DE69940168D1 - Verfahren zum Entschichten von Resistmaterial - Google Patents

Verfahren zum Entschichten von Resistmaterial

Info

Publication number
DE69940168D1
DE69940168D1 DE69940168T DE69940168T DE69940168D1 DE 69940168 D1 DE69940168 D1 DE 69940168D1 DE 69940168 T DE69940168 T DE 69940168T DE 69940168 T DE69940168 T DE 69940168T DE 69940168 D1 DE69940168 D1 DE 69940168D1
Authority
DE
Germany
Prior art keywords
resist material
sensitive adhesive
adhesive sheet
pressure
peeling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69940168T
Other languages
English (en)
Inventor
Eiji Toyoda
Makoto Namikawa
Takuji Okeyui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP19299498A external-priority patent/JP2000029230A/ja
Priority claimed from JP32379898A external-priority patent/JP3959189B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of DE69940168D1 publication Critical patent/DE69940168D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/919—Delaminating in preparation for post processing recycling step
    • Y10S156/922—Specified electronic component delaminating in preparation for recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1142—Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]
    • Y10T156/1147—Using shrinking or swelling agent during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
DE69940168T 1998-07-08 1999-07-07 Verfahren zum Entschichten von Resistmaterial Expired - Fee Related DE69940168D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19299498A JP2000029230A (ja) 1998-07-08 1998-07-08 レジスト材の除去方法
JP32379898A JP3959189B2 (ja) 1998-01-16 1998-11-13 レジスト材の除去方法

Publications (1)

Publication Number Publication Date
DE69940168D1 true DE69940168D1 (de) 2009-02-05

Family

ID=26507633

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69905985T Expired - Fee Related DE69905985T2 (de) 1998-07-08 1999-07-07 Verfahren zum Entschichten eines Resistmaterials
DE69940168T Expired - Fee Related DE69940168D1 (de) 1998-07-08 1999-07-07 Verfahren zum Entschichten von Resistmaterial

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69905985T Expired - Fee Related DE69905985T2 (de) 1998-07-08 1999-07-07 Verfahren zum Entschichten eines Resistmaterials

Country Status (5)

Country Link
US (2) US6245188B1 (de)
EP (2) EP0971270B1 (de)
AT (2) ATE418750T1 (de)
DE (2) DE69905985T2 (de)
ES (1) ES2191387T3 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000331322A (ja) * 1999-05-21 2000-11-30 Nitto Denko Corp ヘッドスライダの製造方法
JP2002231600A (ja) * 2001-01-30 2002-08-16 Nitto Denko Corp レジスト除去用接着テープとレジスト除去方法
KR20020088380A (ko) * 2001-05-18 2002-11-27 닛토덴코 가부시키가이샤 레지스트 물질의 제거방법
DE10242560A1 (de) * 2002-09-13 2004-03-25 Creavis Gesellschaft Für Technologie Und Innovation Mbh Herstellung von selbstreinigenden Oberflächen auf textilen Beschichtungen
US7681302B2 (en) * 2003-01-27 2010-03-23 Sae Magnetics (H. K.) Ltd. Method for manufacturing a hard disk drive arm
WO2004096483A1 (ja) * 2003-04-25 2004-11-11 Nitto Denko Corporation レーザー加工品の製造方法、およびそれに用いるレーザー加工用粘着シート
JP4854061B2 (ja) * 2005-01-14 2012-01-11 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用保護シート
WO2009088357A1 (en) * 2008-01-07 2009-07-16 Agency For Science, Technology And Research Method for lift-off patterning films on a substrate
US8153466B2 (en) * 2009-01-21 2012-04-10 Varian Semiconductor Equipment Associates, Inc. Mask applied to a workpiece
WO2015087192A1 (en) * 2013-12-12 2015-06-18 Semiconductor Energy Laboratory Co., Ltd. Peeling method and peeling apparatus

