitors
US20080201925A1 (en) 2007-02-28 2008-08-28 Maxwell Technologies, Inc. Ultracapacitor electrode with controlled sulfur content
US20080239621A1 (en) * 2007-03-29 2008-10-02 Azizuddin Tajuddin Clip-on leadframe
US7633739B2 (en) * 2007-05-24 2009-12-15 Daniel Devoe Stacked multilayer capacitor
US20080291602A1 (en) * 2007-05-24 2008-11-27 Daniel Devoe Stacked multilayer capacitor
US8289675B2 (en) * 2007-05-24 2012-10-16 Daniel Devoe Stacked multilayer capacitor
US8291585B2 (en) * 2007-08-22 2012-10-23 Tdk Corporation Method for manufacturing electronic component
JP5217584B2 (ja) * 2008-04-07 2013-06-19 株式会社村田製作所 積層セラミック電子部品
JP4549406B2 (ja) * 2008-05-19 2010-09-22 三菱電機株式会社 電子部品搭載構造及び車載用センサー
US8576537B2 (en) * 2008-10-17 2013-11-05 Kemet Electronics Corporation Capacitor comprising flex crack mitigation voids
JP5045649B2 (ja) * 2008-11-17 2012-10-10 株式会社村田製作所 セラミックコンデンサ及びそれを備えた電子部品
DE102009012627B4 (de) * 2009-03-11 2014-04-03 Epcos Ag Elektrisches Bauelement und Verfahren zum Reflow-Löten eines elektrischen Bauelements
KR101191300B1 (ko) 2009-03-26 2012-10-16 케메트 일렉트로닉스 코포레이션 저 ｅｓｌ 및 저 ｅｓｒ을 갖는 리드 적층 세라믹 캐패시터
JP4924698B2 (ja) * 2009-11-11 2012-04-25 Ｔｄｋ株式会社 電子部品実装構造
US10381162B2 (en) * 2010-05-26 2019-08-13 Kemet Electronics Corporation Leadless stack comprising multiple components
FR2964291B1 (fr) * 2010-08-25 2012-08-24 Hispano Suiza Sa Circuit imprime comportant au moins un composant ceramique
KR101412784B1 (ko) * 2011-08-31 2014-06-27 삼성전기주식회사 적층 세라믹 커패시터
KR101292775B1 (ko) * 2011-09-06 2013-08-02 삼화콘덴서공업주식회사 대용량 패키지형 적층 박막 커패시터
US8988857B2 (en) * 2011-12-13 2015-03-24 Kemet Electronics Corporation High aspect ratio stacked MLCC design
US9570236B2 (en) * 2012-03-29 2017-02-14 Taiyo Yuden Co., Ltd. Electronic component and method for manufacturing the same
US9357634B2 (en) 2012-04-27 2016-05-31 Kemet Electronics Corporation Coefficient of thermal expansion compensating compliant component
GB2502971B (en) * 2012-06-11 2017-10-04 Knowles (Uk) Ltd A capacitive structure
JP5664597B2 (ja) 2012-06-12 2015-02-04 株式会社村田製作所 実装構造及び実装方法
JP5874682B2 (ja) * 2012-08-09 2016-03-02 株式会社村田製作所 コンデンサ部品及びコンデンサ部品実装構造体
TWI463710B (zh) * 2012-10-05 2014-12-01 Subtron Technology Co Ltd 接合導熱基板與金屬層的方法
JP2015008270A (ja) * 2013-05-27 2015-01-15 株式会社村田製作所 セラミック電子部品
JP2016535445A (ja) 2013-10-29 2016-11-10 ケメット エレクトロニクス コーポレーション 改良されたリード設計を有するセラミックコンデンサー
KR101525689B1 (ko) * 2013-11-05 2015-06-03 삼성전기주식회사 적층 세라믹 전자 부품 및 적층 세라믹 전자 부품의 실장 기판
JP6372067B2 (ja) * 2013-11-08 2018-08-15 Tdk株式会社 セラミック電子部品
JP6011573B2 (ja) * 2014-03-24 2016-10-19 株式会社村田製作所 電子部品
US10204737B2 (en) 2014-06-11 2019-02-12 Avx Corporation Low noise capacitors
