DE69937407D1 - Verkapselung einer vorrichtung - Google Patents

Verkapselung einer vorrichtung

Info

Publication number
DE69937407D1
DE69937407D1 DE69937407T DE69937407T DE69937407D1 DE 69937407 D1 DE69937407 D1 DE 69937407D1 DE 69937407 T DE69937407 T DE 69937407T DE 69937407 T DE69937407 T DE 69937407T DE 69937407 D1 DE69937407 D1 DE 69937407D1
Authority
DE
Germany
Prior art keywords
package
capture
encapsulation
contacting
disclosed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69937407T
Other languages
English (en)
Other versions
DE69937407T2 (de
Inventor
Ewald Karl Michael Guenther
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Application granted granted Critical
Publication of DE69937407D1 publication Critical patent/DE69937407D1/de
Publication of DE69937407T2 publication Critical patent/DE69937407T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electroluminescent Light Sources (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)
  • Casings For Electric Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Photographic Developing Apparatuses (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
DE69937407T 1999-07-09 1999-07-09 Verkapselung einer vorrichtung Expired - Lifetime DE69937407T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG1999/000073 WO2001004963A1 (en) 1999-07-09 1999-07-09 Encapsulation of a device

Publications (2)

Publication Number Publication Date
DE69937407D1 true DE69937407D1 (de) 2007-12-06
DE69937407T2 DE69937407T2 (de) 2008-07-24

Family

ID=20430226

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69937407T Expired - Lifetime DE69937407T2 (de) 1999-07-09 1999-07-09 Verkapselung einer vorrichtung

Country Status (11)

Country Link
US (2) US6888237B1 (de)
EP (1) EP1119878B1 (de)
JP (1) JP2003504676A (de)
KR (1) KR20010106471A (de)
CN (1) CN1218407C (de)
AT (1) ATE376707T1 (de)
AU (1) AU4951299A (de)
CA (1) CA2342946A1 (de)
DE (1) DE69937407T2 (de)
TW (1) TW492165B (de)
WO (1) WO2001004963A1 (de)

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KR20010106472A (ko) 1999-07-09 2001-11-29 추후제출 소자를 캡슐화하기 위한 라미네이트
US6174613B1 (en) * 1999-07-29 2001-01-16 Agilent Technologies, Inc. Method and apparatus for fabricating polymer-based electroluminescent displays
US6949880B1 (en) 1999-12-17 2005-09-27 Osram Opto Semiconductors Gmbh Encapsulation for organic LED device
WO2001044865A1 (en) 1999-12-17 2001-06-21 Osram Opto Semiconductors Gmbh Improved encapsulation for organic led device
CN1204444C (zh) 1999-12-17 2005-06-01 奥斯兰姆奥普托半导体有限责任公司 改进的有机发光二极管器件
US7394153B2 (en) * 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
US6798954B2 (en) 2001-07-24 2004-09-28 3M Innovative Properties Company Packaged optical micro-mechanical device
US6834154B2 (en) 2001-07-24 2004-12-21 3M Innovative Properties Co. Tooling fixture for packaged optical micro-mechanical devices
US6771859B2 (en) 2001-07-24 2004-08-03 3M Innovative Properties Company Self-aligning optical micro-mechanical device package
GB2378564A (en) * 2001-08-07 2003-02-12 Cambridge Display Tech Ltd Flexible light emitting device with incompressible spacers
US6590157B2 (en) * 2001-09-21 2003-07-08 Eastman Kodak Company Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
US7026758B2 (en) * 2001-09-28 2006-04-11 Osram Opto Semiconductors Gmbh Reinforcement of glass substrates in flexible devices
US7362046B2 (en) 2001-11-10 2008-04-22 Image Portal Limited Partial overlapping display tiles of organic light emitting device
KR100875097B1 (ko) * 2002-09-18 2008-12-19 삼성모바일디스플레이주식회사 광학 공진 효과를 이용한 유기 전계발광 소자
KR100563057B1 (ko) * 2003-11-14 2006-03-24 삼성에스디아이 주식회사 초박형 유기 전계 발광 표시장치 및 그 제조방법
WO2005074148A1 (en) * 2004-01-29 2005-08-11 Artrang Co., Ltd. A portable cellular phone holder which has an electric charging ability
KR100608887B1 (ko) * 2004-05-03 2006-08-03 엘지전자 주식회사 일렉트로 루미네센스 패널 및 그 제조방법
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
KR100776240B1 (ko) * 2006-02-21 2007-11-16 엘지전자 주식회사 임프린트를 이용한 에칭방법과 그에 사용되는 스탬프
US7709940B2 (en) * 2006-04-24 2010-05-04 Spatial Photonics, Inc. Micro device encapsulation
TWI350409B (en) * 2006-07-06 2011-10-11 Nat Univ Chung Hsing Flexible and could be rolling-up area lights module and the method of producing thereof
DE102007004303A1 (de) * 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
DE102007004304A1 (de) 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
CN100466167C (zh) * 2007-02-05 2009-03-04 友达光电股份有限公司 可挠性主动元件阵列基板的制造方法
KR100873080B1 (ko) * 2007-05-10 2008-12-09 삼성모바일디스플레이주식회사 유기 전계 발광표시장치
DE102008024517A1 (de) 2007-12-27 2009-07-02 Osram Opto Semiconductors Gmbh Strahlungsemittierender Körper und Verfahren zur Herstellung eines strahlungsemittierenden Körpers
DE102008049060B4 (de) * 2008-09-26 2018-11-22 Osram Oled Gmbh Organisches, optoelektronisches Bauteil und Herstellungsverfahren hierfür
DE102010018260A1 (de) * 2010-01-29 2011-08-04 OSRAM Opto Semiconductors GmbH, 93055 Beleuchtungsvorrichtung
CN103337596B (zh) * 2013-05-24 2017-06-06 四川虹视显示技术有限公司 一种有机发光二极管的封装结构及其制备方法
CN103325949A (zh) * 2013-05-24 2013-09-25 四川虹视显示技术有限公司 一种有机发光二极管封装结构及其制备方法
US9064873B2 (en) * 2013-07-30 2015-06-23 Taiwan Semiconductor Manufacturing Company Ltd. Singulated semiconductor structure
KR102257729B1 (ko) * 2013-12-25 2021-05-27 니폰 제온 가부시키가이샤 적층 필름, 및 복합 필름의 제조 방법

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TW449938B (en) 2000-06-16 2001-08-11 Visual Photonics Epitaxy Co Lt Light emitting diode with a substrate electroplated with metal reflector and the manufacturing method hereof

Also Published As

Publication number Publication date
EP1119878A1 (de) 2001-08-01
CN1218407C (zh) 2005-09-07
WO2001004963A1 (en) 2001-01-18
DE69937407T2 (de) 2008-07-24
TW492165B (en) 2002-06-21
US20050136571A1 (en) 2005-06-23
AU4951299A (en) 2001-01-30
CA2342946A1 (en) 2001-01-18
EP1119878B1 (de) 2007-10-24
ATE376707T1 (de) 2007-11-15
JP2003504676A (ja) 2003-02-04
US6888237B1 (en) 2005-05-03
KR20010106471A (ko) 2001-11-29
US7214570B2 (en) 2007-05-08
CN1317154A (zh) 2001-10-10

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Legal Events

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8364 No opposition during term of opposition