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368578A (en) * 1976-12-01 1978-06-19 Hitachi Ltd Photo mask
JPS5394770A (en) * 1977-01-31 1978-08-19 Hitachi Ltd Photo mask
JPS6040695B2 (ja) * 1977-08-10 1985-09-12 株式会社日立製作所 フオトマスク
JPS6053457B2 (ja) * 1977-11-21 1985-11-26 株式会社日立製作所 ホトマスクの製造方法
AU570439B2 (en) 1983-03-28 1988-03-17 Compression Labs, Inc. A combined intraframe and interframe transform coding system
JPS63194333A (ja) * 1987-02-09 1988-08-11 Seiko Epson Corp プライマ処理方法
JPH02119847A (ja) 1988-10-28 1990-05-07 Hitachi Medical Corp Ｄｓａ装置
US5053318A (en) * 1989-05-18 1991-10-01 Shipley Company Inc. Plasma processing with metal mask integration
US5688864A (en) * 1990-04-03 1997-11-18 Ppg Industries, Inc. Autophobic water repellent surface treatment
JP2566098B2 (ja) * 1992-05-01 1996-12-25 東京応化工業株式会社 ネガ型放射線感応性レジスト組成物
US5268245A (en) * 1992-07-09 1993-12-07 Polaroid Corporation Process for forming a filter on a solid state imager
JPH0684787A (ja) * 1992-09-01 1994-03-25 Fujitsu Ltd 多層レジストのパターン形成方法
JPH06151671A (ja) * 1992-11-02 1994-05-31 Nitto Denko Corp リードフレームの画像形成工程におけるレジスト膜画像の除去方法、及びこれに用いる接着剤あるいは接着シート類
US5466325A (en) * 1993-06-02 1995-11-14 Nitto Denko Corporation Resist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the method
TW301037B (de) * 1993-11-19 1997-03-21 Sony Co Ltd
WO1997000534A1 (fr) * 1995-06-15 1997-01-03 Nitto Denko Corporation Procede d'elimination d'un agent photoresistant, et adhesif ou feuille adhesive utilises a cet effet
US5641541A (en) * 1995-09-29 1997-06-24 Taiwan Semiconductor Manufacturing Company Process to apply photoresist printer to a wafer
US6228552B1 (en) * 1996-09-13 2001-05-08 Kabushiki Kaisha Toshiba Photo-sensitive material, method of forming a resist pattern and manufacturing an electronic parts using photo-sensitive material
US5763006A (en) * 1996-10-04 1998-06-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for automatic purge of HMDS vapor piping
JP3806991B2 (ja) 1996-10-16 2006-08-09 日産自動車株式会社 自動車部品の組み付け装置
JPH10158602A (ja) * 1996-11-29 1998-06-16 Nitto Denko Corp レジスト除去用粘着テ―プとレジスト除去方法
KR100250637B1 (ko) * 1997-01-06 2000-04-01 윤종용 디하이드로피란에 의한 웨이퍼 프라임 방법
JPH1167626A (ja) * 1997-08-12 1999-03-09 Hitachi Ltd レジスト除去方法および装置
JPH11162805A (ja) * 1997-12-02 1999-06-18 Nitto Denko Corp レジスト除去方法

Also Published As

Publication number Publication date
EP1248156B1 (de) 2008-12-24
DE69905985D1 (de) 2003-04-24
EP1248156A2 (de) 2002-10-09
ATE418750T1 (de) 2009-01-15
DE69905985T2 (de) 2003-09-11
EP0971270A1 (de) 2000-01-12
ES2191387T3 (es) 2003-09-01
EP0971270B1 (de) 2003-03-19
US6565704B2 (en) 2003-05-20
EP1248156A3 (de) 2003-07-09
US6245188B1 (en) 2001-06-12
ATE235072T1 (de) 2003-04-15
US20010015259A1 (en) 2001-08-23

Similar Documents

Publication Publication Date Title
DE59200713D1 (de) Verfahren und Vorrichtung zur Behandlung oder Beschichtung von Substraten.
DE69735920D1 (de) Verfahren und Vorrichtung zum Entfernen von Teilchen von einer Gegenstandsoberfläche
DE69411213T2 (de) Verfahren und Vorrichtung zum Waschen von Substraten
DE69012373T2 (de) Verfahren und Vorrichtung zum Trocknen von Substraten nach Behandlung in einer Flüssigkeit.
DE69620372T2 (de) Verfahren und Vorrichtung zum Waschen oder zum Waschen-Trocknen von Substraten
DE69940168D1 (de) Verfahren zum Entschichten von Resistmaterial
DE59707533D1 (de) Verfahren und vorrichtung zum trocknen von substraten
DE69307125D1 (de) Verfahren und Vorrichtung zum Oberflächenbehandeln von nassen Geweben
ATE44359T1 (de) Verfahren zum bearbeiten und aufbringen einer schutzfolie auf eine platte.
DE69303527T2 (de) Verfahren zur Behandlung von kleinen Löchern in Substratmaterial
DE69033452D1 (de) Vorrichtung und Verfahren zum Behandeln von Substraten
DE69934326D1 (de) Verfahren zur entfernung organischen materials von trägern
DE69106435T2 (de) Verfahren und Vorrichtung zum Behandeln von Blattstapeln.
ATE187661T1 (de) Verfahren zur durchführung einer behandlung in der anwesenheit einer zentrifugalen kraft sowie vorrichtung dafür
DE68917498D1 (de) Verfahren zum Entfernen einer Farbschicht von der Oberfläche eines Gegenstandes, wie z.B. Gestelle oder Rahmen und Produkte und Zusammenstellungen zum Durchführen des Verfahrens.
TW429399B (en) Process for the removal of resist material
DE60032437D1 (de) Verfahren und Vorrichtung zum Behandeln von Substraten
DE50014293D1 (de) Verfahren zur Beseitigung punktförmiger Lackerhebungen
AT378016B (de) Verfahren zum entfaerben und/oder bleichen von zellulosematerial, insbesondere zellstoff, und vorrichtung zur durchfuehrung des verfahrens
DE29521231U1 (de) Vorrichtung zur Entlackung von metallischem Behandlungsgut
DE69313441D1 (de) Verfahren zum Verbessern der Oberflächenbehandlung von perforiertem Material
DE19781220D2 (de) Verfahren zum Trocknen von dünnen Schichten sowie Vorrichtung zur Durchführung des Verfahrens
ATA181190A (de) Verfahren zum aufbereiten von schlaemmen sowie einrichtung zur durchfuehrung dieses verfahrens

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee