DE69938582D1 - Halbleiterbauelement, seine herstellung, leiterplatte und elektronischer apparat - Google Patents

Halbleiterbauelement, seine herstellung, leiterplatte und elektronischer apparat

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Publication number
DE69938582D1
DE69938582D1 DE69938582T DE69938582T DE69938582D1 DE 69938582 D1 DE69938582 D1 DE 69938582D1 DE 69938582 T DE69938582 T DE 69938582T DE 69938582 T DE69938582 T DE 69938582T DE 69938582 D1 DE69938582 D1 DE 69938582D1
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DE
Germany
Prior art keywords
pcb
manufacture
semiconductor element
electronic apparatus
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69938582T
Other languages
English (en)
Other versions
DE69938582T2 (de
Inventor
Nobuaki Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE69938582D1 publication Critical patent/DE69938582D1/de
Application granted granted Critical
Publication of DE69938582T2 publication Critical patent/DE69938582T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
DE69938582T 1998-09-09 1999-09-03 Halbleiterbauelement, seine herstellung, leiterplatte und elektronischer apparat Expired - Lifetime DE69938582T2 (de)

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JP27261398 1998-09-09
JP27261398 1998-09-09
PCT/JP1999/004785 WO2000014802A1 (fr) 1998-09-09 1999-09-03 Dispositif a semi-conducteur et son procede de fabrication, carte de circuit imprime, dispositif electronique

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EP (1) EP1041633B1 (de)
KR (1) KR100514558B1 (de)
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EP1041633A1 (de) 2000-10-04
EP1041633A4 (de) 2001-10-31
KR100514558B1 (ko) 2005-09-13
WO2000014802A1 (fr) 2000-03-16
EP1041633B1 (de) 2008-04-23
KR20010031776A (ko) 2001-04-16
TW563213B (en) 2003-11-21
US20030030137A1 (en) 2003-02-13
CN1277737A (zh) 2000-12-20
DE69938582T2 (de) 2009-06-04
US6486544B1 (en) 2002-11-26
CN1229863C (zh) 2005-11-30

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