DE9300865U1 - Einstückiges Kunststoffteil, insbesondere Spritzgießteil - Google Patents
Einstückiges Kunststoffteil, insbesondere SpritzgießteilInfo
- Publication number
- DE9300865U1 DE9300865U1 DE9300865U DE9300865U DE9300865U1 DE 9300865 U1 DE9300865 U1 DE 9300865U1 DE 9300865 U DE9300865 U DE 9300865U DE 9300865 U DE9300865 U DE 9300865U DE 9300865 U1 DE9300865 U1 DE 9300865U1
- Authority
- DE
- Germany
- Prior art keywords
- plastic part
- piece plastic
- injection molded
- metal block
- especially injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9300865U DE9300865U1 (de) | 1993-01-22 | 1993-01-22 | Einstückiges Kunststoffteil, insbesondere Spritzgießteil |
DE59400021T DE59400021D1 (de) | 1993-01-22 | 1994-01-11 | Einstückiges Kunststoffteil, insbesondere Spritzgiessteil. |
EP94100306A EP0607846B1 (de) | 1993-01-22 | 1994-01-11 | Einstückiges Kunststoffteil, insbesondere Spritzgiessteil |
AT94100306T ATE128601T1 (de) | 1993-01-22 | 1994-01-11 | Einstückiges kunststoffteil, insbesondere spritzgiessteil. |
JP6020007A JP2754497B2 (ja) | 1993-01-22 | 1994-01-19 | 一体成形プラスチック部品 |
US08/185,605 US5461201A (en) | 1993-01-22 | 1994-01-21 | Insulating part with integral cooling element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE9300865U DE9300865U1 (de) | 1993-01-22 | 1993-01-22 | Einstückiges Kunststoffteil, insbesondere Spritzgießteil |
Publications (1)
Publication Number | Publication Date |
---|---|
DE9300865U1 true DE9300865U1 (de) | 1994-05-26 |
Family
ID=6888462
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE9300865U Expired - Lifetime DE9300865U1 (de) | 1993-01-22 | 1993-01-22 | Einstückiges Kunststoffteil, insbesondere Spritzgießteil |
DE59400021T Expired - Fee Related DE59400021D1 (de) | 1993-01-22 | 1994-01-11 | Einstückiges Kunststoffteil, insbesondere Spritzgiessteil. |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE59400021T Expired - Fee Related DE59400021D1 (de) | 1993-01-22 | 1994-01-11 | Einstückiges Kunststoffteil, insbesondere Spritzgiessteil. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5461201A (de) |
EP (1) | EP0607846B1 (de) |
JP (1) | JP2754497B2 (de) |
AT (1) | ATE128601T1 (de) |
DE (2) | DE9300865U1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5929375A (en) * | 1996-05-10 | 1999-07-27 | Ford Motor Company | EMI protection and CTE control of three-dimensional circuitized substrates |
US5914857A (en) * | 1998-03-30 | 1999-06-22 | International Business Machines Corporation | Air flow devices for electronic boards |
US6058013A (en) * | 1998-07-02 | 2000-05-02 | Motorola Inc. | Molded housing with integral heatsink |
US6212076B1 (en) | 1999-02-26 | 2001-04-03 | International Business Machines Corporation | Enhanced heat-dissipating printed circuit board package |
US6377219B2 (en) | 2000-01-11 | 2002-04-23 | Cool Options, Inc. | Composite molded antenna assembly |
US6680015B2 (en) | 2000-02-01 | 2004-01-20 | Cool Options, Inc. | Method of manufacturing a heat sink assembly with overmolded carbon matrix |
JP4165045B2 (ja) * | 2000-09-19 | 2008-10-15 | 松下電器産業株式会社 | 電子機器 |
US20060104035A1 (en) * | 2004-08-24 | 2006-05-18 | Vasoya Kalu K | Edge plated printed wiring boards |
