DE888708T1 - Verbindungsklammer fur kuhlkorperventilator - Google Patents

Verbindungsklammer fur kuhlkorperventilator

Info

Publication number
DE888708T1
DE888708T1 DE0888708T DE97916980T DE888708T1 DE 888708 T1 DE888708 T1 DE 888708T1 DE 0888708 T DE0888708 T DE 0888708T DE 97916980 T DE97916980 T DE 97916980T DE 888708 T1 DE888708 T1 DE 888708T1
Authority
DE
Germany
Prior art keywords
radiator fan
connecting clamp
clamp
radiator
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE0888708T
Other languages
English (en)
Inventor
Donald Clemens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermalloy Inc
Original Assignee
Thermalloy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermalloy Inc filed Critical Thermalloy Inc
Publication of DE888708T1 publication Critical patent/DE888708T1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
    • Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured
DE0888708T 1996-03-22 1997-03-24 Verbindungsklammer fur kuhlkorperventilator Pending DE888708T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/621,167 US5677829A (en) 1995-06-07 1996-03-22 Fan attachment clip for heat sink
PCT/US1997/004820 WO1997035460A1 (en) 1996-03-22 1997-03-24 Fan attachment clip for heat sink

Publications (1)

Publication Number Publication Date
DE888708T1 true DE888708T1 (de) 1999-11-04

Family

ID=24489022

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69726560T Expired - Fee Related DE69726560T2 (de) 1996-03-22 1997-03-24 Verbindungsklammer fuer kuehlkoerperventilator
DE0888708T Pending DE888708T1 (de) 1996-03-22 1997-03-24 Verbindungsklammer fur kuhlkorperventilator

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69726560T Expired - Fee Related DE69726560T2 (de) 1996-03-22 1997-03-24 Verbindungsklammer fuer kuehlkoerperventilator

Country Status (8)

Country Link
US (2) US5677829A (de)
EP (1) EP0888708B1 (de)
JP (1) JP2000507391A (de)
KR (1) KR20000064695A (de)
CN (1) CN1120653C (de)
DE (2) DE69726560T2 (de)
HK (1) HK1019688A1 (de)
WO (1) WO1997035460A1 (de)

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US6503055B1 (en) * 2000-10-30 2003-01-07 Heidelberger Druckmaschinen Ag Environmental control system blower assembly
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US6520250B2 (en) * 2001-02-23 2003-02-18 Foxconn Precision Components Co., Ltd. Fan holder
CN1215751C (zh) * 2001-03-03 2005-08-17 扎尔曼技术株式会社 散热器
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US6496371B2 (en) 2001-03-30 2002-12-17 Intel Corporation Heat sink mounting method and apparatus
US6343013B1 (en) * 2001-04-12 2002-01-29 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6334481B1 (en) * 2001-05-04 2002-01-01 Asia Vital Components Co., Ltd. Retainer for a cooling device
US6469898B1 (en) * 2001-05-21 2002-10-22 Rouchon Industries Inc. Heat dissipating device
US6449151B1 (en) * 2001-06-15 2002-09-10 Foxconn Precision Components Co., Ltd. Heat sink assembly having fastening means for attaching fan to heat sink
JP4786069B2 (ja) * 2001-06-29 2011-10-05 山洋電気株式会社 電子部品冷却装置
US6452803B1 (en) * 2001-07-20 2002-09-17 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6662411B2 (en) * 2002-03-04 2003-12-16 Hewlett-Packard Development Company, L.P. Mushroom head clip fastener
TW586741U (en) * 2002-03-29 2004-05-01 Hon Hai Prec Ind Co Ltd Heat sink assembly
US6950306B2 (en) * 2002-05-10 2005-09-27 Delta Electronics, Inc. Connection frame for fan
US6650541B1 (en) * 2002-06-25 2003-11-18 Hewlett-Packard Development Company, L.P. Fan-securing device for use with a heat transfer device
US7004236B2 (en) * 2003-01-29 2006-02-28 Hon Hai Precision Ind. Co., Ltd. Fan holder
TW584275U (en) * 2003-06-25 2004-04-11 Hon Hai Prec Ind Co Ltd Heat sink assembly
TWM249098U (en) * 2003-10-28 2004-11-01 Hon Hai Prec Ind Co Ltd Fan retainer
US20050199370A1 (en) * 2004-03-15 2005-09-15 Huang Ming T. Heat dissipation module for CPU
CN2694488Y (zh) * 2004-03-18 2005-04-20 鸿富锦精密工业（深圳）有限公司 散热装置
CN2698566Y (zh) * 2004-03-27 2005-05-11 鸿富锦精密工业（深圳）有限公司 制造风扇框架的模具
TW200421074A (en) * 2004-06-03 2004-10-16 Asia Vital Components Co Ltd A stand structure having positioning function
US20050278927A1 (en) * 2004-06-22 2005-12-22 Campbell John W Fan mount
US20060016578A1 (en) * 2004-06-24 2006-01-26 Shine Ying Co., Ltd. [high-performance two-phase flow evaporator]
CN2750473Y (zh) * 2004-07-08 2006-01-04 鸿富锦精密工业（深圳）有限公司 风扇固定架
CN2736570Y (zh) * 2004-08-31 2005-10-26 鸿富锦精密工业（深圳）有限公司 风扇固定装置
US20060054369A1 (en) * 2004-09-13 2006-03-16 Ming-Hui Pan Support frame device with locating function
US7239520B2 (en) * 2004-12-29 2007-07-03 Hewlett-Packard Development Company, L.P. Self-locking fastener adapted to secure a heat sink to a frame
US8125782B2 (en) * 2005-03-07 2012-02-28 Advanced Thermal Solutions, Inc. Heat sink assembly
CN100399554C (zh) * 2005-07-25 2008-07-02 华信精密股份有限公司 具有转接机构的风扇装置
US20070058341A1 (en) * 2005-09-12 2007-03-15 Tsung-Te Hsiao Fan duct
US7369408B2 (en) * 2005-10-14 2008-05-06 Sercomm Corporation Screwless mini fan holder
US7100681B1 (en) 2005-10-31 2006-09-05 Foxconn Technology Co., Ltd. Heat dissipation device having heat pipe
US7365979B2 (en) * 2005-11-01 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating assembly with fan fastening device
US7779638B2 (en) * 2005-12-27 2010-08-24 Intel Corporation Localized microelectronic cooling apparatuses and associated methods and systems
CN101060763B (zh) * 2006-04-19 2011-08-24 鸿富锦精密工业（深圳）有限公司 散热装置
CN100534283C (zh) * 2006-08-02 2009-08-26 富准精密工业(深圳)有限公司 散热装置组合
US7826229B2 (en) * 2006-10-27 2010-11-02 Hewlett-Packard Development Company, L.P. Component retention with distributed compression
US7414839B2 (en) * 2006-11-28 2008-08-19 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan holder for attachment of a fan
CN101212883B (zh) * 2006-12-27 2010-12-22 富准精密工业(深圳)有限公司 散热装置组合
DE202007003846U1 (de) * 2007-03-13 2007-05-24 Jet Computer Products Gmbh Lüfter
US7697297B2 (en) * 2007-11-29 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a clip assembly
US7672126B2 (en) * 2007-11-30 2010-03-02 Hong Fu Jin Precision Indsutry (Shenzhen) Co., Ltd. Mounting apparatus for fan
US7606028B2 (en) * 2007-12-20 2009-10-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a fan holder for attachment of a fan
JP5128962B2 (ja) * 2008-01-07 2013-01-23 富準精密工業（深▲セン▼）有限公司 放熱装置
CN101547584B (zh) * 2008-03-28 2011-12-28 富准精密工业(深圳)有限公司 散热装置、散热装置组合及其固定装置
CN101605443B (zh) * 2008-06-13 2011-06-08 富准精密工业(深圳)有限公司 散热装置及其散热器
WO2010006178A1 (en) * 2008-07-09 2010-01-14 Tinnerman Palnut Engineered Products, Inc. Clip and method for using the clip
US7684191B1 (en) * 2008-08-28 2010-03-23 Sun Microsystems, Inc. Self-retaining vibration isolating fan mount assembly
CN101674718A (zh) * 2008-09-11 2010-03-17 鸿富锦精密工业（深圳）有限公司 散热装置
CN101754659A (zh) * 2008-12-11 2010-06-23 富准精密工业(深圳)有限公司 散热装置
US7848107B2 (en) * 2008-12-23 2010-12-07 Intricast Company, Inc. Heatsink mounting system
US8274793B2 (en) * 2008-12-23 2012-09-25 Intricast Company, Inc. Heatsink mounting system
TW201031881A (en) * 2009-02-16 2010-09-01 Zex Technologies Inc Thermal module having enhanced heat-dissipating efficiency and thermal system thereof
US8144470B2 (en) * 2009-05-21 2012-03-27 Pem Management, Inc. Two-piece heat sink stud
US20110079368A1 (en) * 2009-10-06 2011-04-07 Asia Vital Components Co., Ltd. Fixing mount and thermal module thereof
US7895843B1 (en) 2009-11-30 2011-03-01 Whirlpool Corporation Refrigerator with one piece fan motor mount
CN102385428A (zh) * 2010-09-02 2012-03-21 鸿富锦精密工业（深圳）有限公司 导风罩
CN102802378A (zh) * 2011-05-27 2012-11-28 鸿富锦精密工业（深圳）有限公司 散热装置及使用该散热装置的电子装置
CN103294133B (zh) * 2012-02-27 2016-11-23 重庆市巴南区前进机械厂 风扇固定装置
CN103375423A (zh) * 2012-04-17 2013-10-30 鸿富锦精密工业（深圳）有限公司 风扇
TW201422916A (zh) * 2012-12-14 2014-06-16 Hon Hai Prec Ind Co Ltd 導風罩及散熱裝置
CN104329865B (zh) * 2014-03-28 2017-01-18 海尔集团公司 一种风扇以及具有该风扇的翅片热交换器和冰箱
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GB2204181B (en) * 1987-04-27 1990-03-21 Thermalloy Inc Heat sink apparatus and method of manufacture
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Also Published As

Publication number Publication date
EP0888708A1 (de) 1999-01-07
DE69726560D1 (de) 2004-01-15
WO1997035460A1 (en) 1997-09-25
US6118657A (en) 2000-09-12
CN1120653C (zh) 2003-09-03
EP0888708A4 (de) 2000-10-25
US5677829A (en) 1997-10-14
JP2000507391A (ja) 2000-06-13
DE69726560T2 (de) 2004-09-16
EP0888708B1 (de) 2003-12-03
HK1019688A1 (en) 2000-02-18
KR20000064695A (ko) 2000-11-06
CN1214850A (zh) 1999-04-21

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