TWI625747B (zh) * 2015-01-08 2018-06-01 Holy Stone Enterprise Co Ltd Method and device for manufacturing laminated ceramic electronic component
KR102211742B1 (ko) * 2015-01-27 2021-02-03 삼성전기주식회사 표면 실장 전자부품 및 전자부품의 실장 기판
JP6443104B2 (ja) 2015-02-13 2018-12-26 株式会社村田製作所 コイル部品
DE102015102866B4 (de) 2015-02-27 2023-02-02 Tdk Electronics Ag Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements
JP6806354B2 (ja) * 2015-04-20 2021-01-06 サムソン エレクトロ−メカニックス カンパニーリミテッド． キャパシタ部品及びこれを備えた実装基板
KR102149787B1 (ko) * 2015-05-27 2020-08-31 삼성전기주식회사 적층 세라믹 전자 부품 및 그 실장 기판
US9929123B2 (en) * 2015-06-08 2018-03-27 Analog Devices, Inc. Resonant circuit including bump pads
JP6547569B2 (ja) * 2015-10-08 2019-07-24 Tdk株式会社 電子部品
KR101681429B1 (ko) * 2015-10-08 2016-11-30 삼성전기주식회사 전자 부품 및 그 실장 기판
US10224149B2 (en) * 2015-12-09 2019-03-05 Kemet Electronics Corporation Bulk MLCC capacitor module
US10403439B2 (en) * 2015-12-21 2019-09-03 Palo Alto Research Center Incorporated Multilayer capacitor
US10096426B2 (en) * 2015-12-28 2018-10-09 Tdk Corporation Electronic device
JP6776582B2 (ja) * 2016-03-31 2020-10-28 Tdk株式会社 電子部品
JP2018018938A (ja) * 2016-07-27 2018-02-01 株式会社村田製作所 積層セラミック電子部品
KR102632349B1 (ko) * 2016-09-05 2024-02-02 삼성전기주식회사 커패시터 부품
JP6780394B2 (ja) * 2016-09-12 2020-11-04 Tdk株式会社 電子部品
KR20180047892A (ko) * 2016-11-01 2018-05-10 삼성전기주식회사 적층 전자 부품
JP6862789B2 (ja) * 2016-11-22 2021-04-21 Tdk株式会社 セラミック電子部品
KR20180106427A (ko) * 2017-03-20 2018-10-01 삼성전기주식회사 전자 부품, 그 실장 기판 및 메탈 프레임의 제조 방법
JP6863016B2 (ja) * 2017-03-31 2021-04-21 Tdk株式会社 電子部品
JP7075185B2 (ja) 2017-04-27 2022-05-25 太陽誘電株式会社 コイル部品及び電子機器
JP6869796B2 (ja) * 2017-04-27 2021-05-12 太陽誘電株式会社 コイル部品
JP2018206813A (ja) * 2017-05-30 2018-12-27 株式会社村田製作所 積層セラミック電子部品
JP2019062023A (ja) * 2017-09-25 2019-04-18 Tdk株式会社 電子部品装置
KR102494331B1 (ko) * 2017-10-24 2023-02-02 삼성전기주식회사 적층형 전자 부품 및 그 실장 기판
JP6975915B2 (ja) * 2018-04-25 2021-12-01 パナソニックＩｐマネジメント株式会社 電子部品
KR102538898B1 (ko) * 2018-06-08 2023-06-01 삼성전기주식회사 전자 부품
KR102194707B1 (ko) * 2018-08-16 2020-12-23 삼성전기주식회사 전자 부품
KR102083992B1 (ko) * 2018-08-29 2020-03-03 삼성전기주식회사 전자 부품
KR102150550B1 (ko) * 2018-10-10 2020-09-01 삼성전기주식회사 적층 세라믹 전자부품 집합체
WO2020159809A1 (en) 2019-01-28 2020-08-06 Avx Corporation Multilayer ceramic capacitor having ultra-broadband performance
WO2020159807A1 (en) 2019-01-28 2020-08-06 Avx Corporation Multilayer ceramic capacitor having ultra-broadband performance
CN116612991A (zh) 2019-01-28 2023-08-18 京瓷Avx元器件公司 具有超宽带性能的多层陶瓷电容器
US11211201B2 (en) 2019-01-28 2021-12-28 Avx Corporation Multilayer ceramic capacitor having ultra-broadband performance
WO2020159813A1 (en) 2019-01-28 2020-08-06 Avx Corporation Multilayer ceramic capacitor having ultra-broadband performance
US11043945B2 (en) * 2019-03-22 2021-06-22 Yingchao WU Capacitance-variable pressure sensor
US11705280B2 (en) * 2019-04-25 2023-07-18 KYOCERA AVX Components Corporation Multilayer capacitor having open mode electrode configuration and flexible terminations
JP7369546B2 (ja) 2019-05-31 2023-10-26 太陽誘電株式会社 コイル部品
US11219121B2 (en) * 2020-01-08 2022-01-04 Honeywell International Inc. Circuit board assembly with electronic surface mount device and mount arrangement for thermal protection
US11664159B2 (en) * 2020-04-14 2023-05-30 KYOCERA AVX Components Corporation Component array including one or more heat sink layers

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517155A (en) * 1982-05-18 1985-05-14 Union Carbide Corporation Copper base metal termination for multilayer ceramic capacitors
DE3813435A1 (de) * 1988-04-21 1989-11-02 Siemens Ag Bauelement in chip-bauweise zum befestigen auf einer schaltplatte, mit einem elektrischen oder elektronischen funktionskoerper
JPH04171911A (ja) 1990-11-06 1992-06-19 Mitsubishi Materials Corp 複合セラミックコンデンサ
JPH04188813A (ja) 1990-11-22 1992-07-07 Mitsubishi Materials Corp 複合セラミックコンデンサ及びその製造方法
JP2900596B2 (ja) 1990-11-22 1999-06-02 三菱マテリアル株式会社 複合セラミックコンデンサ
JP2608995B2 (ja) * 1991-02-12 1997-05-14 松下電器産業株式会社 光ビーム加熱半田用ソルダーペースト
JPH04259205A (ja) 1991-02-13 1992-09-14 Marcon Electron Co Ltd チップ形セラミックコンデンサ
JPH0546258A (ja) 1991-08-09 1993-02-26 Shin Meiwa Ind Co Ltd 機構系の駆動方法
JPH05101965A (ja) * 1991-10-08 1993-04-23 Meitec Corp 電子部品の電極端子およびその半田付け方法
JPH06104139A (ja) * 1992-09-21 1994-04-15 Matsushita Electric Ind Co Ltd セラミックチップ部品
JP3282750B2 (ja) * 1993-07-05 2002-05-20 株式会社村田製作所 チップ型電子部品
JP3230394B2 (ja) * 1994-06-01 2001-11-19 株式会社村田製作所 磁器コンデンサ
JPH0817679A (ja) 1994-06-30 1996-01-19 Kyocera Corp 複合セラミックコンデンサ
MY119247A (en) * 1994-10-31 2005-04-30 Tdk Corp Manufacturing method and manufacturing apparatus for ceramic electronic components
US5805409A (en) 1995-08-18 1998-09-08 Tdk Corporation Multi-layer electronic part having external electrodes that have a thermosetting resin and metal particles
GB9814317D0 (en) * 1997-07-23 1998-09-02 Murata Manufacturing Co Ceramic electronic part and method for producing the same
DE69936008T2 (de) * 1998-01-07 2008-01-10 Tdk Corp. Keramischer Kondensator
JP3758408B2 (ja) * 1998-06-24 2006-03-22 株式会社村田製作所 セラミック電子部品

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EP0929087B1 (de) 2007-05-09
EP0929087A3 (de) 2003-03-12
DE69936008T2 (de) 2008-01-10
US6310759B2 (en) 2001-10-30
US20010001258A1 (en) 2001-05-17
TW394963B (en) 2000-06-21
US6523235B1 (en) 2003-02-25
EP0929087A2 (de) 1999-07-14

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