JP4556174B2 (ja) * | 2004-12-15 | 2010-10-06 | 日本電気株式会社 | 携帯端末機器及び放熱方法 |
US7889502B1 (en) * | 2005-11-04 | 2011-02-15 | Graftech International Holdings Inc. | Heat spreading circuit assembly |
US7505275B2 (en) * | 2005-11-04 | 2009-03-17 | Graftech International Holdings Inc. | LED with integral via |
US7606034B2 (en) * | 2006-06-05 | 2009-10-20 | Corsair Memory | Thermally enhanced memory module |
EP2276329A1 (de) * | 2009-07-16 | 2011-01-19 | ABB Research Ltd. | Elektronische Platine mit Wärmekondensator |
US9332632B2 (en) | 2014-08-20 | 2016-05-03 | Stablcor Technology, Inc. | Graphene-based thermal management cores and systems and methods for constructing printed wiring boards |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3930114A (en) * | 1975-03-17 | 1975-12-30 | Nat Semiconductor Corp | Integrated circuit package utilizing novel heat sink structure |
US4410927A (en) * | 1982-01-21 | 1983-10-18 | Olin Corporation | Casing for an electrical component having improved strength and heat transfer characteristics |
DE3248715A1 (de) * | 1982-12-31 | 1984-07-05 | Bosch Gmbh Robert | Elektrisches schaltgeraet, insbesondere fuer kraftfahrzeuge |
FR2560731B1 (fr) * | 1984-03-05 | 1989-05-12 | Telecommunications Sa | Carte imprimee multicouche thermoconductrice |
US4698662A (en) * | 1985-02-05 | 1987-10-06 | Gould Inc. | Multichip thin film module |
JPS6428831A (en) * | 1987-07-23 | 1989-01-31 | Mitsubishi Electric Corp | Hybrid ic |
FR2620296B1 (fr) * | 1987-09-03 | 1990-01-19 | Bendix Electronics Sa | Boitier pour circuit electronique |
US4868349A (en) * | 1988-05-09 | 1989-09-19 | National Semiconductor Corporation | Plastic molded pin-grid-array power package |
EP0465693B1 (de) * | 1990-07-09 | 1993-10-06 | Siemens Aktiengesellschaft | Elektrisch isolierender Schaltungsträger mit integrierten Kühlmitteln |
DE59006070D1 (de) * | 1990-07-09 | 1994-07-14 | Siemens Ag | Schaltungsträger. |
JPH04179298A (ja) * | 1990-11-14 | 1992-06-25 | Nec Corp | 混成集積回路装置 |
US5293301A (en) * | 1990-11-30 | 1994-03-08 | Shinko Electric Industries Co., Ltd. | Semiconductor device and lead frame used therein |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
US5343360A (en) * | 1993-03-31 | 1994-08-30 | Ncr Corporation | Containing and cooling apparatus for an integrated circuit device having a thermal insulator |
-
1993
- 1993-01-22 DE DE9300865U patent/DE9300865U1/de not_active Expired - Lifetime
-
1994
- 1994-01-11 EP EP94100306A patent/EP0607846B1/de not_active Expired - Lifetime
- 1994-01-11 DE DE59400021T patent/DE59400021D1/de not_active Expired - Fee Related
- 1994-01-11 AT AT94100306T patent/ATE128601T1/de not_active IP Right Cessation
- 1994-01-19 JP JP6020007A patent/JP2754497B2/ja not_active Expired - Lifetime
- 1994-01-21 US US08/185,605 patent/US5461201A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5461201A (en) | 1995-10-24 |
ATE128601T1 (de) | 1995-10-15 |
JP2754497B2 (ja) | 1998-05-20 |
JPH06244323A (ja) | 1994-09-02 |
EP0607846B1 (de) | 1995-09-27 |
DE59400021D1 (de) | 1995-11-02 |
EP0607846A1 (de) | 1994-07-27 |
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