DE69936725D1 - Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat - Google Patents
Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substratInfo
- Publication number
- DE69936725D1 DE69936725D1 DE69936725T DE69936725T DE69936725D1 DE 69936725 D1 DE69936725 D1 DE 69936725D1 DE 69936725 T DE69936725 T DE 69936725T DE 69936725 T DE69936725 T DE 69936725T DE 69936725 D1 DE69936725 D1 DE 69936725D1
- Authority
- DE
- Germany
- Prior art keywords
- foil
- applying
- gasket
- viscosem
- pastive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/44—Squeegees or doctors
- B41F15/46—Squeegees or doctors with two or more operative parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB9819625.6A GB9819625D0 (en) | 1998-09-10 | 1998-09-10 | Method and apparatus for applying a viscous or paste material onto a substrate |
GB9819625 | 1998-09-10 | ||
GB9825158 | 1998-11-18 | ||
GBGB9825158.0A GB9825158D0 (en) | 1998-09-10 | 1998-11-18 | Method and apparatus for supplying a viscous or paste material onto a substrate |
GB9827763 | 1998-12-18 | ||
GBGB9827763.5A GB9827763D0 (en) | 1998-09-10 | 1998-12-18 | Method and apparatus for applying a viscous or past material onto a substrate |
GB9903146 | 1999-02-12 | ||
GBGB9903146.0A GB9903146D0 (en) | 1998-09-10 | 1999-02-12 | Method and apparatus for applying a viscous or paste material onto a substrate |
PCT/GB1999/002953 WO2000015436A1 (en) | 1998-09-10 | 1999-09-06 | Method and apparatus for applying a viscous or paste material onto a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69936725D1 true DE69936725D1 (de) | 2007-09-13 |
DE69936725T2 DE69936725T2 (de) | 2008-04-30 |
Family
ID=27451830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69936725T Expired - Lifetime DE69936725T2 (de) | 1998-09-10 | 1999-09-06 | Verfahren und vorrichtung zum auftragen von viskosem oder pastösem material auf ein substrat |
Country Status (8)
Country | Link |
---|---|
US (1) | US6725769B1 (de) |
EP (1) | EP1113931B1 (de) |
JP (1) | JP2002524325A (de) |
AT (1) | ATE368568T1 (de) |
AU (1) | AU5641999A (de) |
DE (1) | DE69936725T2 (de) |
GB (2) | GB9903146D0 (de) |
WO (1) | WO2000015436A1 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6395087B1 (en) * | 1994-12-27 | 2002-05-28 | Visteon Global Technologies, Inc. | Method and apparatus for dispensing viscous material |
WO2000061489A1 (en) * | 1999-04-08 | 2000-10-19 | Crossflow International Limited | Method and apparatus for dispensing viscous material |
GB9913496D0 (en) * | 1999-06-10 | 1999-08-11 | Williams David G | Improved squeegee or sealing means/wiper |
ATE356535T1 (de) | 2000-04-04 | 2007-03-15 | Dek Int Gmbh | Verfahren und vorrichtung zum aufbringen von viskosem oder pastösem material auf ein substrat |
WO2001093647A2 (en) * | 2000-05-31 | 2001-12-06 | Honeywell International Inc. | Filling method |
US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
WO2001093648A2 (en) * | 2000-05-31 | 2001-12-06 | Honeywell International Inc. | Filling device |
US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
JP3685053B2 (ja) * | 2000-12-05 | 2005-08-17 | 松下電器産業株式会社 | スクリーン印刷装置 |
KR100782227B1 (ko) * | 2006-02-23 | 2007-12-05 | 엘에스전선 주식회사 | 스크린 프린터의 스퀴즈 |
US7416104B2 (en) * | 2006-04-21 | 2008-08-26 | International Business Machines Corporation | Rotational fill techniques for injection molding of solder |
US7410092B2 (en) * | 2006-04-21 | 2008-08-12 | International Business Machines Corporation | Fill head for injection molding of solder |
US7694869B2 (en) * | 2006-04-21 | 2010-04-13 | International Business Machines Corporation | Universal mold for injection molding of solder |
US9314864B2 (en) * | 2007-07-09 | 2016-04-19 | International Business Machines Corporation | C4NP compliant solder fill head seals |
US7980445B2 (en) * | 2008-01-23 | 2011-07-19 | International Business Machines Corporation | Fill head for full-field solder coverage with a rotatable member |
JP4643719B2 (ja) * | 2009-02-09 | 2011-03-02 | ヤマハ発動機株式会社 | はんだ供給装置、印刷装置および印刷方法 |
JP5251579B2 (ja) * | 2009-02-12 | 2013-07-31 | 株式会社デンソー | ペースト状物質を有底孔に充填する方法及び装置 |
US8444770B2 (en) * | 2009-06-29 | 2013-05-21 | Ttm Technologies, Inc. | System for cleaning components for filling holes in a printed circuit board with a fluid fill material |
US8122847B2 (en) | 2009-06-29 | 2012-02-28 | Ttm Technologies, Inc. | System for filling holes in a printed circuit board with a fluid fill material |
JP5947098B2 (ja) * | 2011-05-13 | 2016-07-06 | 株式会社半導体エネルギー研究所 | ガラス封止体の作製方法および発光装置の作製方法 |
US8511805B2 (en) | 2011-12-28 | 2013-08-20 | Hewlett-Packard Indigo B.V. | Extracting liquid from a cartridge |
US8632171B2 (en) | 2011-12-28 | 2014-01-21 | Hewlett-Packard Indigo B.V. | Ink cartridges and outputting ink from ink cartridges |
US9738816B2 (en) | 2012-12-06 | 2017-08-22 | 3M Innovative Properties Company | Precision coating of viscous liquids and use in forming laminates |
WO2014088939A1 (en) * | 2012-12-06 | 2014-06-12 | 3M Innovative Properties Company | Discrete coating of liquid on a liquid-coated substrate and use in forming laminates |
US20150321463A1 (en) * | 2014-05-09 | 2015-11-12 | GroupeSTAHL | Flexible platen cover and a heat press having a flexible platen cover |
ITUB20150485A1 (it) * | 2015-03-13 | 2016-09-13 | Sacmi | Sistema di tenuta per plastica fusa |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1433957A (en) * | 1974-01-29 | 1976-04-28 | Mitter & Co | Apparatus for applying fluid or pasty printing media for screen printing machines |
US4043683A (en) * | 1974-06-20 | 1977-08-23 | Loctite Corporation | Dispensing and wiping device |
US4023486A (en) | 1974-08-01 | 1977-05-17 | E.T. Barwick Industries | Screen printing squeegee apparatus |
DE2653912A1 (de) | 1976-11-27 | 1978-06-01 | Mathias Mitter | Vorrichtung zum bemustern und faerben von druckgut, insbesondere textilgut, das entweder in bahnen oder flaechigen einzelstuecken vorliegt mittels einer flachdrucksiebschablone |
US4541395A (en) * | 1984-01-23 | 1985-09-17 | Leroy Geiger | Pressure regulation in pumping a liquid |
US4622239A (en) | 1986-02-18 | 1986-11-11 | At&T Technologies, Inc. | Method and apparatus for dispensing viscous materials |
US4961955A (en) * | 1988-12-20 | 1990-10-09 | Itt Corporation | Solder paste applicator for circuit boards |
US5284189A (en) | 1992-03-16 | 1994-02-08 | Printron, Inc. | Conductive ink packaging for printed circuit board screen printing operations |
NL9301820A (nl) * | 1993-10-20 | 1995-05-16 | Stork Screens Bv | Rakelsamenstel. |
JP3512193B2 (ja) * | 1994-12-27 | 2004-03-29 | フォード モーター カンパニー | 粘性材料を分配する方法および装置 |
US6286422B1 (en) * | 1994-12-27 | 2001-09-11 | Visteon Global Tech., Inc. | Method and apparatus for dispensing viscous material |
FR2754474B1 (fr) * | 1996-10-15 | 1999-04-30 | Novatec | Dispositif pour le depot d'un produit visqueux ou pateux sur un substrat a travers les ouvertures d'un pochoir |
US5947022A (en) * | 1997-11-07 | 1999-09-07 | Speedline Technologies, Inc. | Apparatus for dispensing material in a printer |
US6158338A (en) * | 1998-12-22 | 2000-12-12 | Dek Printing Machines Limited | Cassette for holding and dispensing a viscous material for use in an apparatus for depositing the viscous material on a substrate |
-
1999
- 1999-02-12 GB GBGB9903146.0A patent/GB9903146D0/en not_active Ceased
- 1999-09-06 GB GB9920805A patent/GB2341347B/en not_active Expired - Fee Related
- 1999-09-06 US US09/763,630 patent/US6725769B1/en not_active Expired - Lifetime
- 1999-09-06 AT AT99943149T patent/ATE368568T1/de not_active IP Right Cessation
- 1999-09-06 AU AU56419/99A patent/AU5641999A/en not_active Abandoned
- 1999-09-06 DE DE69936725T patent/DE69936725T2/de not_active Expired - Lifetime
- 1999-09-06 EP EP99943149A patent/EP1113931B1/de not_active Expired - Lifetime
- 1999-09-06 JP JP2000570004A patent/JP2002524325A/ja active Pending
- 1999-09-06 WO PCT/GB1999/002953 patent/WO2000015436A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2002524325A (ja) | 2002-08-06 |
GB9920805D0 (en) | 1999-11-10 |
GB2341347B (en) | 2001-04-18 |
EP1113931B1 (de) | 2007-08-01 |
US6725769B1 (en) | 2004-04-27 |
ATE368568T1 (de) | 2007-08-15 |
DE69936725T2 (de) | 2008-04-30 |
AU5641999A (en) | 2000-04-03 |
WO2000015436A1 (en) | 2000-03-23 |
GB2341347A (en) | 2000-03-15 |
GB9903146D0 (en) | 1999-04-07 |
EP1113931A1 (de) | 2001-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |